Circuit board structure of shielding case buckle

Abstract

The utility model discloses a circuit board structure of a shielding case buckle in the circuit board design field, comprising a plurality of buckle pads arranged on a circuit board, the periphery of each buckle pad is provided with a pad solder resist window, the periphery of the pad solder resist area is provided with a shielding case solder resist window, and the shielding case solder resist window is provided with a shielding case solder resist window. And a solder resist bridge is arranged between the bonding pad solder resist window and the shielding cover solder resist window. According to the utility model, the problem that the shielding case cannot be buckled due to the fact that solder paste easily flows to the solder mask windowing area of the shielding case to cause the deviation of the position of the buckle when the bonding pad of the existing buckle is connected with the solder mask windowing area of the shielding case is solved, the solder mask bridge can play a role in blocking the solder paste from flowing during the buckle welding, the solder paste cannot flow randomly, and the reliability of the buckle is improved. Solder paste is effectively prevented from flowing into a solder mask windowing area of the shielding case, so that the accuracy of the position of the buckle is ensured, the buckle can be automatically reset during reflow soldering, connection between the shielding case and the buckle is facilitated, and the shielding effect of the shielding case is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board design, in particular to a circuit board structure with a shielding cover buckle. Background Art

[0002] With the increasing integration and frequency of electronic devices, electromagnetic interference and electromagnetic compatibility (EMC) issues are becoming increasingly prominent. To ensure the proper operation of electronic devices and reduce mutual interference, effective shielding of components on circuit boards is crucial. To address electromagnetic interference within electronic devices and between electronic components, shielding enclosures are often installed around electromagnetic radiation sources within electronic devices to reduce interference with surrounding circuits. As a common electromagnetic shielding method, shielding enclosures are widely used in various electronic devices, such as in high-frequency and radio frequency circuits and in the packaging of sensitive components.

[0003] Existing shielding covers are typically installed on circuit boards using clips. First, the clips are soldered to the circuit board, and then the shielding cover and clips are clipped together to achieve installation. However, during soldering, the clips' solder pads connect to the solder mask window area of ​​the shielding cover. When solder paste is applied to the clips, the molten solder paste easily flows into the solder mask window area of ​​the shielding cover, causing a mismatch between the clip's solder pads and the solder paste. This can easily prevent the device from automatically resetting during reflow soldering, leading to a deviation in the clip's position, which can prevent the shielding cover from buckling properly and affect its shielding effectiveness.

[0004] The above defects need to be solved urgently. Utility Model Content

[0005] In order to solve the problem that the solder pads of the existing clips are connected to the solder resist window area of ​​the shielding cover, the solder paste easily flows into the solder resist window area of ​​the shielding cover, causing the clip position to deviate, thereby causing the shielding cover to be unable to buckle, the utility model provides a circuit board structure with a shielding cover clip.

[0006] The technical solution of this utility model is as follows:

[0007] A circuit board structure with a shielding cover snap-on design includes a plurality of snap-on pads arranged on the circuit board, a pad solder resist window being provided around the periphery of each snap-on pad, a shielding cover solder resist window being provided around the periphery of the pad solder resist area, and a solder resist bridge being provided between the pad solder resist window and the shielding cover solder resist window.

[0008] According to the above solution of the present invention, the solder resist bridge is in a U-shape and is arranged around the periphery of the snap pad.

[0009] According to the above solution of the present invention, the width of the solder resist bridge is at least 3 mil.

[0010] According to the above solution of the present invention, the width of the solder resist bridge is 4 mil.

[0011] According to the above solution of the present invention, a plurality of snap-on pads are arranged side by side.

[0012] According to the above solution of the present invention, the plurality of snap-on pads are evenly spaced apart.

[0013] According to the above solution of the present invention, the spacing between the snap pad and the pad solder resist window is 2 mil to 3 mil.

[0014] According to the above solution of the present invention, the spacing between the snap pad and the pad solder resist window is 2 mil.

[0015] According to the above solution of the present invention, the buckle pad is in a rectangular shape.

[0016] The utility model according to the above solution has the following beneficial effects:

[0017] In the circuit board structure of the aforementioned shielding cover clip, a solder resist bridge is provided between the solder resist window of the pad and the solder resist window of the shielding cover. During clip soldering, the solder resist bridge can block the flow of solder paste, preventing it from flowing freely and effectively preventing it from flowing into the solder resist window area of ​​the shielding cover, thereby ensuring the accuracy of the clip position. This allows the clip to automatically reset during reflow soldering, facilitating the connection between the shielding cover and the clip, and improving the shielding effect of the shielding cover. In addition, a solder resist window is provided on the periphery of each clip pad to ensure that the clip pad is fully exposed during the soldering process, facilitating the attachment and soldering of solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is one of the structural diagrams of the present utility model;

[0020] Figure 2 for Figure 1 Enlarged view of part A;

[0021] Figure 3 This is the second structural diagram of the present utility model.

[0022] In the figure, 1, circuit board; 11, snap-on pad; 12, solder resist window of pad; 13, solder resist window of shielding cover; 14, solder resist bridge; 15, silk screen line. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] When electronic components mounted on a circuit board operate, they generate electromagnetic radiation, interfering with each other. Furthermore, external electromagnetic interference can also affect the proper operation of the components. To mitigate the effects of electromagnetic radiation, a sealed shielding cover is typically installed around the electronic components, primarily to shield smaller, heat-insensitive components. Typically, the shielding cover is installed using a snap-on mechanism. First, the snap-on components are soldered to the circuit board surface to ensure a secure connection. Then, the corresponding parts of the shielding cover are precisely engaged with the snaps, effectively securing the cover and protecting the internal circuitry from external electromagnetic interference. However, because the snap-on pads connect to the solder mask openings of the shielding cover on the circuit board surface, the molten solder paste easily flows into the solder mask openings of the shielding cover when solder paste is applied to the pads and soldering is performed. This disrupts the intended alignment between the snap-on pads and the solder paste, causing the snaps to misalign and preventing the shielding cover from attaching properly to the snaps.

[0025] like Figure 1 As shown, in order to solve the above technical problems, the present invention provides a circuit board structure with a shielding cover clip, including a plurality of clip pads 11 arranged on a circuit board 1, and the clips are welded on the clip pads 11. A pad solder resist window 12 is provided on the periphery of each clip pad 11, ensuring that the clip pad 11 can be fully exposed during the welding process, facilitating the attachment and welding of solder paste. In addition, a shielding cover solder resist window 13 is provided on the periphery of the pad solder resist area, clearly distinguishing the installation area of ​​the shielding cover from the welding area of ​​the clip pad 11, thereby avoiding mutual interference between the two during the welding process.

[0026] In this embodiment, multiple snap-on pads 11 are arranged side by side, enhancing the connection capability and stability of circuit board 1. The snaps are soldered to circuit board 1, and the shielding cover is connected to the circuit board 1 via the snaps. Each snap-on pad 11 provides stable support and a secure connection point, collectively forming a robust connection system that not only enhances the overall structural strength of the electronic product but also extends its service life. Specifically, the even spacing of the multiple snap-on pads 11 facilitates uniform distribution of solder paste during the soldering process, improving soldering reliability and consistency, and facilitating subsequent circuit testing and maintenance.

[0027] In this embodiment, the spacing D1 between the snap pad 11 and the solder mask opening 12 is 2 mil to 3 mil. The spacing D1 between the snap pad 11 and the solder mask opening 12 can be designed to be any value in the range of 2 mil, 2.1 mil, 2.2 mil, 2.3 mil, 2.4 mil, 2.5 mil, 2.6 mil, 2.7 mil, 2.7 mil, 2.7 mil, 3 mil, etc. In actual design, the spacing D1 between the snap pad and the solder mask opening 12 can be designed according to actual needs. For example, a smaller spacing between the snap pad 11 and the solder mask opening 12 helps save space on the circuit board 1 and improve the compactness of the layout, but it may also place higher requirements on the welding process, such as requiring more precise welding equipment and a more stable welding environment. On the contrary, a larger spacing between the snap pad 11 and the solder mask opening 12 may reduce the difficulty of welding and improve the reliability of welding, but it may also lead to a waste of space on the circuit board 1. In this embodiment, the shape of the snap pad 11 is rectangular. Of course, in actual design, the shape of the snap pad 11 can be designed according to actual needs.

[0028] like Figure 1 、 Figure 2 As shown, in this embodiment, a solder resist bridge 14 is provided between the solder resist window 12 of the pad and the solder resist window 13 of the shielding cover. During the buckle soldering, the solder resist bridge 14 can block the flow of solder paste, and the solder paste will not flow arbitrarily, effectively preventing the solder paste from flowing into the solder resist window 13 area of ​​the shielding cover, thereby ensuring the accuracy of the buckle position and the precise positioning of the buckle during the welding process, and then allowing the buckle to automatically reset during reflow soldering, which helps to connect the shielding cover and the buckle, helps to improve the overall assembly accuracy of the shielding cover and the buckle, and improves the shielding effect of the shielding cover.

[0029] In this embodiment, the solder mask bridge 14 is in a square shape with a hole in the middle, so that the solder mask bridge 14 is arranged around the periphery of the snap pad 11, and the solder mask bridge 14 can completely cover the area between the outer edge of the pad and the solder mask opening 13 of the shielding cover, effectively preventing the solder paste from flowing into the area of the solder mask opening 13 of the shielding cover during the welding process, improving the blocking effect of the solder mask bridge 14, facilitating the connection between the shielding cover and the snap, and enhancing the shielding effect of the shielding cover. After welding, the shielding cover can be firmly attached to the snap, preventing electrical interference or signal leakage, further improving the shielding efficiency of the shielding cover, helping to protect the sensitive components on the circuit board 1 from external electromagnetic radiation, and ensuring the stability and reliability of the overall performance of the electronic device.

[0030] In this embodiment, the width D2 of the solder mask bridge 14 is at least 3 mil to ensure effectively blocking the flow of the solder paste during the welding operation, further improving the blocking effect of the solder mask bridge 14 on the solder paste and preventing the solder paste from flowing into the area of the solder mask opening 13 of the shielding cover. The width D2 of the solder mask bridge 14 can be designed to be 3 mil, 4 mil, 5 mil, etc. In actual design, the width D2 of the solder mask bridge 14 can be designed according to needs, for example, flexibly determined according to the processing ability of the board factory.

[0031] As Figure 3 shown, in this embodiment, a silk screen line 15 is arranged on the periphery of the solder mask bridge 14. The silk screen line 15 is arranged within the solder mask opening 13 of the shielding cover and can serve as a mark for the installation position of the snap, facilitating the quick welding of the snap onto the circuit board 1. When installing the snap, the operator only needs to align the snap with the position indicated by the silk screen line 15 to quickly and accurately determine the welding point of the snap, which not only improves the installation efficiency but also ensures the consistency and accuracy of each installation, reducing the position deviation caused by human error.

[0032] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application.

[0033] It should be understood that those of ordinary skill in the art can make improvements or transformations according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this utility model.

[0034] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A circuit board structure with a shielding cover snap-on, characterized in that: It includes multiple snap-on pads arranged on a circuit board, each of the snap-on pads is provided with a pad solder resist window on its periphery, a shielding cover solder resist window is provided on the periphery of the pad solder resist area, and a solder resist bridge is provided between the pad solder resist window and the shielding cover solder resist window.

2. The circuit board structure with a shielding cover clip according to claim 1, characterized in that: The solder resist bridge is in a U-shape and is arranged around the periphery of the snap pad.

3. The circuit board structure with a shielding cover clip according to claim 1, characterized in that: The width of the solder resist bridge is at least 3 mil.

4. The circuit board structure with a shielding cover clip according to claim 3, characterized in that: The width of the solder resist bridge is 4 mil.

5. The circuit board structure with a shielding cover clip according to claim 1, characterized in that: A plurality of the snap-on pads are arranged side by side.

6. The circuit board structure with a shielding cover clip according to claim 5, characterized in that: The plurality of snap-on pads are evenly spaced apart.

7. The circuit board structure with a shielding cover clip according to claim 1, characterized in that: The spacing between the snap pad and the pad solder resist window is 2 mil to 3 mil.

8. The circuit board structure with a shielding cover clip according to claim 7, characterized in that: The spacing between the snap pad and the pad solder resist window is 2 mil.

9. The circuit board structure with a shielding cover clip according to claim 1, characterized in that: The buckle pad is in a rectangular shape.

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