Semiconductor packaging cleaning equipment

Abstract

The utility model relates to the technical field of semiconductor packaging cleaning, and discloses semiconductor packaging cleaning equipment which comprises a cleaning equipment body. The cleaning equipment body comprises a grabbing and conveying assembly used for grabbing and conveying semiconductor packages, a conveying assembly used for feeding and conveying the semiconductor packages and a cleaning assembly used for cleaning the semiconductor packages, the grabbing and conveying assembly comprises a supporting column, and an extending plate at the upper end of the supporting column is fixedly connected with a fixing shell; a first driving motor is fixedly connected to the interior of the fixing shell, the output end of the first driving motor is fixedly connected with a threaded lead screw, and the threaded lead screw is in threaded connection with a threaded sleeve plate, so that the semiconductor sealing plate is gradually placed in the basic ultrasonic cleaning pool, the precise ultrasonic cleaning pool and the efficient ultrasonic cleaning pool; therefore, the semiconductor packaging pieces can be continuously and stably conveyed, the complexity and time consumption of manual carrying are avoided, and the production efficiency is remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging cleaning, in particular to a semiconductor packaging cleaning device. Background Art

[0002] Semiconductor packaging is a critical step in the semiconductor manufacturing process, and its quality directly determines the performance and reliability of the final product. During the packaging process, chips and packaging materials are extremely susceptible to contamination from the environment, process steps, and the equipment itself, such as particles, organic matter, and metal ions. These contaminants not only affect the sealing and electrical performance of the package but can also cause chip failure or premature failure. Therefore, clean technology plays a vital role in semiconductor packaging.

[0003] When cleaning traditional semiconductor packages, the semiconductor packages are manually handled, resulting in low cleaning efficiency and insufficient cleaning, resulting in poor cleaning results. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor packaging cleaning device.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a semiconductor package cleaning device, including a cleaning device body, the cleaning device body includes a grabbing and conveying component for grabbing and conveying semiconductor packages, a conveying component for feeding and transporting semiconductor packages, and a cleaning component for cleaning semiconductor packages, the grabbing and conveying component includes a support column, the upper end extension plate of the support column is fixedly connected to a fixed shell, the interior of the fixed shell is fixedly connected to a drive motor 1, and the output end of the drive motor 1 is fixedly connected to a threaded screw, and the threaded screw is threadedly connected to a threaded sleeve, and the lower end of the threaded sleeve is fixedly connected There is a first electric telescopic rod, one end of the first electric telescopic rod is fixedly connected to a fixing plate 1, the fixing plate 1 is fixedly connected to a second electric telescopic rod, and the lower end of the second electric telescopic rod is fixedly connected to the first connecting plate, and the first connecting plate is hinged to the connecting rod, and at the same time, the end of the connecting rod away from the first connecting plate is hinged to the second connecting plate, and at the same time, the end of the second connecting plate away from the connecting rod is fixedly connected to a grab plate, the cleaning assembly is arranged below the grabbing and conveying assembly, the cleaning assembly includes a fixed table, and the upper end of the fixed table is fixedly connected to a basic ultrasonic cleaning tank, a precision ultrasonic cleaning tank and a high-efficiency ultrasonic cleaning tank for cleaning semiconductor packages.

[0006] As a further description of the above technical solution:

[0007] The fixed shell is horizontally symmetrically provided with two groups, and the threaded screw is rotatably connected in the fixed shell, and the end of the threaded sleeve away from the threaded screw is slidably connected to the sliding rod provided in the other fixed shell to drive the first electric telescopic rod to move.

[0008] As a further description of the above technical solution:

[0009] The second connecting plate is rotatably connected to the first fixing plate at a corner thereof, and two groups of the second connecting plate and the grabbing plate are vertically and horizontally symmetrically provided for grabbing semiconductor packages.

[0010] As a further description of the above technical solution:

[0011] The basic ultrasonic cleaning tank, the precision ultrasonic cleaning tank and the high-efficiency ultrasonic cleaning tank are placed vertically and horizontally above the fixing table for gradually cleaning the semiconductor package, and the fixing table is placed on the upper end of the support column.

[0012] As a further description of the above technical solution:

[0013] The conveying assembly is arranged on one side of the cleaning assembly, and the conveying assembly includes a second driving motor. The output end of the second driving motor is fixedly connected to a first pulley, a transmission belt is provided on the outer side of the first pulley, and a second pulley is provided inside the side of the transmission belt away from the first pulley, and the upper end of the support column is fixedly connected to a second fixing plate, and the upper ends of the two groups close to the cleaning assembly are fixedly connected to baffles for blocking the semiconductor components transported on the transmission belt.

[0014] As a further description of the above technical solution:

[0015] The second fixing plate is provided with four groups and is arranged on both sides of the transmission belt. The first pulley and the second pulley are respectively rotatably connected to the second fixing plate.

[0016] As a further description of the above technical solution:

[0017] The second driving motor is fixedly connected to the support column and is provided with an extension plate.

[0018] The utility model has the following beneficial effects:

[0019] 1. The semiconductor sealing plate is transported by the conveying component, and is grabbed and transferred by the grabbing and conveying component, so that the semiconductor sealing plate is gradually placed in the basic ultrasonic cleaning tank, the precision ultrasonic cleaning tank and the high-efficiency ultrasonic cleaning tank. In this way, the semiconductor packages can be transported continuously and stably, avoiding the tedious and time-consuming manual handling, thereby significantly improving production efficiency.

[0020] 2. The basic ultrasonic cleaning pool is used to preliminarily remove large particle pollutants, dust and residues, the precision ultrasonic cleaning pool is used to deeply clean complex structures such as tiny pores, microchannels and microcircuits, and the high-efficiency ultrasonic cleaning pool can customize the cleaning solution according to the type, size and material properties of the semiconductor package, which greatly increases the efficiency and effectiveness of cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a semiconductor packaging cleaning device proposed in this utility model. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the three-dimensional structure of a semiconductor packaging cleaning device proposed in this utility model. Figure 2 ;

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of a semiconductor packaging cleaning device proposed in this utility model. Figure 3 ;

[0024] Figure 4 This is a partial structural diagram of a semiconductor packaging cleaning device proposed by the present invention.

[0025] Legend:

[0026] 1. Cleaning equipment body; 2. Grabbing and conveying assembly; 21. Support column; 22. Fixed shell; 23. Driving motor 1; 24. Threaded screw; 25. Threaded sleeve; 26. First electric telescopic rod; 27. Fixed plate 1; 28. Second electric telescopic rod; 29. ​​First connecting plate; 210. Connecting rod; 211. Second connecting plate; 212. Grabbing plate; 3. Conveying assembly; 31. Driving motor 2; 32. First pulley; 33. Transmission belt; 34. Second pulley; 35. Fixed plate 2; 36. Baffle; 4. Cleaning assembly; 41. Fixed table; 42. Basic ultrasonic cleaning tank; 43. Precision ultrasonic cleaning tank; 44. High-efficiency ultrasonic cleaning tank. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Reference Figure 1-Figure 4 The utility model provides a semiconductor packaging cleaning device, including: a cleaning device body 1.

[0029] Specifically, the cleaning device body 1 includes a grabbing and conveying component 2 for grabbing and conveying semiconductor packages, a conveying component 3 for feeding and transporting semiconductor packages, and a cleaning component 4 for cleaning semiconductor packages;

[0030] The grabbing and conveying assembly 2 includes a support column 21, an upper extension plate of the support column 21 is fixedly connected to a fixed shell 22, a drive motor 23 is fixedly connected to the interior of the fixed shell 22, and the output end of the drive motor 23 is fixedly connected to a threaded screw 24, and the threaded screw 24 is threadedly connected to a threaded sleeve 25, and the lower end of the threaded sleeve 25 is fixedly connected to a first electric telescopic rod 26, one end of the first electric telescopic rod 26 is fixedly connected to a fixed plate 27, the fixed plate 27 is fixedly connected to a second electric telescopic rod 28, and the lower end of the second electric telescopic rod 28 is fixedly connected to the fixed plate 27. A first connecting plate 29 is fixedly connected to the first connecting plate 29, and the first connecting plate 29 is hinged with a connecting rod 210. At the same time, the end of the connecting rod 210 away from the first connecting plate 29 is hinged with a second connecting plate 211. At the same time, the end of the second connecting plate 211 away from the connecting rod 210 is fixedly connected with a grab plate 212. The cleaning component 4 is arranged below the grabbing and conveying component 2. The cleaning component 4 includes a fixed table 41, and the upper end of the fixed table 41 is fixedly connected with a basic ultrasonic cleaning tank 42, a precision ultrasonic cleaning tank 43 and a high-efficiency ultrasonic cleaning tank 44 for cleaning semiconductor packages.

[0031] In this embodiment, the grabbing and conveying component 2, the transfer component 3 and the cleaning component 4 constitute the semiconductor package cleaning involved in this application, and realize the semiconductor package cleaning operation.

[0032] In this embodiment, the basic ultrasonic cleaning tank 42 is equipped with a standard ultrasonic generator that can generate high-frequency vibrations, converting tiny bubbles in the cleaning liquid into strong liquid flow power, thereby effectively striking and peeling off pollutants on the surface of the semiconductor package. The precision ultrasonic cleaning tank 43 is equipped with high-frequency ultrasonic vibrations, which can generate smaller bubbles and stronger liquid flow power, ensuring that the cleaning liquid and cleaning agent can penetrate into the fine structure and thoroughly remove internal pollutants. The high-efficiency ultrasonic cleaning tank 44 is equipped with a programmable control system, which can customize the cleaning solution according to the type, size and material properties of the semiconductor package.

[0033] In this embodiment, the second fixing plate 35 is disposed between the two sets of fixing shells 22 and slides between the two sets of fixing shells 22 .

[0034] It should be noted that the shape of the fixing plate 1 27 is U-shaped, and the second electric telescopic rod 28 is arranged on the inner side of the fixing plate 1 27 .

[0035] Specifically, the fixed shell 22 is horizontally symmetrically provided with two groups, and the threaded screw 24 is rotatably connected to the fixed shell 22, and the end of the threaded sleeve 25 away from the threaded screw 24 is slidably connected to the sliding rod provided in the other fixed shell 22 to drive the first electric telescopic rod 26 to move, and the corner of the second connecting plate 211 is rotatably connected to the fixed plate 27. At the same time, the second connecting plate 211 and the grab plate 212 are vertically and horizontally symmetrically provided with two groups for grabbing semiconductor packages. The basic ultrasonic cleaning pool 42, the precision ultrasonic cleaning pool 43 and the high-efficiency ultrasonic cleaning pool 44 are vertically and horizontally placed above the fixed table 41 for gradually cleaning the semiconductor packages. At the same time, the fixed table 41 is placed on the upper end of the support column 21.

[0036] As a preferred embodiment, two groups of connecting rods 210 are provided and are horizontally symmetrically arranged on both sides of the first connecting plate 29 for driving the two groups of second connecting plates 211 to perform deflection movement on the fixed plate 27.

[0037] As a preferred embodiment, the first electric telescopic rod 26 and the second electric telescopic rod 28 can be started simultaneously or at different times.

[0038] Specifically, the transmission component 3 is arranged on one side of the cleaning component 4, and the transmission component 3 includes a driving motor 2 31. The output end of the driving motor 2 31 is fixedly connected to the first pulley 32, and a transmission belt 33 is provided on the outer side of the first pulley 32. A second pulley 34 is provided inside the side of the transmission belt 33 away from the first pulley 32, and the upper end of the support column 21 is fixedly connected to a fixing plate 2 35. At the same time, the upper ends of the two groups close to the cleaning component 4 are fixedly connected with a baffle 36 for blocking the semiconductor components transported on the transmission belt 33. There are four groups of fixing plates 2 35 and they are arranged on both sides of the transmission belt 33. The first pulley 32 and the second pulley 34 are respectively rotatably connected to the fixing plate 2 35, and the driving motor 2 31 is fixedly connected to an extension plate provided on the support column 21.

[0039] As a preferred embodiment, the transmission belt 33 is disposed below the two sets of gripping plates 212 and on one side of the fixing platform 41 .

[0040] It should be noted that the baffle 36 is provided above the transmission belt 33 .

[0041] During use, first, place the semiconductor sealing plate on the transmission belt, start the driving motor 2, drive the first pulley and the transmission belt, transport the semiconductor sealing plate through the transmission belt, and block the semiconductor sealing plate on the transmission belt through the provided baffle, start the driving motor 1, drive the threaded screw to rotate on the fixed shell, and drive the threaded sleeve to move on the sliding rod provided in the other fixed shell toward the direction of the transmission assembly, and drive the two sets of grab plates to move to the side of the first electric telescopic rod above the transmission belt. At this time, the staff can start the first electric telescopic rod to push the two sets of grab plates to move downward, start the second electric telescopic rod to push the first connecting plate, drive the two sets of connecting rods to deflect in the opposite direction, and drive the two drill second connecting plates to deflect in the opposite direction on the fixed plate 1, so that the two sets of grab plates can be The plate grabs the semiconductor sealing plate on the transmission belt, and at this time the first electric telescopic rod is started in reverse so that the height of the semiconductor sealing plate grabbed by the grab plate is higher than the baffle. At this time, the drive motor 1 is started in reverse to drive the threaded screw to rotate in the opposite direction, and drives the threaded sleeve to move in the direction of the cleaning component. When it moves to the top of the basic ultrasonic cleaning tank, the drive motor 1 is stopped, and the first electric telescopic rod is started to drive the semiconductor sealing plate to move downward so that the semiconductor sealing plate is placed in the basic ultrasonic cleaning tank. The second electric telescopic rod is started in reverse to separate the two sets of grab plates from the semiconductor sealing plate. In this way, the drive motor 1, the first electric telescopic rod and the second electric telescopic rod can be started reciprocatingly respectively, so that the semiconductor sealing plate is gradually placed in the basic ultrasonic cleaning tank, the precision ultrasonic cleaning tank and the high-efficiency ultrasonic cleaning tank.

[0042] The semiconductor packaging cleaning equipment of the present invention can continuously and stably transport semiconductor packages, avoiding the tedious and time-consuming manual handling, thereby significantly improving production efficiency. The semiconductor sealing plate is gradually cleaned through the basic ultrasonic cleaning pool, precision ultrasonic cleaning pool and high-efficiency ultrasonic cleaning pool, which greatly increases the efficiency and effect of cleaning.

[0043] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor packaging cleaning device, characterized in that: The cleaning device comprises a cleaning device body (1), wherein the cleaning device body (1) comprises a grabbing and conveying component (2) for grabbing and conveying semiconductor packages, a conveying component (3) for feeding and transporting semiconductor packages, and a cleaning component (4) for cleaning semiconductor packages; The grabbing and conveying assembly (2) includes a support column (21), an upper end extension plate of the support column (21) is fixedly connected to a fixed shell (22), the interior of the fixed shell (22) is fixedly connected to a driving motor (23), and the output end of the driving motor (23) is fixedly connected to a threaded screw (24), and the threaded screw (24) is threadedly connected to a threaded sleeve (25), and the lower end of the threaded sleeve (25) is fixedly connected to a first electric telescopic rod (26), one end of the first electric telescopic rod (26) is fixedly connected to a fixed plate (27), the fixed plate (27) is fixedly connected to a second electric telescopic rod (28), and the second electric telescopic rod (28) The lower end of the grabbing and conveying assembly (2) is fixedly connected to a first connecting plate (29), and the first connecting plate (29) is hinged to a connecting rod (210), and the end of the connecting rod (210) away from the first connecting plate (29) is hinged to a second connecting plate (211), and the end of the second connecting plate (211) away from the connecting rod (210) is fixedly connected to a grab plate (212), the cleaning assembly (4) is arranged below the grabbing and conveying assembly (2), the cleaning assembly (4) includes a fixed platform (41), and the upper end of the fixed platform (41) is fixedly connected to a basic ultrasonic cleaning pool (42), a precision ultrasonic cleaning pool (43) and a high-efficiency ultrasonic cleaning pool (44) for cleaning semiconductor packages.

2. The semiconductor packaging cleaning device according to claim 1, wherein: The fixed shell (22) is provided with two groups in a horizontally symmetrical manner, and the threaded screw (24) is rotatably connected to the fixed shell (22), and the end of the threaded sleeve (25) away from the threaded screw (24) is slidably connected to a sliding rod provided in the other fixed shell (22) to drive the first electric telescopic rod (26) to move.

3. The semiconductor packaging cleaning device according to claim 2, wherein: The corner of the second connecting plate (211) is rotatably connected to the fixing plate (27), and the second connecting plate (211) and the grasping plate (212) are provided with two groups vertically and horizontally symmetrically for grasping semiconductor packages.

4. The semiconductor packaging cleaning device according to claim 3, wherein: The basic ultrasonic cleaning pool (42), the precision ultrasonic cleaning pool (43) and the high-efficiency ultrasonic cleaning pool (44) are placed vertically and horizontally above the fixing platform (41) for gradually cleaning the semiconductor package, and the fixing platform (41) is placed on the upper end of the support column (21).

5. The semiconductor package cleaning device according to claim 4, characterized in that: The transmission component (3) is arranged on one side of the cleaning component (4), and the transmission component (3) includes a second driving motor (31). The output end of the second driving motor (31) is fixedly connected to a first pulley (32). A transmission belt (33) is provided on the outer side of the first pulley (32). A second pulley (34) is provided inside the side of the transmission belt (33) away from the first pulley (32). The upper end of the support column (21) is fixedly connected to a second fixing plate (35). At the same time, the upper ends of the two groups close to the cleaning component (4) are fixedly connected to a baffle (36) for blocking the semiconductor components transported on the transmission belt (33).

6. The semiconductor package cleaning device according to claim 5, characterized in that: The second fixed plate (35) is provided with four groups and is arranged on both sides of the transmission belt (33); the first pulley (32) and the second pulley (34) are respectively rotatably connected to the second fixed plate (35).

7. The semiconductor package cleaning device according to claim 6, wherein: The second driving motor (31) is fixedly connected to the support column (21) and is provided with an extension plate.

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