Feeding device for electroplating chemical layer additive

Abstract

The utility model provides a feeding device for an electroplating chemical layer additive, and relates to the technical field of semiconductor manufacturing. Comprising a support frame, a liquid barrel, a feeding pipe and a liquid pump, the liquid material is arranged on the support frame and is used for placing an additive; one end of the feeding pipe extends into the liquid material barrel, and the other end of the feeding pipe is used for being connected with a storage barrel of an electroplating machine table; the liquid pump is arranged on the feeding pipe and used for pumping the additive in the liquid material barrel into the storage barrel. According to the automatic feeding device, automatic feeding of the storage barrels of the electroplating machine table is achieved, the risk that operators make contact with dangerous chemicals is reduced, and the safety in the working process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a feeding device for electroplating chemical layer additives. Background Art

[0002] During semiconductor manufacturing, conductive paths must be formed on the wafer to connect various electronic components, such as transistors, resistors, and capacitors. These paths are called interconnects or metal lines. Copper is the primary conductive material because of its lower resistivity and higher electromigration resistance, making it superior to the aluminum interconnects used earlier. Due to its improved electromigration resistance, copper interconnects have become the mainstream technology in modern integrated circuit manufacturing.

[0003] Existing devices for electroplating copper on wafer surfaces often require manual addition of chemical additives into a barrel on the machine, which is then added to the plating solution through the machine. Since chemical additives are often hazardous chemicals, they pose a significant safety hazard to operators and are prone to production accidents. Utility Model Content

[0004] The present invention mainly provides a feeding device for electroplating chemical layer additives, which is used to solve the technical problems mentioned in the above background technology, such as chemical additives are often chemical hazardous substances, pose a great safety hazard to operators, and are prone to production accidents.

[0005] The technical solution adopted by the present invention to solve the above technical problems is:

[0006] A feeding device for electroplating chemical layer additives includes a support frame, a liquid material barrel, a feed pipe and a liquid pump; the liquid material is arranged on the support frame for placing the additive; one end of the feed pipe extends into the liquid material barrel, and the other end of the feed pipe is used to connect to the storage barrel of the electroplating machine; the liquid pump is arranged on the feed pipe for drawing the additive in the liquid material barrel into the storage barrel.

[0007] Optionally, a first sealing cover is provided at the connection between the feed pipe and the storage barrel, and the first sealing cover is used to cover the storage barrel. A first chemical sensor is provided in the first sealing cover for identifying the type of additive in the storage barrel.

[0008] Optionally, a second sealing cover is provided at the connection between the feed pipe and the liquid barrel, the second sealing cover is provided on the liquid barrel, and a second chemical sensor is provided in the second sealing cover for identifying the type of additive in the liquid barrel.

[0009] Optionally, a liquid level sensor is further provided on the first sealing cover, and the liquid level sensor is used to monitor the amount of additive in the storage barrel.

[0010] Optionally, the liquid level sensor is a caliper-type sensor.

[0011] Optionally, a flow controller is further provided on the feed pipe, and the flow controller is located between the liquid pump and the second sealing cover, and is used to control the flow of the additive in the feed pipe.

[0012] Optionally, the flow controller is an electric ball valve.

[0013] Optionally, the liquid pump is a rechargeable pump.

[0014] Optionally, a plurality of universal wheels are provided at the bottom of the support frame.

[0015] Optionally, the feeding device for the electroplating chemical layer additive also includes a control unit; the control unit is electrically connected to the liquid pump, the first chemical sensor, the second chemical sensor, the liquid level sensor and the flow controller, respectively; the control unit is used to receive a first type of signal sent by the first chemical sensor and a second type of signal sent by the second chemical sensor, and when the first type of signal is the same as the second type of signal, the liquid pump is controlled to turn on, and when the first type of signal is different from the second type of signal, the liquid pump is controlled to turn off; the controller is also used to receive a liquid level signal sent by the liquid level sensor, and control the flow controller to adjust the flow of the additive in the feed pipe according to the liquid level signal.

[0016] The present application provides a feeding device for electroplating chemical layer additives, which realizes automatic feeding of the storage barrel of the electroplating machine by arranging a liquid barrel for storing additives on a support frame, connecting the liquid barrel with the storage barrel through a feeding pipe, and arranging a liquid pump on the feeding pipe to pump the chemical additives in the liquid barrel into the storage barrel of the electroplating machine through the feeding pipe, thereby reducing the risk of operators being exposed to hazardous chemicals and improving the safety during the working process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic structural diagram of a feeding device for electroplating chemical layer additives in this application;

[0019] Figure 2 This is a schematic diagram of the internal structure of the first sealing cover of this application;

[0020] Figure 3 This is a schematic diagram of the internal structure of the second sealing cover of this application.

[0021] Icons: 100-support frame; 110-universal wheel; 200-liquid barrel; 300-feeding pipe; 310-first sealing cover; 311-first chemical sensor; 320-second sealing cover; 321-second chemical sensor; 400-liquid pump; 500-liquid level sensor; 600-flow controller; 700-storage barrel.

[0022] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In this application, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; it can mean mechanical connection or electrical connection; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0027] Existing copper electroplating equipment for wafers often requires manual addition of chemical additives into a barrel on the machine, which then adds the additives to the plating solution. Because these additives are often hazardous chemicals, they pose significant safety risks to operators and can easily lead to production accidents. To address these issues, embodiments of the present invention provide the following technical solutions to overcome them.

[0028] Please refer to Figures 1 to 3 , an embodiment of the present application provides a feeding device for electroplating chemical layer additives, including a support frame 100, a liquid material barrel 200, a feed pipe 300 and a liquid pump 400; the liquid material is arranged on the support frame 100 for placing additives; one end of the feed pipe 300 extends into the liquid material barrel 200, and the other end of the feed pipe 300 is used to be connected to the storage barrel 700 of the electroplating machine; the liquid pump 400 is arranged on the feed pipe 300 for drawing the additives in the liquid material barrel 200 into the storage barrel 700.

[0029] Specifically, the support frame 100 serves as the basic structure of the entire loading device. The support frame 100 is used to fix and support components such as the liquid barrel 200, the feed pipe 300 and the liquid pump 400 to ensure the stable operation of the device. The liquid barrel 200 is placed on the support frame 100 and is used to store the chemical additives required in the electroplating process. The design of the liquid barrel 200 generally takes into account the storage safety and convenience of chemicals. One end of the feed pipe 300 is connected to the inside of the liquid barrel 200 for absorbing the chemical additives in the barrel, and the other end is connected to the storage barrel 700 of the electroplating machine for delivering the additives to the storage barrel 700. The liquid pump 400 is arranged on the feed pipe 300. The function of the liquid pump 400 is to generate sufficient pressure to pump the chemical additives in the liquid barrel 200 through the feed pipe 300 into the storage barrel 700 of the electroplating machine.

[0030] It is understandable that there can be multiple liquid barrels 200 that can store different types of chemical additives. There can also be multiple feed pipes 300, which are arranged one-to-one corresponding to the liquid barrels 200. Each storage barrel 700 can also correspond one-to-one to the liquid barrel 200 to add different types of chemical additives. Each feed pipe 300 is provided with a liquid pump 400.

[0031] The above-described arrangement reduces the need for direct manual handling of chemical additives, minimizing the risk of chemical leaks and operator exposure to hazardous environments. The presence of the liquid pump 400 and feed pipe 300 makes it easier to monitor the flow of the additive, allowing for timely identification and resolution of potential problems during the delivery process. The design of this device allows for adaptability to liquid tanks 200 of varying sizes and types, providing significant flexibility and adaptability.

[0032] The present application provides a feeding device for electroplating chemical layer additives, which is achieved by arranging a liquid barrel 200 for storing additives on a support frame 100, using a feeding pipe to connect the liquid barrel 200 with a storage barrel 700, and arranging a liquid pump 400 on the feeding pipe to pump the chemical additives in the liquid barrel 200 into the storage barrel 700 of the electroplating machine through a feeding pipe 300, thereby realizing automatic feeding of the storage barrel 700 of the electroplating machine, reducing the risk of operators being exposed to hazardous chemicals, and improving safety during the working process.

[0033] In an embodiment of the present application, a first sealing cover 310 is provided at the connection between the feed pipe 300 and the storage barrel 700. The first sealing cover 310 is used to cover the storage barrel 700. A first chemical sensor 311 is provided in the first sealing cover 310 for identifying the type of additive in the storage barrel 700.

[0034] Specifically, the first sealing cover 310 is set on the feed pipe 300. When it is necessary to add additives to the storage barrel 700, the first sealing cover 310 is covered on the storage barrel 700 to fix the feed pipe 300 in the storage barrel 700, and the first sealing cover 310 is covered on the storage barrel 700 to ensure the sealing of the storage barrel 700 and prevent the additive from volatilizing or overflowing.

[0035] The first chemical sensor 311 is built into the first sealing cover 310 and is used to monitor the type of additives in the storage barrel 700 to ensure that the added chemical additives are correct. When the first chemical sensor 311 detects that the additives in the storage barrel 700 are different from the additives in the feed pipe 300, the liquid pump 400 is shut down to prevent incorrect addition of chemical additives.

[0036] By adopting the above-mentioned configuration, the type of additive can be monitored to prevent the wrong additive from being added, thereby avoiding possible electroplating defects.

[0037] In an embodiment of the present application, a second sealing cover 320 is provided at the connection between the feed pipe 300 and the liquid barrel 200. The second sealing cover 320 is covered on the liquid barrel 200. A second chemical sensor 321 is provided in the second sealing cover 320 for identifying the type of additive in the liquid barrel 200.

[0038] Specifically, the second sealing cover 320 is arranged at the connection between the feed pipe 300 and the liquid barrel 200, and the cover is arranged on the liquid barrel 200 to ensure that the chemical additives in the liquid barrel 200 will not leak, while also preventing external pollutants from entering the barrel, thereby ensuring the purity and stability of the chemical additives and the sealing of the liquid barrel 200.

[0039] The second chemical sensor 321 is installed in the second sealing cover 320 and is used to monitor and identify the type of chemical additives in the liquid barrel 200 to ensure that the added chemical additives are correct. When the second chemical sensor 321 detects that the additives in the liquid barrel 200 are different from the additives in the storage barrel 700, the liquid pump 400 is turned off to prevent the incorrect addition of chemical additives.

[0040] The above-mentioned configuration can ensure that only the correct chemical additives are added to the electroplating machine storage barrel 700, thereby preventing additive confusion due to human error and improving the safety and reliability of the electroplating process.

[0041] In the embodiment of the present application, a liquid level sensor 500 is further provided on the first sealing cover 310 , and the liquid level sensor 500 is used to monitor the amount of the additive in the storage barrel 700 .

[0042] Specifically, the liquid level sensor 500 is integrated in the first sealing cover 310 and can monitor the liquid level of the chemical additive in the storage barrel 700. When the liquid level reaches a specified position, the liquid pump 400 is shut down to prevent excessive overflow of the additive.

[0043] It should be noted that there are many types of liquid level sensors 500. For example, float sensors utilize the principle that a float moves up and down with changes in liquid level, converting the float position into an electrical signal mechanically or electronically. Capacitive sensors use the effect of liquid on capacitance, causing changes in liquid level to cause changes in capacitance. The sensor determines the liquid level by monitoring this capacitance. Hydrostatic pressure sensors use the principle of hydrostatic pressure to infer the liquid level by measuring the pressure exerted by the liquid on the sensor. These sensors can be flexibly configured according to actual needs.

[0044] The above-mentioned configuration can prevent excessive addition of chemical additives, which would cause the chemical additives to overflow from the storage barrel 700 and contaminate the electroplating machine.

[0045] In the embodiment of the present application, the liquid level sensor 500 is preferably a caliper-type sensor.

[0046] Specifically, the caliper-type liquid level sensor 500 is a non-contact liquid level measurement device that uses a caliper or clamping device to attach to the outside of a container or pipe to measure the height of the liquid. This sensor typically uses radar or ultrasonic technology to determine the liquid level without direct contact with the liquid, which prevents contamination or damage to the sensor and reduces maintenance requirements.

[0047] In an embodiment of the present application, a flow controller 600 is further provided on the feed pipe 300 . The flow controller 600 is located between the liquid pump 400 and the second sealing cover 320 and is used to control the flow of the additive in the feed pipe 300 .

[0048] Specifically, the flow controller 600 is installed on the feed pipe 300, between the liquid pump 400 and the second sealing cover 320. Such a layout allows the flow controller 600 to directly regulate the flow of chemical additives extracted from the liquid barrel 200. The main function of the flow controller 600 is to control the flow of chemical additives through the feed pipe 300. It adjusts the flow rate through built-in control mechanisms, such as the opening and closing of valves, to ensure that the additives are delivered at a predetermined rate. The flow controller 600 is usually equipped with a precise adjustment mechanism, including electronic or mechanical valves, which can make fine adjustments to the flow rate to suit different process requirements. The flow controller 600 works in conjunction with the liquid pump 400. The liquid pump 400 is responsible for generating the pressure required to deliver the additives, while the flow controller 600 accurately controls the flow to ensure that the additives are added according to the set parameters.

[0049] By adopting the above-mentioned configuration, the flow rate of the chemical additive is precisely controlled to prevent the chemical additive from flowing out of the storage barrel 700 due to excessive flow rate.

[0050] In an embodiment of the present application, the flow controller 600 is an electric ball valve.

[0051] Specifically, the core of an electric ball valve is an electric actuator, which converts electrical energy into mechanical energy through a motor drive to open and close the ball valve. This actuator typically uses a DC or AC motor and can receive external commands through a controller, enabling remote control of the ball valve. The opening and closing member (ball) of an electric ball valve is driven by the valve stem and rotates around the stem's axis. When the electric actuator receives a control signal, it drives the valve stem to rotate, causing the ball to rotate 90 degrees within the valve seat, thereby opening or closing the valve. By precisely controlling the valve opening, an electric ball valve can regulate fluid flow. The regulating function of an electric ball valve is particularly important in applications where precise control of media flow is required.

[0052] In an embodiment of the present application, the liquid pump 400 is a rechargeable pump.

[0053] Specifically, a rechargeable pump uses a built-in battery that is recharged via an external charger, storing energy for later use. Its greatest advantage is portability. It doesn't require a fixed power outlet and can be used anywhere, making it convenient for the loading device to be moved around anytime.

[0054] In an embodiment of the present application, a plurality of universal wheels 110 are provided at the bottom of the support frame 100 .

[0055] Specifically, universal wheels 110, also known as movable casters, are a unique wheel design whose core feature is the ability of their wheel brackets to rotate 360 ​​degrees on a horizontal plane. This design allows equipment equipped with universal wheels 110 to change direction simply by rotating the wheels without changing the overall orientation of the equipment, greatly improving the flexibility and mobility of the loading device.

[0056] In an embodiment of the present application, the feeding device for the electroplating chemical layer additive also includes a control unit; the control unit is electrically connected to the liquid pump 400, the first chemical sensor 311, the second chemical sensor 321, the liquid level sensor 500 and the flow controller 600 respectively; the control unit is used to receive a first type of signal sent by the first chemical sensor 311 and a second type of signal sent by the second chemical sensor 321, and when the first type of signal is the same as the second type of signal, the liquid pump 400 is controlled to be turned on, and when the first type of signal is different from the second type of signal, the liquid pump 400 is controlled to be turned off; the controller is also used to receive the liquid level signal sent by the liquid level sensor 500, and control the flow controller 600 to adjust the flow of the additive in the feed pipe 300 according to the liquid level signal.

[0057] Specifically, the control unit receives a first type signal (indicating the type of additive in storage barrel 700) from first chemical sensor 311 and a second type signal (indicating the type of additive in liquid tank 200) from second chemical sensor 321. The control unit then compares the first and second type signals. If the first and second type signals are identical, the control unit turns on liquid pump 400; if they are different, the control unit turns off liquid pump 400. This ensures that the additive types in storage barrel 700 and liquid tank 200 are consistent, preventing the addition of the wrong type of additive. The control unit also receives a liquid level signal from liquid level sensor 500 and, based on the liquid level signal, controls flow controller 600 to adjust the flow rate of the additive in feed pipe 300, ensuring that the amount of additive added meets process requirements.

[0058] The setting of the control unit improves the safety, efficiency and quality of production by precisely controlling the additive addition process.

[0059] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A feeding device for electroplating chemical layer additives, characterized in that: It includes a support frame, a liquid barrel, a feed pipe and a liquid pump; The liquid material barrel is arranged on the support frame and is used for placing additives; One end of the feed pipe extends into the liquid barrel, and the other end of the feed pipe is used to connect with the storage barrel of the electroplating machine; The liquid pump is arranged on the feed pipe and is used to pump the additive in the liquid barrel into the storage barrel.

2. The feeding device for electroplating chemical layer additives according to claim 1, characterized in that: A first sealing cover is provided at the connection between the feed pipe and the storage barrel. The first sealing cover is used to cover the storage barrel. A first chemical sensor is provided in the first sealing cover for identifying the type of additive in the storage barrel.

3. The feeding device for electroplating chemical layer additives according to claim 2, characterized in that: A second sealing cover is provided at the connection between the feed pipe and the liquid barrel. The second sealing cover is provided on the liquid barrel. A second chemical sensor is provided in the second sealing cover for identifying the type of additive in the liquid barrel.

4. The feeding device for electroplating chemical layer additives according to claim 3, characterized in that: The first sealing cover is also provided with a liquid level sensor, which is used to monitor the amount of additive in the storage barrel.

5. The feeding device for electroplating chemical layer additives according to claim 4, characterized in that: The liquid level sensor is a caliper type sensor.

6. The feeding device for electroplating chemical layer additives according to claim 4, characterized in that: The feed pipe is also provided with a flow controller, which is located between the liquid pump and the second sealing cover and is used to control the flow of the additive in the feed pipe.

7. The feeding device for electroplating chemical layer additives according to claim 6, characterized in that: The flow controller is an electric ball valve.

8. The feeding device for electroplating chemical layer additives according to claim 7, characterized in that: The liquid pump is a rechargeable pump.

9. The feeding device for electroplating chemical layer additives according to claim 8, characterized in that: A plurality of universal wheels are provided at the bottom of the support frame.

10. The feeding device for electroplating chemical layer additives according to claim 9, characterized in that: Also included is a control unit; The control unit is electrically connected to the liquid pump, the first chemical sensor, the second chemical sensor, the liquid level sensor and the flow controller respectively; The control unit is configured to receive a first type of signal sent by the first chemical sensor and a second type of signal sent by the second chemical sensor, and control the liquid pump to turn on when the first type of signal is the same as the second type of signal, and control the liquid pump to turn off when the first type of signal is different from the second type of signal; The controller is further configured to receive a liquid level signal sent by the liquid level sensor, and control the flow controller to adjust the flow of the additive in the feed pipe according to the liquid level signal.

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