Radiator module capable of dissipating heat efficiently

Abstract

The utility model discloses an efficient heat dissipation radiator module which comprises a support, a vapor chamber, a heat conduction piece and a fan, the support is fixedly installed with an electronic element, the vapor chamber and the heat conduction piece are sequentially installed on the support in an overlapped mode, the vapor chamber is attached to the electronic element, and the fan is installed in the support and located on one side of the heat conduction piece. Air flow is introduced into the heat conducting piece to take away heat; the support is provided with an air guide groove which is located at the bottom of the fan and extends towards the bottom of the vapor chamber to the electronic element. The air guide groove is formed in the support to directly guide airflow generated by the fan to the electronic element, direct heat dissipation of the electronic element is achieved, the heat dissipation efficiency can be greatly improved, the influence of the heat conduction performance of the heat conduction piece on heat dissipation can be reduced, and the service life of the electronic element is prolonged. High temperature of the electronic component caused by heat-conducting property change of the heat-conducting plate in the long-term use process is avoided, the service life of the electronic component is prolonged, and the operation performance stability of the electronic component is improved.

Description

Technical field:

[0001] The utility model relates to the technical field of radiators, in particular to a radiator module with high-efficiency heat dissipation. Background technology:

[0002] In modern electronic products, especially high-performance graphics cards, heat sink design is crucial. This is because electronic devices generate significant heat during operation, especially during high-load operations such as graphics processing and complex computational tasks. This heat generation is primarily due to component power consumption. When current flows through semiconductor materials, the impedance converts some of the electrical energy into heat. If this heat cannot be dissipated quickly, the resulting temperature rise can lead to component performance degradation or even damage.

[0003] Currently, traditional cooling methods primarily include air cooling, liquid cooling, and heat pipe cooling. Air cooling relies on fans to remove heat from the surface of electronic components. It is a widely used and cost-effective method, but it often suffers from insufficient heat dissipation efficiency in high-performance products. Liquid cooling removes heat through liquid circulation, which is more efficient and quieter, but it is complex, costly, and requires leak prevention measures. Heat pipe cooling uses highly conductive materials to quickly transfer heat to the heat sink area, but is limited by the heat capacity of the heat pipe design. Especially in high-performance graphics cards, as computing power increases, the heat generated increases rapidly. If the cooling system cannot quickly reduce the temperature, the graphics card will reduce its frequency to protect itself, resulting in reduced performance.

[0004] For example: the heat dissipation device of China Patent Authorization Announcement No. CN 101605442B, in the technical solution disclosed in the patent, the heat dissipation device is mainly used to dissipate heat from the circuit board, and the heat dissipation device includes a base, a heat sink, a fan, and a cover, wherein the base includes a substrate and a heat spreader. During operation, the heat dissipation device is fixed to the circuit board by a fixing member passing downward through the base and the circuit board and cooperating with a back plate located below the circuit board. The bottom surface of the base heat spreader can be in contact with one or more electronic components, and thermal conductive glue can be applied between the bottom surface of the heat spreader and the top surface of the electronic component to enhance the heat conduction effect. An insulating film can also be placed between the heat dissipation device and the circuit board to act as an insulator and buffer. Since the heat spreader is a plate-shaped heat pipe with high heat conductivity, the heat generated by the electronic component can be absorbed by the heat spreader and quickly and evenly distributed throughout the heat spreader, and then conducted to the entire heat sink. Finally, the airflow generated by the fan passes through the air flow channel in the heat sink and quickly takes away the heat, thereby achieving the effect of quickly cooling the electronic components.

[0005] As described in the above patent, since the heat dissipation devices currently on the market all use airflow generated by a fan to blow through the heat sink or heat conductor to remove heat for heat dissipation, their heat dissipation efficiency depends to a large extent on the thermal conductivity of the heat sink or heat conductor. When the heat dissipation effect of the heat sink or heat conductor decreases due to dust accumulation or other reasons, the electronic components are prone to instantaneous high temperatures, resulting in performance degradation or damage to the electronic components. Therefore, ensuring continuous and stable heat dissipation of electronic components is an important factor in maintaining the performance of electronic products and improving their lifespan.

[0006] In view of this, the inventors propose the following technical solutions. Utility model content:

[0007] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a radiator module with high-efficiency heat dissipation.

[0008] In order to solve the above technical problems, the utility model adopts the following technical solutions: a radiator module with high efficiency in heat dissipation, comprising: a bracket, a heat spreader, a heat conductor, and a fan, wherein the bracket is fixed to an electronic component, the heat spreader and the heat conductor are installed on the bracket in sequence, and the heat spreader is in contact with the electronic component, the fan is installed in the bracket and is located on one side of the heat conductor, and heat is taken away by passing air into the heat conductor; the bracket is provided with an air guide groove located at the bottom of the fan and extending from the bottom of the heat spreader to the electronic component.

[0009] Furthermore, in the above technical solution, the bracket is also equipped with an air guide cover located on the air guide groove and guiding the air flow into the air guide groove. The air guide cover is located at the bottom of the heat sink where the air guide groove enters the heat spreader and is on one side of the heat conductor.

[0010] Furthermore, in the above technical solution, the air guide cover is in the shape of a door frame and spans above the air guide groove, and a wind shield plate inclined from top to bottom is provided in the door frame, and the lower end of the inclined wind shield plate extends toward the heat spreader.

[0011] Furthermore, in the above technical solution, the heat conducting member is attached to the heat spreader, and the heat conducting member includes a bottom plate, a top plate and a plurality of fins formed between the bottom plate and the top plate, wherein a heat dissipation channel for air flow is provided between the fins, and one end of the heat dissipation channel faces the side of the fan.

[0012] Furthermore, in the above technical solution, a cover is also installed on the bracket, which covers the heat conductor and the fan, and an air inlet corresponding to the fan is provided on the cover, and an air outlet corresponding to the end of the heat conductor is provided on one side of the bracket.

[0013] Furthermore, in the above technical solution, the edge of the cover plate is provided with a plurality of connecting ear plates that are bent and can be attached to the inner wall of the bracket, and a plurality of first mounting holes for fixing the connecting ear plates are provided on both sides of the bracket, and the connecting ear plates are fixedly connected to the first mounting holes by screws.

[0014] Furthermore, in the above technical solution, a cylindrical cavity for installing a fan is provided at one end of the bracket, a heat dissipation cavity for installing a heat spreader and a heat conductor is provided on one side of the cylindrical cavity, and several thermally conductive silicone blocks are provided between the bottom of the bracket and the electronic components.

[0015] After adopting the above technical solution, the utility model has the following beneficial effects compared with the existing technology: in the utility model, the air flow generated by the fan is directly guided to the electronic components by arranging an air guide groove on the bracket, thereby realizing direct heat dissipation of the electronic components, which can not only greatly improve the heat dissipation efficiency, but also reduce the influence of the thermal conductivity of the heat conductor on the heat dissipation, avoid high temperature of the electronic components caused by changes in the thermal conductivity of the heat conduction plate during long-term use, and improve the service life and operating performance stability of the electronic components. Description of the drawings:

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 It is an exploded view of the utility model;

[0018] Figure 3 It is a three-dimensional diagram of the bracket in the utility model;

[0019] Figure 4 It is a three-dimensional diagram of the heat conducting element in the utility model. Specific implementation method:

[0020] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0021] See Figures 1 to 4The figure shows a heat sink module with high efficiency in heat dissipation, comprising a bracket 1, a heat spreader 2, a heat conductor 3, and a fan 4. The bracket 1 is fixedly mounted on an electronic component 5, the heat spreader 2 and the heat conductor 3 are sequentially stacked and mounted on the bracket 1, with the heat spreader 2 in contact with the electronic component 5. The fan 4 is mounted within the bracket 1 and is located on one side of the heat conductor 3. The fan 4 removes heat by passing air through the heat conductor 3. The bracket 1 is provided with an air guide groove 11 located at the bottom of the fan 4 and extending from the bottom of the heat spreader 2 toward the electronic component 5. By providing the air guide groove 11 on the bracket 1, the airflow generated by the fan 4 is directed directly to the electronic component 5, achieving direct heat dissipation of the electronic component 5. This not only significantly improves heat dissipation efficiency, but also reduces the effect of the thermal conductivity of the heat conductor 3 on heat dissipation, thereby avoiding high temperatures in the electronic component 5 caused by changes in the thermal conductivity of the heat spreader 3 during long-term use, thereby improving the service life and operational stability of the electronic component 5.

[0022] The bracket 1 is also mounted with an air shroud 6 positioned above the air duct 11 and directing airflow into the air duct 11. The air shroud 6 is located at the bottom of the air duct 11 where it enters the vapor chamber 2, and to one side of the heat conductor 3. The air shroud 6 is shaped like a door frame and spans above the air duct 11. A wind deflector 61 is positioned within the door frame, tilted from top to bottom, with the lower end of the tilted wind deflector 61 extending toward the vapor chamber 2. By adding the air shroud 6 to the air duct 11, the airflow generated by the fan 4 is directed into the air duct 11, thereby increasing the amount of air flowing directly from the air duct 11 toward the electronic components 5 and improving the efficiency of heat dissipation from the electronic components 5.

[0023] The heat conducting member 3 is attached to the heat spreader 2 and includes a bottom plate 31, a top plate 32 and a plurality of fins 33 formed between the bottom plate 31 and the top plate 32, wherein a heat dissipation channel for air flow is provided between the fins 33, and one end of the heat dissipation channel faces one side of the fan 4.

[0024] A cover plate 7 is also installed on the bracket 1, which covers the heat conductor 3 and the fan 4, and is provided with an air inlet 71 corresponding to the fan 4. An air outlet 12 corresponding to the end of the heat conductor 3 is provided on one side of the bracket 1.

[0025] The edge of the cover plate 7 is provided with a plurality of bent connecting ear plates 72 that can be attached to the inner wall of the bracket 1. Both sides of the bracket 1 are provided with a plurality of first mounting holes 13 for fixing the connecting ear plates 72, and the connecting ear plates 72 are fixedly connected to the first mounting holes 13 by screws.

[0026] A cylindrical cavity 14 for mounting a fan 4 is provided at one end of the bracket 1 , a heat dissipation cavity 15 for mounting a heat spreader 2 and a heat conductor 3 is provided on one side of the cylindrical cavity 14 , and a plurality of heat-conducting silicone blocks 8 are provided between the bottom of the bracket 1 and the electronic component 5 .

[0027] To sum up, in the present invention, a fan 4 is provided on one side of the heat conductor 3 to generate airflow to conduct the heat out. An air guide groove 11 is added to the bottom of the bracket 1 below the fan 4, and the air guide groove 11 is used to directly guide the airflow generated by the fan 4 to blow toward the electronic component 5, thereby achieving direct heat dissipation of the electronic component 5, thereby improving the heat dissipation of the electronic component 5.

[0028] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made based on the structure, features and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A heat sink module with high heat dissipation efficiency, comprising a bracket (1), a heat spreader (2), a heat conducting member (3), and a fan (4), wherein: The bracket (1) is fixedly mounted on an electronic component (5), the heat spreader (2) and the heat conducting member (3) are sequentially stacked and mounted on the bracket (1), and the heat spreader (2) is fitted on the electronic component (5), and the characteristics are: The fan (4) is installed in the bracket (1) and is located on one side of the heat conducting member (3), and removes heat by passing airflow through the heat conducting member (3); The bracket (1) is provided with an air guide groove (11) located at the bottom of the fan (4) and extending toward the bottom of the heat spreader (2) and toward the electronic component (5).

2. The radiator module with high heat dissipation efficiency according to claim 1, characterized in that: The bracket (1) is also provided with an air guide cover (6) which is located on the air guide groove (11) and guides air flow into the air guide groove (11). The air guide cover (6) is located at the bottom of the air guide groove (11) where it enters the heat spreader (2) and is located on one side of the heat conducting member (3).

3. The radiator module with high heat dissipation efficiency according to claim 2, characterized in that: The wind guide cover (6) is in the shape of a door frame and spans above the wind guide groove (11), and a wind shield (61) inclined from top to bottom is provided in the door frame, and the lower end of the inclined wind shield (61) extends toward the heat diffusion plate (2).

4. The radiator module with high heat dissipation efficiency according to claim 1, characterized in that: The heat conducting member (3) is attached to the heat spreader (2), and the heat conducting member (3) includes a bottom plate (31), a top plate (32), and a plurality of fins (33) formed between the bottom plate (31) and the top plate (32), wherein a heat dissipation channel for air flow is provided between the fins (33), and one end of the heat dissipation channel faces one side of the fan (4).

5. The radiator module with high heat dissipation efficiency according to claim 1, characterized in that: A cover plate (7) is also installed on the bracket (1), and the cover plate (7) covers the heat-conducting member (3) and the fan (4). An air inlet (71) corresponding to the fan (4) is provided on the cover plate (7), and an air outlet (12) corresponding to the end of the heat-conducting member (3) is provided on one side of the bracket (1).

6. The radiator module with high heat dissipation efficiency according to claim 5, characterized in that: The edge of the cover plate (7) is provided with a plurality of connecting ear plates (72) that are bent and can be attached to the inner wall of the bracket (1); a plurality of first mounting holes (13) for fixing the connecting ear plates (72) are provided on both sides of the bracket (1); and the connecting ear plates (72) are fixedly connected to the first mounting holes (13) by screws.

7. A heat sink module with high heat dissipation efficiency according to any one of claims 1 to 6, characterized in that: A cylindrical cavity (14) for mounting a fan (4) is provided at one end of the bracket (1), a heat dissipation cavity (15) for mounting a heat spreader (2) and a heat conducting member (3) is provided on one side of the cylindrical cavity (14), and a plurality of heat-conducting silica gel blocks (8) are provided between the bottom of the bracket (1) and the electronic component (5).

Images