Sensor damping structure and inertial measurement unit

Abstract

The embodiment of the utility model provides a sensor damping structure and an inertial measurement unit, and relates to the technical field of sensor application. Wherein the anti-vibration pad is respectively contacted with the bottom cover and the box body, corners or edges of the sensor circuit board assembly are installed on the anti-vibration pad, the control board assembly is installed on the box body, and the box body is connected with the bottom cover. The anti-vibration pad is used for reducing vibration conducted to the sensor circuit board assembly by the bottom cover or the box body. According to the sensor vibration reduction structure, a carrier plate is omitted, and the sensor circuit board assembly is directly installed on the vibration reduction pad, so that the material cost is reduced, the product weight is reduced, the size of the carrier plate is omitted, and product miniaturization is facilitated.

Description

Technical Field

[0001] The present application relates to the field of sensor application technology, and in particular to a sensor vibration reduction structure and an inertial measurement unit. Background Art

[0002] In some sensor application scenarios, in order to reduce the impact of vibration on sensor performance, the sensor circuit board assembly is mounted on a carrier board, which is then mounted on a vibration-damping pad. The vibration-damping pad is used to reduce external vibration transmitted to the sensor circuit board assembly through the carrier board.

[0003] The carrier board design also has an important function, which is to carry two sensor circuit board assemblies that are perpendicular to each other. One sensor circuit board assembly is used to measure horizontal acceleration, and the other sensor circuit board assembly is used to measure gravity acceleration.

[0004] However, the carrier board also brings a potential problem: it increases the overall weight of the product and increases the material cost, especially when the carrier board is made of metal.

[0005] How to reduce material costs while reducing vibration is the technical problem to be solved in this application. Utility Model Content

[0006] The purpose of this application is to provide a sensor vibration reduction structure and an inertial measurement unit to reduce material costs under vibration reduction conditions.

[0007] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions.

[0008] In a first aspect, an embodiment of the present application provides a sensor vibration reduction structure, including a control board assembly, a sensor circuit board assembly, a vibration reduction pad, a bottom cover and a box body.

[0009] The vibration damping pads are in contact with the bottom cover and the box body respectively. The corners or edges of the sensor circuit board assembly are mounted on the vibration damping pads. The control board assembly is mounted on the box body. The box body and the bottom cover are connected.

[0010] The vibration-damping pad is used to reduce vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly.

[0011] Compared with the prior art, this application has the following beneficial effects:

[0012] The sensor vibration reduction structure provided in the embodiment of the present application is no longer equipped with a carrier board, but instead the sensor circuit board assembly is directly installed on the vibration reduction pad, which reduces material costs, reduces product weight, eliminates the volume of the carrier board, and is conducive to product miniaturization.

[0013] Optionally, the sensor circuit board assembly includes a first circuit board assembly and a second circuit board assembly.

[0014] A corner or an edge of the first circuit board assembly is mounted on the vibration damping pad, and the second circuit board assembly is mounted on the first circuit board assembly, and the second circuit board assembly is perpendicular to the first circuit board assembly.

[0015] The two circuit board assemblies are arranged vertically, one can be used to collect horizontal acceleration, and the other sensor circuit board assembly can be used to collect gravity acceleration.

[0016] Optionally, the four corners of the first circuit board assembly are mounted on the vibration-damping pads, and the number of the vibration-damping pads is four.

[0017] The first circuit board assembly can be designed as a rectangle, and the four corners of the rectangle are mounted on the vibration damping pad, which is stable, balanced and reliably fixed.

[0018] Optionally, the second circuit board assembly is mounted on the upper surface of the first circuit board assembly by welding, which can be soldering, which is easy to obtain and low in cost.

[0019] Optionally, both sides of the second circuit board assembly are welded to the first circuit board assembly, and each side of the second circuit board assembly has three welding points, located at both ends and in the middle. Three welding points can make the weld at one edge more secure, and welding on both sides can make the overall connection more secure.

[0020] Optionally, the sensor vibration reduction structure balances weight in at least one of the following ways:

[0021] Some components in the control board assembly or the sensor circuit board assembly are symmetrical along a central plane;

[0022] A counterweight is provided on the control board assembly or the sensor circuit board assembly to make the weight of the control board assembly or the sensor circuit board assembly symmetrical along a central plane.

[0023] Balancing the weight and placing the center of mass on a central plane can prevent the center of mass from being off-center during shaking and can reduce vibration.

[0024] Optionally, the control board assembly is mounted on the top surface of the box body. Mounting on the top surface of the box body can reduce the occupied area of ​​the bottom surface of the entire sensor vibration reduction structure.

[0025] Optionally, the control board assembly is fixed to the top surface of the box body by screwing. Compared with the glue dispensing method, the screwing method is complicated and slow in production process, while the screwing method reduces the production process time and cost.

[0026] Optionally, the control board assembly includes a main control chip and a heat dissipation pad, and the main control chip contacts the top surface of the box body through the heat dissipation pad, so that the heat of the main control chip is preferentially released to the outside from the top surface of the box body.

[0027] In a second aspect, embodiments of the present application provide an inertial measurement unit (IMU) comprising the sensor vibration reduction structure described in the first aspect, wherein the sensor circuit board assembly includes a MEMS chip. Due to the vibration reduction effect of the sensor vibration reduction structure, the MEMS chip is less susceptible to vibration, thereby improving the accuracy of the entire IMU. Furthermore, the IMU eliminates the need for a carrier board, saving material costs and space. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 This is a schematic diagram of an existing sensor installation structure;

[0030] Figure 2 A schematic diagram of a carrier board of an existing sensor mounting structure;

[0031] Figure 3 A schematic diagram of a sensor vibration reduction structure provided in an embodiment of the present application;

[0032] Figure 4 A schematic diagram of an embodiment of the present application providing a second circuit board assembly installed perpendicular to the first circuit board assembly;

[0033] Figure 5 A schematic top view of an installation method of a sensor circuit board assembly and a vibration damping pad provided in an embodiment of the present application;

[0034] Figure 6 A schematic structural diagram of a vibration damping pad provided in an embodiment of the present application;

[0035] Figure 7 A schematic diagram of a vibration damping pad in contact with a first circuit board provided in an embodiment of the present application;

[0036] Figure 8A schematic diagram of a second circuit board provided in an embodiment of the present application being mounted on a first circuit board by welding;

[0037] Figure 9 A schematic diagram of the structure inside the box of a sensor vibration reduction structure provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 11 Control panel assembly

[0040] 111 main control chip

[0041] 112 cooling pad

[0042] 12 Vibration damping pads

[0043] 121 First Floor

[0044] 122 Second Floor

[0045] 123 Third Floor

[0046] 13 Bottom cover

[0047] 14 Box

[0048] 15 carrier board

[0049] 16 Sensor PCB Assembly

[0050] 161 first circuit board assembly

[0051] 1611 First Circuit Board

[0052] 1612 First Sensor

[0053] 162 Second circuit board assembly

[0054] 1621 Second Circuit Board

[0055] 1622 Second Sensor

[0056] 163 welding points

[0057] 17 flexible cable DETAILED DESCRIPTION

[0058] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. The described embodiments are part of the embodiments of the present application, but not all of the embodiments. Generally, the components of the embodiments of the present application described in the drawings herein can be arranged and designed in various different configurations.

[0059] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is claimed, but rather merely represents selected embodiments of the present application. All other embodiments derived by persons of ordinary skill in the art based on the embodiments in this application without creative effort are intended to fall within the scope of protection of this application. The following embodiments and features therein may be combined with each other unless there is a conflict.

[0060] In the description of this application, it should be noted that relational terms such as first and second are used solely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. The term "connected" should be understood broadly, for example, it can mean fixed connection, detachable connection, or integral connection; it can be directly connected or indirectly connected through an intermediate medium.

[0061] An existing sensor installation structure is as follows Figure 1 The structure includes a control board assembly 11, a vibration damping pad 12, a bottom cover 13, a box body 14, a carrier board 15 and a sensor circuit board assembly 16.

[0062] The carrier plate 15 is L-shaped, i.e. Figure 1 The part with diagonal shadow. Figure 2 The carrier plate includes a horizontal portion and a vertical portion. The width of the vertical portion is smaller than that of the horizontal portion. Therefore, there is enough space at the four corners of the horizontal portion, and the four corners can be installed on the vibration damping pads 12.

[0063] The two sensor circuit board assemblies 16 mounted on the carrier 15 are perpendicular to each other, wherein one sensor circuit board assembly is used to measure horizontal acceleration and the other sensor circuit board assembly is used to measure gravity acceleration. The carrier has the function of supporting the two perpendicular sensor circuit board assemblies.

[0064] There is a problem with this sensor mounting structure: although the carrier board plays the role of supporting the two sensor circuit board assemblies and acts as a vibration damping pad as a medium, the carrier board occupies material costs and product space.

[0065] See Figure 3 An embodiment of the present application provides a sensor vibration reduction structure, including a control board assembly 11, a sensor circuit board assembly 16, a vibration reduction pad 12, a bottom cover 13 and a box body 14.

[0066] The vibration damping pad 12 contacts the bottom cover 13 and the box body 14 respectively. The corners or edges of the sensor circuit board assembly 16 are mounted on the vibration damping pad 12 . The control board assembly 11 is mounted on the box body 14 . The box body 14 and the bottom cover 13 are connected.

[0067] The vibration damping pad 12 is used to reduce the vibration transmitted from the bottom cover 13 or the box body 14 to the sensor circuit board assembly 16 .

[0068] compared to Figure 1 The sensor vibration reduction structure omits the carrier board 15 and instead directly mounts the sensor circuit board assembly 16 on the vibration reduction pad 12, which reduces material costs, reduces product weight, eliminates the volume of the carrier board 15, and is conducive to product miniaturization.

[0069] like Figure 4 The sensor circuit board assembly 16 may include a first circuit board assembly 161 and a second circuit board assembly 162. The corner or edge of the first circuit board assembly 161 is mounted on the vibration damping pad 12, and the second circuit board assembly 162 is mounted on the first circuit board assembly 161, and the second circuit board assembly 162 is perpendicular to the first circuit board assembly 161.

[0070] The first circuit board assembly 161 may include a first sensor and a first circuit board, and the first sensor is located on the first circuit board.

[0071] The second circuit board assembly 162 may include a second sensor and a second circuit board. The second sensor is located on the second circuit board. The second circuit board is mounted perpendicular to the first circuit board. The first circuit board directly supports the first sensor, and the first circuit board indirectly supports the second sensor through the second circuit board. The first circuit board functions as a carrier for two mutually perpendicular sensors.

[0072] Figure 5 A top view of an installation method of a sensor circuit board assembly and a vibration damping pad 12 is shown. The sensor circuit board assembly includes a first circuit board 1611, a first sensor 1612, a second circuit board 1621 and a second sensor 1622.

[0073] Four first sensors 1612 are provided on the first circuit board 1611. A second sensor 1622 is provided on the second circuit board 1621. The width of the second circuit board 1621 is smaller than that of the first circuit board 1611, so that vibration damping pads 12 can be installed at the four corners of the first circuit board 1611.

[0074] Figure 6 One shape of the vibration damping pad 12 is shown. The vibration damping pad 12 includes three layers from bottom to top: a first layer 121 , a second layer 122 and a third layer 123 .

[0075] The bottom surface of the first layer 121 is connected to the bottom cover 13. The upper surface of the first layer 121, the side surface of the second layer 122 and the lower surface of the third layer 123 form a storage space. If this storage space is designed to accommodate a corner of the rectangular first circuit board 1611, the top view of the storage space is L-shaped. The contact surface between the upper surface of the first layer 121 and the lower surface of the third layer 123 and the upper and lower surfaces of the first circuit board 1611 can be L-shaped, such as Figure 7 , Figure 7 The appearance of the lower surface of the third layer 123 in contact with the surface of the first circuit board 1611 is shown.

[0076] There are three types of contacts between the vibration damping pad 12 and the first circuit board 1611: the upper surface of the first layer 121 contacts the lower surface of the first circuit board 1611; the lower surface of the third layer 123 contacts the upper surface of the first circuit board 1611; and the side surface of the second layer 122 contacts the edge of the first circuit board 1611.

[0077] The contact may also be a contact with an extrusion force, which can cause the vibration damping pad 12 to have a certain amount of extrusion in the vertical direction or the horizontal direction.

[0078] The dimensions of the components can be designed so that the side surfaces of the vibration damping pad 12 are squeezed by the first circuit board 1611 and the box body 14 , and the bottom and top surfaces of the vibration damping pad 12 are squeezed by the box body 14 and the bottom cover 13 .

[0079] The extrusion amount of the vibration-damping pad 12 in the horizontal and vertical directions can be set to be consistent. Since vibration causes deformation, the deformation will cause the extrusion force to change. If the extrusion amount of the vibration-damping pad 12 in the horizontal and vertical directions is set to be the same, then the forces in the horizontal and vertical directions during vibration will be consistent, avoiding bending moment and torque during vibration, ensuring the stability of the first circuit board 1611 and the sensor circuit board assembly 16 thereon, and avoiding inaccurate detection due to tilt of the sensor circuit board assembly 16.

[0080] Regarding the installation method of the second circuit board assembly 162 on the first circuit board assembly 161, the second circuit board assembly 162 can be installed on the upper surface of the first circuit board assembly 161 by welding, that is, the second circuit board can be installed on the first circuit board by welding, and the welding material can be solder.

[0081] like Figure 8 , Figure 8 It shows that the second circuit board 1621 is installed on the first circuit board 1611 by welding. It can be seen that there are three welding points 163 on one side of the second circuit board 1621, and three welding points can also be set on the other side, near the two ends and in the middle respectively. There are a total of 6 welding points on both sides, which can make the second circuit board 1621 more secure.

[0082] Figure 8 In the embodiment, the first circuit board assembly 161 is connected to the flexible flat cable 17, and the flexible flat cable 17 connects different circuit board assemblies, such as the first circuit board assembly 161 and the control board assembly 11. The first circuit board 1611 can be connected to the control board assembly 11 through the flexible flat cable 17.

[0083] The electrical connection between the second circuit board 1621 and the first circuit board 1611 can be achieved through soldering, which can be used for both soldering and electrical connection. The electrical connection between the second circuit board 1621 and the first circuit board 1611 can also be achieved through a flexible flat cable.

[0084] refer to Figure 8 and Figure 5 , the sensor vibration reduction structure can balance the weight in at least one of the following ways:

[0085] Some components of the control board assembly 11 or the sensor circuit board assembly 16 are symmetrical along a central plane. For example, in the sensor circuit board assembly 16, four first sensors 1612 on the first circuit board 1611 are symmetrically arranged, and one second sensor 1622 on the second circuit board 1621 is set in the center.

[0086] A counterweight is provided on the control board assembly 11 or the sensor circuit board assembly 16 to make the weight of the control board assembly 11 or the sensor circuit board assembly 16 symmetrical along a central plane. The counterweight can be in the form of adding components or increasing or decreasing the circuit board area, for example Figure 8 There is a protruding circuit board area at the location where the first circuit board 1611 is connected to the flexible cable.

[0087] Figure 9 A schematic diagram of the interior of a sensor vibration damping structure is shown, along with a method for installing a control board assembly. The control board assembly includes a main control chip 111 and a heat sink 112. The main control chip 111 contacts the top surface of the housing 14 via the heat sink 112, allowing heat from the main control chip 111 to be preferentially released from the top surface of the housing 14. The heat sink 112 also buffers vibrations transmitted from the housing 14 to the main control chip 111. The separate layout of the main control chip 111 and the sensor circuit board assembly reduces the impact of vibrations generated by the control board assembly on the sensor.

[0088] like Figure 9The control board assembly can be secured to the top of the box body 14 using control board screws 113. Compared to glue-fixing the control board assembly using glue, the glue-fixing method is more complex and slows production. The screw-fixing method reduces production time and cost. The bottom cover 13 is secured to the bottom of the box body 14 using bottom cover screws 18. Through holes can be provided at the four corners of the box body 14 for securing to external components.

[0089] Based on the above embodiments, embodiments of the present application further provide an inertial measurement unit (IMU), comprising the aforementioned sensor vibration reduction structure, wherein the sensor circuit board assembly includes a MEMS chip. The MEMS chip receives information related to external posture, and the vibration reduction pad has a vibration reduction effect, thereby improving the performance of the IMU.

[0090] In general, the present application proposes a sensor vibration reduction structure and an inertial measurement unit. Under the action of the vibration reduction pad, the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly is reduced, thereby reducing the impact of the vibration on the sensor. In addition, no carrier board is required to support two mutually perpendicular sensors, saving manufacturing costs.

[0091] The above-described device and system embodiments are merely illustrative, and some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment. Those skilled in the art may understand and implement the present invention without inventive effort.

[0092] The above are merely preferred embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A sensor vibration reduction structure, characterized in that: Includes a control board assembly, a sensor circuit board assembly, a vibration damping pad, a bottom cover and a box body; The vibration-damping pads are in contact with the bottom cover and the box body respectively, the corners or edges of the sensor circuit board assembly are mounted on the vibration-damping pads, the control board assembly is mounted on the box body, and the box body and the bottom cover are connected; The vibration damping pad is used to reduce the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly; The sensor circuit board assembly includes a first circuit board assembly and a second circuit board assembly; The corner or edge of the first circuit board assembly is mounted on the vibration damping pad, and the second circuit board assembly is mounted on the first circuit board assembly, and the second circuit board assembly is perpendicular to the first circuit board assembly; The first circuit board assembly includes a first sensor and a first circuit board, wherein the first sensor is located on the first circuit board; The second circuit board assembly includes a second sensor and a second circuit board, the second sensor being located on the second circuit board; The second circuit board is vertically mounted on the first circuit board, and a width of the second circuit board is smaller than a width of the first circuit board.

2. The sensor vibration reduction structure according to claim 1, wherein: The four corners of the first circuit board assembly are mounted on the vibration-damping pads, and the number of the vibration-damping pads is four.

3. The sensor vibration reduction structure according to claim 1, wherein: The second circuit board assembly is mounted on the upper surface of the first circuit board assembly by welding.

4. The sensor vibration reduction structure according to claim 3, wherein: Both sides of the second circuit board assembly are welded to the first circuit board assembly, and each side of the second circuit board assembly has three welding points, which are arranged at both ends and in the middle.

5. The sensor vibration reduction structure according to claim 1, wherein: The sensor vibration reduction structure balances weight in at least one of the following ways: Some components in the control board assembly or the sensor circuit board assembly are symmetrical along a central plane; A counterweight is provided on the control board assembly or the sensor circuit board assembly so that the weight of the control board assembly or the sensor circuit board assembly is symmetrical along a central plane.

6. The sensor vibration reduction structure according to claim 1, wherein: The control board assembly is installed on the top surface of the box body.

7. The sensor vibration reduction structure according to claim 6, wherein: The control panel assembly is fixed to the top surface of the box body by means of screws.

8. The sensor vibration reduction structure according to claim 6, wherein: The control board assembly includes a main control chip and a heat dissipation pad. The main control chip contacts the top surface of the box body through the heat dissipation pad, so that the heat of the main control chip is preferentially released to the outside from the top surface of the box body.

9. An inertial measurement unit, characterized in that The sensor vibration reduction structure comprises the sensor vibration reduction structure according to any one of claims 1 to 8, wherein the sensor circuit board assembly comprises a MEMS chip.

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