PCB structure for improving outgoing line of high-speed differential signal on SMD connector

Abstract

The utility model discloses a PCB structure for improving outgoing line of a high-speed differential signal on an SMD connector, the wiring mode is changed, the shape of a connector PAD does not need to be changed, when a first signal line and a second signal line are respectively led out from a first bonding pad and a second bonding pad, the outgoing line phenomenon of a first inclined section on the first signal line is eliminated, and the outgoing line quality of the SMD connector is improved. In the same way, the wire outgoing mode of directly entering the first straight section on the first signal wire eliminates the phenomenon of wire outgoing of the second inclined section on the second signal wire, and the wire outgoing mode of directly entering the second straight section further realizes parallel and symmetrical wire outgoing, and reduces the phenomenon of different distances between the first signal wire and the second signal wire as much as possible. And a loose coupling wire outlet mode is avoided, so that the discontinuity of impedance is reduced, and the mutation of the impedance is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board design, and more particularly to a PCB structure for improving the outlet of high-speed differential signals at SMD connectors. Background Art

[0002] To maintain impedance continuity, high-speed differential traces are routed using parallel spacing (also known as symmetrical routing). For signal quality, the distance between the two high-speed differential lines should be kept as constant as possible, which translates to tightly coupled routing. If the distance between the two signal lines increases or decreases, it affects the impedance continuity of the signal, causing sudden impedance fluctuations, which in turn affects signal quality and integrity.

[0003] Existing SMD connector outlet methods are as follows Figure 1 As shown in the figure, since the connector PAD is a structural component and its shape cannot be changed, when the line is output in section A, the distance between the two signal lines becomes larger, which is the appearance of loose coupling. The lack of coupling in this section will lead to a sudden change in impedance. Only after the AB intersection is the tightly coupled routing (section B routing method), the high-speed differential impedance will be continuous in the B routing method. Therefore, at the AB intersection, the impedance of the high-speed differential signal line will suddenly change. This impedance discontinuity will cause reflection and loss to the high-speed differential signal, affecting the signal integrity. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the utility model provides a PCB structure for improving the output of high-speed differential signals at SMD connectors, so as to solve the problem that the output of high-speed differential PADs is prone to uncoupling, resulting in sudden changes in the impedance of the high-speed differential signal lines.

[0005] The technical solution of the present utility model is as follows: A PCB structure for improving the output of high-speed differential signals in an SMD connector, comprising: a first solder pad, a second solder pad, a first signal line, and a second signal line, wherein the first signal line is connected to the first solder pad, the first signal line comprises a first straight section and a first inclined section, and in the orthographic projection direction of the first solder pad, the projection of the first inclined section coincides with the projection of the first solder pad; the second signal line comprises a second straight section and a second inclined section, and in the orthographic projection direction of the second solder pad, the projection of the second inclined section coincides with the projection of the second solder pad, and the first straight section and the second straight section are arranged in parallel.

[0006] Furthermore, in the direction of the orthographic projection of the first solder pad, the connection point between the right side edge of the first straight section and the right side edge of the first inclined section is located at the right top corner of the first solder pad, and a first angle is formed between the right side edge of the first inclined section and the right side edge of the first solder pad, and the first angle is an acute angle.

[0007] Furthermore, the first angle is 45°.

[0008] Furthermore, in the direction of the orthographic projection of the second solder pad, the connection point between the left side edge of the second straight section and the left side edge of the second inclined section is located at the left top corner of the second solder pad, and a second angle is formed between the left side edge of the second inclined section and the left side edge of the second solder pad, and the second angle is an acute angle.

[0009] Furthermore, the second angle is 45°.

[0010] Furthermore, the length of the first straight section is equal to the length of the second straight section.

[0011] Furthermore, the first signal line also includes a first extension section, the first extension section and the first straight section are connected through the first inclined section, the first extension section and the first straight section are parallel to each other, and in the positive projection direction of the first pad, the projection of the first extension section coincides with the projection of the first pad.

[0012] Furthermore, the second signal line also includes a second extension section, the second extension section and the second straight section are connected through the second inclined section, the second extension section and the second straight section are parallel to each other, and in the positive projection direction of the second pad, the projection of the second extension section coincides with the projection of the second pad.

[0013] Furthermore, the length of the first extension section is equal to the length of the second extension section.

[0014] According to the above-mentioned scheme, the beneficial effect of the present invention is that: the present invention provides a PCB structure for improving the output of high-speed differential signals in SMD connectors, including a first soldering pad, a second soldering pad, a first signal line and a second signal line, the first signal line is connected to the first soldering pad, the first signal line includes a first straight section and a first inclined section, in the orthographic projection direction of the first soldering pad, the projection of the first inclined section coincides with the projection of the first soldering pad; the second signal line includes a second straight section and a second inclined section, in the orthographic projection direction of the second soldering pad, the projection of the second inclined section coincides with the projection of the second soldering pad, and the first straight section and the second straight section are arranged in parallel. With this design, by changing the routing method, there is no need to change the shape of the connector PAD. When the first signal line and the second signal line are led out from the first pad and the second pad respectively, the phenomenon of the first signal line coming out from the first inclined section is eliminated, and the line is directly led into the first straight section. Similarly, the phenomenon of the second signal line coming out from the second inclined section is eliminated, and the line is directly led into the second straight section, thereby achieving parallel and symmetrical routing, minimizing the phenomenon of different spacing between the first signal line and the second signal line, avoiding the occurrence of loosely coupled routing, and reducing impedance discontinuity and impedance mutation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is the wire outlet method of the existing SMD connector;

[0017] Figure 2 This is the wire outlet method of the SMD connector in the embodiment of the present utility model.

[0018] In the figure, 1, first solder pad; 2, second solder pad; 3, first signal line; 31, first straight section; 32, first inclined section; 33, first extension section; 4, second signal line; 41, second straight section; 42, second inclined section; 43, second extension section; α1, first angle; α2, second angle. DETAILED DESCRIPTION

[0019] The following detailed description of the embodiments of the present invention is provided in conjunction with the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention. That is, the present invention is not limited to the described embodiments.

[0020] In order to better understand the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments:

[0021] The solder pad (PAD) of an SMD connector is not just a metal area on a circuit board for soldering components; it is also a key component of the SMD connector's overall structure. The design, size, and position of the pad are typically determined based on the connector's physical characteristics and electrical requirements to ensure the connector is properly and reliably fixed to the circuit board and achieves an electrical connection. Because the pad is part of the structural component and is closely related to the connector's design and function, in practical applications, arbitrary changes to the pad's shape are generally not allowed. Therefore, how to solve the technical problems existing in the technical background under the premise that the shape of the SMD connector's pad cannot be changed has become a key issue.

[0022] Based on this, the utility model provides a PCB structure for improving the output of high-speed differential signals in SMD connectors, including: a first soldering pad 1, a second soldering pad 2, a first signal line 3 and a second signal line 4, the first signal line 3 is connected to the first soldering pad 1, the first signal line 3 includes a first straight section 31 and a first inclined section 32, in the orthographic projection direction of the first soldering pad 1, the projection of the first inclined section 32 coincides with the projection of the first soldering pad 1; the second signal line 4 includes a second straight section 41 and a second inclined section 42, in the orthographic projection direction of the second soldering pad 2, the projection of the second inclined section 42 coincides with the projection of the second soldering pad 2, and the first straight section 31 and the second straight section 41 are arranged in parallel. With this design, by changing the routing method, there is no need to change the shape of the connector PAD. When the first signal line 3 and the second signal line 4 are led out from the first pad 1 and the second pad 2 respectively, the phenomenon of the first inclined section 32 on the first signal line 3 being led out is eliminated, and the line is directly led into the first straight section 31. Similarly, the phenomenon of the second inclined section 42 on the second signal line 4 being led out is eliminated, and the line is directly led into the second straight section 41, thereby achieving parallel and symmetrical routing, minimizing the phenomenon of different spacings between the first signal line 3 and the second signal line 4, avoiding the occurrence of loosely coupled routing, and thereby reducing impedance discontinuity and impedance mutation.

[0023] See also Figure 2As shown, in the orthographic projection direction of the first pad 1, the connection point between the right side of the first straight section 31 and the right side of the first inclined section 32 is located at the right top corner of the first pad 1, and a first angle α1 is formed between the right side of the first inclined section 32 and the right side of the first pad 1. The first angle α1 is an acute angle. Specifically, the first angle α1 is 45°. In the orthographic projection direction of the second pad 2, the connection point between the left side of the second straight section 41 and the left side of the second inclined section 42 is located at the left top corner of the second pad 2, and a second angle α2 is formed between the left side of the second inclined section 42 and the left side of the second pad 2. The second angle α2 is an acute angle. Specifically, the second angle α2 is 45°. With this design, the first signal line 3 exits from the right top corner of the first pad 1, eliminating the exit phenomenon of the first inclined section 32 and directly entering the first straight section 31. Similarly, the second signal line 4 exits from the left top corner of the second pad 2, eliminating the exit phenomenon of the second inclined section 42 and directly entering the second straight section 41, so that the first signal line 3 and the second signal line 4 can be parallel and symmetrically exited, minimizing the phenomenon of inconsistent spacing when the differential signal lines exit, and avoiding the occurrence of loosely coupled exit methods.

[0024] Preferably, the length of the first straight section 31 is equal to the length of the second straight section 41. This design ensures that the straight sections of the differential signal lines after leaving the pads have the same electrical length and impedance characteristics, helping to ensure that the differential signals remain balanced during transmission and reduce electromagnetic coupling and signal distortion.

[0025] Preferably, the first signal line 3 further includes a first extension section 33, which is connected to the first straight section 31 via a first inclined section 32. The first extension section 33 and the first straight section 31 are parallel to each other, and in the orthographic projection direction of the first pad 1, the projection of the first extension section 33 coincides with the projection of the first pad 1. In this embodiment, the second signal line 4 further includes a second extension section 43, which is connected to the second straight section 41 via a second inclined section 42. The second extension section 43 and the second straight section 41 are parallel to each other, and in the orthographic projection direction of the second pad 2, the projection of the second extension section 43 coincides with the projection of the second pad 2.

[0026] Preferably, the length of the first extension section 33 is equal to the length of the second extension section 43 .

[0027] It should be noted that the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0029] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A PCB structure for improving high-speed differential signal output at an SMD connector, characterized in that: include: A first solder pad (1), a second solder pad (2), a first signal line (3) and a second signal line (4), wherein the first signal line (3) is connected to the first solder pad (1), the first signal line (3) comprises a first straight section (31) and a first inclined section (32), and in the orthographic projection direction of the first solder pad (1), the projection of the first inclined section (32) coincides with the projection of the first solder pad (1); the second signal line (4) comprises a second straight section (41) and a second inclined section (42), and in the orthographic projection direction of the second solder pad (2), the projection of the second inclined section (42) coincides with the projection of the second solder pad (2), and the first straight section (31) and the second straight section (41) are arranged in parallel.

2. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 1, wherein: In the orthographic projection direction of the first solder pad (1), the connection point between the right side edge of the first straight section (31) and the right side edge of the first inclined section (32) is located at the right top corner of the first solder pad (1), and a first angle is formed between the right side edge of the first inclined section (32) and the right side edge of the first solder pad (1), and the first angle is an acute angle.

3. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 2, wherein: The first angle is 45°.

4. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 3, wherein: In the orthographic projection direction of the second solder pad (2), the connection point between the left side of the second straight section (41) and the left side of the second inclined section (42) is located at the left top corner of the second solder pad (2), and a second angle is formed between the left side of the second inclined section (42) and the left side of the second solder pad (2), and the second angle is an acute angle.

5. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 4, wherein: The second angle is 45°.

6. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 1, wherein: The length of the first straight section (31) is equal to the length of the second straight section (41).

7. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 1, wherein: The first signal line (3) further comprises a first extension section (33), the first extension section (33) and the first straight section (31) being connected via the first inclined section (32), the first extension section (33) and the first straight section (31) being parallel to each other, and in the orthographic projection direction of the first pad (1), the projection of the first extension section (33) coincides with the projection of the first pad (1).

8. The PCB structure for improving the output of high-speed differential signals from an SMD connector according to claim 7, wherein: The second signal line (4) further comprises a second extension section (43), the second extension section (43) and the second straight section (41) are connected via the second inclined section (42), the second extension section (43) and the second straight section (41) are parallel to each other, and in the orthographic projection direction of the second pad (2), the projection of the second extension section (43) coincides with the projection of the second pad (2).

9. The PCB structure for improving high-speed differential signal output from an SMD connector according to claim 8, wherein: The length of the first extension section (33) is equal to the length of the second extension section (43).

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