Die structure of lower cover of high-precision electronic product

Abstract

The utility model discloses a mould structure of a high-precision electronic product lower cover, which comprises a mould I. The mould structure has the beneficial effects that a round and flat ejector pin and an ejector block are arranged, so that an external ejector rod pushes a pin plate and drives the round and flat ejector pin and the ejector block to move, and a product body is ejected out and separated from a rear mould core through the round and flat ejector pin and the ejector block; a product is normally produced, a front mold inclined top and a rear mold sliding block are arranged, so that release position and exhaust treatment during mold opening of the front mold inclined top are achieved, release position and exhaust treatment is conducted through the rear mold sliding block, demolding treatment is conveniently conducted on a product body produced between a front mold core and a rear mold core, and a three-point sequence valve needle is inversely installed on the rear mold core for glue feeding; the two buckling positions of the front mold core are provided with inclined ejection structures, a deformation numerical value is found through mold flow analysis, reversible deformation is directly conducted according to the number during design, and under the condition that it is guaranteed that the product structure and the assembly quality are not affected, it is guaranteed that the injection molding period is reasonable, production is smooth, and the mold machining period is controlled within the specified time.

Description

Technical Field

[0001] The utility model relates to the technical field of mold structures, in particular to a mold structure for a lower cover of a high-precision electronic product. Background Art

[0002] Mold structure refers to the components of a mold and how they are connected and coordinated with each other. In the mold processing industry, for precision products made of high-temperature materials (PEEK+GF), due to their long strip shape and high assembly requirements, as well as the large deformation and difficult-to-control dimensions caused by the material properties, traditional processing methods such as side gluing or water-based gluing are difficult to control deformation. Continuous testing and modification of the parting surface based on the deformation are required, which seriously affects the mold's production cycle and easily leads to risks such as dimensional deviation in subsequent injection molding production. Utility Model Content

[0003] The purpose of the present utility model is to provide a mold structure for the lower cover of a high-precision electronic product, so as to solve the problem raised in the above-mentioned background technology that it is difficult to control deformation when performing side gluing or fine water gluing according to the traditional processing method, and it is necessary to continuously test and change the parting surface according to the deformation amount, which seriously affects the production cycle of the mold and is prone to risks such as dimensional deviation in subsequent injection molding production.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a mold structure for a high-precision lower cover of an electronic product, comprising:

[0005] Mold No. 1;

[0006] A rear mold core is arranged on the inner side of the No. 1 mold;

[0007] The front mold inclined top is symmetrically arranged inside the front mold core;

[0008] A round flat ejector pin is slidably disposed inside the rear mold core and is slidably connected to the No. 1 mold;

[0009] The ejector block is symmetrically arranged above the rear mold core, and the top end of the round flat ejector pin is fixedly connected to the ejector block;

[0010] Mold No. 2, mold No. 2 is placed on one side of mold No. 1;

[0011] The front mold core is arranged on the inner side of the No. 2 mold.

[0012] As a preferred solution of the present invention: it also includes a needle valve type hot runner, which is arranged inside the No. 1 mold, and an injection tube is fixedly connected to one side of the needle valve type hot runner, and one end of the injection tube is connected to the rear mold core.

[0013] As a preferred solution of the present invention: it also includes a product body, which is arranged between the front mold core and the rear mold core, and a rear mold slider is arranged inside the rear mold core.

[0014] As a preferred solution of the present invention: a guide cylinder is symmetrically fixedly connected inside the No. 2 mold, and a No. 1 guide rod matched with the guide cylinder is symmetrically fixedly connected to one side of the No. 1 mold.

[0015] As a preferred solution of the present invention: a No. 2 guide rod is symmetrically fixed to one side of the No. 1 mold, and a guide groove cooperating with the No. 2 guide rod is symmetrically opened on one side of the No. 2 mold.

[0016] As a preferred solution of the present invention: a first heating tube hole is provided inside the rear mold core, and a second heating tube hole is provided inside the front mold core.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides a round flat ejector and an ejector block, so that the external ejector rod pushes the needle plate and drives the round flat ejector and the ejector block to move, and the product body is ejected by the round flat ejector and the ejector block, separated from the rear mold core, and the product is produced normally; by providing a front mold inclined ejector and a rear mold slider, the front mold inclined ejector can be disengaged and vented when the mold is opened; the rear mold slider performs the disengagement and venting, and it is convenient to demold the product body produced between the front mold core and the rear mold core; the rear mold core is inverted at three points for sequential valve needle injection, and the two buckle positions of the front mold core are made into an inclined ejector structure, and mold flow analysis is used to find the deformation value, and the reverse deformation is directly modified according to the value during design, first of all, without affecting the product structure and assembly quality, ensuring that the injection cycle is reasonable and the production is smooth, and controlling the mold processing cycle within the specified time to meet customer requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of mold No. 1 of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of mold No. 2 of the utility model;

[0020] Figure 3 This is an exploded view of the utility model;

[0021] Figure 4 This is a schematic diagram of the position structure of the product body of the utility model;

[0022] Figure 5 This is a schematic diagram of the ejection structure of a round flat ejector pin of the utility model;

[0023] Figure 6 This is a schematic diagram of the product body structure of the utility model.

[0024] In the figure: 1. Front mold core; 2. Front mold inclined ejector; 3. Rear mold slider; 4. Ejector block; 5. Round flat ejector pin; 6. Rear mold core; 7. Hole for heating pipe No. 1; 8. Hole for heating pipe No. 2; 9. Needle valve hot runner; 10. Product body; 11. Mold No. 1; 12. Mold No. 2; 13. Guide rod No. 1; 14. Guide cylinder; 15. Guide rod No. 2; 16. Guide groove; 17. Injection tube. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figures 1 to 6 The utility model provides a technical solution: a mold structure for the lower cover of a high-precision electronic product, comprising: a No. 1 mold 11; a rear mold core 6 is fixedly connected to the inner side of the No. 1 mold 11; a front mold inclined top 2 is symmetrically arranged inside the front mold core 1; a round flat ejector pin 5 is slidably arranged inside the rear mold core 6, and the round flat ejector pin 5 is slidably connected to the No. 1 mold 11; an ejector block 4 is symmetrically arranged above the rear mold core 6, and the top of the round flat ejector pin 5 is fixedly connected to the ejector block 4; a No. 2 mold 12 is placed on one side of the No. 1 mold 11; and the front mold core 1 is fixedly connected to the inner side of the No. 2 mold 12.

[0027] It can be understood that before the mold of the present invention is closed, the round flat ejector pin 5 is first reset to the bottom, and the ejector block 4 is synchronously driven to reset, and then the front mold core 1 and the rear mold core 6 are closed. After a certain distance, the front mold inclined ejector pin 2 and the rear mold slider 3 are driven to reset. After reaching the position, the injection molding machine starts to inject glue for production. After the mold injection is completed, the mold is opened, the No. 2 mold 12 is pulled open, the front mold core 1 and the front mold inclined ejector pin 2 are disengaged and separated from the product body 10 at the same time, and the rear mold slider 3 is synchronously driven to move outward to separate from the buckle position of the product body 10. The external ejector rod pushes the needle plate to drive the round flat ejector pin 5 and the ejector block 4 to eject the product body 10 and separate from the rear mold core 6, so that the product body 10 can be produced normally.

[0028] See also Figures 1 to 6 , and also includes a needle valve hot runner 9, which is arranged inside the No. 1 mold 11. An injection tube 17 is fixedly connected to one side of the needle valve hot runner 9, and one end of the injection tube 17 is connected to the rear mold core 6.

[0029] It can be understood that the present invention uses the needle valve hot runner 9 to perform injection molding machine glue injection production, and enters the rear mold core 6 through the injection tube 17 to perform injection molding.

[0030] See also Figures 1 to 6, and also includes a product body 10, which is arranged between the front mold core 1 and the rear mold core 6, and a rear mold slider 3 is arranged inside the rear mold core 6.

[0031] It can be understood that the present invention facilitates the demoulding of the product body 10 produced between the front mold core 1 and the rear mold core 6 by providing a tripping position and exhaust processing through the rear mold slider 3 .

[0032] See also Figures 1 to 6 A guide cylinder 14 is symmetrically fixed to the interior of the No. 2 mold 12, and a No. 1 guide rod 13 that cooperates with the guide cylinder 14 is symmetrically fixed to one side of the No. 1 mold 11.

[0033] It can be understood that the present invention improves the mold clamping stability between the No. 2 mold 12 and the No. 1 mold 11 by coordinating and positioning the No. 1 guide rod 13 on one side of the No. 1 mold 11 with the guide cylinder 14 on the side of the No. 2 mold 12.

[0034] See also Figures 1 to 6 A No. 2 guide rod 15 is symmetrically fixed to one side of the No. 1 mold 11, and a guide groove 16 that cooperates with the No. 2 guide rod 15 is symmetrically opened on one side of the No. 2 mold 12.

[0035] It can be understood that the present invention further improves the mold clamping stability between the No. 1 mold 11 and the No. 2 mold 12 through the coordinated positioning between the No. 2 guide rod 15 and the guide groove 16 .

[0036] See also Figures 1 to 6 A first heating tube hole 7 is provided inside the rear mold core 6, and a second heating tube hole 8 is provided inside the front mold core 1.

[0037] It can be understood that, in the present invention, the function of the No. 1 heating tube hole 7 and the No. 2 heating tube hole 8 in the injection mold is to install heating tubes, convert electrical energy into thermal energy, heat the mold and thus maintain a constant temperature of the injection material.

[0038] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "two ends", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one such feature.

[0040] In the present invention, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0041] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mold structure for a high-precision lower cover of an electronic product, characterized in that: include: Mold No. 1 (11); A rear mold core (6), the rear mold core (6) is arranged on the inner side of the first mold (11); A front mold inclined top (2), the front mold inclined top (2) is symmetrically arranged inside the front mold core (1); A round flat ejector pin (5), the round flat ejector pin (5) is slidably arranged inside the rear mold core (6), and the round flat ejector pin (5) is slidably connected to the No. 1 mold (11); A top block (4), the top block (4) is symmetrically arranged above the rear mold core (6), and the top end of the round flat ejector pin (5) is fixedly connected to the top block (4); A second mold (12), the second mold (12) is placed on one side of the first mold (11); The front mold core (1) is arranged on the inner side of the second mold (12).

2. The mold structure for a high-precision lower cover of an electronic product according to claim 1, characterized in that: The invention also includes a needle valve hot runner (9), which is arranged inside the first mold (11). An injection tube (17) is fixedly connected to one side of the needle valve hot runner (9), and one end of the injection tube (17) is connected to the rear mold core (6).

3. The mold structure for a high-precision lower cover of an electronic product according to claim 1, characterized in that: The product body (10) is also included. The product body (10) is arranged between the front mold core (1) and the rear mold core (6). A rear mold slider (3) is arranged inside the rear mold core (6).

4. The mold structure for a high-precision lower cover of an electronic product according to claim 1, characterized in that: A guide cylinder (14) is symmetrically fixed inside the No. 2 mold (12), and a No. 1 guide rod (13) matched with the guide cylinder (14) is symmetrically fixed on one side of the No. 1 mold (11).

5. The mold structure for a high-precision lower cover of an electronic product according to claim 1, characterized in that: A second guide rod (15) is symmetrically fixed to one side of the first mold (11), and a guide groove (16) cooperating with the second guide rod (15) is symmetrically opened on one side of the second mold (12).

6. The mold structure for a high-precision lower cover of an electronic product according to claim 1, characterized in that: A first heating tube hole (7) is provided inside the rear mold core (6), and a second heating tube hole (8) is provided inside the front mold core (1).

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