Low-resistance circuit board

Abstract

The utility model discloses a low-resistance circuit board, which comprises an assembly mechanism, the assembly mechanism comprises a substrate, the upper side of the substrate is fixedly connected with a first conducting layer, the upper side of the first conducting layer is fixedly connected with an insulating layer, the upper side of the insulating layer is fixedly connected with a second conducting layer, and the upper side of the second conducting layer is fixedly connected with a solder mask layer. According to the utility model, through the arrangement of the assembly mechanism, the substrate is made of a polyimide material and has good insulation performance and thermal stability, mechanical support is provided for the whole circuit board, the first conductive layer and the second conductive layer are both made of a copper foil material, and copper has good conductivity and is a common material for manufacturing a conductive circuit of the circuit board; the copper foil with the ounce thickness can provide a lower resistance path, the loss of current in the transmission process is reduced, the insulating layer made of a polyester film material is arranged between the first conducting layer and the second conducting layer, the two conducting layers are prevented from being electrically connected in series, and normal operation of a circuit is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a low-resistance circuit board. Background Art

[0002] A circuit board, also known as a printed circuit board (PCB), is an important electronic component. A circuit board is mainly composed of an insulating substrate, a conductive pattern (such as a copper foil circuit) and a pad. The insulating substrate is usually made of materials such as glass fiber reinforced resin and has good insulation properties and mechanical strength. The conductive pattern is a circuit connection line formed on the substrate through processes such as etching and is used to transmit electrical signals. The pad is the metal part used for soldering electronic components. The circuit board provides a stable installation position and electrical connection for various electronic components. Through the conductive lines on the circuit board, different electronic components can be connected according to design requirements to form specific circuit functions.

[0003] Circuit boards are generally installed in some electronic devices. Most of the current circuit boards generate heat when current passes through the resistance in the circuit during use. The higher the resistance, the more heat is generated under the same current and time. This means that a large amount of electrical energy is converted into heat energy and wasted, which reduces energy utilization efficiency and has poor practicality. Therefore, in order to solve the above problems, a low-resistance circuit board is proposed. Utility Model Content

[0004] The utility model mainly solves the technical problems existing in the above-mentioned prior art and provides a low-resistance circuit board.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a low-resistance circuit board, comprising a component mechanism, the component mechanism comprising a substrate, a first conductive layer fixedly connected to the upper side of the substrate, an insulating layer fixedly connected to the upper side of the first conductive layer, a second conductive layer fixedly connected to the upper side of the insulating layer, a solder resist layer fixedly connected to the upper side of the second conductive layer, solder pads fixedly connected to the inside of the first conductive layer and the second conductive layer, a through hole being provided inside the solder pad, a conductive ring fixedly connected to the inside of the through hole, an insulating layer between the first conductive layer and the second conductive layer, which can prevent the first conductive layer and the second conductive layer from being electrically connected in series.

[0006] Preferably, the substrate is made of polyimide, and the first conductive layer and the second conductive layer are made of copper foil. Copper has good electrical conductivity and is a common material for making conductive circuits in circuit boards.

[0007] Preferably, the thickness of the first conductive layer and the second conductive layer is one ounce, and the insulating layer is made of polyester film. One ounce of copper foil can provide a lower resistance path and reduce current loss during transmission.

[0008] Preferably, the material of the solder resist layer is epoxy resin, and the material of the pad is copper foil. In a low-resistance circuit board, the design of the pad needs to consider good contact with the electronic components to ensure low-resistance connection.

[0009] Preferably, the conductive ring is in the shape of a ring, and the material of the conductive ring is copper. The through hole is a via hole that runs through the entire circuit board and is usually used to connect power and ground circuits at different levels.

[0010] Preferably, a notch is formed through the surface of the solder resist layer, and a fixing hole is formed through the surface of the substrate. There are four fixing holes, and the pads are arranged in the notch. The fixing holes are basically formed at the four corners.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0012] 1. The utility model adopts the setting of the component mechanism. The substrate is made of polyimide material, which has good insulation performance and thermal stability, providing mechanical support for the entire circuit board. The first conductive layer and the second conductive layer are both made of copper foil. Copper has good conductivity and is a common material for making conductive lines on circuit boards. One-ounce thick copper foil can provide a lower resistance path, reducing current loss during transmission. An insulating layer of polyester film material is provided between the first conductive layer and the second conductive layer to prevent electrical series connection between the two conductive layers, ensuring the normal operation of the circuit.

[0013] 2. The utility model provides the first conductive layer and the second conductive layer. When the current flows in the circuit board, it can be transmitted through the first conductive layer and the second conductive layer at the same time. Since both conductive layers are made of low-resistance copper foil and a good connection is achieved through the conductive ring in the through hole, the current can flow efficiently between the two conductive layers, reducing the energy loss caused by resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 This is a schematic structural diagram of the utility model facing the whole;

[0016] Figure 2 This is a schematic diagram of the overall structure of the utility model from the side;

[0017] Figure 3 This is a schematic structural diagram of the front cross-section of the present invention;

[0018] Figure 4It is a schematic structural diagram of the side cross-section of the utility model.

[0019] In the figure: 1. Substrate; 2. First conductive layer; 3. Insulating layer; 4. Second conductive layer; 5. Solder mask layer; 6. Pad; 7. Through hole; 8. Conductive ring; 9. Notch; 10. Fixing hole. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 A low-resistance circuit board includes an assembly structure, which includes a substrate 1. A first conductive layer 2 is fixedly connected to the upper side of the substrate 1, an insulating layer 3 is fixedly connected to the upper side of the first conductive layer 2, a second conductive layer 4 is fixedly connected to the upper side of the insulating layer 3, a solder resist layer 5 is fixedly connected to the upper side of the second conductive layer 4, a solder pad 6 is fixedly connected to the inside of the first conductive layer 2 and the second conductive layer 4, a through hole 7 is opened inside the solder pad 6, and a conductive ring 8 is fixedly connected to the inside of the through hole 7. The material of the substrate 1 is polyimide, the material of the first conductive layer 2 and the second conductive layer 4 is copper foil, the thickness of the first conductive layer 2 and the second conductive layer 4 is one ounce, and the material of the insulating layer 3 is polyester The material of the solder mask layer 5 is epoxy resin, and the material of the pad 6 is copper foil. This low-resistance circuit board is mainly composed of component structures. The substrate 1 is made of polyimide, which has good insulation performance and thermal stability, providing mechanical support for the entire circuit board. The first conductive layer 2 and the second conductive layer 4 are both made of copper foil. Copper has good conductivity and is a commonly used material for making conductive lines on circuit boards. One ounce thick copper foil can provide a lower resistance path and reduce the loss of current during transmission. An insulating layer 3 made of polyester film is provided between the first conductive layer 2 and the second conductive layer 4 to prevent electrical series connection between the two conductive layers and ensure the normal operation of the circuit.

[0022] In one aspect of this embodiment, when current flows in the circuit board, it can be transmitted through the first conductive layer 2 and the second conductive layer 4 at the same time. Since both conductive layers are made of low-resistance copper foil and a good connection is achieved through the conductive ring 8 in the through hole 7, the current can flow efficiently between the two conductive layers, reducing the energy loss caused by resistance. A slot 9 is opened through the surface of the solder resist layer 5, and the solder pad 6 is arranged in the slot 9 to facilitate soldering connection between the electronic components and the solder pad 6. Four fixing holes 10 are opened through the surface of the substrate 1, located at the four corners of the substrate 1. These fixing holes 10 are used to fix the circuit board to the housing of the electronic device or other supporting structure to ensure the stability of the circuit board during operation.

[0023] Working principle of the utility model: When the low resistance circuit board is in use, it is fixed at a certain place through the fixing parts through the fixing holes 10. When the current flows in the circuit board, it can be transmitted through the first conductive layer 2 and the second conductive layer 4 at the same time, and a good connection is achieved through the conductive ring 8 in the through hole 7, so that the current can flow efficiently between the two conductive layers, reducing the energy loss caused by resistance. The pad 6 is set inside the first conductive layer 2 and the second conductive layer 4. The material is also copper foil, which is used for soldering electronic components to ensure good contact with the electronic components to achieve low resistance connection. The pad 6 is inside. A through hole 7 is provided, which runs through the entire circuit board and is usually used to connect power and ground circuits at different levels. A circular copper conductive ring 8 is fixedly connected inside the through hole 7, which further enhances the conductive performance of the through hole 7. The solder resist layer 5 is made of epoxy resin and covers the upper side of the second conductive layer 4, which plays a role in protecting the conductive circuit, preventing welding short circuits and improving the appearance quality of the circuit board. A notch 9 is provided on the surface of the solder resist layer 5, and the soldering pad 6 is arranged in the notch 9 to facilitate soldering connection between electronic components and the soldering pad 6. All electrical equipment in this solution is powered by an external power supply.

[0024] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A low-resistance circuit board, comprising a component mechanism, characterized in that: The assembly structure comprises a substrate (1), a first conductive layer (2) is fixedly connected to the upper side of the substrate (1), an insulating layer (3) is fixedly connected to the upper side of the first conductive layer (2), a second conductive layer (4) is fixedly connected to the upper side of the insulating layer (3), a solder resist layer (5) is fixedly connected to the upper side of the second conductive layer (4), a solder pad (6) is fixedly connected to the inside of the first conductive layer (2) and the second conductive layer (4), a through hole (7) is provided inside the solder pad (6), and a conductive ring (8) is fixedly connected to the inside of the through hole (7).

2. A low resistance circuit board according to claim 1, characterized in that: The substrate (1) is made of polyimide, and the first conductive layer (2) and the second conductive layer (4) are made of copper foil.

3. The low-resistance circuit board according to claim 1, characterized in that: The thickness of the first conductive layer (2) and the second conductive layer (4) is one ounce, and the material of the insulating layer (3) is polyester film.

4. The low-resistance circuit board according to claim 1, characterized in that: The material of the solder resist layer (5) is epoxy resin, and the material of the solder pad (6) is copper foil.

5. The low-resistance circuit board according to claim 1, characterized in that: The conductive ring (8) is in the shape of a circular ring and is made of copper.

6. The low-resistance circuit board according to claim 1, characterized in that: The surface of the solder resist layer (5) is provided with a notch (9), and the surface of the substrate (1) is provided with a fixing hole (10), and four fixing holes (10) are provided.

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