Drawing type damping microarray chip detection kit
By designing a pull-out shock-absorbing microarray chip detection kit and using sponge connections and slide rail structures to achieve shock absorption and refrigeration, the problems of fragility and temperature control of traditional test kits are solved, and transportation stability and detection accuracy are improved.
Patent Information
- Application Number
- CN202421634137.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-11
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-07-11
AI Technical Summary
Traditional test kits are fragile during transportation, microarray chips are inconvenient to access, and difficult to keep at low temperatures, which affects detection accuracy.
A pull-out shock-absorbing microarray chip detection kit was designed. The kit consists of a box body and a lid, with a cooling box and a multi-layer microarray chip placement layer inside. Shock absorption and refrigeration are achieved through sponge connection. The slide rail is easy to pull out, and the cold air from the ice bag is conducted through the sponge to maintain a constant temperature.
The stability and practicality of the microarray chip are improved, damage during transportation is reduced, and the accuracy and convenience of detection are ensured.
Smart Images
Figure CN223315597U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of reagent kits, and in particular relates to a pull-out type shock-absorbing microarray chip detection reagent kit. Background Art
[0002] Microarray chip technology, as an advanced biological detection technology, has the advantages of high throughput, parallel processing, and high sensitivity. It can be used to detect the expression of disease-related genes, providing an important basis for early diagnosis and personalized treatment of diseases, and has broad development prospects.
[0003] However, during the use of microarray chips, detection kits are often used to facilitate their storage and transportation. However, conventional detection kits, with the cartridge and reagents typically formed as a single, integrated structure, make it difficult to remove the microarray chip all at once. Furthermore, the microarray chip is easily damaged and broken by vibration, thus compromising the safety of the kit. Furthermore, during room-temperature genetic testing, the reagents cannot be kept cool during removal, affecting the accuracy of microarray detection.
[0004] Therefore, it is necessary to provide a pull-out type shock-absorbing microarray chip detection kit to solve the above problems. Summary of the Invention
[0005] In order to solve the above technical problems existing in the prior art, the utility model provides a pull-out shock-absorbing microarray chip detection kit, which solves the technical problems of the kit being easily broken by vibration during transportation, inconvenient insertion, and difficult temperature control.
[0006] The technical solution adopted in this utility model is:
[0007] A pull-out shock-absorbing microarray chip detection kit comprises a kit body, wherein the kit body comprises a box body (1) and a box cover (2) covering the box body (1), and is characterized in that a cooling box (5) and several mutually parallel microarray chip placement layers (4) are sequentially arranged inside the box body (1) from bottom to top, the front side of the box body (1) is open, and the several layers of the microarray chip placement layers (4) and the cooling box (5) can be pulled out from the front side opening;
[0008] Adjacent microarray chip placement layers (4) and the microarray chip placement layer (4) and the cooling box (5) are connected via sponges;
[0009] The upper portion of the cooling box (5) is open, and an ice bag is built into the cooling box (5). Cold air emitted by the ice bag is conducted upward from the bottom through the hollow area inside the sponge, thereby achieving a refrigeration and heat preservation effect on the microarray chip.
[0010] Furthermore, the microarray chip placement layer (4) comprises, from top to bottom, a sponge shock-absorbing layer (6), a dense sponge board (7), and a sponge drawer bottom; the sponge shock-absorbing layer (6) is provided with a rectangular parallelepiped protrusion, the dense sponge board (7) is provided with a rectangular parallelepiped groove, and the microarray chip is placed in the rectangular groove; the rectangular parallelepiped protrusion is clamped in the rectangular parallelepiped groove to achieve connection between the sponge shock-absorbing layer (6) and the dense sponge board (7).
[0011] Furthermore, the dense sponge board (7) is provided with five 40×10×6 mm rectangular grooves from left to right, and the rectangular grooves are spaced 10 mm apart from each other, the leftmost rectangular groove (901) is spaced 15 mm apart from the left end of the dense sponge board (7), and the rightmost rectangular groove (905) is spaced 15 mm apart from the right side of the dense sponge board (7), and each rectangular groove is provided for inserting a chip.
[0012] Furthermore, the sponge shock-absorbing layer (6) is provided with five 40×10×2 mm rectangular parallelepiped protrusions from left to right, and the rectangular parallelepiped protrusions correspond to the rectangular parallelepiped grooves one by one and are tightly engaged, thereby achieving a shock-absorbing and protective effect on the built-in microarray chip.
[0013] Furthermore, slide rails (11) are respectively provided on the inner sides of the left and right sides of the box body (1), and convex grooves (12) are respectively provided on the outer side walls of the left and right sides of the microarray chip placement layer (4) and the cooling box (5), and the slide rails (11) are slidably matched with the convex grooves (12).
[0014] Furthermore, the box body (1) is provided with a card slot (3), and the box cover (2) is provided with a card tongue that engages with the card slot (3).
[0015] Furthermore, the front of the microarray chip placement layer (4) and the cooling box (5) are both provided with handles (13) to facilitate the microarray chip placement layer (4) and the cooling box (5) to be pulled forward.
[0016] Compared with the prior art, the beneficial effects of the present invention are embodied in:
[0017] (1) The utility model fixes the dense sponge board equipped with the microarray chip through the mutual cooperation among the closing cover of the reagent box shell, the sponge shock-absorbing layer, the dense sponge board, and the sponge drawer bottom, thereby playing a multiple protection role and reducing bumps. In addition, the provided slide rail can facilitate the pulling out of the chip placement layer, making it more convenient and quick to take and put the microarray chip, thereby improving the practicality of the reagent box.
[0018] (2) The present invention provides a cooling box on the bottom inner layer of the test kit housing that can be pulled forward by a slide rail. The upper portion of the cooling box is open and is used to place an ice pack. The microarray chip in the test kit needs to be refrigerated and stored, but needs to be taken out during specific applications. By adding an ice pack to the cooling box, the cold air emitted by the ice will pass through the dense sponge board, the sponge shock-absorbing layer and the internal grid structure of the sponge drawer bottom and enter the upper layer from bottom to top, thereby cooling the stored microarray chip to achieve the effect of temporarily maintaining a constant temperature. The cooling box can be reused, saving space, and improving the stability of the microarray chip and the practicality of the test kit. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional diagram of the present utility model.
[0020] Figure 2 This is a diagram of the internal structure of the present invention (the cooling box is drawn out and the box cover is opened).
[0021] Figure 3 This is a schematic diagram of the structure of the sponge shock-absorbing layer of the microarray chip placement layer of the utility model.
[0022] Figure 4 This is a schematic diagram of the structure of the dense sponge board for placing the microarray chip of the utility model.
[0023] Explanation of the accompanying reference numerals: 1. box body; 2. box cover; 3. card slot; 4. microarray chip placement layer; 5. cooling box; 6. sponge shock-absorbing layer; 7. dense sponge board; 8. sponge drawer bottom; 901-905, rectangular parallelepiped grooves; 1001-1005, rectangular parallelepiped protrusions; 11. slide rail; 12. protruding groove; 13. handle. DETAILED DESCRIPTION
[0024] The following describes the specific implementation of the embodiment of the present invention in detail with reference to the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the embodiment of the present invention and is not intended to limit the embodiment of the present invention.
[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.
[0026] The present invention will be described in detail below with reference to the accompanying drawings and in combination with exemplary embodiments.
[0027] refer to Figures 1 to 4The utility model discloses a pull-out shock-absorbing microarray chip detection kit, comprising a kit body, the kit body comprising a box body 1 and a box cover 2 covering the box body 1, the box body 1 being provided with a cooling box 5 and several mutually parallel microarray chip placement layers 4 in order from bottom to top, the front side of the box body 1 being open, and the several layers of the microarray chip placement layers 4 and the cooling box 5 being removable from the front side opening;
[0028] Adjacent microarray chip placement layers 4 and between the microarray chip placement layers 4 and the cooling box 5 are connected by sponges, which play a multiple protection role and reduce bumps;
[0029] The upper portion of the cooling box 5 is open, and an ice pack is built into the cooling box 5. The cold air emitted by the ice pack is conducted upward from the bottom through the hollow area inside the sponge, thereby lowering the internal temperature of the test kit, thereby cooling the stored microarray chip and achieving the effect of temporarily maintaining a constant temperature. The box can be reused, saving space, and improving the stability and practicality of the microarray chip.
[0030] Specifically, the microarray chip placement layer 4 is provided with two layers.
[0031] In one embodiment, the microarray chip placement layer 4 includes a sponge shock-absorbing layer 6, a dense sponge board 7 and a sponge drawer bottom from top to bottom; the sponge shock-absorbing layer 6 is provided with a rectangular protrusion, and the dense sponge board 7 is provided with a rectangular groove, and the microarray chip is placed in the rectangular groove; the rectangular protrusion is clamped in the rectangular groove to achieve the connection between the sponge shock-absorbing layer 6 and the dense sponge board 7.
[0032] Specifically, the sponge shock-absorbing layer 6, the dense sponge board 7 and the sponge drawer bottom 8 are all grid structures, which facilitates the cold air from the ice pack in the cooling box 5 to be transmitted to the entire test kit body.
[0033] In one embodiment, five 40×10×6 mm rectangular grooves 901, 902, 903, 904, and 905 are provided on the dense sponge board 7 from left to right, and the rectangular grooves are spaced 10 mm apart from each other. The leftmost rectangular groove 901 is 15 mm away from the left end of the dense sponge board 7, and the rightmost rectangular groove 905 is 15 mm away from the right side of the dense sponge board 7. Each rectangular groove is for inserting chips.
[0034] The sponge shock-absorbing layer 6 is provided with five 40×10×2 mm rectangular protrusions 1001, 1002, 1003, 1004, 1005 from left to right. The rectangular protrusions correspond to the rectangular grooves one by one and are tightly engaged, achieving shock-absorbing protection for the built-in microarray chip.
[0035] In one embodiment, slide rails (11) are provided on the inner sides of the left and right sides of the box body 1, and convex grooves 12 are provided on the outer walls of the left and right sides of the microarray chip placement layer 4 and the cooling box 5, respectively, and the slide rails 11 are slidably matched with the convex grooves 12.
[0036] Specifically, the slide rail 11 can facilitate the sliding of the microarray chip placement layer 4 and the cooling box 5, making it more convenient and quick to take and place the microarray chip, thereby improving the practicality of the test kit.
[0037] In one embodiment, a card slot 3 is provided on the box body 1 , and a card tongue that engages with the card slot 3 is provided on the box cover 2 .
[0038] In one embodiment, a handle 13 is provided on the front of the microarray chip placement layer 4 and the cooling box 5 to facilitate pulling the microarray chip placement layer 4 and the cooling box 5 forward.
[0039] The working principle of the pull-out type shock-absorbing microarray chip detection kit provided by the utility model is as follows:
[0040] During use, the handle 13 is pulled to pull out the microarray chip placement layer 4 through the cooperation of the handle 13 and the slide rail 11, the sponge cushioning layer 6 inside the microarray chip placement layer 4 is unfolded, the microarray chip is placed in the corresponding position on the dense sponge board 7, and the sponge cushioning layer 6 is tightly fastened to the dense sponge board 7. After fastening, the microarray chip placement layer 4 is pushed into the box body through the cooperation of the handle 13 and the slide rail 11. The microarray chip can be stored in a refrigerator at low temperature.
[0041] To use the microarray chip, first pull out the cooling box 5 using the handle 13 in conjunction with the slide rails 11, add an ice pack to maintain a low temperature throughout the entire process. Pull the handle 13 and pull out the chip placement layer 4 using the handle 13 in conjunction with the slide rails 11. Open the sponge cushioning layer 6 inside the microarray chip placement layer 4 to access the microarray chip.
[0042] During transportation, the sponge shock-absorbing layer 6, the dense sponge board 7, and the sponge drawer bottom 8 provide a buffering and protective effect on the microarray chip, reducing the impact of shock on the microarray chip, thereby preventing damage to the microarray chip and unnecessary losses. Simultaneously, the cooling box 5 also protects the microarray chip. During the removal of the test kit for testing, the cold air released by the cooling box 5 can keep the microarray chip at a low temperature, thereby reducing the impact of temperature changes on the microarray chip during the process of removal.
[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.
[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0045] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0046] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0047] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.
[0048] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.
Claims
1. A pull-out shock-absorbing microarray chip detection kit, comprising a kit body, wherein the kit body comprises a box body (1) and a box cover (2) covering the box body (1), characterized in that: The box body (1) is provided with a cooling box (5) and several mutually parallel microarray chip placement layers (4) in sequence from bottom to top. The front side of the box body (1) is open, and the several layers of the microarray chip placement layers (4) and the cooling box (5) can be drawn out from the front side opening. Adjacent microarray chip placement layers (4) and the microarray chip placement layer (4) and the cooling box (5) are connected via sponges; The upper portion of the cooling box (5) is open, and an ice bag is built into the cooling box (5). Cold air emitted by the ice bag is conducted upward from the bottom through the hollow area inside the sponge, thereby achieving a refrigeration and heat preservation effect on the microarray chip.
2. The pull-out type shock-absorbing microarray chip detection kit according to claim 1, characterized in that: The microarray chip placement layer (4) comprises, from top to bottom, a sponge shock-absorbing layer (6), a dense sponge board (7), and a sponge drawer bottom; the sponge shock-absorbing layer (6) is provided with a rectangular parallelepiped protrusion, the dense sponge board (7) is provided with a rectangular parallelepiped groove, and the microarray chip is placed in the rectangular parallelepiped groove; the rectangular parallelepiped protrusion is clamped in the rectangular parallelepiped groove to achieve connection between the sponge shock-absorbing layer (6) and the dense sponge board (7).
3. The pull-out type shock-absorbing microarray chip detection kit according to claim 2, characterized in that: The dense sponge board (7) is provided with five 40×10×6 mm rectangular grooves from left to right, and the rectangular grooves are spaced 10 mm apart from each other. The leftmost rectangular groove (901) is spaced 15 mm apart from the left end of the dense sponge board (7), and the rightmost rectangular groove (905) is spaced 15 mm apart from the right end of the dense sponge board (7). Each rectangular groove is for inserting a chip.
4. The pull-out type shock-absorbing microarray chip detection kit according to claim 3, characterized in that: The sponge shock-absorbing layer (6) is provided with five 40×10×2 mm rectangular protrusions from left to right. The rectangular protrusions correspond to the rectangular grooves one by one and are tightly joined, thereby achieving a shock-absorbing protection effect on the built-in microarray chip.
5. The pull-out type shock-absorbing microarray chip detection kit according to claim 1, characterized in that: Slide rails (11) are respectively provided on the inner sides of the left and right sides of the box body (1), and convex grooves (12) are respectively provided on the outer walls of the left and right sides of the microarray chip placement layer (4) and the cooling box (5), and the slide rails (11) are slidably matched with the convex grooves (12).
6. The pull-out type shock-absorbing microarray chip detection kit according to claim 1, characterized in that: The box body (1) is provided with a card slot (3), and the box cover (2) is provided with a card tongue that engages with the card slot (3).
7. The pull-out type shock-absorbing microarray chip detection kit according to claim 1, characterized in that: The front of the microarray chip placement layer (4) and the cooling box (5) are both provided with handles (13) to facilitate pulling the microarray chip placement layer (4) and the cooling box (5) forward.