Adjustable blowing disc and reflow soldering equipment

Abstract

The utility model relates to an adjustable blowing disc and reflow soldering equipment. The adjustable blowing disc comprises a frame, a blowing mechanism and a control mechanism, the blowing plate is mounted at the top of the frame and provided with a plurality of blowing holes, airflow flows out of the blowing holes, the blowing plate comprises a first end and a second end, the first end is hinged to the frame, and the second end can rotate along the first end under the action of external force so as to change the distance between the second end and the bottom of the frame; the adjusting assembly comprises a driving part and an adjusting rod; the driving part can drive the adjusting rod to drive the first end of the blowing plate to move up and down; the anti-high-temperature cotton structure is located below the air blowing plate and attached to the air blowing plate, liquid located at the air blowing holes can be adsorbed, the anti-high-temperature cotton structure is attached to the lower surface of the air blowing disc, the liquid located at the air blowing holes can be adsorbed, and the phenomenon that scaling powder is condensed on the air blowing disc after being transpired and atomized and then is cooled, and dew drops are formed is effectively prevented; and poor appearance quality and potential influence on the performance and the reliability of electronic components caused by the fact that the dripping dew drips on the PCB are avoided.

Description

Technical Field

[0001] The utility model relates to the field of soldering equipment, in particular to an adjustable blowing plate and reflow soldering equipment. Background Art

[0002] In the electronics manufacturing industry, reflow soldering equipment is a key piece of production equipment used to solder electronic components onto printed circuit boards (PCBs). The cooling zone of reflow soldering equipment typically uses a blower to cool the PCB after soldering, ensuring that the solder solidifies quickly and forms strong solder joints.

[0003] Currently, traditional reflow soldering equipment uses flux within the solder during the reflow process. When exposed to high temperatures, the flux evaporates and atomizes. When this evaporating airflow encounters the cool air from the blowholes in the cooling zone, condensation easily forms on the blower tray. If not promptly addressed, this condensation, when it reaches a certain level, can form dripping onto the PCB, resulting in poor appearance and potentially affecting the performance and reliability of electronic components.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects. Utility Model Content

[0005] In view of this, the embodiments of the present application provide an adjustable blower tray to solve at least one problem in the background technology, including:

[0006] frame;

[0007] a blowing plate mounted on the top of the frame and having a plurality of blowing holes through which air flows, the blowing plate comprising a first end and a second end, the first end being hinged to the frame, the second end being capable of rotating along the first end under the action of an external force to change the distance between the second end and the bottom of the frame;

[0008] An adjustment assembly includes a driving member and an adjustment rod connected to the driving member, wherein the driving member can drive the adjustment rod to move the first end of the blowing plate up and down;

[0009] The high-temperature-proof cotton structure is located below the blowing plate and is attached to the blowing plate, and can absorb the liquid located at the blowing hole.

[0010] Optionally, in the above-mentioned adjustable blowing plate, the thickness of the high-temperature resistant cotton structure is 3 mm.

[0011] Optionally, the adjustable blowing tray further comprises at least one magnetic element;

[0012] A connecting rod and a connecting rope fixed on the connecting rod are protruding from the lower surface of the blowing plate, and the other end of the connecting rope is connected to the magnetic part. The magnetic part can be adsorbed with the blowing plate to fix the high-temperature protection cotton structure located between the magnetic part and the blowing disk.

[0013] Optionally, the above-mentioned adjustable blowing tray further includes a mounting plate detachably connected to the blowing plate, the mounting plate is provided with a plurality of air holes corresponding one-to-one to the blowing holes, and the high-temperature resistant cotton structure is configured to be clamped between the mounting plate and the blowing plate.

[0014] Optionally, the above-mentioned adjustable blowing plate further includes a detection component for detecting the temperature of the PCB board above the blowing plate.

[0015] The present application also provides a reflow soldering device, comprising:

[0016] Preheating unit, capable of preheating the PCB board;

[0017] A heat preservation unit is provided on one side of the preheating unit, which can keep the temperature of the PCB board and the components thereon stable;

[0018] A reflow unit, which heats the PCB to a target temperature so that the solder pads on the PCB are connected to the component pins;

[0019] The cooling unit comprises an adjustable air blowing plate as described above, and is used for cooling the PCB board.

[0020] Compared with the prior art, the present application has the following beneficial effects: by attaching a high-temperature-proof cotton structure to the lower surface of the blowing plate, the liquid located at the blowing hole can be adsorbed, effectively preventing the dripping phenomenon caused by condensation on the blowing plate after the flux evaporates and atomizes and encounters cooling, and avoiding dripping onto the PCB to cause poor appearance quality and potential impact on the performance and reliability of electronic components; in addition, the first end of the blowing plate is hinged to the frame, the second end can be rotated under the action of external force, and the driving part drives the adjusting rod to move the first end of the blowing plate up and down, thereby realizing flexible adjustment of the blowing angle and distance, so that the reflow soldering equipment can accurately control the direction and intensity of the cooling airflow according to different PCB sizes, thicknesses and welding process requirements, meet diverse production needs, improve the consistency and stability of the cooling effect, and ensure welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is an exploded schematic diagram of the two blowing discs connected to the high-temperature protection cotton structure shown in this application;

[0022] Figure 2This is a schematic diagram of the assembly of the two blowing discs shown in this application with the high-temperature-proof cotton structure after connection;

[0023] Figure 3 It is a schematic diagram of the structure of the blowing disc shown in this application;

[0024] Figure 4 yes Figure 3 Side view of the blower tray shown.

[0025] Reference numerals:

[0026] 1- Blowing tray;

[0027] 2-High temperature proof cotton structure;

[0028] 3-blowing plate, 31-blowing hole, 32-first end, 33-second end;

[0029] 4-Framework;

[0030] 5- driving member;

[0031] 6-Adjustment rod; DETAILED DESCRIPTION

[0032] The exemplary embodiments disclosed in the present application will be described in more detail below. In the description below, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0033] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. And when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part is present in the present application.

[0034] Spatially relative terms such as "below," "beneath," "beneath," "beneath," "above," "upper," etc., may be used herein for convenience to describe the relationship of one element or feature to other elements or features shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientations depicted in the figures.

[0035] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and " / the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0036] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0037] Please refer to Figure 1-Figure 4 As shown, the adjustable air blower 1 shown in a preferred embodiment of the present application is suitable for installation in the cooling unit of the reflow soldering equipment for cooling the PCB board. In this embodiment, the reflow soldering equipment includes a preheating unit, a heat preservation unit, a reflow unit and a cooling unit arranged in sequence along a direction.

[0038] Specifically, the preheating unit can preheat the PCB, remove moisture from the surface of the PCB and components, and prevent thermal shock. In this embodiment, the temperature of the preheating unit can be adjusted between 50°C and 150°C, with a heating rate of 2°C / s. In other embodiments, the temperature of the preheating unit can be adjusted according to actual conditions.

[0039] The heat preservation unit is arranged on one side of the preheating unit to keep the temperature of the PCB and the components thereon stable. In this embodiment, the temperature of the heat preservation unit is controlled at 150°C-200°C for 60 seconds.

[0040] The reflow unit heats the PCB to the target temperature, allowing the solder pads on the PCB to connect to the component pins. The reflow unit can reach temperatures between 200°C and 260°C, with the heating rate and holding time adjusted to suit different soldering requirements.

[0041] The cooling unit includes the above-mentioned adjustable air blowing plate 1. After the PCB board is soldered in the reflow unit, it enters the cooling unit for cooling.

[0042] like Figure 1 and Figure 2 As shown, two blow trays 1 are connected relative to each other as a set. Each adjustable blow tray 1 comprises a frame 4, a blow plate 3, and a heat-resistant cotton structure 2 positioned below the blow plate 3. The blow plate 3 is mounted on top of the frame 4 and has a plurality of blow holes 31 through which air flows to cool the PCB. The heat-resistant cotton structure 2 is attached to the blow plate 3 and absorbs liquid located at the blow holes 31, preventing condensation on the blow tray 1 caused by the evaporation and atomization of the flux. This prevents condensation from dripping onto the PCB, potentially affecting the appearance and reliability of the electronic components.

[0043] It should be noted that, in this embodiment, the diameter of the blowing hole 31 is 2 mm, which can ensure that the airflow is blown out at an appropriate speed and flow rate, so that it will not be too strong to cause damage to the components on the PCB board, and can effectively cool the board; the thickness of the high-temperature protection cotton structure 2 is 3 mm, which can not only achieve the adsorption of condensation near the blowing hole 31, but also meet the cooling requirements of the reflow soldering cooling zone for the PCB board, so that the high-temperature protection cotton structure 2 will not be too thick, which will affect the wind effect and fail to cool the PCB; nor will the high-temperature protection cotton structure 2 be too thin, which will increase the frequency of its replacement.

[0044] In this embodiment, the adjustable blower plate 1 also includes at least one magnetic element. A connecting rod and a connecting rope are protruding from the lower surface of the blower plate 3. The other end of the connecting rope is connected to the magnetic element. When the heat-resistant cotton structure 2 needs to be fixed, the magnetic element is attracted to the blower plate 3, thereby securing the heat-resistant cotton structure 2 between the magnetic element and the blower plate 3. This fixing method is simple and reliable, and it facilitates the installation and replacement of the heat-resistant cotton structure 2.

[0045] In another embodiment, the adjustable blowing tray 1 further includes a mounting plate detachably connected to the blowing plate 3. The mounting plate is provided with a plurality of air holes corresponding one to one with the blowing holes 31. The heat-resistant cotton structure 2 is configured to be clamped between the mounting plate and the blowing plate 3, which can also achieve the fixation of the heat-resistant cotton structure 2, facilitate the replacement and maintenance of the heat-resistant cotton structure 2, and ensure that the blowing tray 1 always maintains good adsorption performance.

[0046] As described above, the blowing plate 3 includes a first end 32 and a second end 33. The first end 32 is hinged to the frame 4. The second end 33 can rotate along the first end 32 under the action of an external force to change the distance between the second end 33 and the bottom of the frame 4, so as to flexibly adjust the blowing angle to adapt to PCB boards of different sizes and shapes, thereby ensuring uniformity and optimal cooling effect.

[0047] In this embodiment, the adjustable blowing plate 1 further includes an adjustment assembly that drives the second end 33 of the blowing plate 3 to move relative to the frame 4 to change the distance between the second end 33 and the bottom of the frame 4, thereby changing the angle of the blowing plate 1 relative to the PCB. Specifically, the adjustment assembly includes a driver 5 and an adjustment rod 6 connected to the driver 5. The driver 5 is capable of driving the adjustment rod 6 to move the first end 32 of the blowing plate 3 up and down, thereby adjusting the blowing angle and distance according to actual needs and improving cooling efficiency. It should be noted that in this embodiment, the driver 5 is a cylinder disposed on the outside of the blowing plate 1.

[0048] Furthermore, the adjustable air blower plate 1 includes a detector for detecting the temperature of the PCB above the air blower plate 3. This detector is connected to the control assembly to transmit real-time temperature information on the PCB to the control assembly, which in turn controls the cylinder's output shaft to move upward a target distance, thereby driving the adjustment rod 6 to move the second end 33 of the air blower plate 1, providing precise cooling control and improving welding quality. This detector can be a temperature sensor.

[0049] In summary, in this embodiment, the cooling unit includes the aforementioned adjustable air blower. After the PCB board passes through the reflow unit for soldering, it enters the cooling unit. The adjustable air blower rapidly cools the PCB board by adjusting the blowing angle and intensity. The anti-high-temperature cotton structure absorbs any condensation that may occur, preventing it from dripping onto the PCB board. The detection component monitors the temperature of the PCB board in real time and stops cooling when the temperature reaches a set value. This ensures that the temperature of the PCB board drops evenly during the cooling process, avoiding soldering defects caused by excessive local temperature differences and preventing condensation dripping from adversely affecting the PCB board.

[0050] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. An adjustable blowing tray, characterized in that: include: frame; a blowing plate mounted on the top of the frame and having a plurality of blowing holes through which air flows, the blowing plate comprising a first end and a second end, the first end being hinged to the frame, the second end being capable of rotating along the first end under the action of an external force to change the distance between the second end and the bottom of the frame; An adjustment assembly includes a driving member and an adjustment rod connected to the driving member, wherein the driving member can drive the adjustment rod to move the first end of the blowing plate up and down; The high-temperature-proof cotton structure is located below the blowing plate and is attached to the blowing plate, and can absorb the liquid located at the blowing hole.

2. The adjustable blowing tray according to claim 1, characterized in that: The thickness of the high temperature proof cotton structure is 3 mm.

3. The adjustable blowing tray according to claim 1, characterized in that: The adjustable blowing disc further comprises at least one magnetic attraction member; A connecting rod and a connecting rope fixed on the connecting rod are protruding from the lower surface of the blowing plate, and the other end of the connecting rope is connected to the magnetic part. The magnetic part can be adsorbed with the blowing plate to fix the high-temperature protection cotton structure located between the magnetic part and the blowing disk.

4. The adjustable blowing tray according to claim 1, characterized in that: The adjustable blowing tray also includes a mounting plate detachably connected to the blowing plate, and the mounting plate is provided with a plurality of air holes corresponding one to one with the blowing holes, and the high-temperature resistant cotton structure is configured to be clamped between the mounting plate and the blowing plate.

5. The adjustable blowing tray according to claim 1, characterized in that: The adjustable blowing plate further includes a detection component for detecting the temperature of the PCB board above the blowing plate.

6. A reflow soldering device, characterized in that: include: Preheating unit, capable of preheating the PCB board; A heat preservation unit is provided on one side of the preheating unit, which can keep the temperature of the PCB board and the components thereon stable; A reflow unit, which heats the PCB to a target temperature so that the solder pads on the PCB are connected to the component pins; A cooling unit comprising the adjustable air blowing plate according to any one of claims 1 to 5, for cooling a PCB board.

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