Photoresist decompression drying device

Abstract

The utility model provides a photoresist reduced-pressure drying device, and particularly relates to the technical field of semiconductor production, the photoresist reduced-pressure drying device comprises a box body, when the photoresist reduced-pressure drying device is used, a glued semiconductor is placed on a placing plate, then the box body is closed, a first vacuum pump is started, a control valve is opened, and gas in the box body is sucked out through a first exhaust pipe; after drying is completed, the semiconductors are placed on a placement plate, air is exhausted through a second vacuum pump and a second exhaust pipe, the semiconductors are made to be tightly attached to the placement plate, displacement of the semiconductors is prevented, when the placement plate is installed, only a pull rod needs to be pulled, a fixing plate is matched with a fixing frame, and therefore springs are compressed, and the semiconductors are placed on the placement plate. Then the inserting block at the bottom of the placing plate is inserted into the inserting groove in the fixing frame, then the pull rod is loosened, the spring rebounds, one end of the pull rod is inserted into the pin hole, and therefore the placing plate is limited and fixed, and due to the arrangement, the placing plate is more convenient to install.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a photoresist decompression drying device. Background Art

[0002] After the semiconductor is coated with glue, it needs to be baked in an oven to evaporate the large amount of solvent on the semiconductor before exposure. The solvent remaining on the semiconductor will cause light to be scattered when the semiconductor is exposed, resulting in unclear photolithography patterns. In the current semiconductor production process, after spin coating, it is directly placed in an oven for baking. The drying efficiency of the solvent is low, and a higher baking temperature and a longer baking time are required, which affects production efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a photoresist reduced-pressure drying device to solve the problem raised in the above-mentioned background technology that in the current semiconductor production process, the photoresist is directly placed in an oven for baking after spin coating, the drying efficiency of the solvent is low, a high baking temperature and a long time are required, and the production efficiency is affected.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a photoresist reduced pressure drying device, comprising a box body, a fixing groove is provided on the inner side of the box body, a first vacuum pump is fixedly connected to the inner side of the fixing groove, one end of the air inlet of the first vacuum pump is connected to a control valve, one side of the control valve is connected to a first exhaust pipe, a fixing seat is fixedly connected to the inner side of the fixing seat, an electric cylinder is fixedly connected to the inner side of the fixing seat, a threaded hole is provided on the output end of the electric cylinder, a support plate is threadedly connected to the inner side of the threaded hole, a placement plate is sleeved on the outer side of the output end of the electric cylinder, and a storage groove is provided through the top of the placement plate.

[0005] Preferably, an air cavity is provided on the inner side of the placement plate, a through hole is provided on the top of the placement plate, a second air extraction pipe is fixedly connected to the outer side of the placement plate, and one end of the second air extraction pipe is connected to a second vacuum pump.

[0006] Preferably, the air cavity is communicated with a through hole, the air cavity is communicated with the second air extraction pipe, and the through holes are equidistantly distributed on the top of the placement plate.

[0007] Preferably, the support plate is placed on the inner side of the storage groove, and the placement plate is placed on the top of the fixing seat.

[0008] Preferably, the bottom of the placement plate is fixedly connected with an insert block, a pin hole is provided on the outside of the insert block, the outside of the fixing seat is fixedly connected with a fixing frame, a slot is provided on the top of the fixing frame, a pull rod is slidably passed through one side of the fixing frame, a fixing plate is fixedly connected to the outside of the pull rod, and a spring is fixedly connected to one side of the fixing plate.

[0009] Preferably, one end of the spring is fixedly connected to the fixing frame, and the outer wall of the inserting block is in contact with the inner wall of the slot.

[0010] Compared with the prior art, the beneficial effect of the present invention is as follows: when using the photoresist reduced pressure drying device, the semiconductor coated with glue is placed on the placement plate, and then the box body is closed, the first vacuum pump is started, the control valve is opened, and the gas in the box body is sucked out and discharged through the first exhaust pipe, thereby achieving the effect of reduced pressure drying. After the drying is completed, the electric cylinder is started, and the semiconductor is pushed up by the support plate, so that the semiconductor is removed, which is more convenient for the picking operation. The semiconductor is placed on the placement plate, and the air is exhausted by the second vacuum pump and the second exhaust pipe, so that the semiconductor is close to the placement plate to prevent it from shifting. When installing the placement plate, you only need to pull the pull rod, and cooperate with the fixing frame through the fixing plate to compress the spring, and then insert the plug at the bottom of the placement plate into the slot on the fixing frame. After that, release the pull rod, and the spring rebounds, so that one end of the pull rod is inserted into the pin hole, thereby limiting and fixing the placement plate. This arrangement is more convenient for installing the placement plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the appearance structure of the utility model;

[0012] Figure 2 This is a schematic diagram of the structure of the first vacuum pump and the control valve used in conjunction with each other in the utility model;

[0013] Figure 3 This is a schematic diagram of the structure of the placement plate of the utility model;

[0014] Figure 4 This utility model Figure 3 Enlarged structural diagram at point A in the middle.

[0015] In the figure: 1. Box body; 2. Fixing groove; 3. First vacuum pump; 4. Control valve; 5. First exhaust pipe; 6. Fixing seat; 7. Electric cylinder; 8. Threaded hole; 9. Support plate; 10. Placement plate; 11. Storage groove; 12. Air cavity; 13. Through hole; 14. Second exhaust pipe; 15. Second vacuum pump; 16. Insert block; 17. Pin hole; 18. Fixing frame; 19. Slot; 20. Pull rod; 21. Fixing plate; 22. Spring. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application.

[0018] Example

[0019] See also Figure 1-4 The utility model discloses a photoresist reduced pressure drying device: it comprises a box body 1, a fixing groove 2 is opened on the inner side of the box body 1, a first vacuum pump 3 is fixedly connected to the inner side of the fixing groove 2, one end of the air inlet of the first vacuum pump 3 is connected to the control valve 4, and one side of the control valve 4 is connected to the first exhaust pipe 5, the inner side of the box body 1 is fixedly connected to a fixing seat 6, the inner side of the fixing seat 6 is fixedly connected to an electric cylinder 7, the output end of the electric cylinder 7 is opened with a threaded hole 8, the inner side of the threaded hole 8 is threadedly connected to a supporting plate 9, a placement plate 10 is sleeved on the outer side of the output end of the electric cylinder 7, and a storage groove 11 is opened on the top of the placement plate 10. When in use, the semiconductor coated with glue is placed on the placement plate 10, and then the box body 1 is closed, the first vacuum pump 3 is started, the control valve 4 is opened, and the gas in the box body 1 is sucked out and discharged through the first exhaust pipe 5, thereby achieving the effect of reduced pressure drying. After drying is completed, the electric cylinder 7 is started to push up the semiconductor through the supporting plate 9, so that the semiconductor can be removed, which is more convenient for taking the operation.

[0020] In order to facilitate the fixing of the semiconductor, an air cavity 12 is opened on the inner side of the placement plate 10, a through hole 13 is opened on the top of the placement plate 10, and a second exhaust pipe 14 is fixedly connected to the outer side of the placement plate 10. One end of the second exhaust pipe 14 is connected to a second vacuum pump 15. The semiconductor is placed on the placement plate 10, and air is extracted through the second vacuum pump 15 and the second exhaust pipe 14, so that the semiconductor is close to the placement plate 10 to prevent it from shifting.

[0021] Furthermore, the air cavity 12 is connected to the through hole 13 , the air cavity 12 is connected to the second air extraction pipe 14 , and the through holes 13 are evenly distributed on the top of the placement plate 10 .

[0022] Furthermore, the supporting plate 9 is placed inside the receiving groove 11 , and the placement plate 10 is placed on the top of the fixing seat 6 .

[0023] In order to facilitate the installation of the placement plate 10, the bottom of the placement plate 10 is fixedly connected with an insert block 16, and a pin hole 17 is provided on the outside of the insert block 16. The outside of the fixing seat 6 is fixedly connected with a fixing frame 18, and a slot 19 is provided on the top of the fixing frame 18. A pull rod 20 is slid through one side of the fixing frame 18, and a fixing plate 21 is fixedly connected to the outside of the pull rod 20. A spring 22 is fixedly connected to one side of the fixing plate 21. When installing the placement plate 10, you only need to pull the pull rod 20, and cooperate with the fixing frame 18 through the fixing plate 21 to compress the spring 22, and then insert the insert block 16 at the bottom of the placement plate 10 into the slot 19 on the fixing frame 18. After that, release the pull rod 20, and the spring 22 rebounds, so that one end of the pull rod 20 is inserted into the pin hole 17, thereby limiting and fixing the placement plate 10. This arrangement makes it more convenient to install the placement plate 10.

[0024] Furthermore, one end of the spring 22 is fixedly connected to the fixing bracket 18 , and the outer wall of the insert block 16 fits in contact with the inner wall of the slot 19 .

[0025] Working principle: When in use, place the glue-coated semiconductor on the placement plate 10, then close the box 1, start the first vacuum pump 3, open the control valve 4, and suck out the gas in the box 1 through the first exhaust pipe 5 and discharge it, thereby achieving the effect of reduced pressure drying. After drying is completed, start the electric cylinder 7, push the semiconductor up through the support plate 9, and thus remove the semiconductor, which is more convenient for taking operations. Place the semiconductor on the placement plate 10, and exhaust the air through the second vacuum pump 15 and the second exhaust pipe 14, so that the semiconductor is close to the placement plate 10 to prevent it from shifting. When installing the placement plate 10, you only need to pull the pull rod 20, cooperate with the fixing frame 18 through the fixing plate 21, thereby compressing the spring 22, and then insert the plug 16 at the bottom of the placement plate 10 into the slot 19 on the fixing frame 18, then release the pull rod 20, and the spring 22 rebounds, so that one end of the pull rod 20 is inserted into the pin hole 17, thereby limiting and fixing the placement plate 10. This setting is more convenient for installing the placement plate 10.

[0026] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these implementation rules without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A photoresist reduced pressure drying device, comprising a housing (1), characterized in that: A fixing groove (2) is provided on the inner side of the box body (1), a first vacuum pump (3) is fixedly connected to the inner side of the fixing groove (2), one end of the air inlet of the first vacuum pump (3) is connected to a control valve (4), one side of the control valve (4) is connected to a first exhaust pipe (5), a fixing seat (6) is fixedly connected to the inner side of the fixing seat (6), an electric cylinder (7) is fixedly connected to the inner side of the fixing seat (6), a threaded hole (8) is provided on the output end of the electric cylinder (7), a supporting plate (9) is threadedly connected to the inner side of the threaded hole (8), a placement plate (10) is sleeved on the outer side of the output end of the electric cylinder (7), and a receiving groove (11) is provided through the top of the placement plate (10).

2. The photoresist reduced pressure drying device according to claim 1, characterized in that: An air cavity (12) is provided on the inner side of the placement plate (10), a through hole (13) is provided on the top of the placement plate (10), a second air extraction pipe (14) is fixedly connected to the outer side of the placement plate (10), and one end of the second air extraction pipe (14) is connected to a second vacuum pump (15).

3. The photoresist reduced pressure drying device according to claim 2, characterized in that: The air cavity (12) is connected to the through hole (13), the air cavity (12) is connected to the second air extraction pipe (14), and the through holes (13) are evenly distributed on the top of the placement plate (10).

4. The photoresist reduced pressure drying device according to claim 1, characterized in that: The supporting plate (9) is placed on the inner side of the receiving groove (11), and the placing plate (10) is placed on the top of the fixing seat (6).

5. The photoresist reduced pressure drying device according to claim 1, characterized in that: The bottom of the placement plate (10) is fixedly connected to an insert block (16), a pin hole (17) is provided on the outer side of the insert block (16), a fixing frame (18) is fixedly connected to the outer side of the fixing seat (6), a slot (19) is provided on the top of the fixing frame (18), a pull rod (20) is slidably connected to one side of the fixing frame (18), a fixing plate (21) is fixedly connected to the outer side of the pull rod (20), and a spring (22) is fixedly connected to one side of the fixing plate (21).

6. The photoresist reduced-pressure drying device according to claim 5, characterized in that: One end of the spring (22) is fixedly connected to the fixing frame (18), and the outer wall of the inserting block (16) is in contact with the inner wall of the slot (19).

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