Thermal management integrated module
The integrated modular design of flow plates, valves and heat exchangers solves the energy loss problem caused by complex piping in the thermal management system, achieving more efficient thermal management.
Patent Information
- Application Number
- CN202422230658.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-09-11
AI Technical Summary
In existing thermal management systems, the complex piping design results in significant energy loss during the flow of refrigerant, reducing system efficiency.
An integrated module design of flow channel plates, valves and heat exchangers is adopted, wherein at least one valve is arranged corresponding to the flow port along the height direction of the thermal management integrated module, shortening the flow path and reducing energy loss.
The thermal management module structure is simplified, the flow path is shortened, and the system efficiency is improved.
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Figure CN223314783U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of thermal management technology, and in particular to a thermal management integrated module. Background Art
[0002] The thermal management system is a critical component of a vehicle, ensuring that all components maintain an appropriate operating temperature and regulating cabin temperature for a comfortable ride. A thermal management system includes a large number of electronic components, interconnected by piping. This results in complex and lengthy piping, leading to significant energy loss during refrigerant flow and reduced thermal management efficiency. Utility Model Content
[0003] In view of this, the present application provides a thermal management integrated module to solve the problems of complex structure and low efficiency of thermal management integrated modules in the prior art.
[0004] The present application provides a thermal management integrated module, which includes a flow channel plate, a valve component and a heat exchanger. The flow channel plate has a flow channel and a mounting hole, the mounting hole is connected to the flow channel, and the mounting hole is used to install the valve component. The heat exchanger has a flow port, and the flow port is connected to the flow channel, wherein at least one of the valve components is arranged corresponding to the flow port along the height direction of the thermal management integrated module.
[0005] In one possible embodiment, the valve component includes a battery electronic expansion valve and a heating valve, the flow channel plate includes a plurality of mounting holes, the electronic expansion valve and the heating valve are respectively installed in the mounting holes, the heat exchanger has a plurality of flow ports, and the electronic expansion valve and the heating valve correspond to the positions of different flow ports along the height direction of the thermal management integrated module.
[0006] In a possible implementation manner, the inner wall of the flow channel is arc-shaped.
[0007] In a possible embodiment, the flow channel plate includes an upper flow channel plate and a lower flow channel plate, and the upper flow channel plate and the lower flow channel plate are stacked along the height direction of the thermal management integrated module. The flow channel is provided on the side of the upper flow channel plate close to the lower flow channel plate, and the mounting hole is provided on the side of the upper flow channel plate away from the lower flow channel plate.
[0008] In a possible implementation, the lower flow channel plate has a mounting portion that protrudes toward the upper flow channel plate. The upper flow channel plate has a positioning groove, and the mounting portion can extend into the positioning groove.
[0009] In a possible implementation, the thermal management integrated module includes a sensor, which is installed on the flow channel plate and is used to detect the pressure or temperature of the refrigerant in the flow channel.
[0010] In a possible implementation, the thermal management integrated module includes a wiring harness, one end of which is connected to the valve component, and the other end of which is connected to a wiring harness of the entire vehicle.
[0011] In a possible implementation, the thermal management integrated module includes a bracket, which is mounted on a side wall of the flow channel plate and is used to be connected to a vehicle body.
[0012] In a possible implementation, the bracket has a connection hole, and the connection hole is provided with a buffer.
[0013] In one possible embodiment, the valve component includes an evaporator electronic expansion valve, an outdoor heat exchanger electronic expansion valve and a one-way valve. The evaporator electronic expansion valve is used to control the evaporator refrigerant flow rate, the outdoor heat exchanger electronic expansion valve is used to control the outdoor heat exchanger refrigerant flow rate, and the one-way valve is used to control the one-way flow of the refrigerant.
[0014] The present application provides a thermal management integrated module, which includes a flow channel plate, a valve component and a heat exchanger. The flow channel plate has a flow channel, and the flow channel plate has a mounting hole, which is connected to the flow channel. The mounting hole is used to install the valve component. The heat exchanger has a flow port, which is connected to the flow channel. At least one valve component is arranged corresponding to the flow port along the height direction of the thermal management integrated module, thereby shortening the length of the flow path, reducing capacity loss, and improving the efficiency of the thermal management integrated module. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0016] Figure 1 A schematic structural diagram of a thermal management integrated module provided in an embodiment of the present application;
[0017] Figure 2 A schematic diagram of the internal structure of a flow channel plate provided in an embodiment of the present application;
[0018] Figure 3 An exploded diagram of a thermal management integrated module provided in an embodiment of the present application;
[0019] Figure 4A top view of a thermal management integrated module provided in an embodiment of the present application.
[0020] Description of reference numerals:
[0021] 1- flow channel plate;
[0022] 11- flow channel;
[0023] 12-Mounting hole;
[0024] 2-valve parts;
[0025] 21-Battery electronic expansion valve;
[0026] 22-heating valve;
[0027] 23-Evaporator electronic expansion valve;
[0028] 24- Outdoor heat exchanger electronic expansion valve;
[0029] 25- one-way valve;
[0030] 3-heat exchanger;
[0031] 31- circulation port;
[0032] 4-Sensor;
[0033] 41- High-pressure PT sensor;
[0034] 42- low pressure PT sensor;
[0035] 43-temperature sensor;
[0036] 5-Wire harness;
[0037] 6- Bracket;
[0038] 61-connection hole;
[0039] 62-Buffer. DETAILED DESCRIPTION
[0040] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0041] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0042] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.
[0043] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.
[0044] like Figures 1 to 3 As shown, an embodiment of the present application provides a thermal management integrated module, including a flow channel plate 1, a valve component 2 and a heat exchanger 3. The flow channel plate 1 has a flow channel 11, which is a recessed area or groove provided in the flow channel plate 1, and the liquid refrigerant can flow inside the flow channel 11. The flow channel plate 1 can be provided with a plurality of flow channels 11 and a flow route of the flow channel 11 according to actual needs. The flow channel plate 1 is provided with a mounting hole 12, which is interconnected with the flow channel 11, and the mounting hole 12 is used to connect other pipelines or install other components. The mounting hole 12 can be used to install the valve component 2, which can control the flow rate of the liquid in the flow channel 11 or control the opening or closing of the flow channel 11. Multiple valve components 2 can be provided to cooperate with different flow channels 11 respectively, so as to realize separate control of multiple flow channels 11 respectively. The heat exchanger 3 is a device for realizing heat transfer. The heat exchanger 3 has multiple flow ports 31. The flow ports 31 are connected to the flow channel plate 1, so that the liquid refrigerant flowing in the flow channel 11 can enter the heat exchanger 3 and flow to realize the heat transfer function. The thermal management integrated module can be equipped with two heat exchangers 3 to improve efficiency.
[0045] The thermal management integrated module provided in the embodiments of this application is used in a vehicle thermal management system, such as a new energy vehicle, to achieve thermal management of the cabin, thermal management of the power battery, and cooling of the motor and electronic control system. Compared to existing thermal management systems that use various pipes to connect various components, the thermal integrated management modules provided in this application can be interconnected via a flow channel plate 1, thereby simplifying the structure of the thermal integrated management module, reducing its size, and simplifying its assembly.
[0046] The shape of the flow channel 11 in the flow channel plate 1 needs to take into account the position of the components connected to the flow channel plate 1. The longer the flow path of the flow channel 11, the more energy loss the refrigerant loses during the flow process, which will reduce the working efficiency of the thermal management integrated module. At least one valve member 2 provided in the embodiment of the present application is arranged along the height direction of the thermal management integrated module corresponding to the flow port 31, such as Figure 1As shown, the vertical direction Z in the figure is the height direction of the thermal management integrated module, as shown in FIG. Figure 3 As shown, the corresponding arrangement means that the connection position of the valve component 2 to the flow channel 11 and the flow port 31 are on the same straight line in the height direction of the thermal management integrated module, or are approximately on the same straight line in the height direction of the thermal management integrated module. It can also be understood that the projections of the valve component 2 and the flow port 31 in the height direction of the thermal management system overlap or partially overlap with each other, thereby shortening the length of the flow channel 11 connecting the valve component 2 and the flow port 31, shortening the path of the flow channel 11, reducing the energy loss of the refrigerant during the flow process, simplifying the structure of the flow channel 11, and improving the working efficiency of the thermal management integrated module. The valve component 2 is installed in the mounting hole 12, so it is necessary to set at least one mounting hole 12 corresponding to the flow port 31 along the height direction of the thermal management integrated module to meet the positional relationship between the valve component 2 and the flow port 31.
[0047] In one possible embodiment, the valve component 2 includes a battery electronic expansion valve 21 and a heating valve 22, the flow channel plate 1 includes multiple mounting holes 12, the battery electronic expansion valve 21 and the heating valve 22 are respectively installed in different mounting holes 12, the heat exchanger 3 has multiple flow ports 31, and the battery electronic expansion valve 21 and the heating valve 22 respectively correspond to the positions of different flow ports 31 along the height direction of the thermal management integrated module.
[0048] The battery electronic expansion valve 21 is used to control the refrigerant flow of the battery cooler. The flow channel plate 1 is provided with a mounting hole 12 corresponding to the flow port 31 along the height direction of the thermal management integrated module. The battery electronic expansion valve 21 is installed in the mounting hole 12. Therefore, the electronic expansion valve can be set directly above the flow port 31, so that the battery electronic expansion valve 21 and the heat exchanger 3 can be connected through a shorter flow channel 11, which facilitates the control of the refrigerant flow of the battery cooler and can reduce the energy loss of the refrigerant during the flow process. The heating valve 22 is used to control the switching of the heat pump heating mode. The mounting hole 12 that cooperates with the heating valve 22 corresponds to the position of the flow port 31 along the height direction of the thermal management integrated module. It can also reduce the energy loss during the flow of the refrigerant through a similar principle to the battery electronic expansion valve 21. The thermal management integrated module provided in the embodiment of the present application can be provided with multiple valve components 2 according to actual needs. For example, the electronic expansion valve can be set to connect to the water tank heat exchanger at the front of the vehicle, and the electronic expansion valve can be set to connect to the air conditioner heat exchanger, etc.
[0049] In a possible implementation, the inner wall of the flow channel 11 is arc-shaped.
[0050] In order to meet the installation and setting requirements of different components, the path of the flow channel 11 is usually set to a curved shape, and the inner wall of the part of the flow channel 11 that needs to be bent can be set to a smooth arc for transition, or when multiple flow channels 11 are connected to each other, the structure of the connection position is set to an arc surface connection. The arc or arc surface structure can reduce the resistance encountered by the refrigerant when flowing in the flow channel 11, which is beneficial to improving the working efficiency of the thermal management integrated module. During processing, the arc structure of the flow channel 11 can be processed on the flow channel plate 1 by milling or the like, or the inner wall of the flow channel 11 can be processed into an arc surface. The specific processing method is not limited here.
[0051] In one possible embodiment, the flow channel plate 1 includes an upper flow channel plate and a lower flow channel plate, which are stacked along the height direction of the thermal management integrated module. A flow channel 11 is provided on the side of the upper flow channel plate close to the lower flow channel plate, and a mounting hole 12 is provided on the side of the upper flow channel plate away from the lower flow channel plate.
[0052] The thickness of the upper flow plate is relatively large, and the structural strength of the upper flow plate is relatively high. A large number of parts can be set on the upper flow plate, and it is convenient to process the flow channel 11 on the upper flow plate. The processing method can be through drilling or milling and other processing methods. As long as the flow channel 11 can be processed on the surface of the upper flow plate, there is no limitation here. The thickness of the lower flow plate is relatively small, which is convenient for reducing the overall weight of the flow plate 1. Specifically, the flow channel 11 is located on the side of the upper flow plate close to the lower flow plate. The upper flow plate and the lower flow plate are overlapped along the height direction of the thermal management integrated module. The lower flow plate and the upper flow plate are connected to each other to enclose a relatively closed flow channel 11, so that the refrigerant in the flow channel 11 can only flow out through preset positions such as the preset mounting holes 12 in the flow channel 11, ensuring that the flow channel 11 has good sealing. A connection opening can be preset on the side of the lower flow plate close to the heat exchanger 3, and the connection opening can be used to connect to the flow port 31.
[0053] In a possible embodiment, the lower flow channel plate has a mounting portion that protrudes toward the upper flow channel plate. The upper flow channel plate has a positioning groove, and the mounting portion can extend into the positioning groove.
[0054] The mounting portion can be configured as a cylindrical boss or a conical boss, and the positioning groove can be configured as a stepped hole, a conical hole, or a groove. When the upper and lower runner plates are positioned and installed, the mounting portion can extend into the positioning groove, thereby positioning the upper and lower runner plates, facilitating accurate positioning of the two when connected. The lower runner plate can be provided with multiple mounting portions, and the upper runner plate can be provided with corresponding multiple positioning grooves, which can further improve the accuracy of the positioning and installation of the two. The positions of the mounting portion and the positioning groove can be interchanged according to actual needs, for example, the upper runner plate can be provided with a mounting portion, and the lower runner plate can be provided with a positioning groove.
[0055] In a possible implementation, the thermal management integrated module includes a sensor 4 , which is mounted on the flow channel plate 1 and is used to detect the pressure or temperature of the refrigerant in the flow channel 11 .
[0056] The sensor 4 can be installed on the upper flow channel plate, which has a larger thickness and higher strength, and is suitable for installing components. The sensor 4 can be installed in the mounting hole 12 of the flow channel plate 1 or other preset mounting structures. The sensor 4 is used to monitor the pressure or temperature of the refrigerant in the sensing channel 11, and then control the switch state of the valve component 2 according to the monitored data, so that different channels 11 can be opened or closed independently, which facilitates the more intelligent operation of the thermal management integrated module. The valve component 2 may include a low-pressure PT sensor 42, a high-pressure PT sensor 41 and a temperature sensor 43, wherein the low-pressure PT sensor 42 is used to sense the temperature and pressure of the refrigerant at the battery cooler outlet, the high-pressure PT sensor 41 is used to sense the temperature and pressure of the refrigerant at the indoor condenser outlet, and the temperature sensor 43 is used to sense the refrigerant temperature at the outdoor heat exchanger outlet. Setting sensors 4 with different functions according to actual needs can achieve more accurate monitoring of the refrigerant status, which is convenient for adjusting the thermal management integrated module to work more efficiently.
[0057] In one possible embodiment, the thermal management integrated module includes a wiring harness 5, one end of which is connected to the valve component 2 and the other end is connected to the vehicle wiring harness 5. The wiring harness 5 is used to connect the electronic components of the thermal management integrated module and can realize power supply or data transmission of the electronic components on the thermal management integrated module through the wiring harness 5.
[0058] In a possible implementation, the thermal management integrated module includes a bracket 6 , which is mounted on a side wall of the flow channel plate 1 , and is used to be connected to the vehicle body.
[0059] Bracket 6 is used to mount the thermal management integrated module on the vehicle body. Bracket 6 can be connected to the upper runner plate. The upper runner plate is thicker, thus providing greater structural strength. This allows for a stable connection between the upper runner plate and bracket 6, further ensuring the thermal management integrated module is stably mounted on the vehicle body via bracket 6. Specifically, bracket 6 can be connected to the side wall or bottom wall of the upper runner plate.
[0060] In a possible embodiment, the bracket 6 has a connecting hole 61 , and the connecting hole 61 is provided with a buffer 62 .
[0061] According to actual needs, brackets 6 can be provided on both sides of the flow channel plate 1, so that both sides of the thermal management integrated module can be connected to the vehicle body respectively, thereby improving the stability of the installation of the thermal management integrated module. The connecting hole 61 is used to set a connecting piece, such as a bolt, etc., and the bracket 6 is connected to the vehicle body through the connecting piece. The inner wall of the connecting hole 61 is provided with a buffer 62, and the buffer 62 has elasticity. For example, the material of the buffer 62 can be rubber or silicone. The buffer 62 can be set in a ring shape and snap-fitted into the connecting hole 61. The connecting piece needs to pass through the buffer 62 when it is installed. When the vehicle vibrates during driving, the buffer 62 can play a buffering effect, reduce the vibration of the thermal management integrated module, and improve its installation stability. In order to achieve a stable connection between the bracket 6 and the vehicle body, the bracket 6 set on both sides of the flow channel plate 1 is provided with at least three connecting holes 61, so that three installation points can be provided to achieve the connection between the bracket 6 and the vehicle body.
[0062] In one possible embodiment, the valve component 2 includes an evaporator electronic expansion valve 23, an outdoor heat exchanger 3 electronic expansion valve 24 and a one-way valve 25. The evaporator electronic expansion valve 23 is used to control the evaporator refrigerant flow rate, the outdoor heat exchanger 3 electronic expansion valve 24 is used to control the refrigerant flow rate of the outdoor heat exchanger 3, and the one-way valve 25 is used to control the one-way flow of the refrigerant to prevent the refrigerant from flowing back, such as preventing the water tank heat exchanger 3 at the front of the vehicle from flowing back. The thermal management integrated module provided in the embodiment of the present application can be provided with valve components 2 with different functions according to actual needs, and the position of the valve component 2 can be set at a suitable position of the flow channel plate 1 to achieve different control functions. The valve component 2 and the heat exchanger 3 can be set as close as possible to shorten the distance of the flow channel 11, which is conducive to improving the working efficiency of the thermal management integrated module.
[0063] An embodiment of the present application provides a thermal management integrated module, which includes a flow channel plate 1, a valve component 2 and a heat exchanger 3. The flow channel plate 1 has a flow channel 11, and the flow channel plate 1 has a mounting hole 12. The mounting hole 12 is connected to the flow channel 11, and the mounting hole 12 is used to install the valve component 2. The heat exchanger 3 has a flow port 31, and the flow port 31 is connected to the flow channel 11. At least one valve component 2 is arranged corresponding to the flow port 31 along the height direction of the thermal management integrated module, thereby shortening the length of the flow path, reducing capacity loss, and improving the efficiency of the thermal management integrated module.
[0064] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present application.
Claims
1. A thermal management integrated module, characterized in that: The thermal management integrated module includes a flow channel plate, a valve component and a heat exchanger. The flow channel plate has a flow channel and a mounting hole. The mounting hole is connected to the flow channel. The mounting hole is used to install the valve component. The heat exchanger has a flow port, which is connected to the flow channel. At least one of the valve components is arranged corresponding to the flow port along the height direction of the thermal management integrated module.
2. The thermal management integrated module according to claim 1, characterized in that: The valve component includes a battery electronic expansion valve and a heating valve, the flow channel plate includes a plurality of mounting holes, the electronic expansion valve and the heating valve are respectively installed in the mounting holes, the heat exchanger has a plurality of flow ports, and the electronic expansion valve and the heating valve correspond to the positions of different flow ports along the height direction of the thermal management integrated module.
3. The thermal management integrated module according to claim 1, characterized in that: The inner wall of the flow channel is arc-shaped.
4. The thermal management integrated module according to claim 1, characterized in that: The flow channel plate includes an upper flow channel plate and a lower flow channel plate, and the upper flow channel plate and the lower flow channel plate are stacked along the height direction of the thermal management integrated module. The flow channel is provided on the side of the upper flow channel plate close to the lower flow channel plate, and the mounting hole is provided on the side of the upper flow channel plate away from the lower flow channel plate.
5. The thermal management integrated module according to claim 4, characterized in that: The lower flow channel plate has a mounting portion, and the mounting portion protrudes in a direction close to the upper flow channel plate. The upper flow channel plate has a positioning groove, and the mounting portion can extend into the positioning groove.
6. The thermal management integrated module according to claim 1, characterized in that: The thermal management integrated module includes a sensor, which is installed on the flow channel plate and is used to detect the pressure or temperature of the refrigerant in the flow channel.
7. The thermal management integrated module according to claim 1, characterized in that: The thermal management integrated module includes a wiring harness, one end of which is connected to the valve component, and the other end of which is connected to the vehicle wiring harness.
8. The thermal management integrated module according to claim 1, characterized in that: The thermal management integrated module includes a bracket, which is mounted on a side wall of the flow channel plate and is used to be connected to a vehicle body.
9. The thermal management integrated module according to claim 8, characterized in that: The bracket has a connecting hole, and the connecting hole is provided with a buffer piece.
10. The thermal management integrated module according to any one of claims 1 to 9, characterized in that: The valve components include an evaporator electronic expansion valve, an outdoor heat exchanger electronic expansion valve and a one-way valve. The evaporator electronic expansion valve is used to control the evaporator refrigerant flow rate, the outdoor heat exchanger electronic expansion valve is used to control the outdoor heat exchanger refrigerant flow rate, and the one-way valve is used to control the one-way flow of the refrigerant.