Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic device includes: a battery; the heat dissipation piece is arranged on one side of the battery, the heat dissipation piece comprises a heat conduction layer and a supporting layer which are stacked, the supporting layer comprises a main body part and a reinforcing part, the reinforcing part is embedded in the main body part, and the impact strength of the reinforcing part is higher than that of the main body part.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] Battery safety is crucial for the use of electronic devices. On the one hand, batteries generate heat during use, and this heat needs to be dissipated promptly to avoid potential safety hazards caused by heat accumulation. On the other hand, when electronic devices are subjected to collisions, such as falling onto uneven surfaces or being struck by sharp objects, these objects can puncture the back cover of the device, potentially damaging the battery and posing a safety hazard.

[0003] To achieve heat dissipation and impact protection for the battery, a composite structure consisting of a heat sink and a buffer layer is typically placed between the back cover of an electronic device and the battery. However, to achieve good impact resistance in the event of a drop, the buffer layer must be thick enough, which does not meet the requirements for lightweighting the electronic device. Utility Model Content

[0004] The present application aims to provide an electronic device that can solve the technical problem in the related art that the thickness of the electronic device increases due to the provision of a composite structure consisting of a heat sink and a buffer layer.

[0005] In a first aspect, an embodiment of the present application provides an electronic device, including:

[0006] Battery;

[0007] The heat sink is arranged on one side of the battery. The heat sink includes a stacked heat-conducting layer and a supporting layer. The supporting layer includes a main body and a reinforcing part. The reinforcing part is embedded in the main body. The impact resistance of the reinforcing part is higher than that of the main body.

[0008] The electronic device of the embodiment of the present application includes a battery and a heat sink. The heat sink can be used to dissipate heat from the battery to prevent the battery temperature from being too high. The heat sink includes a support layer and a heat-conducting layer. At the same time, the support layer includes a main body and a reinforcing portion embedded in the main body. By providing the reinforcing portion, and the impact strength of the reinforcing portion is higher than the impact strength of the main body, the area on the battery corresponding to the reinforcing portion can be protected, thereby improving the protection effect on the battery and preventing the battery from being damaged when the electronic device is impacted. That is, in the embodiment of the present application, a reinforcing portion is provided in the support layer of the heat sink for the position points that are easily damaged when impacted, while the position that is not easily damaged is still the original material of the support layer, so that the heat sink can maintain its original thickness, thereby not increasing the overall thickness of the electronic device, and then there is no need to provide a separate buffer layer, thereby reducing the overall thickness and cost of the electronic device, while effectively protecting the position of the battery that is easily damaged.

[0009] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1 One of the structural schematic diagrams of the electronic device according to the embodiment of the present application is shown;

[0012] Figure 2 A second structural diagram of an electronic device according to an embodiment of the present application is shown;

[0013] Figure 3 The third structural diagram of the electronic device according to the embodiment of the present application is shown;

[0014] Figure 4 A schematic diagram showing a case where an electronic device according to an embodiment of the present application is impacted is shown;

[0015] Figure 5 A schematic structural diagram of a heat sink in an electronic device according to an embodiment of the present application is shown;

[0016] Figure 6 Shown Figure 5 Schematic diagram of the structure of the middle support layer.

[0017] Reference numerals:

[0018] 100 electronic device, 102 battery, 104 heat sink, 106 thermal conductive layer, 108 support layer, 110 reinforcement portion, 114 mounting hole, 116 adhesive layer, 118 packaging layer, 122 housing, 126 connecting portion, 128 avoidance gap, 130 main body, 132 circuit board, 134 double-sided tape. DETAILED DESCRIPTION

[0019] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application in specific circumstances.

[0022] The following combination Figures 1 to 6 An electronic device according to an embodiment of the present application is described.

[0023] In some embodiments of the present application, an electronic device is provided. Figure 1 FIG1 shows one of the structural diagrams of the electronic device according to an embodiment of the present application. Figure 5 A schematic structural diagram of a heat sink in an electronic device according to an embodiment of the present application is shown; Figure 6 Shown Figure 5 Schematic diagram of the structure of the middle support layer; Figure 1 、 Figure 5 and Figure 6 As shown, the electronic device 100 includes: a battery 102; a heat sink 104, the heat sink 104 is arranged on one side of the battery 102, the heat sink 104 includes a stacked heat conductive layer 106 and a support layer 108, the support layer 108 includes a main body 130 and a reinforcement part 110, the reinforcement part 110 is embedded in the main body 130, and the impact strength of the reinforcement part 110 is higher than the impact strength of the main body 130.

[0024] In the embodiment of the present application, the electronic device 100 includes a battery 102. It is understood that the electronic device 100 can realize the supply of electrical energy through the battery 102 to realize the operation of the electronic device 100. Furthermore, the electronic device 100 also includes a heat sink 104. The heat sink 104 is attached to the battery 102 of the electronic device 100. The heat sink 104 can realize heat dissipation of the battery 102 of the electronic device 100 to prevent the battery 102 from overheating during the operation of the electronic device 100, thereby ensuring the performance and service life of the battery 102.

[0025] The heat sink 104 includes a thermally conductive layer 106 and a support layer 108. The support layer 108 is configured to adhere to the surface of the battery 102, and the thermally conductive layer 106 adheres to the support layer 108. The support layer 108 stabilizes the thermally conductive layer 106, ensuring a stable positional relationship between the thermally conductive layer 106 and the surface of the battery 102, thereby ensuring that the thermally conductive layer 106 effectively dissipates heat from the battery 102. Specifically, the thermally conductive layer 106 can be made of graphite to ensure effective heat dissipation from the battery 102 and prevent the battery 102 from overheating. The support layer 108 can be made of PET (polyethylene glycol terephthalate).

[0026] Furthermore, the support layer 108 includes a main body 130 and a reinforcement portion 110. The reinforcement portion 110 is embedded in the main body 130, and the impact strength of the reinforcement portion 110 is higher than the impact strength of the main body 130. The reinforcement portion 110 can protect the area on the battery 102 corresponding to the reinforcement portion 110. In this way, when the electronic device 100 is hit or when the electronic device 100 falls on an uneven ground, the reinforcement portion 110 can protect the battery 102 to prevent damage to the battery 102 and leakage of electrolyte, thereby effectively preventing the battery 102 from catching fire.

[0027] That is, by improving the heat sink 104 of the electronic device 100 and adding a reinforcement 110 to the support layer 108 of the heat sink 104, a specific area of ​​the battery 102 is protected by the reinforcement 110, so that the heat sink 104 can not only dissipate heat from the battery 102, but also enhance the protection of the battery 102. Compared with the protection methods in the related art, the embodiment of the present application sets the reinforcement 110 in the support layer 108 of the heat sink 104 at the location that is easily damaged when impacted, while the location that is not easily damaged is still made of the original material of the support layer 108. As a result, the heat sink 104 can maintain its original thickness, thereby not increasing the overall thickness of the electronic device 100, and thus does not need to set a separate buffer layer, reducing the overall thickness and cost of the electronic device 100, while effectively protecting the location of the battery 102 that is easily damaged. In addition, the reinforcement 110 is set on the main body 130 of the support layer 108, and the reinforcement 110 cannot be directly seen from the appearance, thereby ensuring the appearance of the electronic device 100.

[0028] The electronic device 100 of the embodiment of the present application includes a battery 102 and a heat sink 104. The heat sink 104 can dissipate heat from the battery 102 to prevent the battery from overheating. The heat sink 104 includes a support layer 108 and a thermally conductive layer 106. The support layer 108 includes a main body 130 and a reinforcing portion 110 embedded in the main body 130. By providing the reinforcing portion 110, and the impact strength of the reinforcing portion 110 is higher than the impact strength of the main body 130, the area on the battery 102 corresponding to the reinforcing portion 110 can be protected, thereby improving the protection effect of the battery 102 and preventing damage to the battery 102 when the electronic device 100 is impacted. That is, in the embodiment of the present application, a reinforcement portion 110 is provided in the support layer 108 of the heat sink 104 at a position that is easily damaged when impacted, while the position that is not easily damaged is still made of the original material of the support layer 108. This allows the heat sink 104 to maintain its original thickness, thereby not increasing the overall thickness of the electronic device 100, and eliminating the need to provide a separate buffer layer, thereby reducing the overall thickness and cost of the electronic device 100, while effectively protecting the position of the battery 102 that is easily damaged.

[0029] In some embodiments of the present application, the electronic device 100 includes a display screen and a shell 122, which enclose a cavity, a battery is disposed in the cavity, a heat sink 104 is disposed between the battery and the shell 122, and a support layer 108 is located on the side of the heat conductive layer facing the battery.

[0030] In an embodiment of the present application, the electronic device 100 further includes a display screen and a housing 122, and the display screen and the housing 122 enclose a cavity, so that the battery and other components of the electronic device 100 can be accommodated through the cavity. That is, the battery is arranged in the cavity, the heat sink 104 is located between the battery and the housing 122, and the support layer 108 is located on the side of the thermal conductive layer facing the battery. In other words, the support layer 108 can be attached to the surface of the battery to achieve fixation between the fixed thermal conductive layer and the battery, so that the thermal conductive layer can conduct the heat generated by the battery to the housing 122, and then heat exchange is performed between the housing 122 and the air to complete the heat dissipation process of the battery.

[0031] In some embodiments of the present application, the electronic device 100 also includes a circuit board 132, which is arranged on one side of the battery 102, and the circuit board 132 and the battery 102 are arranged in parallel. A connecting portion 126 is provided at one end of the heat sink 104, and the connecting portion 126 is fixedly connected to the circuit board 132, and the reinforcing portion is arranged adjacent to the connecting portion 126.

[0032] In the embodiment of the present application, the electronic device 100 further includes a circuit board 132. The circuit board 132 enables integration and connection between multiple electrical components within the electronic device 100, thereby ensuring the structural integrity of the electronic device 100. Furthermore, the circuit board 132 is disposed on one side of the battery 102, and the circuit board 132 and the battery 102 are disposed side by side. Specifically, the battery 102 can be attached to one side of the circuit board 132.

[0033] Furthermore, a connection portion 126 is provided at one end of the heat sink 104, and the connection portion 126 can achieve a fixed connection between the heat sink 104 and the circuit board 132. Specifically, there can be multiple connection portions 126, and the multiple connection portions 126 are arranged at intervals along the circumference of the heat sink 104, so that the heat sink 104 and the circuit board 132 are fixed at different positions along the circumference of the heat sink 104, thereby improving the fixing effect of the heat sink 104.

[0034] In addition, the connecting portion 126 and the circuit board 132 may be bonded together by a double-sided adhesive tape 134 to achieve connection between the heat sink 104 and the circuit board 132 .

[0035] In some embodiments of the present application, the reinforcement portion 110 is opposite to the center of gravity of the electronic device 100 .

[0036] In the embodiment of the present application, the reinforcement portion 110 may be disposed at a position opposite to the center of gravity of the electronic device 100 .

[0037] It is understandable that Figure 4 FIG. 1 is a schematic diagram showing an electronic device according to an embodiment of the present application being impacted; FIG. Figure 4 As shown, 5# is the position where the center of gravity of the electronic device 100 is located. When the electronic device 100 falls onto an uneven ground, if the center of gravity of the electronic device 100 is impacted, almost all of the kinetic energy generated by the electronic device 100 during its fall will be converted into an impact on the center of gravity of the electronic device 100. In this way, the battery 102 of the electronic device 100 is subjected to the greatest impact force, which is more likely to cause damage to the battery 102. In contrast, when the 4# or 6# position is impacted, only a portion of the kinetic energy generated by the entire device during its fall is converted into the impact between the 4# or 6# position and the protruding object, while the other portion is converted into the impact between the 6# or 7# position and the ground. By arranging the reinforcement portion 110 at the position where the center of gravity of the electronic device 100 is located, the position where the center of gravity of the electronic device 100 is located can be effectively protected to prevent damage to the battery 102.

[0038] In some embodiments of the present application, there are multiple reinforcement parts 110 , and the reinforcement parts 110 are disposed at locations where the electronic device 100 has a risk of falling.

[0039] In the embodiment of the present application, the reinforcement portion 110 may also be provided at a drop risk location of the electronic device 100. It is understood that a drop risk location is a location where the electronic device is likely to land and be punctured by a sharp object when it falls.

[0040] Specifically, before the electronic device 100 leaves the factory, an uneven ground drop test is usually carried out. The uneven ground drop test is an important test to measure the safety performance of the battery 102 of the electronic device 100. During the experiment, the electronic device 100 is suspended and fixed, and a sharp triangular cone is placed on the ground. The vertical height of the electronic device 100 and the triangular cone is adjusted, and it is ensured that when the device fixing the electronic device 100 is released, the test point position of the battery 102 of the electronic device 100 can just hit the triangular cone. It is understandable that when the electronic device 100 falls from a height to the triangular cone, the electronic device 100 collides with the triangular cone, and the sharp triangular cone punctures the back cover of the electronic device 100 and the battery cell diaphragm inside the battery 102, causing leakage of the electrolyte, short circuit of the positive and negative poles of the battery 102, instantaneous discharge, and release of a large amount of energy, causing the battery to catch fire. Specifically, Figure 3 The third structural diagram of the electronic device according to the embodiment of the present application is shown; Figure 2 and Figure 3 As shown, during the experiment, drop tests were performed on areas 1 to 9 respectively, thereby determining the areas in areas 1 to 9 where the battery 102 of the electronic device 100 is more susceptible to damage, that is, the drop risk locations of the electronic device 100. Then, the location of the reinforcement portion 110 was determined based on the collision test on the electronic device 100 to protect the more susceptible areas of the electronic device 100, thereby preventing damage to the battery 102 of the electronic device 100 during collision.

[0041] In some embodiments of the present application, both side surfaces of the reinforcing portion 110 are flush with both side surfaces of the main body 130 , and the reinforcing portion 110 is a metal part.

[0042] In an embodiment of the present application, when setting the reinforcement portion 110, the two side surfaces of the reinforcement portion 110 can be set to be flush with the two side surfaces of the main body portion 130, thereby avoiding the reinforcement portion 110 protruding from the surface of the main body portion 130, thereby avoiding an increase in the thickness of the heat sink 104, and thus avoiding an increase in the overall thickness of the electronic device.

[0043] Furthermore, the reinforcement part 110 may be a metal part, specifically, the reinforcement part 110 may include a steel sheet, a copper sheet, etc., so as to improve the protective effect of the reinforcement part 110 and ensure the protection effect of the battery 102 when the battery 102 receives an impact.

[0044] In some embodiments of the present application, the main body 130 defines a mounting hole 114 , the reinforcement portion 110 is disposed in the mounting hole 114 , and an edge of the reinforcement portion 110 is connected to a wall of the mounting hole 114 .

[0045] In the embodiments of this application, Figure 5 As shown, a mounting hole 114 can be opened on the main body 130 so that the reinforcement part 110 can be installed in the mounting hole 114, thereby avoiding the thickness of the reinforcement part 110 causing an increase in the overall thickness of the electronic device 100, which is beneficial to the miniaturization design of the electronic device 100.

[0046] In some embodiments of the present application, the heat sink 104 further includes an adhesive layer 116 , which is located between the support layer 108 and the heat conducting layer 106 and is used to connect the support layer 108 and the heat conducting layer 106 .

[0047] In the embodiments of this application, Figure 5 As shown, the support layer 108 and the thermally conductive layer 106 can be bonded together via an adhesive layer 116 to achieve a fixed connection between the support layer 108 and the thermally conductive layer 106, thereby ensuring the stability of the position of the thermally conductive layer 106. Specifically, the adhesive layer 116 can be a thin double-sided tape, which can not only ensure the stability of the connection between the support layer 108 and the thermally conductive layer 106, but also ensure the overall thickness of the heat sink 104, thereby preventing the heat sink 104 from being too thick and affecting the overall size of the electronic device 100.

[0048] In addition, the adhesive layer 116 can also be bonded to the reinforcing portion 110 . The adhesive layer 116 can also be used to fix the position of the reinforcing portion 110 , thereby ensuring the stability of the position of the reinforcing portion 110 and preventing the reinforcing portion 110 from being displaced.

[0049] In some embodiments of the present application, the heat sink 104 further includes: a packaging layer 118 , which covers the thermal conductive layer 106 and is used to package the thermal conductive layer 106 .

[0050] In the embodiments of this application, Figure 5 As shown, the heat sink 104 may further include a packaging layer 118 . The packaging layer 118 may be used to package the heat conducting layer 106 , thereby preventing the heat conducting layer 106 from being damaged by the external environment.

[0051] Specifically, the encapsulation layer 118 can be made of an opaque matte material, such as a black matte material. On the one hand, the matte material can avoid light pollution and is easy to maintain. On the other hand, it can improve the heat absorption effect of the heat sink 104, thereby improving the heat dissipation effect of the heat sink 104 on the battery 102.

[0052] In some embodiments of the present application, the heat dissipation element 104 includes at least one avoidance notch 128 , and the avoidance notch 128 extends from an edge of the heat dissipation element 104 toward the center of the heat dissipation element 104 .

[0053] In the embodiments of this application, Figure 6 As shown, the heat sink 104 may further include at least one avoidance notch 128. By providing the avoidance notch 128, when the heat sink 104 is installed in the housing 122 of the electronic device 100, it can avoid other devices in the electronic device 100, thereby preventing the heat sink 104 from interfering with other devices.

[0054] Specifically, the avoidance gap 128 may extend from the edge of the heat sink 104 toward the center of the heat sink 104 to ensure the structural integrity of the heat sink 104 .

[0055] In some embodiments of the present application, there are multiple heat dissipating elements 104 , and the multiple heat dissipating elements 104 are respectively attached to different areas of the battery 102 .

[0056] In the embodiments of this application, Figure 2 FIG2 shows a second structural diagram of an electronic device according to an embodiment of the present application; Figure 2 As shown, the number of heat sinks 104 can be set to multiple according to the area of ​​the battery 102 of the electronic device 100 and the arrangement of multiple devices in the electronic device 100, so that the heat sink 104 does not affect the arrangement of other devices in the electronic device 100, and the heat dissipation effect of the heat sink 104 on the battery 102 is further improved. At the same time, each heat sink 104 includes at least one reinforcement portion 110. Therefore, in each heat sink 104, the reinforcement portion 110 can be used to protect the battery 102 to prevent the battery 102 from being damaged when it is impacted. Figure 2 As shown, area 2 , area 5 , and area 8 on the electronic device 100 can be protected by two heat dissipation members 104 .

[0057] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0058] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Battery; A heat sink is provided on one side of the battery, the heat sink comprises a stacked heat-conducting layer and a supporting layer, the supporting layer comprises a main body and a reinforcing portion, the reinforcing portion is embedded in the main body, and the impact resistance of the reinforcing portion is higher than the impact resistance of the main body.

2. The electronic device according to claim 1, wherein The electronic device includes a display screen and a shell, the display screen and the shell form a cavity, the battery is arranged in the cavity, the heat sink is arranged between the battery and the shell, and the support layer is located on the side of the heat conductive layer facing the battery.

3. The electronic device according to claim 2, wherein: The electronic device also includes a circuit board, which is arranged on one side of the battery, and the circuit board and the battery are arranged in parallel. A connecting portion is provided at one end of the heat sink, and the connecting portion is fixedly connected to the circuit board. The reinforcing portion is arranged adjacent to the connecting portion.

4. The electronic device according to claim 1, wherein: The reinforcement portion is opposite to the center of gravity of the electronic device.

5. The electronic device according to claim 1, wherein There are multiple reinforcement parts, and the reinforcement parts are arranged at the falling risk points of the electronic device.

6. The electronic device according to any one of claims 1 to 5, characterized in that: Both side surfaces of the reinforcement portion are flush with both side surfaces of the main body portion, and the reinforcement portion is a metal part.

7. The electronic device according to claim 6, wherein: The main body is provided with a mounting hole, the reinforcement portion is arranged in the mounting hole, and the edge of the reinforcement portion is connected to the hole wall of the mounting hole.

8. The electronic device according to any one of claims 1 to 5, characterized in that: The heat sink also includes: An adhesive layer is located between the support layer and the heat-conducting layer, and is used to connect the support layer and the heat-conducting layer.

9. The electronic device according to claim 8, wherein: The heat sink also includes: The packaging layer covers the heat-conducting layer and is used to package the heat-conducting layer.

10. The electronic device according to any one of claims 1 to 5, characterized in that: The heat dissipation element includes at least one avoidance notch, and the avoidance notch extends from an edge of the heat dissipation element toward a center of the heat dissipation element.

11. The electronic device according to any one of claims 1 to 5, characterized in that: There are multiple heat sinks, and the multiple heat sinks are respectively attached to different areas of the battery.

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