PCB (printed circuit board) reflow soldering tool
By designing PCB board reflow welding tooling, the precise positioning and compression of components is achieved using positioning pallets and compression columns, the inaccurate positioning and complex process problems of traditional welding tooling are solved, and the production efficiency is improved and the defect rate is reduced.
Patent Information
- Application Number
- CN202422694770.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-11-06
AI Technical Summary
Traditional PCB board welding tooling cannot achieve the compact layout of components, cannot accurately position, and the welding process is complex and the operation skills are high, resulting in low production efficiency.
A PCB board reflow welding tool is designed, including a workbench, a positioning mechanism, a pressing mechanism and a buckle mechanism. Through the combination of positioning pallets and a pressing column, the precise positioning and compression of the PCB board and electronic components are achieved, and the elastic hoop is used to facilitate observation of the state before and after welding.
It improves positioning accuracy, reduces dummy welding and tilt, reduces product defect rate, simplifies operating procedures, and saves production costs.
Smart Images

Figure CN223301021U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB board welding, in particular to a PCB board reflow welding tool. Background Art
[0002] In traditional PCB and electronic component soldering processes, soldering tooling cannot achieve a compact layout of components and cannot accurately position PCBs and electronic components. In addition, the soldering process of traditional soldering tooling is relatively complex, requiring high operator skills, which reduces production efficiency. Utility Model Content
[0003] In view of the deficiencies in the prior art, the present invention provides a PCB reflow soldering tool to solve the above-mentioned problems.
[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a PCB board reflow soldering tool, comprising a workbench, a positioning mechanism is provided on the top of the workbench, a pressing mechanism is provided on the top of the positioning mechanism, and buckle mechanisms are provided on both sides of the workbench;
[0005] The positioning mechanism includes a positioning support plate, a plurality of first guide pins and guide sleeves are installed at the bottom of the positioning support plate, a spring is provided between the positioning support plate and the workbench, and positioning grooves are provided inside the positioning support plate and the workbench;
[0006] The clamping mechanism includes a fixed seat, a clamping handle is rotatably connected to the front side of the fixed seat, the top of the clamping handle is fixedly connected to a connecting block, the top of the connecting block is rotatably connected to a connecting frame, the bottom end of the connecting frame is rotatably connected to a clamping column, a guide sleeve is provided on the outside of the clamping column, the bottom end of the clamping column is fixedly connected to an installation fixing plate, the bottom end of the installation fixing plate is fixedly connected to a pressure plate, two pairs of second guide column and guide sleeves are provided on the pressure plate, and a plurality of push rods are fixedly connected to the bottom surface of the pressure plate.
[0007] Preferably, multiple first guide pillars and guide sleeves are respectively arranged at the four corners of the bottom of the positioning tray, and the positioning tray is connected to the workbench through multiple pairs of first guide pillars and guide sleeves, so that the movement of the positioning tray can be guided to improve the positioning accuracy.
[0008] Preferably, the fixing seat is fixedly mounted on the workbench, the guide sleeve is fixedly mounted on the fixing seat, and the guide sleeve matches the pressing column, so that the guide sleeve can guide the movement of the pressing column.
[0009] Preferably, the positioning groove on the positioning support plate matches the PCB board, and the positioning groove inside the workbench matches the electronic component, so that the PCB board and the electronic component can be positioned.
[0010] Preferably, the pressing plate is connected to the workbench through two pairs of second guide pillars and guide sleeves, and the pressing plate is detachably connected to the mounting and fixing plate, so that it can guide the movement of the pressing plate and improve the positioning accuracy.
[0011] Preferably, the plurality of ejector pins are made of low-hardness, high-temperature resistant material to prevent damage to the PCB board, and the workbench is provided with heat dissipation holes, which can play a good heat dissipation role.
[0012] Preferably, the buckle mechanism includes a hook and a support frame, the support frame is rotatably connected to a rotating block, the rotating block is rotatably connected to an elastic hoop, the elastic hoop matches the hook, and can easily open the workbench, making it more convenient to observe the status of the PCB board and electronic components before and after welding.
[0013] The utility model provides a PCB reflow soldering tool. Compared with the existing technology, it has the following advantages:
[0014] 1. The PCB reflow soldering tool is designed to place the PCB in the positioning groove on the positioning tray, and the electronic components in the positioning groove inside the workbench. The clamping handle is then rotated to drive the ejector to move. The ejector is used to press the PCB down to make it fit tightly with the electronic components. The spring prevents the electronic components from floating, reducing the occurrence of cold solder joints or tilting of the electronic components, which leads to cold solder joints, reducing product defective rates, and saving production costs.
[0015] 2. The PCB reflow soldering tool is designed to hang the elastic hoop on the hook and then rotate the rotating block downward. The rotating block rotates and pulls the elastic hoop, causing the elastic hoop to deform and tighten the hook. The rotating block can also be rotated in the opposite direction, making it easy to open the workbench and more convenient to observe the status of the PCB board and electronic components before and after soldering. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0017] Figure 2 This is a side structural diagram of the present utility model;
[0018] Figure 3 This is a schematic structural diagram of the pressing mechanism of the present utility model;
[0019] Figure 4 It is a schematic structural diagram of the buckle mechanism of the present utility model.
[0020] In the figure: 1. workbench; 2. positioning mechanism; 201. positioning support plate; 202. first guide post and guide sleeve; 203. spring; 3. clamping mechanism; 301. fixing seat; 302. clamping handle; 303. connecting block; 304. connecting frame; 305. clamping column; 306. mounting plate; 307. pressing plate; 308. ejector pin; 309. second guide post and guide sleeve; 310. guide sleeve; 4. buckle mechanism; 401. hook; 402. support frame; 403. rotating block; 404. elastic hoop. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0022] See also Figure 1-3 The utility model provides a technical solution: a PCB board reflow soldering tool, comprising a workbench 1, the workbench 1 is provided with heat dissipation holes, which can play a good heat dissipation role, a positioning mechanism 2 is provided on the top of the workbench 1, a pressing mechanism 3 is provided on the top of the positioning mechanism 2, and buckle mechanisms 4 are provided on both sides of the workbench 1. The PCB board and electronic components can be positioned by the positioning mechanism 2, and the pressing mechanism 3 is used to cooperate with the positioning mechanism 2 to press the PCB board and electronic components, thereby reducing the occurrence of cold soldering or tilting of electronic components, reducing product defective rate, and saving production costs.
[0023] The positioning mechanism 2 includes a positioning tray 201, and multiple pairs of first guide column guide sleeves 202 are installed at the bottom of the positioning tray 201. The multiple first guide column guide sleeves 202 are respectively arranged at the four corners of the bottom of the positioning tray 201, and the positioning tray 201 is connected to the workbench 1 through multiple pairs of first guide column guide sleeves 202, so that it can guide the movement of the positioning tray 201 and improve the positioning accuracy. A spring 203 is provided between the positioning tray 201 and the workbench 1, and positioning grooves are provided inside the positioning tray 201 and inside the workbench 1. The positioning grooves on the positioning tray 201 match the PCB board, and the positioning grooves inside the workbench 1 match the electronic components, so that the PCB board and the electronic components can be positioned.
[0024] The clamping mechanism 3 includes a fixed seat 301, a clamping handle 302 is rotatably connected to the front side of the fixed seat 301, a connecting block 303 is fixedly connected to the top of the clamping handle 302, a connecting frame 304 is rotatably connected to the top of the connecting block 303, a clamping column 305 is rotatably connected to the bottom end of the connecting frame 304, a guide sleeve 310 is provided on the outside of the clamping column 305, a mounting plate 306 is fixedly connected to the bottom end of the clamping column 305, the fixed seat 301 is fixedly installed on the workbench 1, the guide sleeve 310 is fixedly installed on the fixed seat 301, and the guide sleeve 310 matches the clamping column 305 so that it can The guide sleeve 310 can be used to guide the movement of the clamping column 305. The bottom end of the mounting plate 306 is fixedly connected to a pressure plate 307. Two pairs of second guide column guide sleeves 309 are provided on the pressure plate 307. The pressure plate 307 is connected to the workbench 1 through the two pairs of second guide column guide sleeves 309. The pressure plate 307 is detachably connected to the mounting plate 306, so that it can guide the movement of the pressure plate 307 and improve the positioning accuracy. A plurality of ejector rods 308 are fixedly connected to the bottom surface of the pressure plate 307. The plurality of ejector rods 308 are made of low-hardness and high-temperature resistant material to prevent damage to the PCB board.
[0025] See also Figure 1 and Figure 4 The buckle mechanism 4 includes a hook 401 and a support frame 402. The support frame 402 is rotatably connected to a rotating block 403, and the rotating block 403 is rotatably connected to an elastic hoop 404. The elastic hoop 404 matches the hook 401. The elastic hoop 404 can be hung on the hook 401 and then the rotating block 403 is rotated downward. The rotating block 403 rotates and pulls the elastic hoop 404, causing the elastic hoop 404 to deform and tighten the hook 401, and the rotating block 403 can be rotated in the opposite direction, so that the workbench 1 can be easily opened, and the status of the PCB board and electronic components can be more conveniently observed before and after welding.
[0026] During operation, the PCB board is placed in the positioning groove on the positioning support plate 201, and the electronic components are placed in the positioning groove inside the workbench 1, and then the clamping handle 302 is rotated. The rotation of the clamping handle 302 drives the connecting block 303 to rotate, and the rotation of the connecting block 303 drives the connecting frame 304 to rotate. The rotation of the connecting frame 304 drives the clamping column 305 to move downward, and the movement of the clamping column 305 drives the installation and fixing plate 306 to move. The movement of the installation and fixing plate 306 drives the pressure plate 307 to move, and the movement of the pressure plate 307 drives the ejector rod 308 to move. The ejector rod 308 is used to press the PCB board down so that it is pressed tightly against the electronic components, and the spring 203 is used to prevent the electronic components from floating up. The PCB board does not contact the electronic components, resulting in cold soldering, reducing the product defective rate and saving production costs.
[0027] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.
Claims
1. A PCB reflow soldering tool, comprising a workbench (1), characterized in that: A positioning mechanism (2) is provided on the top of the workbench (1), a pressing mechanism (3) is provided on the top of the positioning mechanism (2), and buckle mechanisms (4) are provided on both sides of the workbench (1); The positioning mechanism (2) comprises a positioning support plate (201), a plurality of first guide column guide sleeves (202) are installed at the bottom of the positioning support plate (201), a spring (203) is provided between the positioning support plate (201) and the workbench (1), and positioning grooves are provided inside the positioning support plate (201) and inside the workbench (1); The clamping mechanism (3) comprises a fixed seat (301), the front side of the fixed seat (301) is rotatably connected to a clamping handle (302), the top end of the clamping handle (302) is fixedly connected to a connecting block (303), the top end of the connecting block (303) is rotatably connected to a connecting frame (304), the bottom end of the connecting frame (304) is rotatably connected to a clamping column (305), the outer side of the clamping column (305) is provided with a guide sleeve (310), the bottom end of the clamping column (305) is fixedly connected to a mounting plate (306), the bottom end of the mounting plate (306) is fixedly connected to a pressing plate (307), the pressing plate (307) is provided with two pairs of second guide column guide sleeves (309), and the bottom surface of the pressing plate (307) is fixedly connected to a plurality of ejector rods (308).
2. The PCB reflow soldering tool according to claim 1, characterized in that: The plurality of first guide pillars and guide sleeves (202) are respectively arranged at the four corners of the bottom of the positioning support plate (201), and the positioning support plate (201) is connected to the workbench (1) through the plurality of first guide pillars and guide sleeves (202).
3. The PCB reflow soldering tool according to claim 1, characterized in that: The fixing seat (301) is fixedly mounted on the workbench (1), the guide sleeve (310) is fixedly mounted on the fixing seat (301), and the guide sleeve (310) matches the pressing column (305).
4. The PCB reflow soldering tool according to claim 1, characterized in that: The positioning groove on the positioning support plate (201) matches the PCB board, and the positioning groove inside the workbench (1) matches the electronic component.
5. The PCB reflow soldering tool according to claim 1, characterized in that: The pressing plate (307) is connected to the workbench (1) via two pairs of second guide pillars and guide sleeves (309), and the pressing plate (307) is detachably connected to the mounting and fixing plate (306).
6. The PCB reflow soldering tool according to claim 1, characterized in that: The plurality of push rods (308) are made of a low-hardness, high-temperature resistant material, and heat dissipation holes are provided on the workbench (1).
7. The PCB reflow soldering tool according to claim 1, characterized in that: The buckle mechanism (4) comprises a hook (401) and a support frame (402), and a rotating block (403) is rotatably connected to the support frame (402).
8. The PCB reflow soldering tool according to claim 7, characterized in that: An elastic hoop (404) is rotatably connected to the rotating block (403), and the elastic hoop (404) matches the hook (401).