Bonding head assembly and die bonding equipment

Abstract

The utility model relates to the technical field of die bonders, in particular to a bonding head assembly and die bonding equipment, which comprises a first mounting base, a second mounting base and the first mounting base form vertical sliding fit, and a driving unit drives the second mounting base to move along the vertical direction of the first mounting base. The displacement measuring unit is used for measuring the vertical displacement of the second mounting base on the first mounting base, the suction nozzle is vertically arranged on the second mounting base and is connected with the negative pressure end of the air source, and the rotating unit is used for driving the suction nozzle to rotate and accurately adjusting the angular position of the chip. The suction nozzle can be used for adsorbing a chip or pasting the chip on the suction nozzle on a printed circuit board, the vertical displacement amount of the second mounting base can be accurately measured through the displacement measuring unit, the vertical displacement amount of the chip is accurately controlled through the control unit of the die bonding equipment, the bonding pressure of the suction nozzle and the chip is controlled, and the die bonding efficiency is improved. Or the combination pressure of the chip and the printed circuit board can prevent the chip from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a bonding head component and crystal bonding equipment. Background Art

[0002] Die bonding, also known as chip mounting, uses colloid to bond the chip to the designated area of ​​the bracket to form a thermal or electrical path, providing conditions for subsequent wire bonding. It is mainly used for lead cabinet pressure plates of various gold wire ultrasonic welding equipment and various suction nozzles, ejectors, dispensing heads, porcelain nozzles, through needles, motors, carbon brushes, encoders, transmission belts and various spare parts and instruments of automated robots for various chip mounting equipment.

[0003] In die bonding equipment, chips are often mounted on printed circuit boards using a nozzle to pick up the chips. The chips are then transferred to their mounting locations on the printed circuit boards for installation. Because chips are small and fragile, the pressure of the nozzle must be controlled during the placement and handling process to prevent them from being crushed during the suction and bonding process. Furthermore, the position and angle of the chips must be adjusted during placement and handling to ensure accurate alignment during die bonding. However, current nozzles lack high precision in pressure control and chip position and angle adjustment. Utility Model Content

[0004] The purpose of this utility model is to provide a bonding head assembly and a die bonding device, aiming to solve the above-mentioned technical problem that the bonding head has low precision in controlling pressure and adjusting chip position angle, so as to ensure the accuracy of the chip and printed circuit board installation position and avoid chip damage.

[0005] The following technical solutions are used to solve the technical problems in this utility model:

[0006] The bonnet assembly includes:

[0007] a first mounting base;

[0008] a second mounting base, forming a vertical sliding fit with the first mounting base;

[0009] a driving unit, configured to drive the second mounting base to move vertically along the first mounting base;

[0010] a displacement measuring unit, configured to measure a vertical displacement of the second mounting base on the first mounting base;

[0011] a suction nozzle, vertically disposed on the second mounting base and connected to the negative pressure end of the air source;

[0012] The rotating unit is used to drive the suction nozzle to rotate.

[0013] The utility model also has the following technical features:

[0014] In one embodiment of the present invention, an elastic connecting member is further included, with two ends thereof abutting against the first mounting base and the second mounting base.

[0015] In one embodiment of the present invention, the driving unit includes a motor stator arranged between the first mounting base and the second mounting base, a motor mover is arranged in the motor stator, the moving direction of the motor mover in the motor stator is vertical, and one end of the motor mover is connected to the first mounting base or the second mounting base.

[0016] In an embodiment of the present invention, the displacement measuring unit includes a displacement sensor provided on the first mounting base, and the displacement sensor is used to measure the displacement of the second mounting base.

[0017] In one embodiment of the present invention, a linear track forms a sliding guide fit between the first mounting base and the second mounting base, and the linear track is parallel to the moving direction of the motor mover.

[0018] In one embodiment of the present invention, a guide rail seat is detachably connected to the first mounting base, the motor stator and the linear track are fixed on the guide rail seat, one end of the motor mover is connected to the second mounting base, and the second mounting base is slidably mounted on the linear track.

[0019] In one embodiment of the present invention, a compression spring seat is provided on the first mounting base, and the elastic connecting member includes a spring and an adjusting screw rod. The adjusting screw rod and the spring are vertical and abut against each other in the up and down directions. The lower end of the spring abuts against the second mounting base, and the upper end of the adjusting screw rod forms a threaded connection with the compression spring seat.

[0020] In one embodiment of the present invention, the rotating unit includes a rotating motor arranged on the second mounting base, the driving shaft of the rotating motor is provided with an air guide channel, and the suction nozzle is installed at the driving shaft position of the rotating motor and is connected to the air guide channel.

[0021] In one embodiment of the present invention, a rotating cover is provided on the rotating motor, a gas joint is provided on the rotating cover, the gas joint is connected to the gas guide channel, and an adjusting wire is provided on the rotating cover, and the adjusting wire is used to adjust the gas flow of the gas joint.

[0022] Another object of the present invention is to provide a die bonding device, which includes the above-mentioned die bonding head assembly.

[0023] Compared with the existing technology, the beneficial effects of the present invention are reflected in: the bonding head assembly is used in the crystal bonding equipment, and the chip can be adsorbed through the suction nozzle, and the angular position of the chip can be accurately adjusted through the rotation unit. The second mounting base is driven by the driving unit to move along the vertical direction of the first mounting base. The suction nozzle can be used to adsorb the chip or the chip on the suction nozzle can be placed on the printed circuit board. The vertical displacement of the second mounting base can be accurately measured by the displacement measuring unit, so that the vertical displacement of the chip can be accurately controlled by the control unit of the crystal bonding equipment, and then the bonding pressure between the suction nozzle and the chip, or the bonding pressure between the chip and the printed circuit board can be controlled to avoid damage to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 and Figure 2 Schematic diagrams of the bungee assembly in one embodiment of the present invention from two perspectives;

[0025] Figure 3 This is an exploded view of a bungee assembly in one embodiment of the present invention;

[0026] Description of Figure Numbers:

[0027] 10. First mounting base; 11. Guide rail base; 12. Z reader base; 13. Grating reader; 14. Grating;

[0028] 20. Second mounting base;

[0029] 30. Compression spring seat;

[0030] 40. Suction nozzle;

[0031] 51. Spring; 52. Adjusting screw;

[0032] 61. Motor stator; 62. Motor mover;

[0033] 70. Straight track;

[0034] 80. Rotating motor; 81. Rotating gland; 82. Air joint; 83. Adjusting thread; 84. Suction nozzle clamping shaft. DETAILED DESCRIPTION

[0035] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0036] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0037] It should be noted that the die bonding process is a key step in the semiconductor packaging process. Its main purpose is to accurately place the chip in the designated area of ​​the bracket and bond it through colloid to form a thermal path or electrical path, providing conditions for subsequent wire bonding. This process is crucial to fields such as LED packaging, chip semiconductor packaging, and camera precision mounting. Taking chip packaging as an example, after the existing wafer is produced through the previous cutting process, there will be chips arranged in an array on the blue film. The chip on the blue film can be directly adsorbed by the bonding head assembly and then transferred to the printed circuit board station. The chip on the bonding head assembly can be placed on the glue coating position of the printed circuit board to achieve bonding and fixation of the chip and the printed circuit board. Since the chip itself is small and fragile, it is necessary to control the pressure of the bonding head during the placement process to prevent the chip from being crushed during the absorption and die bonding process. In addition, the position and angle of the chip and the printed circuit board are also very important. key, which also directly affects the quality of the patch. In this regard, the utility model proposes a head assembly, including: a first mounting base 10; a second mounting base 20, which forms a vertical sliding fit with the first mounting base 10; a driving unit, which drives the second mounting base 20 to move along the vertical direction of the first mounting base 10; a displacement measuring unit, which is used to measure the vertical displacement of the second mounting base 20 on the first mounting base 10; a suction nozzle 40, which is vertically arranged on the second mounting base 20 and connected to the negative pressure end of the air source; and a rotating unit, which is used to implement rotational drive of the suction nozzle 40.

[0038] In one embodiment, see Figure 1 and Figure 2The first mounting base 10 is mounted on the Z-axis lifting mechanism of the die bonding equipment. When the chip on the blue film is to be adsorbed and picked up, the first mounting base 10 and the accessories on the first mounting base 10 are driven down by the Z-axis lifting mechanism, so that the suction nozzle 40 on the second mounting base 20 is close to the chip. The second mounting base 20 is driven by the driving unit to move vertically along the first mounting base 10 so that the suction nozzle 40 is in contact with the chip. The vertical displacement of the second mounting base 20 on the first mounting base 10 is measured by the displacement measuring unit, so that the pressure of the suction nozzle 40 in contact with the chip can be accurately controlled. The Z-axis lifting mechanism is activated and the entire bonding head assembly is transported. Transfer it to a position above the printed circuit board. Similarly, start the Z-axis lifting mechanism again to lower the first mounting base 10 and the accessories on the first mounting base 10, and make the suction nozzle 40 on the second mounting base 20 close to the printed circuit board. Drive the second mounting base 20 to move vertically along the first mounting base 10 through the moving unit again, so that the chip on the suction nozzle 40 is in contact with the printed circuit board. The vertical displacement of the second mounting base 20 on the first mounting base 10 is measured by the displacement measuring unit, so that the contact pressure between the chip on the suction nozzle 40 and the printed circuit board can be accurately controlled to avoid damage to the chip during suction and placement installation.

[0039] In one embodiment, the nozzle 40 can be rotated and adjusted by a rotating unit, so that the angle of the chip in the dedicated area on the nozzle 40 can be adjusted in real time to a set angle to achieve precise installation of the chip and the printed circuit board.

[0040] In one embodiment, in order to achieve elastic extrusion between the suction nozzle 40 and the chip or elastic extrusion between the chip and the printed circuit board to further reduce chip damage caused by uneven extrusion force, the head assembly also includes an elastic connector 50, both ends of which are resting on the first mounting base 10 and the second mounting base 20. The suction nozzle 40 can be made of rubber material to reduce damage to the chip.

[0041] In one embodiment, see Figure 3 The driving unit includes a motor stator 61 arranged on the first mounting base 10, and a motor mover 62 is arranged in the motor stator 61. The motor mover 62 is located in the motor stator 61 and the moving direction is vertical. One end of the motor mover 62 is connected to the second mounting base 20. When the motor stator 61 is energized, the motor mover 62 can be located in the motor stator 61 and move to drive the second mounting base 20 to move vertically, thereby realizing the vertical movement of the second mounting base 20 and the suction nozzle 40.

[0042] In another embodiment, the driving unit includes a motor stator 61 arranged on the second mounting base 20, and a motor mover 62 is arranged in the motor stator 61. The motor mover 62 is located in the motor stator 61 and the moving direction is vertical. One end of the motor mover 62 is connected to the first mounting base 10. When the motor stator 61 is energized, the motor mover 62 can be located in the motor stator 61 and move to drive the second mounting base 20 to move vertically, thereby realizing the vertical movement of the second mounting base 20 and the suction nozzle 40.

[0043] In a specific embodiment, the driving unit composed of the motor stator 61 and the motor mover 62 can be a voice coil motor. The voice coil motor has the advantages of high precision, high response speed, high reliability, etc., and is suitable for application in the die bonding equipment.

[0044] In one embodiment, to measure the vertical displacement of the second mounting base 20 on the first mounting base 10 , the displacement measuring unit includes a displacement sensor disposed on the first mounting base 10 , and the displacement sensor is used to measure the displacement of the second mounting base 20 .

[0045] In a specific embodiment, the displacement sensor can be installed on the first mounting base 10, and a calibration point is set on the second mounting base 20. The displacement sensor measures the calibration point on the second mounting base 20 to accurately measure the displacement of the second mounting base 20. Then, the control unit of the die bonding equipment controls the vertical displacement of the entire bonding head assembly according to the displacement, thereby achieving accurate control of the chip picking and mounting force.

[0046] In another specific embodiment, the displacement sensor can be installed on the second mounting base 20, and a calibration point is set on the first mounting base 10. The displacement sensor measures the calibration point on the first mounting base 10 to accurately measure the displacement of the second mounting base 20.

[0047] In a specific embodiment, a Z head base 12 is installed on the first mounting base 10, and the displacement sensor can be a grating head 13 and a grating 14. The grating head 13 is fixed on the Z head base 12, and the grating 14 is fixed on the second mounting base 20. The displacement of the second mounting base 20 is controlled by feedback from the grating head 13.

[0048] In a specific embodiment, in order to achieve vertical guided sliding of the first mounting base 10 and the second mounting base 20, a linear track 70 is installed on the first mounting base 10, and the linear track 70 is parallel to the moving direction of the motor mover 62, and the second mounting base 20 is vertically slidably set on the linear track 70.

[0049] In another specific embodiment, a linear track 70 is installed on the second mounting base 20 . The linear track 70 is parallel to the moving direction of the motor mover 62 . The first mounting base 10 is vertically slidably disposed on the linear track 70 .

[0050] In a specific embodiment, a guide rail seat 11 is detachably connected to the first mounting base 10 of the bang head assembly, and the voice coil motor stator 61 and the linear rail 70 are fixed on the guide rail seat 11. One end of the voice coil motor mover 62 is connected to the second mounting base 20, and the second mounting base 20 is slidably mounted on the linear rail 70.

[0051] In a specific embodiment, a compression spring seat 30 is provided on the first mounting base 10, and the elastic connecting member 50 includes a spring 51 and an adjusting screw rod 52. The adjusting screw rod 52 and the spring 51 are vertically and abutted in the up and down directions. The lower end of the spring 51 abuts on the second mounting base 20, and the upper end of the adjusting screw rod 52 forms a threaded connection with the compression spring seat 30.

[0052] In one embodiment, the spring 51 may be an elastic member such as a coil spring or a gas spring, and the elastic force of the spring 51 may be adjusted by rotating the adjusting screw 52 .

[0053] In one embodiment, in order to enable the rotating unit to rotate and adjust the suction nozzle 40 while also accurately adjusting the angle of the suction nozzle 40, the rotating unit includes a rotating motor 80 arranged on the second mounting base 20, and the driving shaft of the rotating motor 80 is provided with an air guide channel, and the suction nozzle 40 is installed at the driving shaft position of the rotating motor 80 and is connected to the air guide channel.

[0054] In one embodiment, the rotary motor 80 should be a direct drive motor (DD motor), which has high precision in adjusting the angle of the suction nozzle 40, and an air guide channel is set on the driving shaft of the rotary motor 80, thereby being able to adsorb the chip.

[0055] In a specific embodiment, a rotating cover 81 is provided on the rotating motor 80, and a gas joint 82 is provided on the rotating cover 81. The gas joint 82 is connected to the gas guide channel, and an adjusting wire 83 is provided on the rotating cover 81. The adjusting wire 83 is used to adjust the gas flow of the gas joint 82, and a suction nozzle clamping shaft 84 is installed under the rotating motor 80, and the suction nozzle 40 is installed under the suction nozzle clamping shaft 84. The suction nozzle 40 works through the air path to achieve the purpose of adsorbing the chip.

[0056] The present invention also proposes a die bonding device, which includes a bonding head assembly. The die bonding device adsorbs the chip through the bonding head assembly. When the chip is installed on the printed circuit board, the chip can be adsorbed by the suction nozzle 40, and the angular position of the chip posture is accurately adjusted by the rotating unit. The second mounting base 20 is driven by the driving unit to move in the vertical direction along the first mounting base 10. The suction nozzle 40 can be used to adsorb the chip or the chip on the suction nozzle 40 can be placed on the printed circuit board. The vertical displacement of the second mounting base 20 can be accurately measured by the displacement measuring unit, and then the vertical displacement of the chip can be accurately controlled by the control unit of the die bonding device, so that the bonding pressure between the suction nozzle and the chip, or the bonding pressure between the chip and the printed circuit board can be controlled to avoid damage to the chip. The specific structure of the bonding head assembly refers to the above embodiment. Since the present die bonding device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0057] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0058] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. The bang head assembly is characterized by: include: a first mounting base; a second mounting base, forming a vertical sliding fit with the first mounting base; a driving unit, configured to drive the second mounting base to move vertically along the first mounting base; a displacement measuring unit, configured to measure a vertical displacement of the second mounting base on the first mounting base; a suction nozzle, vertically disposed on the second mounting base and connected to the negative pressure end of the air source; The rotating unit is used to drive the suction nozzle to rotate.

2. The bungee assembly according to claim 1, characterized in that: It also includes an elastic connecting member, two ends of which are abutted against the first mounting base and the second mounting base.

3. The bungee assembly according to claim 1, characterized in that: The driving unit includes a motor stator arranged between the first mounting base and the second mounting base, a motor mover is arranged in the motor stator, the moving direction of the motor mover in the motor stator is vertical, and one end of the motor mover is connected to the first mounting base or the second mounting base.

4. The bungee assembly according to claim 1, wherein: The displacement measuring unit includes a displacement sensor provided on the first mounting base, and the displacement sensor is used to measure the displacement of the second mounting base.

5. The bungee assembly according to claim 3, characterized in that: The first mounting base and the second mounting base form a sliding guide cooperation through a linear track, and the linear track is parallel to the moving direction of the motor mover.

6. The bungee assembly according to claim 5, characterized in that: The first mounting base is detachably connected to a guide rail seat, the motor stator and the linear track are fixed on the guide rail seat, one end of the motor mover is connected to the second mounting base, and the second mounting base is slidably mounted on the linear track.

7. The bungee assembly according to claim 2, characterized in that: A compression spring seat is provided on the first mounting base, and the elastic connecting member includes a spring and an adjusting screw rod. The adjusting screw rod and the spring are vertical and abut against each other in the up and down directions. The lower end of the spring abuts against the second mounting base, and the upper end of the adjusting screw rod forms a threaded connection with the compression spring seat.

8. The bungee assembly according to claim 1, wherein: The rotating unit includes a rotating motor arranged on the second mounting base, a driving shaft of the rotating motor is provided with an air guide channel, and the suction nozzle is installed at the driving shaft position of the rotating motor and communicates with the air guide channel.

9. The bungee assembly according to claim 8, characterized in that: The rotating motor is provided with a rotating gland, the rotating gland is provided with a gas joint, the gas joint is communicated with the gas guide channel, the rotating gland is provided with an adjusting wire, the adjusting wire is used to adjust the gas flow of the gas joint.

10. Die bonding equipment, characterized by: The die bonding equipment includes the bonding head assembly according to any one of claims 1 to 9.

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