Electronic device

Abstract

The embodiment of the utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a display screen, a middle frame, a frame piece, a conductive layer and a conductive piece. The frame piece is connected to the middle frame, one part of the frame piece is located on the display side of the display screen, orthographic projections of the frame piece and the display screen on a reference plane are partially overlapped, and the reference plane is a plane where the length direction and the width direction of the electronic equipment are located. The resistance of the conducting layer is smaller than or equal to 1 ohm, the conducting layer is attached to the inner surface of the frame piece, the conducting layer comprises a guiding part and a pin part, the guiding part is electrically connected with the pin part, and the guiding part extends in the length direction of the frame piece and is located on the display side of the display screen. The first end of the conductive part is electrically connected with the middle frame, and the second end of the conductive part is electrically connected with the pin part. In this way, the effect of grounding static electricity entering the electronic equipment is achieved, and the display screen is prevented from being damaged by electrostatic discharge.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to an electronic device. Background Art

[0002] Currently, electronic devices generate static electricity during use. If the static electricity is not eliminated, it will cause a discharge phenomenon due to direct contact or induction, which is the electrostatic discharge (ESD) effect. The static electricity will enter the interior of the electronic device through the gap between the side of the electronic device and the display screen, causing damage to the display screen. In the related art, a conductive cloth is provided inside the electronic device. One end of the conductive cloth overlaps with the protective layer outside the bend of the display panel in the display screen, and the other end of the conductive cloth is electrically connected to the ground of the electronic device. After the static electricity enters the electronic device, it is conducted away by the conductive cloth, thereby achieving the purpose of preventing static electricity discharge. However, the positioning accuracy of the conductive cloth is poor, and it cannot conduct away the static electricity, which makes the display screen easily damaged. Utility Model Content

[0003] An embodiment of the present application provides an electronic device that achieves the function of grounding static electricity that enters the interior of the electronic device, thereby preventing the discharge of static electricity from damaging the display screen of the electronic device.

[0004] An embodiment of the present application provides an electronic device, which includes a display screen, a middle frame, a frame member, a conductive layer and a conductive member. The frame member is connected to the middle frame, a portion of the frame member is located on the display side of the display screen, and the frame member and the display screen partially overlap in their orthographic projections on a reference plane, where the reference plane is a plane where the length and width directions of the electronic device are located. The resistance of the conductive layer is less than or equal to 1 ohm, and the conductive layer is attached to the inner surface of the frame member. The conductive layer includes a guide portion and a pin portion, and the guide portion is electrically connected to the pin portion. The guide portion extends along the length direction of the frame member and is located on the display side of the display screen. The first end of the conductive member is electrically connected to the middle frame, and the second end of the conductive member is electrically connected to the pin portion.

[0005] In the embodiment of the present application, after external static electricity enters the electronic device, the guide portion transfers the static electricity to the pin portion, and the pin portion transfers the static electricity to the middle frame through the conductive member for discharge, thereby preventing the static electricity from damaging the display screen. In addition, the resistance of the conductive layer is less than or equal to 1 ohm, so that the conductive layer has a high conductivity. The conductive layer transmits static electricity quickly and can transfer static electricity to the conductive member in a timely manner, thereby preventing excessive accumulation of static electricity on the display screen and further improving the display screen's anti-static release capability. In addition, the conductive layer has a low resistance, absorbs less antenna radiation efficiency, and has little impact on antenna performance. Within the allowable range, it can meet the requirements of a lightweight design of electronic equipment, and makes a distributed antenna design possible, thereby increasing battery capacity and achieving a long-lasting design.

[0006] In some possible implementations, the conductive layer is a metal layer, which can easily reduce the resistance of the conductive layer to less than or equal to 1 ohm, ensuring high conductivity. Furthermore, the metal layer can be formed on the inner surface of the frame member using low-cost processes such as laser ablation, laser direct structuring, laser reconstructive printing, or laser surface coating, reducing the cost of the conductive layer and improving the economic efficiency of the electronic device.

[0007] In some possible implementations, the conductive member is a conductive spring, and the middle frame is electrically connected to the conductive layer via the conductive spring.

[0008] In this way, the conductive spring is elastic and can maintain close contact with the pin portion and the middle frame, improving the reliability of the electrical connection between the conductive spring, the middle frame, and the pin portion. In addition, the conductive spring can be elastically deformed, so after the frame member and the middle frame are assembled, the conductive spring, the middle frame, and the pin portion can still maintain electrical contact, thereby reducing the difficulty of assembling the electronic device.

[0009] In some possible implementations, the conductive spring is fixedly connected to the connecting portion of the frame member and is in electrical contact with the pin portion, or the conductive spring is fixedly connected to the middle frame and is in electrical contact with the middle frame.

[0010] In this way, the conductive spring can be assembled into a whole with the middle frame or the frame in advance, which can improve the assembly efficiency of the electronic device.

[0011] In some possible implementations, the conductive layer includes a plurality of pin portions, which are arranged at intervals along the length direction of the guide portion, and each pin portion is electrically connected to the middle frame through at least one conductive member.

[0012] In this way, the conductive layer can transfer static electricity to the middle frame through multiple conductive parts, thereby increasing the speed of drawing away static electricity on the conductive layer and further improving the anti-static release capability of the display screen.

[0013] In some possible implementations, the electronic device includes a plurality of conductive layers, which are attached to an inner surface of the frame member and arranged at intervals along a length direction of the frame member.

[0014] In this way, multiple conductive layers independently channel static electricity that enters the electronic device through the gap between the frame and the display, increasing the speed of static electricity removal and further improving the display's anti-static discharge capabilities. Furthermore, the gap between adjacent conductive layers shortens the length of each conductive layer, allowing the RF resonant noise generated by the conductive layers to avoid the antenna's resonant frequency band, further minimizing its impact on antenna performance.

[0015] In some possible implementations, the spacing between two adjacent conductive layers along the length of the frame is greater than or equal to 0.2 mm and less than or equal to 0.8 mm. This prevents excessive spacing between adjacent conductive layers, preventing static electricity from escaping through the gap between the two adjacent conductive layers and damaging the display. Furthermore, it ensures that RF resonant noise generated by the conductive layers avoids the antenna's resonant frequency band.

[0016] In some possible implementations, the electronic device includes multiple conductive parts, which are arranged at intervals along the length direction of the frame part. Each conductive layer is electrically connected to the middle frame through at least one conductive part. Each conductive layer transfers static electricity to the middle frame through the corresponding conductive part to ensure static grounding.

[0017] In some possible implementations, at least one conductive member is in electrical contact with the pin portions of two adjacent conductive layers, respectively, which can reduce the number of conductive members and ease the difficulty of arranging components inside the electronic device.

[0018] In some possible implementations, the frame member includes a suspended portion and a connecting portion. The connecting portion is connected to the middle frame, a gap is formed between the suspended portion and the display screen, and the orthographic projection of the suspended portion and the display screen on a reference plane partially overlap. The guide portion is attached to the inner surface of the suspended portion, and the pin portion is attached to the inner surface of the connecting portion.

[0019] In this way, static electricity entering from the gap between the suspended part and the display screen is promptly transferred to the pin part by the guide part, and the conductive part transfers the static electricity on the pin part to the middle frame, realizing static grounding and preventing static discharge from damaging the display screen.

[0020] In some possible implementations, the display screen includes a display panel, which includes a display portion, a bending portion, and a binding portion connected in sequence. Along the thickness direction of the electronic device, the binding portion is spaced apart from the display portion and is located on the non-display side of the display portion, and the conductive layer is located between the bending portion and the frame member.

[0021] In this way, static electricity that enters the electronic device through the gap between the frame member and the display screen is led away by the conductive layer, thereby preventing the static electricity from damaging the bent portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a cross-sectional schematic diagram of an electronic device in the related art;

[0023] Figure 2 A schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0024] Figure 3 for Figure 2 Schematic diagram of the cross section in the AA direction;

[0025] Figure 4 for Figure 3 A magnified schematic diagram of point A in the middle;

[0026] Figure 5 for Figure 3 Schematic diagram of the three-dimensional structure of the middle frame member and the conductive layer;

[0027] Figure 6 A schematic diagram of the planar structure of another electronic device provided in an embodiment of the present application;

[0028] Figure 7 for Figure 3 Schematic diagram of the three-dimensional structure of the conductive layer;

[0029] Figure 8 A schematic diagram of a three-dimensional structure of multiple conductive layers and a frame member in another electronic device provided by an embodiment of the present application;

[0030] Figure 9 for Figure 8 Enlarged schematic diagram of the dotted line in the middle.

[0031] Description of reference numerals:

[0032] 100, display screen; 110, display panel; 111, display portion; 112, bending portion; 113, binding portion;

[0033] 200, conductive layer; 210, guide portion; 220, pin portion;

[0034] 300, middle frame;

[0035] 310, first middle frame member; 320, second middle frame member;

[0036] 330, connecting groove;

[0037] 400, frame member; 410, first frame; 420, second frame; 401, suspended portion; 402, connecting portion;

[0038] 510, first housing; 511, first area; 520, second housing; 521, second area;

[0039] 600, conductive element; 610, first bullet segment; 620, second bullet segment; 630, third bullet segment;

[0040] X, length direction; Y, width direction; Z, thickness direction. DETAILED DESCRIPTION

[0041] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a point of sales (POS) machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, and other devices with a display screen.

[0042] In the embodiments of the present application, a mobile phone is used as an example of the electronic device for description, wherein the mobile phone can be a folding phone, a straight phone, or a side-sliding phone.

[0043] Electronic devices generate static electricity during use. If the static electricity is not eliminated, it can cause discharge due to direct contact or induction, a phenomenon known as electrostatic discharge (ESD). This static electricity can enter the interior of the electronic device through the gap between the side of the electronic device and the display, causing damage to the display.

[0044] Figure 1 It is a cross-sectional schematic diagram of an electronic device in the related art.

[0045] In order to prevent the display screen from being damaged by electrostatic discharge (ESD), in the related art, see Figure 1 As shown, the electronic device includes a display screen 800 and a conductive fabric 900. Display screen 800 has a display panel 810, which includes a display portion 811, a bent portion 812, and a binding portion 813, which are connected in sequence. A protective layer 820 is provided on the outer side of bent portion 812. One end of conductive fabric 900 overlaps protective layer 820, and the other end of conductive fabric 900 is electrically connected to the ground of the electronic device. When dimension A is greater than dimension B, conductive fabric 900 conducts static electricity that enters the electronic device, preventing static electricity from accumulating on display screen 800, thereby achieving ESD protection.

[0046] However, the fixture for conductive fabric 900 has a tolerance of + / -0.8 mm, resulting in poor positioning accuracy for conductive fabric 900. The actual position of conductive fabric 900 deviates significantly from the preset position, causing dimension A to be smaller than dimension B. This prevents conductive fabric 900 from overlapping protective layer 820, preventing it from dissipating static electricity and damaging display screen 800. Furthermore, due to the thinness of bent portion 812, static electricity easily penetrates the bent portion 812, resulting in weak ESD protection.

[0047] In view of this, the electronic device provided in the embodiment of the present application is internally provided with a conductive layer 200 and a conductive member 600. The conductive layer 200 is electrically connected to the middle frame 300 via the conductive member 600. The conductive layer 200 transfers static electricity entering the electronic device from the outside to the middle frame 300 via the conductive member 600 and grounds it, thereby preventing the display screen 100 from failing due to electrostatic discharge effects and extending the service life of the display screen 100 and the electronic device. In addition, the resistance of the conductive layer 200 is less than or equal to 1 ohm, which has little absorption on the antenna radiation efficiency and has little impact on the antenna performance. Within the allowable range, it can meet the requirements of the lightweight design of the electronic device and make the distributed antenna design possible, which can increase the battery capacity and thus achieve a long-lasting design.

[0048] Figure 2 This is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application. Figure 3 for Figure 2 Schematic diagram of the cross section in the AA direction.

[0049] See also Figure 2 As shown, the electronic device may include a display screen 100, a middle frame 300 and a frame member 400. The display screen 100 has a display side and a non-display side. The display side is used to display text, images, videos, etc., and the non-display side is arranged opposite to the display side. Figure 3 As shown, the display screen 100 and the frame member 400 are arranged on the same side of the middle frame 300, and the frame member 400 and the display screen 100 are respectively connected to the middle frame 300.

[0050] A portion of the frame member 400 is located on the display side of the display screen 100, and the orthographic projections of the frame member 400 and the display screen 100 on the reference plane partially overlap. The reference plane is the length direction of the electronic device (eg Figure 2 X direction) and width direction (such as Figure 2 That is, the frame member 400 may include a first portion and a second portion, the first portion being perpendicular to the thickness direction of the electronic device (e.g., Figure 3 The second portion is arranged with the display screen 100 in the X direction, and the second portion is located at the display side of the display screen 100 and covers the edge of the display screen 100.

[0051] When the electronic device is a foldable device with a folded state and an unfolded state, the middle frame 300 and the frame member 400 are both composed of left and right parts. Figure 2As shown, the middle frame 300 may include a first middle frame member 310 and a second middle frame member 320, which are hinged via a hinge structure. The frame member 400 may include a first frame member 410 and a second frame member 420, which may be connected via a flexible connector. The first frame member 410 is connected to the first middle frame member 310, and the second frame member 420 is connected to the second middle frame member 320.

[0052] Since the frame member 400 serves as an appearance member, in order to improve the aesthetic effect of the electronic device, in some embodiments, a layer (not shown in the figure) can be provided on the outer surface of the frame member 400. In this case, the thickness of the layer can be 0.03mm, 0.05mm, etc.

[0053] The frame member 400 is made of an insulating material, such as polycarbonate (PC). In addition, in some embodiments, the frame member 400 may also be called a small A shell or an insulating upper cover.

[0054] Figure 4 for Figure 3 The enlarged schematic diagram of point A in the middle, Figure 5 for Figure 3 Schematic diagram of the three-dimensional structure of the middle frame member and the conductive layer.

[0055] See also Figure 5 As shown, the frame member 400 may include a suspended portion 401 and a connecting portion 402. Figure 4 As shown, there is a gap between the suspended portion 401 and the display screen 100, and the orthographic projections of the suspended portion 401 and the display screen 100 on the reference plane partially overlap. It should be noted that in some embodiments, the suspended portion 401 may also contact the display screen 100. The connecting portion 402 is provided at the outer edge of the suspended portion 401 and is connected to the middle frame 300.

[0056] Among them, such as Figure 5 As shown, the suspended portion 401 and the connecting portion 402 may be integrally formed. In addition, the outer surface of the suspended portion 401 may be a plane, and the outer surface of the connecting portion 402 may be an inclined surface or a curved surface.

[0057] like Figure 4 As shown, the middle frame 300 is arranged along the thickness direction of the electronic device (eg Figure 4 The side facing the display screen 100 (in the middle Z direction) may include a connecting groove 330, and one end of the connecting portion 402 is located inside the connecting groove 330, which can realize the connection between the frame member 400 and the middle frame 300 and reduce the overlapping thickness between the frame member 400 and the middle frame 300, which helps to achieve a thinning design of electronic devices.

[0058] The connection between the connecting portion 402 and the middle frame 300 can be achieved by snapping, bonding (e.g., adhesive), etc. In some embodiments, an adhesive structure such as adhesive (not shown) can be provided between one end of the connecting portion 402 and the inner wall of the connecting groove 330 to achieve the connection between the frame member 400 and the middle frame 300. Of course, the connecting portion 402 can also be connected to the middle frame 300 by other means.

[0059] The display screen 100 may be a flexible screen, a hard screen, a hybrid screen, etc. For example Figure 2 As shown, the display screen 100 is a flexible screen, which enables the electronic device to have a folded state and an unfolded state.

[0060] See also Figure 4 As shown, the display screen 100 may include a display panel 110, and the display panel 110 may be a flexible display panel, such as an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, etc.

[0061] See also Figure 4 As shown, the display panel 110 may include a display portion 111, a bending portion 112, and a binding portion 113 connected in sequence. The bending portion 112 is located between the display portion 111 and the binding portion 113, and connects the display portion 111 and the binding portion 113. Figure 4 The binding portion 113 is spaced apart from the display portion 111 and is located on the non-display side of the display portion 111. The bending portion 112 includes at least a partial arc segment.

[0062] It should be noted that, in addition to the display panel 110, the display screen 100 may also include other devices. In some embodiments, the display screen 100 may also include a cover plate, a polarizer, a transparent adhesive layer, a back film, a support layer and a connecting layer. The transparent adhesive layer is arranged between the polarizer and the cover plate, the polarizer is located between the transparent adhesive layer and the display portion 111 of the display panel 110, the back film, the support layer and the connecting layer connect the binding portion 113 and the display portion 111 and are supported between the display portion 111 and the binding portion 113, the back film is connected to the binding portion 113, the connecting layer is connected to the display portion 111, and the supporting layer is located between the back film and the connecting layer. The cover plate is a light-transmitting plate-like structure, which is used to protect the display panel 110 and can transmit the image light emitted by the display panel 110. The polarizer is used to reduce the impact of reflected light on the display effect of the display screen 100. The supporting layer is made of conductive material, and the back film is made of insulating material. In some embodiments, the transparent adhesive layer is an optically clear adhesive (OCA).

[0063] See also Figure 4 As shown, the gap between the frame member 400 and the display screen 100 can meet the requirements of the foldable device being bent back and forth, or can also prevent the frame member 400 from being damaged by the impact force on the display screen 100 when the electronic device is dropped. However, static electricity can easily enter the interior of the electronic device through the gap between the display screen 100 and the frame member 400, and the static electricity discharge effect may cause damage to the display screen 100, or even damage the electronic device.

[0064] To solve this problem, see Figure 3 As shown, the electronic device also includes a conductive layer 200 and a conductive member 600. The conductive layer 200 is attached to the inner surface of the frame member 400. The first end of the conductive member 600 is electrically connected to the conductive layer 200, and the second end of the conductive member 600 is electrically connected to the middle frame 300. The conductive layer 200 is electrically connected to the middle frame 300 through the conductive member 600, and the middle frame 300 is electrically connected to the ground of the electronic device.

[0065] After external static electricity enters the interior of the electronic device through the gap between the frame member 400 and the display screen 100, the conductive layer 200 transfers the static electricity that enters from the gap between the frame member 400 and the display screen 100 to the conductive member 600. The conductive member 600 then transfers the static electricity to the middle frame 300. The static electricity is grounded through the middle frame 300, and the static electricity discharge will not cause damage to the display screen 100. The display screen 100 can withstand higher static electricity risks and has higher reliability. In addition, the conductive layer 200 is electrically connected to the middle frame 300 through the conductive member 600. The conductive layer 200 and the middle frame 300 have an indirect physical contact relationship, which can increase the speed at which the conductive layer 200 transfers static electricity to the middle frame 300, helping to further improve the anti-static discharge capability of the display screen 100.

[0066] In an embodiment of the present application, the resistance of the conductive layer 200 is less than or equal to 1 ohm (Ω). For example, the resistance of the conductive layer 200 can be 0.1 ohm, 0.2 ohm, 0.3 ohm, 0.4 ohm, 0.5 ohm, 0.6 ohm, 0.7 ohm, 0.8 ohm, etc. In this way, the conductive layer 200 has a high conductivity, and the conductive layer 200 has a fast transmission speed for static electricity, and can transfer static electricity to the conductive member 600 in a timely manner, thereby avoiding excessive accumulation of static electricity on the display screen 100, and further improving the anti-static release capability of the display screen 100. In addition, the conductive layer 200 has a low resistance, absorbs less antenna radiation efficiency, and has little impact on antenna performance. Within the allowable range, it can meet the requirements of the lightweight design of electronic devices and make distributed antenna design possible, thereby achieving a long-lasting design.

[0067] The conductive layer 200 has low resistance and high conductivity. The conductive layer 200 will not have a significant impact on the high-frequency band of the antenna, thereby eliminating the constraints of the conductive layer 200 on the design of the antenna and the design of the overall machine architecture. The display screen 100 provided in this application can be applicable to different antenna design schemes to meet different overall machine architecture designs. For example, in some scenarios, electronic devices can adopt a distributed antenna layout to increase the capacity of the battery and disperse the heat source as much as possible to facilitate heat dissipation.

[0068] Figure 6 A schematic diagram of the planar structure of another electronic device provided in an embodiment of the present application.

[0069] In some embodiments, as Figure 6 As shown, the electronic device may include a first shell 510 and a second shell 520 that are rotatably connected, the display screen 100 is stacked on one side of the first shell 510 and the second shell 520, the first shell 510 includes a first middle frame 310 and a first border 410, the second shell 520 includes a second middle frame 320, a second border 420 and a conductive layer 200, and the conductive layer 200 is attached to the inner surface of the second border 420. At this time, the chip-level system (SoC) is located in the first shell 510, and the radio frequency integrated circuit (RFIC) is located in the second shell 520, so that the electronic device can adopt a chip-level system (SoC) and a radio frequency integrated circuit (RFIC) separated on two middle frames, and a design scheme combining one side of the RFIC with a flexible screen binding design to expand the battery space of the foldable phone, improve the battery life of the whole phone, and realize a long-life design of the electronic device.

[0070] The first shell 510 includes a plurality of first areas 511, which are spaced apart along the periphery of the first shell 510 for mounting a short-range antenna module. The short-range antenna module may include a global positioning system (GPS), Bluetooth (BT), wireless fidelity (WiFi), and other wireless communication modules. The second shell 520 includes a plurality of second areas 521, which are spaced apart along the periphery of the second shell 520 for mounting a cellular antenna module. The cellular antenna module includes several sub-antennas. In some embodiments, the cellular antenna module can be formed by at least a portion of the second frame 420, that is, the second frame 420 can include a plurality of metal frame segments, which can serve as an antenna radiator to form a sub-antenna of the cellular antenna module.

[0071] The cellular antenna module is located on the outside of the conductive layer 200, and the conductive layer 200 is arranged on the inner surface of the second frame 420. The conductive layer 200 has low resistance, and the conductive layer 200 absorbs less antenna radiation energy of the cellular antenna module, and has little impact on the high-frequency signal of the cellular antenna module, which can ensure antenna performance. There are no longer any restrictions on the distribution of the antenna, making the overall machine architecture design more flexible.

[0072] In some embodiments, the conductive layer 200 can be a metal layer made of a high-conductivity metal material, such as constantan or manganese copper, which can easily make the resistance of the conductive layer 200 less than or equal to 1 ohm, thereby ensuring the high conductivity of the conductive layer 200. In addition, the metal layer can be formed on the inner surface of the frame member 400 through low-cost processes such as laser activating plating (LAP), laser direct structuring (LDS), laser restructuring printing (LRP), or laser structuring coating (LSC), which can reduce the cost of the conductive layer 200 and improve the economic efficiency of the electronic device.

[0073] In addition, the metal layer is formed using LAP, LDS, LRP, LSP and other technologies, which can also reduce the requirement for the thickness of the large surface of the frame member 400 (i.e., the thickness of the overhanging portion 401), so that the thickness of the overhanging portion 401 can be less than or equal to 0.25 mm. For example, the thickness of the overhanging portion 401 can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, etc. This helps to reduce the difficulty of designing electronic devices to be lightweight and thin.

[0074] It should be noted that, in addition to being made of metal materials, the conductive layer 200 may also be made of metal materials and non-metal materials, as long as the resistance of the conductive layer 200 is less than or equal to 1 ohm.

[0075] See also Figure 4 As shown, the conductive layer 200 is attached to the inner surface of the frame member 400 and is located between the bent portion 112 and the frame member 400. In other words, the conductive layer 200 is located on the inner surface of the frame member 400 on the side close to the bent portion 112. By placing the conductive layer 200 on the inner surface of the frame member 400, static electricity is transferred to the conductive member 600 through the conductive member 600 without affecting the appearance of the entire device or other performance.

[0076] In addition, the conductive layer 200 is disposed between the frame member 400 and the bending portion 112 (eg Figure 4 As shown), the static electricity on the bending portion 112 can be transferred to the middle frame 300 through the conductive member 600 for grounding, preventing the static electricity from discharging in the bending portion 112 and damaging the bending portion 112, thereby improving the ESD resistance of the bending portion 112 and further improving the ESD resistance of the display screen 100.

[0077] Specifically, see Figure 4 As shown, along the direction perpendicular to the thickness direction of the electronic device (such as Figure 4 In the middle X direction), one end of the conductive layer 200 is closer to the opening end of the gap between the frame member 400 and the display screen 100 than the bending portion 112, so the static electricity entering from the gap will enter the conductive layer 200, preventing the static electricity from discharging in the bending portion 112, thereby improving the ESD resistance of the bending portion 112.

[0078] Figure 7 for Figure 3 Schematic diagram of the three-dimensional structure of the conductive layer.

[0079] See also Figure 7 As shown, the conductive layer 200 includes a guide portion 210 and a pin portion 220, and the guide portion 210 is electrically connected to the pin portion 220. The guide portion 210 is attached to the inner surface of the suspended portion 401 (eg, Figure 5 As shown), the guide portion 210 is along the length direction of the frame member 400 (as shown Figure 5 Y direction) extension settings (such as Figure 5 As shown), the guide portion 210 is located on the display side of the display screen 100 (as shown Figure 4 The pin portion 220 is attached to the inner surface of the connecting portion 402 (as shown). Figure 5 As shown), the pin portion 220 is located between the bent portion 112 and the frame member 400 and is spaced apart from the middle frame 300 (as shown Figure 4 As shown). Figure 4 As shown, the pin portion 220 is electrically connected to the conductive member 600 , and the pin portion 220 is electrically connected to the middle frame 300 through the conductive member 600 , thereby achieving electrical connection between the conductive layer 200 and the middle frame 300 .

[0080] When static electricity enters the electronic device, it is transferred from the guide portion 210 to the pin portion 220. The pin portion 220 then transfers the static electricity to the middle frame 300 via the conductive member 600 for grounding, preventing static electricity from damaging the display 100. Furthermore, the guide portion 210 transfers static electricity from the display 100 to the pin portion 220, preventing excessive static electricity from building up on the display 100 and further improving the display 100's ESD resistance.

[0081] See also Figure 4 As shown, at least a portion of the guide portion 210 is located in the gap between the display screen 100 and the frame member 400, and at least a portion of the orthographic projection of the guide portion 210 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference plane. For example, a portion of the orthographic projection of the guide portion 210 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference plane. Of course, the orthographic projection of the guide portion 210 on the reference plane may also be located inside the orthographic projection of the display screen 100 on the reference plane.

[0082] like Figure 4 As shown, along the thickness direction of the electronic device (such as Figure 4 The guide portion 210 is spaced apart from the display screen 100 and can draw away static electricity from the display screen 100 by coupling and tripping the power supply, thereby preventing damage to the display screen 100 caused by electrostatic discharge.

[0083] In some embodiments, the guide portion 210 extends along the length direction of the frame member 400 (eg Figure 5 The length of the guide portion 210 in the Y direction is greater than or equal to the width of the bending portion 112 along the length direction of the frame member 400. The guide portion 210 can at least cover both ends of the bending portion 112 in the length direction. The guide portion 210 can lead away the static electricity on the bending portion 112 to prevent the bending portion 112 from being damaged due to static electricity release.

[0084] For example, Figure 7 As shown, the guide portion 210 can be a long strip structure, for example, the guide portion 210 can be a rectangular strip structure with a length greater than a width. Of course, the guide portion 210 can also be a strip structure of other shapes, such as a trapezoidal strip structure.

[0085] The shape of the pin portion 220 may include but is not limited to a rectangular sheet structure, an arc-shaped sheet structure, a trapezoidal sheet structure, a triangular sheet structure, etc. The pin portion 220 only needs to be able to achieve electrical connection between the guide portion 210 and the conductive member 600.

[0086] In some embodiments, the conductive layer 200 may include a plurality of pin portions 220 , for example Figure 7 As shown, the conductive layer 200 may include two pin portions 222. Of course, the number of pin portions 220 may be more than two. Multiple pin portions 220 are spaced apart along the length of the guide portion 210. Each pin portion 220 is electrically connected to the middle frame 300 via at least one conductive member 600. For example, each pin portion 220 can be electrically connected to the middle frame 300 via a single conductive member 600. In this way, the conductive layer 200 can transfer static electricity to the middle frame 300 via the multiple conductive members 600, increasing the speed at which static electricity is drawn away from the conductive layer 200 and further enhancing the anti-static discharge capability of the display screen 100.

[0087] It should be noted that, in addition to being composed of a plurality of pin portions 220 and one guide portion 210 , in some scenarios, the conductive layer 200 may also be composed of one pin portion 220 and one guide portion 210 .

[0088] In an embodiment of the present application, the first end of the conductive member 600 is electrically in contact with the pin portion 220, and the second end of the conductive member 600 is electrically in contact with the middle frame 300. The middle frame 300 is electrically connected to the conductive layer 200 through the conductive member 600. The conductive member 600 can transfer static electricity on the pin portion 220 to the middle frame 300 to achieve electrostatic grounding.

[0089] The conductive member 600 is made of a conductive material. For example, the conductive member 600 may be made of a metal material. Alternatively, the conductive member 600 may be made of a non-metallic material and a metal material.

[0090] In some possible implementations, such as Figure 4 As shown, the conductive member 600 can be a conductive spring, through which the middle frame 300 is electrically connected to the conductive layer 200. The conductive spring is elastic and can maintain close contact with the pin portion 220 and the middle frame 300, thereby improving the reliability of the electrical connection between the conductive spring, the pin portion 220, and the middle frame 300. In addition, the conductive spring can undergo elastic deformation. After the frame member 400 and the middle frame 300 are assembled, the conductive spring can still maintain electrical contact with the middle frame 300 and the pin portion 220, thereby reducing the difficulty of assembling the electronic device.

[0091] Of course, in addition to being a conductive spring, in some embodiments, the conductive member 600 may also be a conductive foam. The middle frame 300 is electrically connected to the pin portion 220 via the conductive foam. In this case, at least a portion of the conductive foam may be located between the conductive layer 200 and the middle frame 300 and abut against the middle frame 300 and the conductive layer 200, respectively. In other embodiments, the conductive member 600 may also be a conductive glue. The middle frame 300 is electrically connected to the pin portion 220 via the conductive glue. In this case, at least a portion of the conductive glue is located between the conductive layer 200 and the middle frame 300 and is in electrical contact with the conductive layer 200 and the middle frame 300, respectively.

[0092] For example, the conductive spring can be fixedly connected to the middle frame 300 and electrically contact the middle frame 300. Of course, in addition to being fixed to the middle frame 300, in some embodiments, the conductive spring can also be fixedly connected to the connection portion 402 of the frame member 400 and electrically contact the pin portion 220. In this way, the conductive spring can be fixed to either the frame member 400 or the middle frame 300.

[0093] There are no restrictions on how the conductive spring is secured. For example, the conductive spring can be welded to the middle frame 300, or it can be secured to the middle frame 300 via screws. Of course, the conductive spring can also be secured to the middle frame 300 using other securing methods, which will not be detailed here.

[0094] In the embodiment of the present application, there is no limitation on the specific structure of the conductive spring. Figure 4 As shown, the conductive spring fragment may include a first spring fragment 610, a second spring fragment 620 and a third spring fragment 630 connected in sequence, the first spring fragment 610 and the third spring fragment 630 are located on the same side of the second spring fragment 620, the first spring fragment 610 and the third spring fragment 630 are spaced apart, the first spring fragment 610 is fixedly connected to the middle frame 300 and is in electrical contact with the middle frame 300, the third spring fragment 630 is in electrical contact with the pin portion 220, and the conductive spring fragment surrounded by the first spring fragment 610, the second spring fragment 620 and the third spring fragment 630 is similar to a "C"-shaped plate structure.

[0095] In some embodiments, the middle frame 300 can be a metal middle frame 300. The entire middle frame 300 is made of metal material. The metal middle frame 300 is electrically connected to the ground of the electronic device (for example, the circuit board of the electronic device). The middle frame 300 can be used as a reference ground. In this way, the conductive member 600 is grounded through the middle frame 300.

[0096] However, in other embodiments, the middle frame 300 may also be a non-metallic middle frame 300. In this case, the middle frame 300 may be an integral structure composed of metal materials and non-metallic materials. One end of the conductive member 600 is electrically connected to the metal material of the middle frame 300, and the metal material of the middle frame 300 is electrically connected to the ground of the electronic device. In this way, the conductive member 600 is grounded through the metal material of the middle frame 300.

[0097] In the above content, the number of the conductive layer 200 is one. However, in some scenarios, the number of the conductive layer 200 may be multiple. In this case, multiple conductive layers 200 may be understood as a single conductive layer 200 being interrupted to become multiple conductive layers.

[0098] Figure 8 This is a schematic diagram of a three-dimensional structure of multiple conductive layers and a frame member in another electronic device provided by an embodiment of the present application. Figure 9 for Figure 8 Enlarged schematic diagram of the dotted line in the middle.

[0099] Figure 8 The electronic equipment shown is Figure 2 The difference of the electronic device shown is that the electronic device may include multiple conductive layers 200, e.g. Figure 8 As shown, the number of the conductive layers 200 can be five. Of course, the number of the conductive layers 200 can be more or less than five. Figure 9 The multiple conductive layers 200 respectively draw away static electricity that enters the electronic device through the gap between the frame member 400 and the display screen 100, thereby increasing the speed of drawing away static electricity and further improving the anti-static release capability of the display screen 100.

[0100] In addition, there is a gap between two adjacent conductive layers 200, which shortens the length of a single conductive layer 200. The radio frequency resonant noise generated by the conductive layer 200 avoids the antenna resonant frequency band, which can further reduce the impact on the antenna performance. This allows electronic devices to adopt a distributed antenna layout solution, which can increase the battery capacity and disperse the heat source as much as possible to facilitate heat dissipation.

[0101] Since the number of the conductive layer 200 is multiple, the number of the guide portion 210 is multiple, and the multiple guide portions 210 are arranged along the length direction of the frame member 400 (eg Figure 9 In this case, the total length can be greater than or equal to the width of the bending portion 112 in the longitudinal direction of the frame member 400, and the total length is equal to the sum of the lengths of all the guide portions 210 in the longitudinal direction of the frame member 400 plus the spacing between all adjacent two guide portions 210 (such as Figure 8 or Figure 9 Thus, the two guide portions 210 can cover both ends of the bending portion 112, ensuring that the bending portion 112 will not be damaged by static electricity.

[0102] In some embodiments, along the length direction of the frame member 400 (eg Figure 9 As shown), the spacing between two adjacent conductive layers 200 (as shown Figure 8 or Figure 9 The spacing (shown as H in FIG) is greater than or equal to 0.2 mm and less than or equal to 0.8 mm. For example, the spacing between two adjacent conductive layers 200 can be 0.2 mm, 0.3 mm, 0.45 mm, 0.6 mm, 0.8 mm, etc. This can prevent the gap between two adjacent conductive layers 200 from being too large, preventing static electricity from escaping from the gap between two adjacent conductive layers 200 to the display screen 100, thereby preventing static electricity from damaging the display screen 100. In addition, it can ensure that the RF resonant noise generated by the conductive layer 200 avoids the antenna resonant frequency band.

[0103] In order to electrically connect each conductive layer 200 to the middle frame 300, the electronic device includes multiple conductive members 600, which are spaced apart along the length of the frame member 400. Each conductive layer 200 is electrically connected to the middle frame 300 through at least one conductive member 600. For example, each conductive layer 200 is electrically connected to the middle frame 300 through one conductive member 600. Of course, each conductive member 600 can also be electrically connected to the middle frame 300 through multiple conductive members 600, or a portion of the multiple conductive layers 200 can be electrically connected to the middle frame 300 through one conductive member 600, and another portion can be electrically connected to the middle frame 300 through multiple conductive members 600. In this way, each conductive layer 200 transfers static electricity to the middle frame 300 through the corresponding conductive member 600, ensuring static grounding.

[0104] In some embodiments, at least one conductive member 600 is electrically connected to the pin portions 220 of two adjacent conductive layers 200. For example, an electronic device includes three conductive members 600, one of which is electrically connected to the pin portions 220 of two adjacent conductive layers 200. In this way, two adjacent conductive layers 200 can share one conductive member 600, which can reduce the number of conductive members 600, reduce the space occupied by the conductive members 600, and simplify the layout of components within the electronic device.

[0105] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0106] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0107] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0108] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0109] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0110] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: It comprises a display screen (100), a middle frame (300), a frame member (400), a conductive layer (200), and a conductive member (600); The frame member (400) is connected to the middle frame (300), a portion of the frame member (400) is located on the display side of the display screen (100), and the orthographic projections of the frame member (400) and the display screen (100) on a reference plane partially overlap, and the reference plane is a plane where the length direction and width direction of the electronic device are located; The conductive layer (200) has a resistance less than or equal to 1 ohm, the conductive layer (200) is attached to the inner surface of the frame member (400), the conductive layer (200) comprises a guide portion (210) and a pin portion (220), the guide portion (210) is electrically connected to the pin portion (220), and the guide portion (210) is extended along the length direction of the frame member (400) and is located on the display side of the display screen (100); The first end of the conductive member (600) is electrically connected to the middle frame (300), and the second end of the conductive member (600) is electrically connected to the pin portion (220).

2. The electronic device according to claim 1, wherein The conductive layer (200) is a metal layer.

3. The electronic device according to claim 1, wherein The conductive member (600) is a conductive spring sheet, and the middle frame (300) is electrically connected to the conductive layer (200) via the conductive spring sheet.

4. The electronic device according to claim 3, wherein: The conductive spring is fixedly connected to the connection portion (402) of the frame member (400) and is in electrical contact with the pin portion (220), or the conductive spring is fixedly connected to the middle frame (300) and is in electrical contact with the middle frame (300).

5. The electronic device according to any one of claims 1 to 4, characterized in that: The conductive layer (200) comprises a plurality of pin portions (220), the plurality of pin portions (220) being arranged at intervals along the length direction of the guide portion (210), and each of the pin portions (220) being electrically connected to the middle frame (300) via at least one of the conductive members (600).

6. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device comprises a plurality of conductive layers (200), wherein the plurality of conductive layers (200) are attached to the inner surface of the frame member (400) and are arranged at intervals along the length direction of the frame member (400).

7. The electronic device according to claim 6, wherein: Along the length direction of the frame member (400), the distance between two adjacent conductive layers (200) is greater than or equal to 0.2 mm and less than or equal to 0.8 mm.

8. The electronic device according to claim 6, wherein: The electronic device comprises a plurality of conductive members (600), wherein the plurality of conductive members (600) are arranged at intervals along the length direction of the frame member (400), and each of the conductive layers (200) is electrically connected to the middle frame (300) via at least one of the conductive members (600).

9. The electronic device according to claim 8, wherein: At least one of the conductive members (600) is in electrical contact with the pin portions (220) of two adjacent conductive layers (200).

10. The electronic device according to any one of claims 1 to 4, characterized in that: The frame member (400) comprises a suspended portion (401) and a connecting portion (402), wherein the connecting portion (402) is connected to the middle frame (300), a gap is provided between the suspended portion (401) and the display screen (100), and the orthographic projections of the suspended portion (401) and the display screen (100) on the reference plane partially overlap; The guide portion (210) is attached to the inner surface of the suspended portion (401), and the pin portion (220) is attached to the inner surface of the connecting portion (402).

11. The electronic device according to any one of claims 1 to 4, characterized in that: The display screen (100) comprises a display panel (110), the display panel (110) comprising a display portion (111), a bending portion (112), and a binding portion (113) connected in sequence; along the thickness direction of the electronic device, the binding portion (113) is spaced apart from the display portion (111) and is located on the non-display side of the display portion (111); and the conductive layer (200) is located between the bending portion (112) and the frame member (400).

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