Air floatation shock absorber and system for wafer film thickness detection

Abstract

The utility model discloses an air floatation shock absorber and system for wafer film thickness detection, which comprises a detection device, a bottom plate is fixed at the lower end of the detection device, a sleeving column capable of moving up and down is sleeved in a fixed column, rotatable threaded cylinders are mounted at four corners of the lower end of the bottom plate, and the rotatable threaded cylinders are connected with the bottom plate through a threaded rod. According to the device, the rotatable threaded cylinders are installed at the four corners of the lower end of the detection equipment, and the rotatable threaded cylinders rotate with the rotating shafts at the upper ends as the circle center axes; the rotatable threaded cylinder is rotated to enable the bolt column to completely enter the internal position of the rotatable threaded cylinder, so that the installation of the detection equipment and the air floating shock absorber is completed, the simplified installation mode reduces the possibility of errors of operators in the connection process, and the air floating shock absorber can work normally after being installed.

Description

Technical Field

[0001] The utility model relates to the technical field of air-floating shock absorbers, in particular to an air-floating shock absorber and a system for wafer film thickness detection. Background Art

[0002] An air-floating shock absorber is a device that uses the principle of gas pressure to reduce vibration and impact. It provides stable support by forming a layer of air film between the base and the equipment, reducing the impact of external vibration on the measurement results. The air-floating shock absorber can effectively isolate environmental vibrations, ensuring that the detection equipment maintains a high degree of stability and accuracy during operation, thereby improving the accuracy and reliability of wafer film thickness detection.

[0003] When air-floating shock absorbers are used in equipment, there is a problem of complex installation, which may cause operators to make errors, such as improper connection or missing parts, which will lead to the performance of the air-floating shock absorbers being degraded. Therefore, a new device is needed to solve the current problems. Utility Model Content

[0004] The purpose of the present utility model is to provide an air-floating shock absorber and system for wafer film thickness detection, so as to solve the problem that the installation method of the air-floating shock absorber proposed in the above-mentioned background technology is too complicated, which may cause errors by the operator, such as improper connection or missing parts, which will lead to the performance degradation of the air-floating shock absorber. Therefore, the market needs a new device to solve the current problems.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an air-floating shock absorber for wafer film thickness detection, comprising a detection device, a bottom plate fixed at the lower end of the detection device, fixed columns fixed at the four corners of the lower end of the bottom plate, a sleeve column that can move up and down is sleeved at the inner position of the fixed column, a rotatable threaded barrel is installed at the four corners of the lower end of the bottom plate, the rotatable threaded barrel is installed at the lower end of the bottom plate through a rotating shaft fixed at the upper end, a bolt column is installed at the inner side of the rotatable threaded barrel, a fixing plate is fixed at the lower end of the bolt column, and the upper end of the fixing plate is provided with insertion holes at the left and right sides;

[0006] An upper guard plate is fixed at the lower end of the insertion hole, a rubber pad is provided at the upper end of the upper guard plate, damping columns are provided at the four corners of the lower end of the upper guard plate, a lower guard plate is fixed at the lower end of the damping columns, a compressed air cavity is provided at the middle position of the upper end of the lower guard plate, and an air valve is provided at the front end of the compressed air cavity.

[0007] Preferably, a supporting steel plate is provided at the upper end of the compressed air cavity, and a rubber diaphragm is provided at the upper end of the supporting steel plate.

[0008] Preferably, the rubber diaphragm is fixed at the lower end of the upper protective plate.

[0009] Preferably, the valve controls the gas flow and pressure inside the compressed air cavity by adjusting the degree of opening and closing.

[0010] Preferably, the rotatable threaded barrel is rotated to allow the bolt column to enter an inner position.

[0011] Preferably, the installation of the rotatable threaded barrel and the bolt column enables the air-floating shock absorber to be installed at the lower end position of the detection equipment, and the rotatable threaded barrel rotates with the rotation axis as the central axis.

[0012] Preferably, the sleeve column is sleeved at an inner position of the fixed column and can move.

[0013] Preferably, the rotatable threaded barrel is mounted on the bolt column so that the sleeve column can be inserted into an inner position of the insertion hole.

[0014] To achieve the above-mentioned purpose, the present invention also provides the following technical solution: an air flotation shock absorption system for wafer film thickness detection, characterized in that the air flotation shock absorption system includes four air flotation shock absorbers as described above; the four air flotation shock absorbers are arranged at intervals in the circumferential direction, and the four air flotation shock absorbers are connected to each other.

[0015] Compared with the prior art, the present invention provides an air-floating shock absorber for wafer film thickness detection, which has the following beneficial effects:

[0016] 1. This device is equipped with rotatable threaded barrels at the four corners of the lower end of the detection equipment. The rotatable threaded barrel rotates with the rotating shaft at the upper end as the central axis. When the rotatable threaded barrel contacts the bolt column at the upper end of the air-floating shock absorber, the rotatable threaded barrel is rotated so that the bolt column completely enters the internal position of the rotatable threaded barrel, thus completing the installation of the detection equipment and the air-floating shock absorber. The simplified installation method reduces the possibility of errors made by the operator during the connection process, so that the air-floating shock absorber can work normally after installation.

[0017] 2. When the air-floating shock absorber is installed at the lower end of the detection equipment, the sleeve column can be pulled out from the internal position of the fixed column and inserted into the internal position of the insertion hole, so that the position of the air-floating shock absorber can be limited. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1The utility model is a schematic diagram of the structure of an air-floating shock absorber for wafer film thickness detection.

[0019] Figure 2 The utility model is a structural schematic diagram of an air-floating shock absorber detection device for wafer film thickness detection.

[0020] Figure 3 The utility model is a schematic diagram of the bottom structure of an air-floating shock absorber base plate for wafer film thickness detection.

[0021] Figure 4 The utility model is a schematic diagram of the cross-sectional structure of an air-floating shock absorber bottom plate for wafer film thickness detection.

[0022] In the figure: 1. Compressed air chamber; 2. Damping column; 3. Support steel plate; 4. Rubber diaphragm; 5. Fixing plate; 6. Bolt column; 7. Insertion hole; 8. Rubber pad; 9. Upper guard plate; 10. Lower guard plate; 11. Valve nozzle; 12. Testing equipment; 13. Base plate; 14. Rotatable threaded cylinder; 15. Fixing column; 16. Socket column; 17. Rotating shaft. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] The utility model provides Figure 1-4 The air-floating shock absorber for wafer film thickness detection shown in the figure includes a detection device 12, a bottom plate 13 is fixed at the lower end of the detection device 12, a fixed column 15 is fixed at the lower end of the bottom plate 13 at the four corners, a sleeve column 16 that can move up and down is sleeved at the inner position of the fixed column 15, a rotatable threaded barrel 14 is installed at the four corners of the lower end of the bottom plate 13, the rotatable threaded barrel 14 is installed at the lower end of the bottom plate 13 through a rotating shaft 17 fixed at the upper end, and a sleeve column 16 that can move up and down is sleeved at the inner position of the fixed column 15. It is equipped with a bolt column 6, a fixing plate 5 is fixed at the lower end of the bolt column 6, an upper end of the fixing plate 5 is provided with insertion holes 7 at the left and right sides, an upper guard plate 9 is fixed at the lower end of the insertion hole 7, a rubber pad 8 is provided at the upper end of the upper guard plate 9, a damping column 2 is provided at the four corners of the lower end of the upper guard plate 9, a lower guard plate 10 is fixed at the lower end of the damping column 2, a compressed air chamber 1 is provided at the middle position of the upper end of the lower guard plate 10, and an air valve 11 is provided at the front end of the compressed air chamber 1.

[0025] Compressed air chamber 1 stores and supplies gas. When the equipment requires shock absorption, the gas in compressed air chamber 1 is released. When the gas is released from compressed air chamber 1, it enters the bottom of the shock absorber through valve 11, forming an air film. This air film isolates the detection equipment 12 from the ground and provides buoyancy support.

[0026] like Figure 3 and Figure 4 As shown, a supporting steel plate 3 is provided at the upper end position of the compressed air chamber 1, and a rubber diaphragm 4 is provided at the upper end position of the supporting steel plate 3. The rubber diaphragm 4 is fixed at the lower end position of the upper guard plate 9. The valve mouth 11 controls the gas flow and pressure inside the compressed air chamber 1 by adjusting the opening and closing degree. The rotatable threaded barrel 14 rotates to allow the bolt column 6 to enter the internal position. The installation of the rotatable threaded barrel 14 and the bolt column 6 allows the air-floating shock absorber to be installed at the lower end position of the detection equipment 12. The rotatable threaded barrel 14 rotates with the rotating shaft 17 as the central axis. The sleeve column 16 is sleeved at the internal position of the fixed column 15 and can be moved. The installation of the rotatable threaded barrel 14 and the bolt column 6 allows the sleeve column 16 to be inserted into the internal position of the insertion hole 7.

[0027] When the air-floating shock absorber is installed at the lower end of the detection device 12, the sleeve column 16 can be pulled out from the inner position of the fixed column 15 and inserted into the inner position of the insertion hole 7, so that the position of the air-floating shock absorber can be limited.

[0028] Based on the same technical concept, the present invention also provides an air flotation damping system for wafer film thickness testing. This air flotation damping system can be applied beneath the testing platform of a corresponding wafer film thickness testing device to maintain stability. The air flotation damping system includes four air flotation dampers as described above; the four air flotation dampers are arranged circumferentially and spaced apart. For example, they can be located at the four corners of the bottom of the testing platform.

[0029] At the same time, the four air-floating shock absorbers are interconnected. This arrangement forms a unified whole, facilitating rapid adjustment. This is because, when the pressure in one of the four air-floating shock absorbers changes, the remaining air-floating shock absorbers can simultaneously adjust their pressure balance based on the principle of interconnected vessels, thus quickly reaching a new equilibrium.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An air-floating shock absorber for wafer film thickness detection, characterized in that: The invention comprises a detection device (12), wherein a bottom plate (13) is fixed at the lower end of the detection device (12), a fixing column (15) is fixed at the four corners of the lower end of the bottom plate (13), a sleeve column (16) that can move up and down is sleeved at the inner position of the fixing column (15), a rotatable threaded cylinder (14) is installed at the four corners of the lower end of the bottom plate (13), the rotatable threaded cylinder (14) is installed at the lower end of the bottom plate (13) through a rotating shaft (17) fixed at the upper end, a bolt column (6) is installed at the inner side of the rotatable threaded cylinder (14), a fixing plate (5) is fixed at the lower end of the bolt column (6), and the upper end of the fixing plate (5) is provided with insertion holes (7) at the left and right sides. An upper guard plate (9) is fixed at the lower end of the insertion hole (7), a rubber pad (8) is provided at the upper end of the upper guard plate (9), damping columns (2) are provided at the four corners of the lower end of the upper guard plate (9), a lower guard plate (10) is fixed at the lower end of the damping column (2), a compressed air cavity (1) is provided at the middle position of the upper end of the lower guard plate (10), and a valve (11) is provided at the front end of the compressed air cavity (1).

2. The air-floating shock absorber for wafer film thickness detection according to claim 1, characterized in that: A supporting steel plate (3) is provided at the upper end of the compressed air chamber (1), and a rubber diaphragm (4) is provided at the upper end of the supporting steel plate (3).

3. The air-floating shock absorber for wafer film thickness detection according to claim 2, characterized in that: The rubber diaphragm (4) is fixed at the lower end of the upper protective plate (9).

4. The air-floating shock absorber for wafer film thickness detection according to claim 1, characterized in that: The air valve (11) controls the gas flow and pressure inside the compressed air chamber (1) by adjusting the degree of opening and closing.

5. The air-floating shock absorber for wafer film thickness detection according to claim 1, characterized in that: The rotatable threaded barrel (14) is rotated to allow the bolt column (6) to enter the inner position.

6. The air-floating shock absorber for wafer film thickness detection according to claim 5, characterized in that: The installation of the rotatable threaded barrel (14) and the bolt column (6) enables the air-floating shock absorber to be installed at the lower end of the detection device (12), and the rotatable threaded barrel (14) rotates with the rotating shaft (17) as the central axis.

7. The air-floating shock absorber for wafer film thickness detection according to claim 1, characterized in that: The sleeve column (16) is sleeved at an inner position of the fixed column (15) and can move.

8. The air-floating shock absorber for wafer film thickness detection according to claim 7, characterized in that: The installation of the rotatable threaded barrel (14) and the bolt column (6) enables the sleeve column (16) to be inserted into the inner position of the insertion hole (7).

9. An air flotation damping system for wafer film thickness detection, characterized in that: The air-floating shock absorption system comprises four air-floating shock absorbers according to any one of claims 1 to 8; the four air-floating shock absorbers are arranged at intervals in the circumferential direction, and the four air-floating shock absorbers are connected to each other.

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