Heat dissipation shell, braking system and vehicle

Abstract

The utility model discloses a heat dissipation shell, a braking system and a vehicle. The heat dissipation shell comprises a sealing cover, a heat conduction structure and a heat dissipation structure. The sealing cover is used for being in sealing connection with the PCB; the heat conduction structure is arranged on the inner side of the sealing cover and used for abutting against a heating element in the PCB. The heat dissipation structure is arranged on the outer side of the sealing cover. According to the heat dissipation shell, the heat dissipation structure is arranged on the outer side of the sealing cover, and the heat conduction structure abutting against the heating element on the PCB is arranged on the inner side of the sealing cover, so that heat generated by the heating element can be conducted to the sealing cover and then dissipated through the heat dissipation structure on the outer side of the sealing cover, and the heat is prevented from being accumulated in the sealing cover; according to the PCB heat dissipation structure, a good heat dissipation effect can be achieved on the PCB under the sealing condition, the heat dissipation structure and the heat conduction structure arranged on the sealing cover do not occupy too much space, the size is small, and cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, and in particular to a heat dissipation housing, a braking system and a vehicle. Background Art

[0002] PCB boards are used to provide stable and reliable electrical connections for electronic components. During the use of PCB boards, some high-power electronic components, such as MOS tubes and control chips, are prone to heating up, and excessively high temperatures can affect the functionality of electronic components.

[0003] In the prior art, silicone grease is typically applied to the surface of electronic components, or a water-cooled or air-cooled heat sink is added to increase heat dissipation and cool the PCB. However, the heat dissipation effect of silicone grease is limited, and the additional water-cooled or air-cooled heat sink occupies a large area and is difficult to install near a sealed PCB, resulting in a limited heat dissipation effect on the PCB. Utility Model Content

[0004] The embodiments of the present invention provide a heat dissipation housing, a braking system and a vehicle to solve the problem of poor heat dissipation effect of existing PCB board heat dissipation methods.

[0005] The embodiment of the utility model provides a heat dissipation housing, comprising a sealing cover, a heat conducting structure and a heat dissipation structure;

[0006] The sealing cover is used to be sealed and connected to the PCB board;

[0007] The heat-conducting structure is arranged on the inner side of the sealing cover and is used to abut against the heating element in the PCB board;

[0008] The heat dissipation structure is arranged on the outer side of the sealing cover.

[0009] Preferably, the heat-conducting structure comprises at least two heat-conducting protrusions arranged on the inner side of the sealing cover, and the end of each heat-conducting protrusion is used to abut against the heating element in the PCB board.

[0010] Preferably, the heat dissipation structure includes at least one heat dissipation fin arranged on the outer side of the sealing cover.

[0011] Preferably, the thickness of the heat sink is 1-3 mm, and the height of the heat dissipation rib is 5-10 mm.

[0012] Preferably, the heat dissipation structure includes at least one heat dissipation rib formed by protruding and / or recessing outward from the outer side of the sealing cover.

[0013] Preferably, the sealing cover, the heat-conducting structure and the heat-dissipating structure are integrally formed.

[0014] Preferably, the heat dissipation structure further includes a wiring harness connector provided on the sealing cover.

[0015] Preferably, the sealing cover comprises a cover body and a connecting portion extending from the cover body;

[0016] The wiring harness connector is arranged on the connecting portion and is sealed and connected to the connecting portion.

[0017] The embodiment of the present utility model further provides a braking system, comprising a PCB board and any one of the heat dissipation housings described above;

[0018] The PCB board is assembled on the inner side of the sealing cover and is sealed with the sealing cover.

[0019] An embodiment of the present invention further provides a vehicle, comprising the above-mentioned braking system.

[0020] The present invention provides a heat dissipation housing, a braking system, and a vehicle. The heat dissipation housing comprises a heat dissipation structure disposed on the outside of a sealing cover and a heat conduction structure disposed on the inside of the sealing cover, which contacts a heating element on a PCB. Heat generated by the heating element is conducted to the sealing cover and then dissipated through the heat dissipation structure on the outside of the sealing cover, thereby preventing heat from accumulating within the sealing cover. This provides a good heat dissipation effect for the PCB in a sealed state. Furthermore, the heat dissipation structure and heat conduction structure disposed on the sealing cover do not occupy excessive space, resulting in a small size and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 This is a structural schematic diagram of a heat dissipation housing in one embodiment of the present utility model;

[0023] Figure 2 This is another structural schematic diagram of the heat dissipation housing in one embodiment of the present utility model.

[0024] In the figure: 1. Sealing cover; 11. Cover body; 2. Heat-conducting structure; 3. Heat dissipation structure; 31. Heat sink; 32. Heat dissipation rib; 4. PCB board; 5. Wiring harness connector; 51. Connecting part. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0028] An embodiment of the present utility model provides a heat dissipation housing, comprising a sealing cover 1, a heat-conducting structure 2 and a heat dissipation structure 3; the sealing cover 1 is used to be sealed and connected to a PCB board 4; the heat-conducting structure 2 is arranged on the inner side of the sealing cover 1, and is used to abut against the heating element in the PCB board 4; the heat dissipation structure 3 is arranged on the outer side of the sealing cover 1.

[0029] As an example, the heat dissipation housing includes a sealing cover 1, a thermally conductive structure 2, and a heat dissipation structure 3. The sealing cover 1 is sealed against the PCB 4, providing a waterproof and dustproof seal. The inner side of the sealing cover 1 faces the PCB 4. The thermally conductive structure 2 is located inside the sealing cover 1 and abuts against the heating elements (such as MOS transistors and control chips) on the PCB 4, directing the heat generated by the heating elements to the sealing cover 1. The heat dissipation structure 3 is located outside the sealing cover 1, in contact with the air, dissipating heat transferred to the sealing cover 1 into the air, achieving excellent heat dissipation.

[0030] In this example, by providing a heat dissipation structure 3 on the outside of the sealing cover 1 and providing a heat-conducting structure 2 on the inside of the sealing cover 1 that abuts the heating element on the PCB board 4, the heat generated by the heating element can be conducted to the sealing cover 1, and then dissipated through the heat dissipation structure 3 on the outside of the sealing cover 1, thereby preventing heat from accumulating inside the sealing cover 1. This can produce a better heat dissipation effect for the PCB board 4 in a sealed state, and the heat dissipation structure 3 and heat-conducting structure 2 provided on the sealing cover 1 do not take up too much space, are small in size, and have low cost.

[0031] In one embodiment, the heat-conducting structure 2 includes at least two heat-conducting protrusions disposed on the inner side of the sealing cover 1 , and a distal end of each heat-conducting protrusion is used to abut against a heating element in the PCB board 4 .

[0032] As an example, the heat-conducting structure 2 includes at least two heat-conducting protrusions arranged on the inner side of the sealing cover 1, and the end of each heat-conducting protrusion abuts against the heating element (such as a MOS tube or a control chip) in the PCB board 4, so that the heat generated by the heating element can be conducted to the sealing cover 1 and the heat dissipation structure 3 outside the sealing cover 1, so that the heat generated by the heating element can be quickly dissipated, preventing the heat accumulated on the heating element from affecting the performance of the element.

[0033] In one embodiment, the heat dissipation structure 3 includes at least one heat dissipation fin 31 disposed on the outer side of the sealing cover 1 .

[0034] As an example, the heat dissipation structure 3 includes at least one heat sink 31 arranged on the outside of the sealing cover 1. Two adjacent heat sinks 31 are arranged at intervals, which can expand the contact area between the outside of the sealing cover 1 and the air and facilitate heat dissipation.

[0035] In one embodiment, the thickness of the heat sink 31 is 1-3 mm, and the height of the heat sink 31 is 5-10 mm.

[0036] As an example, the size of each heat sink 31 is determined by the heat dissipation requirements of different PCB boards 4. Usually, the thickness of the heat sink 31 can be within 1-3 mm, and the height of the heat sink 31 can be within 5-10 mm to balance the production cost and heat dissipation efficiency.

[0037] In one embodiment, the heat dissipation structure 3 further includes at least one heat dissipation rib 32 formed by protruding outward and / or recessing inward from the outer side of the sealing cover 1 .

[0038] As an example, the heat dissipation structure 3 further includes at least one heat dissipation rib 32. The heat dissipation rib 32 is formed by an inward depression or outward protrusion on the outer side of the sealing cover 1. Since the air flow rate on a curved surface is greater than the flow rate on a flat surface, the air flow rate outside the heat dissipation rib 32 of the sealing cover 1 is greater than the air flow rate outside the plane of the sealing cover 1. The higher air flow rate can remove heat more quickly, thereby improving the heat dissipation efficiency of the sealing cover 1.

[0039] In one embodiment, the sealing cover 1 , the heat conducting structure 2 and the heat dissipating structure 3 are integrally formed.

[0040] As an example, the sealing cover 1, the thermal conductive structure 2 and the heat dissipation structure 3 can be integrally formed by metal machining or injection molding. The integral molding can make the sealing cover 1 easy to manufacture as a whole, and the sealing cover 1, the thermal conductive structure 2 and the heat dissipation structure 3 are tightly connected and not easily damaged or failed.

[0041] In one embodiment, the heat dissipation structure 3 further includes a wiring harness connector 5 provided on the sealing cover 1 .

[0042] As an example, the heat dissipation structure 3 further includes a wiring harness connector 5 disposed on the sealing cover 1. One end of the wiring harness connector 5 is connected to the PCB board 4, and the other end is used to plug into an external circuit to electrically connect the external circuit and the PCB board 4. Depending on the wiring requirements of the PCB board 4, the wiring harness connector 5 can be disposed at the edge of the sealing cover 1, extending along the outer side of the sealing cover 1, or it can be disposed on the outer surface of the sealing cover 1 and perpendicular to the outer side of the sealing cover 1. The heat dissipation structure 3 is arranged around the wiring harness connector 5.

[0043] In one embodiment, the sealing cover 1 includes a cover body 11 and a connecting portion 51 extending from the cover body 11 ; the wiring harness connector 5 is disposed on the connecting portion 51 and is sealed and connected to the connecting portion 51 .

[0044] As an example, the sealing cover 1 includes a cover body 11 and a connecting portion 51 extending from the cover body 11. Depending on the wiring requirements of the PCB board 4, the connecting portion 51 can be located at the edge of the cover body 11, extending in the same direction as the cover body 11; the connecting portion 51 can also be located on the outside of the cover body 11, extending perpendicular to the outer side of the cover body 11. The heat dissipation structure 3 is arranged around the connecting portion 51. The connecting portion 51 is used to assemble the wiring harness connector 5, forming a sealed connection with the wiring harness connector 5, thereby forming a waterproof and dustproof seal at the wiring harness connector 5.

[0045] The embodiment of the present utility model further provides a braking system, comprising a PCB board 4 and the heat dissipation housing in the above embodiment; the PCB board 4 is assembled on the inner side of the sealing cover 1 and is sealed to the sealing cover 1 .

[0046] As an example, the braking system includes a PCB board 4 and the heat dissipation housing in the above-mentioned embodiment. The PCB board 4 is assembled on the inner side of the sealing cover 1, and a sealed connection is formed between the PCB board 4 and the sealing cover 1, which is waterproof and dustproof. The heat-conducting structure 2 on the inner side of the sealing cover 1 abuts against the heating element on the PCB board 4, transferring heat to the sealing cover 1, and the heat dissipation structure 3 on the outer side of the sealing cover 1 can dissipate heat into the air, thereby playing a heat dissipation role. When the braking system is assembled on a vehicle, the airflow around the braking system can quickly take away the heat from the heat dissipation structure 3 when the vehicle is moving, achieving a good heat dissipation effect and having a strong adaptability to the entire vehicle.

[0047] An embodiment of the present utility model further provides a vehicle, comprising the braking system in the above embodiment.

[0048] As an example, a vehicle includes the braking system described above. In this example, the thermally conductive structure 2 within the vehicle's braking system transfers heat generated by the heating element on the PCB 4 to the braking system's sealing cover 1. The heat dissipation structure 3 on the outside of the sealing cover 1 dissipates the heat into the air. Especially when the vehicle is in motion, the airflow surrounding the braking system can quickly remove heat from the heat dissipation structure 3, achieving excellent heat dissipation and providing strong compatibility with the vehicle.

[0049] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A heat dissipation housing, characterized in that: It includes a sealing cover, a heat-conducting structure and a heat-dissipating structure; The sealing cover is used to be sealed and connected to the PCB board; The heat-conducting structure is arranged on the inner side of the sealing cover and is used to abut against the heating element in the PCB board; The heat dissipation structure is arranged on the outer side of the sealing cover.

2. The heat dissipation housing according to claim 1, characterized in that: The heat-conducting structure includes at least two heat-conducting protrusions arranged on the inner side of the sealing cover, and the end of each heat-conducting protrusion is used to abut against the heating element in the PCB board.

3. The heat dissipation housing according to claim 1, wherein: The heat dissipation structure includes at least one heat dissipation fin arranged on the outer side of the sealing cover.

4. The heat dissipation housing according to claim 3, characterized in that: The heat dissipation structure includes at least one heat dissipation rib formed by protruding and / or recessing outward from the outer side of the sealing cover.

5. The heat dissipation housing according to claim 4, characterized in that: The thickness of the heat sink is 1-3 mm, and the height of the heat dissipation rib is 5-10 mm.

6. The heat dissipation housing according to claim 1, characterized in that: The sealing cover, the heat-conducting structure and the heat-dissipating structure are integrally formed.

7. The heat dissipation housing according to claim 1, characterized in that: The heat dissipation structure further includes a wiring harness connector arranged on the sealing cover.

8. The heat dissipation housing according to claim 7, characterized in that: The sealing cover comprises a cover body and a connecting portion extending from the cover body; The wiring harness connector is arranged on the connecting portion and is sealed and connected to the connecting portion.

9. A braking system, characterized in that: Comprising a PCB board and the heat dissipation housing according to any one of claims 1 to 8; The PCB board is assembled on the inner side of the sealing cover and is sealed with the sealing cover.

10. A vehicle, characterized in that: Includes the braking system according to claim 9.

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