Part adsorption device for mobile communication mainboard patch

Abstract

The utility model provides a part adsorption device for a mobile communication mainboard patch, which relates to the field of mainboard part adsorption devices, and is characterized in that through the arrangement of an adsorption assembly and a reinforcing assembly, a sliding column is aligned to a patch part placed on a base during use, and then the patch part is pressed down; the sliding column is driven to slide and move downwards in the sliding piece and extrude the first spring, then the sliding column moving downwards drives the suction cup to be separated from the patch part and suck the patch part, the sliding column is loosened, and the sliding column returns to the previous position under the elastic force of the first spring. The extending block is pulled to drive the sliding plug to slide in the communicating groove, so that the air density between the communicating groove and the suction cup is reduced, the suction force of the suction cup is improved, and then the sliding column is pushed to adjust the position of the sliding column through the sliding groove. And then the patch part is conveyed to a proper position, and the sliding column is pressed down again to enable the patch part to be attached to the main board, so that the problem that the suction force of a suction cup is small in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the field of mainboard parts adsorption devices, in particular to a parts adsorption device for mobile communication mainboard patches. Background Art

[0002] The mobile phone motherboard is the main circuit board in the mobile phone, which mainly includes: baseband chip and power management chip, RF processor and RF power amplifier, other CPU memory controller, touch screen Bluetooth WIFI sensor, etc., as well as some microphones, headphones, speakers, cameras, screens, interfaces, etc. These things are welded on a circuit board. The whole circuit board is called the mobile phone motherboard. The function of the mobile phone motherboard is to integrate the operation and management of the mobile phone.

[0003] After searching, the Chinese patent with patent publication number CN217072222U disclosed in the prior art "a device for adsorbing parts for mobile phone motherboard patches, in which a suction cup that can slide up and down and left and right is provided to absorb the inner screen or outer screen located at the screen placement area, and then the screen adsorbed on the suction cup is moved and bonded to the motherboard at the motherboard placement area. This device eliminates the step of manually bonding the mobile phone screen and ensures that the screen and the motherboard can be perfectly bonded, and the operation is very simple and convenient. In addition, as the suction cup moves left and right, it drives the fan to rotate, so that the fan cools the motherboard with a certain temperature at the bottom, saving time and effort." However, the following defects still exist:

[0004] (1) In actual use, the suction cup is not strong enough to hold the motherboard parts firmly, and it is easy for them to fall off during movement, causing damage to the motherboard parts;

[0005] (2) The positioning effect of the motherboard is poor during actual use, and it is impossible to fix and limit motherboards of different sizes, resulting in a relatively single working range and poor practicality.

[0006] Therefore, we have made improvements to this problem and proposed a parts adsorption device for mobile communication motherboard patches. Utility Model Content

[0007] The purpose of the utility model is to address the current problems that the motherboard parts are not firmly adsorbed by suction cups, are easily damaged by falling during movement, have poor positioning effect on the motherboard, and cannot be fixed and limited on motherboards of different sizes, resulting in a relatively single working range and poor practicality.

[0008] In order to achieve the above-mentioned purpose of the utility model, the utility model provides the following technical solutions:

[0009] A parts adsorption device for mobile communication motherboard chips is used to improve the above problems.

[0010] The utility model is specifically as follows:

[0011] The device comprises a base, an adsorption component is provided on the top of the base, a reinforcement component is provided inside the adsorption component, a clamping component is provided on the top of the base, and a limiting component is provided on one side of the clamping component;

[0012] The adsorption assembly includes a workbench, a bracket, a sliding groove, a sliding sheet, a sliding column, a suction cup, a first spring and a limit plate. The workbench is arranged on the top of the base, the bracket is fixedly connected to the top of the base, the sliding groove is opened at the top of the bracket, the sliding sheet is slidably connected to the top of the sliding groove, the sliding column is slidably connected to the inside of the sliding sheet and slidably connected to the inside of the sliding groove, the suction cup is arranged at the bottom of the sliding column, the first spring is arranged between the sliding column and the sliding sheet and is used in conjunction with the sliding column, and the limit plate is fixedly connected to one side of the sliding column and is used in conjunction with the sliding groove for sliding connection.

[0013] As a preferred technical solution of the present invention, the reinforcement component includes a connecting groove, an extension groove, a sliding plug and an extension block. The connecting groove is opened between the suction cup and the sliding column, the extension groove is opened at the top of the connecting groove, the sliding plug is slidably connected to the inside of the extension groove, and the extension block is fixedly connected to the top of the sliding plug and slidably connected to the inside of the extension groove.

[0014] As an optimal technical solution of the present invention, the clamping assembly includes a movable groove, a bidirectional screw, a motor and a clamping plate. The movable groove is opened at the top of the base, the bidirectional screw is rotatably connected to the inside of the movable groove, the motor is arranged on one side of the base and the output end is fixedly connected to the bidirectional screw, the two clamping plates are slidably connected to the inside of the movable groove and are used in conjunction with the bidirectional screw threaded connection, and the two clamping plates are symmetrically arranged at both ends of the bidirectional screw.

[0015] As an optimal technical solution of the present invention, the limiting assembly includes a limiting groove, a limiting clamp, a limiting plate and a second spring. The two limiting grooves are opened on both sides of the clamping plate. The limiting clamp is slidably connected to the inside of the limiting groove. The two limiting plates are fixedly connected to both sides of the clamping plate. The second spring is arranged between the limiting plate and the limiting clamp.

[0016] As a preferred technical solution of the present invention, a stabilizing groove is provided on one side of the limiting plate, one side of the limiting clamp is fixedly connected to a stabilizing rod, and the stabilizing rod is slidably connected to the inside of the stabilizing groove.

[0017] As a preferred technical solution of the present invention, one side of the clamping plate is fixedly connected to two cooperative plates, one side of the limiting clamping plate is fixedly connected to a cooperative rod, and the cooperative rod is slidably connected to the inside of the cooperative plate.

[0018] As an optimal technical solution of the present invention, two positioning plates are fixedly connected to the top of the base, a positioning rod is slidably connected inside the positioning plate, a positioning splint is fixedly connected to one side of the positioning rod, and a third spring is arranged between the positioning splint and the positioning plate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] In the solution of the present utility model:

[0021] 1. Through the provided adsorption component and reinforcement component, when in use, the sliding column is aligned with the patch part placed on the base of the device, and then pressed down, driving the sliding column to slide down inside the sliding piece and squeeze the first spring, and then the downward sliding column will drive the suction cup and the patch part to be released and absorb the patch part, and release the sliding column. The sliding column will be returned to the previous position by the elastic force of the first spring, and the extension block can be pulled to drive the sliding plug to slide inside the connecting groove, so that the air density between the connecting groove and the suction cup is reduced, thereby increasing the suction force of the suction cup, and then the sliding column can be pushed to adjust the position of the sliding column through the sliding groove, and then the patch part is transported to the appropriate position and the sliding column is pressed down again to mount the patch part on the mainboard, which solves the problem of weak suction force of the suction cup in the prior art;

[0022] 2. Through the provided clamping assembly and limiting assembly, the mainboard is placed between the two clamping plates during use, the motor is started to drive the bidirectional screw to rotate, drive the two clamping plates to slide inside the movable groove, and clamp the mainboard, thereby positioning and fixing the mainboard for subsequent processing. Then the second spring will apply elastic force to the limiting clamping plate, so that multiple limiting clamping plates can limit and fix the mainboard in positioning again, and it can be used with mainboards under different belts. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of the parts adsorption device for mobile communication motherboard patches provided by the utility model;

[0024] Figure 2 This is a right side view of the parts adsorption device for mobile communication motherboard patch provided by the utility model;

[0025] Figure 3 The utility model provides a parts adsorption device for mobile communication motherboard patch Figure 2 Schematic diagram of the cross-sectional three-dimensional structure at AA in the middle;

[0026] Figure 4 The utility model provides a parts adsorption device for mobile communication motherboard patch Figure 3 Schematic diagram of the local structure in;

[0027] Figure 5 This is a structural schematic diagram of the clamping assembly of the parts adsorption device for mobile communication motherboard patch provided by the utility model.

[0028] Indicated in the figure:

[0029] 1. Base; 2. Adsorption component; 3. Reinforcement component; 4. Clamping component; 5. Limiting component; 201. Workbench; 202. Bracket; 203. Sliding groove; 204. Sliding sheet; 205. Sliding column; 206. Suction cup; 207. First spring; 208. Limiting plate; 301. Connecting groove; 302. Extension groove; 303. Sliding plug; 304. Extension block; 401. Moving groove; 402. Bidirectional screw; 403. Motor; 404. Clamping plate; 501. Limiting groove; 502. Limiting splint; 503. Limiting plate; 504. Second spring; 6. Stabilizing groove; 7. Stabilizing rod; 8. Collaborative plate; 9. Collaborative rod; 10. Positioning plate; 11. Positioning rod; 12. Positioning splint; 13. Third spring. DETAILED DESCRIPTION

[0030] To make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them.

[0031] Therefore, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the claimed invention, but merely represents some embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein can be combined with each other.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0034] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5As shown, this embodiment provides a component adsorption device for mobile communication motherboard patch, including a base 1, a suction component 2 is provided on the top of the base 1, a reinforcement component 3 is provided inside the suction component 2, a clamping component 4 is provided on the top of the base 1, and a limit component 5 is provided on one side of the clamping component 4;

[0035] The adsorption assembly 2 includes a workbench 201, a bracket 202, a sliding groove 203, a sliding piece 204, a sliding column 205, a suction cup 206, a first spring 207 and a limit plate 208. The workbench 201 is arranged on the top of the base 1, the bracket 202 is fixedly connected to the top of the base 1, the sliding groove 203 is opened at the top of the bracket 202, the sliding piece 204 is slidably connected to the top of the sliding groove 203, the sliding column 205 is slidably connected to the inside of the sliding piece 204 and slidably connected to the inside of the sliding groove 203, the suction cup 206 is arranged at the bottom of the sliding column 205, the first spring 207 is arranged between the sliding column 205 and the sliding piece 204 and is used in conjunction with the sliding column 205, and the limit plate 208 is fixedly connected The sliding post 205 is on one side of the sliding post 205 and is used in a sliding connection with the sliding groove 203. When in use, the sliding post 205 is aligned with the patch component placed on the device base 1, and then pressed down, driving the sliding post 205 to slide down inside the sliding piece 204 and squeeze the first spring 207. The downward sliding post 205 will drive the suction cup 206 to release the patch component and absorb the patch component. Release the sliding post 205, and the sliding post 205 will be returned to the previous position by the elastic force of the first spring 207. Then push the sliding post 205 to adjust the position of the sliding post 205 through the sliding groove 203, and then transport the patch component to the appropriate position and press the sliding post 205 down again to patch the patch component onto the mainboard.

[0036] like Figure 3 As shown, as a preferred embodiment, on the basis of the above method, the reinforcement component 3 further includes a connecting groove 301, an extension groove 302, a sliding plug 303 and an extension block 304. The connecting groove 301 is opened between the suction cup 206 and the sliding column 205, the extension groove 302 is opened at the top of the connecting groove 301, the sliding plug 303 is slidably connected to the inside of the extension groove 302, and the extension block 304 is fixedly connected to the top of the sliding plug 303 and slidably connected to the inside of the extension groove 302. When in use, pulling the extension block 304 can drive the sliding plug 303 to slide inside the connecting groove 301, so that the air density between the connecting groove 301 and the suction cup 206 is reduced, thereby improving the suction force of the suction cup 206.

[0037] like Figure 5As shown, as a preferred embodiment, on the basis of the above method, further, the clamping assembly 4 includes a movable groove 401, a bidirectional screw 402, a motor 403 and a clamping plate 404, the movable groove 401 is opened at the top of the base 1, the bidirectional screw 402 is rotatably connected to the inside of the movable groove 401, the motor 403 is arranged on one side of the base 1 and the output end is fixedly connected to the bidirectional screw 402, the two clamping plates 404 are slidably connected to the inside of the movable groove 401 and used in conjunction with the bidirectional screw 402 threaded connection, the two clamping plates 404 are symmetrically arranged at both ends of the bidirectional screw 402, when in use, the main board is placed between the two clamping plates 404, the motor 403 is started, the bidirectional screw 402 is driven to rotate, the two clamping plates 404 are driven to slide inside the movable groove 401, and the main board is clamped, so as to position and fix the main board for subsequent processing, and at the same time, it can be used for main boards under different belts.

[0038] like Figure 4 As shown, as a preferred embodiment, on the basis of the above method, the limiting component 5 further includes a limiting groove 501, a limiting clamp 502, a limiting plate 503 and a second spring 504. The two limiting grooves 501 are opened on both sides of the clamping plate 404, and the limiting clamp 502 is slidably connected to the inside of the limiting groove 501. The two limiting plates 503 are fixedly connected to both sides of the clamping plate 404. The second spring 504 is arranged between the limiting plate 503 and the limiting clamp 502. When in use, after the main board is clamped and fixed, the second spring 504 will apply elastic force to the limiting clamp 502, so that the multiple limiting clamps 502 can limit and fix the main board in positioning again.

[0039] like Figure 4 As shown, as a preferred embodiment, on the basis of the above method, further, a stabilizing groove 6 is opened on one side of the limiting plate 503, and one side of the limiting splint 502 is fixedly connected to the stabilizing rod 7, and the stabilizing rod 7 is slidably connected to the inside of the stabilizing groove 6. When in use, the stabilizing rod 7 slides inside the stabilizing groove 6 to improve the stability of the movement of the limiting splint 502.

[0040] like Figure 4 As shown, as a preferred embodiment, on the basis of the above method, further, one side of the clamping plate 404 is fixedly connected to two cooperative plates 8, one side of the limiting clamp 502 is fixedly connected to the cooperative rod 9, and the cooperative rod 9 is slidably connected to the inside of the cooperative plate 8. When in use, the sliding of the cooperative rod 9 inside the cooperative plate 8 can further improve the stability of the movement of the limiting clamp 502.

[0041] like Figure 5As shown, as a preferred embodiment, on the basis of the above method, further, two positioning plates 10 are fixedly connected to the top of the base 1, and a positioning rod 11 is slidably connected inside the positioning plate 10. A positioning clamp 12 is fixedly connected to one side of the positioning rod 11, and a third spring 13 is arranged between the positioning clamp 12 and the positioning plate 10. When in use, the third spring 13 drives the positioning clamping, which can simply limit the patch parts.

[0042] Specifically, when the present mobile communication motherboard patch parts adsorption device is in use: the sliding column 205 is aligned with the patch part placed on the device base 1, and then pressed down, driving the sliding column 205 to slide down inside the sliding sheet 204 and squeeze the first spring 207, and then the downward sliding column 205 will drive the suction cup 206 to release the patch part and adsorb the patch part, and release the sliding column 205. The sliding column 205 will be returned to its previous position by the elastic force of the first spring 207, and pulling the extension block 304 can drive the sliding plug 303 to slide inside the connecting groove 301, so that the air density between the connecting groove 301 and the suction cup 206 is reduced, thereby improving the suction force of the suction cup 206. , and then push the sliding column 205 to adjust the position of the sliding column 205 through the sliding groove 203, and then transport the patch parts to the appropriate position and press the sliding column 205 down again to patch the patch parts onto the mainboard, and place the mainboard between the two clamping plates 404, start the motor 403, drive the bidirectional screw 402 to rotate, drive the two clamping plates 404 to slide inside the moving groove 401, and clamp the mainboard, so as to position and fix the mainboard for subsequent processing, and then the second spring 504 will apply elastic force to the limiting clamping plate 502, so that multiple limiting clamping plates 502 can limit and fix the mainboard in positioning again, and at the same time can be used for mainboards under different belts.

[0043] All technical features in this embodiment can be freely combined according to actual needs.

[0044] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A parts adsorption device for mobile communication motherboard patch, comprising a base (1), characterized in that: An adsorption component (2) is provided on the top of the base (1), a reinforcement component (3) is provided inside the adsorption component (2), a clamping component (4) is provided on the top of the base (1), and a limiting component (5) is provided on one side of the clamping component (4); The adsorption assembly (2) includes a workbench (201), a bracket (202), a sliding groove (203), a sliding sheet (204), a sliding column (205), a suction cup (206), a first spring (207) and a limiting plate (208), wherein the workbench (201) is arranged on the top of the base (1), the bracket (202) is fixedly connected to the top of the base (1), the sliding groove (203) is opened on the top of the bracket (202), and the sliding sheet (204) is slidably connected to the sliding column (205). The top of the groove (203), the sliding column (205) is slidably connected to the inside of the sliding sheet (204) and slidably connected to the inside of the sliding groove (203), the suction cup (206) is arranged at the bottom of the sliding column (205), the first spring (207) is arranged between the sliding column (205) and the sliding sheet (204) and is used in conjunction with the sliding column (205), and the limiting plate (208) is fixedly connected to one side of the sliding column (205) and is used in conjunction with the sliding groove (203).

2. A mobile communication motherboard patch parts adsorption device according to claim 1, characterized in that: The reinforcing assembly (3) comprises a connecting groove (301), an extension groove (302), a sliding plug (303) and an extension block (304); the connecting groove (301) is opened between the suction cup (206) and the sliding column (205); the extension groove (302) is opened at the top of the connecting groove (301); the sliding plug (303) is slidably connected to the interior of the extension groove (302); and the extension block (304) is fixedly connected to the top of the sliding plug (303) and slidably connected to the interior of the extension groove (302).

3. The mobile communication motherboard patch component adsorption device according to claim 1, characterized in that: The clamping assembly (4) includes a movable groove (401), a bidirectional screw (402), a motor (403) and a clamping plate (404), wherein the movable groove (401) is opened at the top of the base (1), the bidirectional screw (402) is rotatably connected to the inside of the movable groove (401), the motor (403) is arranged on one side of the base (1) and the output end is fixedly connected to the bidirectional screw (402), the two clamping plates (404) are slidably connected to the inside of the movable groove (401) and are used in conjunction with the bidirectional screw (402) for threaded connection, and the two clamping plates (404) are symmetrically arranged at both ends of the bidirectional screw (402).

4. A component adsorption device for mobile communication motherboard patch according to claim 3, characterized in that: The limiting assembly (5) comprises a limiting groove (501), a limiting clamp (502), a limiting plate (503) and a second spring (504), wherein the two limiting grooves (501) are provided on both sides of the clamping plate (404), the limiting clamp (502) is slidably connected to the inside of the limiting groove (501), the two limiting plates (503) are fixedly connected to both sides of the clamping plate (404), and the second spring (504) is provided between the limiting plate (503) and the limiting clamp (502).

5. A mobile communication motherboard patch parts adsorption device according to claim 4, characterized in that: A stabilizing groove (6) is provided on one side of the limiting plate (503), one side of the limiting clamping plate (502) is fixedly connected to a stabilizing rod (7), and the stabilizing rod (7) is slidably connected to the inside of the stabilizing groove (6).

6. The mobile communication motherboard patch component adsorption device according to claim 5, characterized in that: One side of the clamping plate (404) is fixedly connected to two cooperative plates (8), one side of the position-limiting clamping plate (502) is fixedly connected to a cooperative rod (9), and the cooperative rod (9) is slidably connected to the interior of the cooperative plate (8).

7. The component adsorption device for mobile communication motherboard patch according to claim 3, characterized in that: Two positioning plates (10) are fixedly connected to the top of the base (1), a positioning rod (11) is slidably connected inside the positioning plate (10), a positioning clamping plate (12) is fixedly connected to one side of the positioning rod (11), and a third spring (13) is provided between the positioning clamping plate (12) and the positioning plate (10).

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