Integrated circuit semiconductor processing cooling mechanism

Abstract

The utility model relates to the technical field of circuit semiconductors, and discloses an integrated circuit semiconductor processing cooling mechanism which comprises a shell, the right end of the shell is fixedly connected with a motor, the driving end of the motor is connected with a mounting frame through a rotating assembly so as to be used for uniformly dissipating heat of a semiconductor, and the inner wall of the mounting frame is provided with a placing frame. Knobs are rotationally connected to the inner walls of the placing frames, sliding plates are connected to the rear ends of the knobs through transmission assemblies and used for driving the sliding plates to move, and the sliding plates are connected through rotating assemblies and used for driving the sliding plates on the two sides to move synchronously. According to the utility model, the semiconductor can be clamped and fixed in the placing racks through the rotary knobs, the placing racks are installed on the installation frame at the same time, and then the placing racks on the two sides are driven to rotate through the motor, so that each part of the surface of the semiconductor can be alternately exposed in cold air, thereby realizing more uniform heat distribution, reducing local hot spots and improving the cooling efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit semiconductors, in particular to an integrated circuit semiconductor processing cooling mechanism. Background Art

[0002] During the integrated circuit semiconductor processing, excessively high temperatures will reduce the electrical performance and processing speed of the semiconductor. The cooling mechanism can effectively manage, dissipate or remove excess heat generated by electrical operations, thereby keeping the equipment running within the optimal operating temperature range.

[0003] After searching, the publication number CN219347029U discloses an integrated circuit semiconductor processing cooling mechanism, comprising a cooling box body, a cold air pipe fixedly mounted on the top of the cooling box body, a plurality of nozzles fixedly mounted on the bottom of the cold air pipe, a plurality of placement plates disposed inside the cooling box body, a plurality of mounting slots formed inside the placement plates, a screw rod rotatably mounted on the inner wall of the rear side of the mounting slot, the other end of the screw rod extending to the front side of the placement plate, a first rotating wheel fixedly mounted on one end of the screw rod located in front of the placement plate, two movable blocks threadedly mounted on the surface of the screw rod, and a connecting block extending to the top of the placement plate fixedly mounted on the top of each of the two movable blocks. This integrated circuit semiconductor processing cooling mechanism can fix integrated circuit semiconductors of different sizes through two limit covers and four limit plates, and is simpler and more convenient to adjust, greatly improving the practicality of this new device.

[0004] Based on the above patent, by rotating the first rotating wheel to rotate the screw rod, the two moving blocks can be moved in opposite or opposite directions, thereby making the distance between the two limit covers adjustable, and rotating the two threaded rods respectively to move the limit plates, thereby making the distance between the two limit plates adjustable. Thus, integrated circuit semiconductors of different sizes can be fixed by the two limit covers and four limit plates, and the adjustment is simpler and more convenient, which greatly improves the practicality of the new type. However, when cooling, cold air can only be transported downward from the upper side, which easily leads to uneven heat dissipation. The uneven heat distribution may cause the temperature of some parts to be higher than other parts, which may lead to low overall cooling efficiency.

[0005] In response to this technical problem, the present application proposes an integrated circuit semiconductor processing cooling mechanism. Utility Model Content

[0006] The purpose of the utility model is to solve the shortcomings of the prior art and to propose an integrated circuit semiconductor processing cooling mechanism. The semiconductor can be clamped and fixed in a placement rack by a knob, and the placement rack is installed on a mounting frame. The placement racks on both sides are then driven to rotate by a motor, which can ensure that various parts of the semiconductor surface are alternately exposed to cold air, thereby achieving more uniform heat distribution, reducing local hot spots, and improving cooling efficiency.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] An integrated circuit semiconductor processing cooling mechanism, comprising:

[0009] The outer shell is fixedly connected to a motor at the right end of the outer shell, and the driving end of the motor is connected to a mounting frame through a rotating assembly for uniformly dissipating heat to the semiconductor. The inner walls of the mounting frames are provided with placement racks, and the inner walls of the placement racks are rotatably connected to knobs. The rear ends of the knobs are connected to sliding plates through transmission assemblies for driving the sliding plates to move. The sliding plates are connected by a rotating assembly to drive the sliding plates on both sides to move synchronously. The opposite ends of the sliding plates are provided with clamping assemblies for clamping and fixing the semiconductor. The opposite ends of the mounting frames are rotatably connected to the upper and lower parts on the left and right sides of the inner wall of the outer shell, and the upper and lower ends of the sliding plates are slidably connected to the inner wall of the placement rack;

[0010] The pull plate, the outer walls of the pull plate are slidably connected to the left and right sides of the inner wall of the placement rack, and the rear end of the pull plate is connected to the installation frame through a snap assembly for installation and removal of the installation frame.

[0011] Furthermore, the rotating assembly includes gears rotatably connected to the upper and lower parts of the right side of the inner wall of the shell, the left ends of the gears are fixedly connected to the right end of the right mounting frame, and the right ends of the lower gears are fixedly connected to the driving end of the motor.

[0012] Furthermore, a refrigerator is fixedly connected to the left end of the shell, and a heat dissipation frame is fixedly connected to the right end of the refrigerator.

[0013] Furthermore, the transmission assembly includes a threaded rod fixedly connected to the rear end of the knob, the outer wall of the threaded rod is threadedly connected to a connecting block, the outer wall of the connecting block is slidably connected to the inner wall of the placement rack, and the left and right ends of the connecting block are fixedly connected to the opposite end of the connected sliding plate.

[0014] Furthermore, the rotating assembly includes a connecting frame fixedly connected to the rear end of the sliding plate, the inner wall of the connecting frame is rotatably connected to a rotating rod, and the upper and lower ends of the rotating rod are rotatably connected to the upper and lower sides of the inner wall of the placement rack.

[0015] Furthermore, the clamping assembly includes a connecting plate fixedly connected to one side opposite to one end of the sliding plate, and the clamping plate fixedly connected to one side opposite to one end of the connecting plate.

[0016] Furthermore, the snap assembly includes a slot opened on the inner wall of the installation frame, the inner wall of the slot is provided with a card block, the front end of the card block is fixedly connected to the rear end of the pull plate, and the rear end of the card block and the front side of the inner wall of the installation frame are both arc-shaped.

[0017] Furthermore, one opposite end of the block is fixedly connected to a spring, and the other end of the spring is fixedly connected to the opposite side of the inner wall of the placement rack.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the present invention, the semiconductor can be clamped and fixed in the placement rack by a knob, and the placement rack is installed on the mounting frame. The placement racks on both sides are then driven to rotate by a motor, which can ensure that various parts of the semiconductor surface are alternately exposed to the cold air, thereby achieving a more uniform heat distribution, reducing local hot spots, and improving cooling efficiency.

[0020] 2. In the present invention, the rack can be removed from the mounting frames on both sides by pulling the pull plate toward the middle side. The operation is simple, which facilitates workers to quickly replace or install and remove semiconductors, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional diagram of an integrated circuit semiconductor processing cooling mechanism proposed by the present invention;

[0022] Figure 2 This is a cross-sectional view of the housing of an integrated circuit semiconductor processing cooling mechanism proposed by the present invention;

[0023] Figure 3 This is a cross-sectional view of an installation frame for an integrated circuit semiconductor processing cooling mechanism proposed by the present invention;

[0024] Figure 4 This is a cross-sectional view of a placement rack for an integrated circuit semiconductor processing cooling mechanism proposed by the present invention;

[0025] Figure 5 This is a structural diagram of a rotating rod of an integrated circuit semiconductor processing cooling mechanism proposed by the present invention.

[0026] Legend:

[0027] 1. Housing; 2. Refrigerator; 3. Heat dissipation frame; 4. Motor; 5. Gear; 6. Mounting frame; 7. Placement rack; 8. Pull plate; 9. Block; 10. Spring; 11. Slot; 12. Knob; 13. Threaded rod; 14. Connecting block; 15. Sliding plate; 16. Connecting frame; 17. Rotating rod; 18. Connecting plate; 19. Clamping plate. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Reference Figure 1 、 Figure 2 and Figure 5 As shown, an embodiment of the present invention provides: an integrated circuit semiconductor processing cooling mechanism, including a shell 1, a motor 4 is fixedly connected to the right end of the shell 1, and a mounting frame 6 is provided at the driving end of the motor 4 for uniformly dissipating heat to the semiconductor, and a placement rack 7 is provided on the inner wall of the mounting frame 6, and a knob 12 is rotatably connected to the inner wall of the placement rack 7, and a sliding plate 15 is provided at the rear end of the knob 12 for driving the sliding plate 15 to move, so as to drive the sliding plates 15 on both sides to move synchronously for clamping and fixing the semiconductor, and the opposite ends of the mounting frame 6 are rotatably connected to the upper and lower parts on the left and right sides of the inner wall of the shell 1, and the upper and lower ends of the sliding plate 15 are slidably connected to the inner wall of the placement rack 7, and the gear 5 is rotatably connected to the upper and lower parts of the right side of the inner wall of the shell 1, and the left end of the gear 5 is fixedly connected to At the right end of the right mounting frame 6, the right end of the lower gear 5 is fixedly connected to the driving end of the motor 4, the left end of the shell 1 is fixedly connected to the refrigerator 2, the right end of the refrigerator 2 is fixedly connected to the heat dissipation frame 3, fixedly connected to the threaded rod 13 at the rear end of the knob 12, the outer wall of the threaded rod 13 is threadedly connected to the connecting block 14, the outer wall of the connecting block 14 is slidably connected to the inner wall of the placement rack 7, the left and right ends of the connecting block 14 are fixedly connected to the opposite end of the connected sliding plate 15, the connecting frame 16 is fixedly connected to the rear end of the sliding plate 15, the inner wall of the connecting frame 16 is rotatably connected to the rotating rod 17, the upper and lower ends of the rotating rod 17 are rotatably connected to the upper and lower sides of the inner wall of the placement rack 7, the opposite side of the sliding plate 15 is fixedly connected to the connecting plate 18, and the opposite end of the connecting plate 18 is fixedly connected to the clamping plate 19.

[0030] Specifically, the working principle of the refrigerator 2 is that low-pressure and low-temperature gaseous refrigerant is sucked into the compressor, and the compressor compresses the refrigerant to make it a high-temperature and high-pressure gas. The high-temperature and high-pressure gaseous refrigerant enters the condenser. In the condenser, the refrigerant exchanges heat with the outdoor environment and is dissipated to the external environment through a fan or natural convection. The refrigerant is cooled and condensed into a high-pressure liquid. The high-pressure liquid refrigerant enters the evaporator through the expansion valve, and the low-temperature and low-pressure liquid refrigerant enters the evaporator. In the evaporator, the refrigerant absorbs the heat of the indoor air and quickly evaporates into a low-temperature and low-pressure gas. This process achieves a cooling effect, and heat is absorbed from the air in the indoor space. The semiconductor can be clamped and fixed in the placement rack 7 by the knob 12, and the placement rack 7 is installed on the mounting frame 6. The placement rack 7 on both sides is then driven to rotate by the motor 4 to ensure that various parts of the semiconductor surface are alternately exposed to the cold air, thereby achieving a more uniform heat distribution, reducing local hot spots, and improving cooling efficiency.

[0031] Reference Figure 3 and Figure 4 As shown, the pull plate 8 and the outer wall of the pull plate 8 are slidably connected to the left and right sides of the inner wall of the placement frame 7 for installation and disassembly of the installation frame 6. A slot 11 is opened on the inner wall of the installation frame 6, and a card block 9 is provided on the inner wall of the slot 11. The front end of the card block 9 is fixedly connected to the rear end of the pull plate 8. The rear end of the card block 9 and the front side of the inner wall of the installation frame 6 are both arc-shaped. The opposite end of the card block 9 is fixedly connected to a spring 10, and the other end of the spring 10 is fixedly connected to the opposite side of the inner wall of the placement frame 7.

[0032] Specifically, by pulling the pull plate 8 toward the middle side, the placement rack 7 can be removed from the installation frames 6 on both sides. The operation is simple, which facilitates workers to quickly replace or install and remove semiconductors, thereby improving work efficiency.

[0033] Working principle: First, rotate the rotating plate on the front side to the left to open it, then pull the pull plate 8 to the middle side, remove the card block 9 from the card slot 11, remove the placement rack 7 from the installation frame 6, and then insert the semiconductor into the placement rack 7. At the same time, rotate the knob 12, the knob 12 drives the threaded rod 13 to rotate, and the threaded rod 13 drives the sliding plates 15 on both sides to move forward. When the sliding plate 15 on the middle side slides, the rotating rod 17 drives the outer sliding plates 15 to slide synchronously, so that the sliding plates 15 on both sides slide in opposite directions, and drive the connecting plate 18 and the clamping plate 19 to move, and the semiconductor is clamped and fixed by the clamping plate 19, and the installed placement rack 7 is aligned with the installation frame 6 The groove between the clamping block and the mounting frame 6 is formed, and the clamping block 9 is pushed backward. When the arc surface of the clamping block 9 contacts the arc surface of the mounting frame 6, the clamping block 9 will slide inward. After the placement rack 7 is installed in place, the clamping block 9 is clamped into the clamping slot 11 by the spring 10 to complete the installation. During cooling, the motor 4 and the refrigerator 2 are started by the controller. The motor 4 drives the gear 5 on the lower side to rotate, and drives the gear 5 on the upper side in the opposite direction. The gear 5 will also drive the mounting frame 6 and the placement rack 7 to rotate, thereby driving the semiconductor to rotate. At the same time, the refrigerator 2 will generate cold air and transport the cold air to both sides through the heat dissipation frame 3 to cool the semiconductor. After cooling is completed, the placement rack 7 is disassembled and the semiconductor is taken out of the placement rack 7.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An integrated circuit semiconductor processing cooling mechanism, characterized in that: include: A housing (1) is provided, wherein the right end of the housing (1) is fixedly connected to a motor (4), the driving end of the motor (4) is connected to a mounting frame (6) through a rotating assembly for uniformly dissipating heat for the semiconductor, the inner wall of the mounting frame (6) is provided with a placement frame (7), the inner wall of the placement frame (7) is rotatably connected to a knob (12), the rear end of the knob (12) is connected to a sliding plate (15) through a transmission assembly for driving the sliding plate (15) to move, the sliding plates (15) are connected to each other through a rotating assembly for driving the sliding plates (15) on both sides to move synchronously, the opposite ends of the sliding plates (15) are provided with a clamping assembly for clamping and fixing the semiconductor, the opposite ends of the mounting frame (6) are rotatably connected to the upper and lower parts on the left and right sides of the inner wall of the housing (1), and the upper and lower ends of the sliding plate (15) are slidably connected to the inner wall of the placement frame (7); A pull plate (8), the outer walls of which are slidably connected to the left and right sides of the inner wall of the placement frame (7), and the rear end of the pull plate (8) is connected to the installation frame (6) through a snap assembly for installation and removal of the installation frame (6).

2. The integrated circuit semiconductor processing cooling mechanism according to claim 1, characterized in that: The rotating assembly comprises gears (5) rotatably connected to the upper and lower portions of the right side inner wall of the housing (1); the left ends of the gears (5) are fixedly connected to the right end of the right mounting frame (6); and the lower right end of the gears (5) is fixedly connected to the driving end of the motor (4).

3. The integrated circuit semiconductor processing cooling mechanism according to claim 2, characterized in that: The left end of the housing (1) is fixedly connected to a refrigerator (2), and the right end of the refrigerator (2) is fixedly connected to a heat dissipation frame (3).

4. The integrated circuit semiconductor processing cooling mechanism according to claim 1, characterized in that: The transmission assembly includes a threaded rod (13) fixedly connected to the rear end of the knob (12), the outer wall of the threaded rod (13) is threadedly connected to a connecting block (14), the outer wall of the connecting block (14) is slidably connected to the inner wall of the placement frame (7), and the left and right ends of the connecting block (14) are fixedly connected to the opposite end of the connected sliding plate (15).

5. The integrated circuit semiconductor processing cooling mechanism according to claim 1, characterized in that: The rotating assembly comprises a connecting frame (16) fixedly connected to the rear end of the sliding plate (15); the inner wall of the connecting frame (16) is rotatably connected to a rotating rod (17); and the upper and lower ends of the rotating rod (17) are rotatably connected to the upper and lower sides of the inner wall of the placement rack (7).

6. The integrated circuit semiconductor processing cooling mechanism according to claim 1, characterized in that: The clamping assembly comprises a sliding plate (15) having a connecting plate (18) fixedly connected to one side opposite to one end thereof, and a clamping plate (19) fixedly connected to one side opposite to the connecting plate (18).

7. The integrated circuit semiconductor processing cooling mechanism according to claim 1, characterized in that: The buckle assembly includes a card slot (11) provided on the inner wall of the installation frame (6), a card block (9) is provided on the inner wall of the card slot (11), the front end of the card block (9) is fixedly connected to the rear end of the pull plate (8), and the rear end of the card block (9) and the front side of the inner wall of the installation frame (6) are both arc-shaped.

8. The integrated circuit semiconductor processing cooling mechanism according to claim 7, characterized in that: One opposite end of the clamping block (9) is fixedly connected to a spring (10), and the other end of the spring (10) is fixedly connected to the opposite side of the inner wall of the placement rack (7).

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