Laminated semiconductor refrigeration pressure head

Abstract

The utility model provides a laminated semiconductor refrigeration pressing head which comprises a shell assembly, a refrigeration assembly is arranged at the bottom of the shell assembly, and the refrigeration assembly comprises a heat dissipation water tank, a water inlet pipe, a water outlet pipe, a heat conduction plate, heat dissipation fins, a sealing ring, a first semiconductor refrigeration sheet, a second semiconductor refrigeration sheet, a wire, a pressing plate and a pressing block. One side of the heat dissipation water tank communicates with a water inlet pipe, one side of the heat dissipation water tank communicates with a water outlet pipe, the bottom of the heat dissipation water tank is detachably and fixedly connected with a heat conduction plate, and the top of the heat conduction plate is evenly and fixedly connected with heat dissipation fins. According to the utility model, refrigeration is carried out by adopting a mode of superposing the two semiconductor refrigeration sheets, the structure is compact, the installation space is saved, the maximization of the whole refrigeration effect is realized by accurately controlling the power input of the refrigeration sheets, the refrigeration area and the refrigeration capacity are obviously improved, a lower temperature can be reached in a shorter time, and the refrigeration efficiency is improved. And the method is suitable for low-temperature application scenarios below-55 DEG C.

Description

Technical Field

[0001] The utility model relates to a pressure head, in particular to a laminated semiconductor refrigeration pressure head, belonging to the technical field of semiconductor pressure heads. Background Art

[0002] A semiconductor cooling head is a highly efficient refrigeration device based on semiconductor refrigeration technology, utilizing the Peltier effect for rapid cooling. Its compact structure, high cooling efficiency, and quiet, vibration-free operation make it ideal for semiconductor chip testing. Temperature control is crucial in chip testing, and semiconductor cooling heads enable precise temperature control, ensuring a stable, low-temperature environment for chip testing, thereby improving test accuracy and reliability.

[0003] The mainstream semiconductor cooling heads currently on the market rely primarily on a single-layer cooling plate or a combination of multiple single-layer cooling plates to achieve cooling. However, when the cooling demand reaches -50°C or lower, this single-layer cooling plate design is generally unable to meet the higher cooling requirements. To this end, a stacked semiconductor cooling head is proposed. Utility Model Content

[0004] In view of this, the present invention provides a laminated semiconductor refrigeration pressure head to solve or alleviate one of the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is achieved as follows: a laminated semiconductor refrigeration pressure head, including a shell assembly, a refrigeration assembly is provided at the bottom of the shell assembly, and the refrigeration assembly includes a heat dissipation water tank, a water inlet pipe, a water outlet pipe, a heat conduction plate, a heat dissipation fin, a sealing ring, a first semiconductor refrigeration sheet, a second semiconductor refrigeration sheet, a wire, a pressure plate and a pressure block;

[0006] The heat dissipation device is connected to the heat dissipation device by a threading device, and the heat dissipation device is connected to the heat dissipation device by a threading device, and the heat dissipation device is connected to the heat dissipation device by a threading device. The heat dissipation device is connected to the heat dissipation device by a threading device, and the heat dissipation device is connected to the heat dissipation device by a threading device.

[0007] Further preferably: the housing assembly includes a top plate and an outer housing;

[0008] The bottom of the top plate is fixedly connected with the outer shell.

[0009] Further preferably, a wiring hole is opened on one side of the outer shell.

[0010] Further preferably, the top plate is slidably connected to the outer side wall of the guide rod.

[0011] Further preferably, the outer side wall of the guide rod is provided with a spring.

[0012] Further preferably, the inner side wall of the top plate is provided with fixing bolts.

[0013] Further preferably, the fixing bolt is threadedly connected to a nut, and the nut is fixedly connected to the top of the inner shell.

[0014] Further preferably, the heat dissipation water tank is fixedly connected to the inner wall of the inner shell.

[0015] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0016] This utility model uses two semiconductor refrigeration plates stacked together for cooling, which has a compact structure and saves installation space. By precisely controlling the power input of the refrigeration plates, the overall cooling effect is maximized, which significantly improves the cooling area and cooling capacity, and can reach lower temperatures in a shorter time. It is suitable for low-temperature application scenarios below -55°C.

[0017] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 It is a structural diagram of the utility model;

[0020] Figure 2 This is a structural diagram of the inner shell of the utility model;

[0021] Figure 3 This is a structural diagram of the refrigeration component of the present utility model;

[0022] Figure 4 This is a structural diagram of the heat conducting plate of the present utility model;

[0023] Figure 5 This is a structural diagram of the first and second semiconductor refrigeration plates of the present utility model;

[0024] Figure 6 This is a structural diagram of the briquetting of the present utility model.

[0025] Figure numerals: 10, shell assembly; 11, top plate; 12, outer shell; 13, wiring hole; 14, guide rod; 15, spring; 16, inner shell; 17, fixing bolt; 18, nut; 20, refrigeration assembly; 21, heat sink; 22, water inlet pipe; 23, water outlet pipe; 24, heat conduction plate; 25, heat sink fin; 26, sealing ring; 27, first semiconductor refrigeration plate; 28, second semiconductor refrigeration plate; 29, wire; 210, pressure plate; 211, pressure block. DETAILED DESCRIPTION

[0026] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0027] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] like Figures 1-6 As shown, the embodiment of the present invention provides a laminated semiconductor refrigeration pressure head, including a housing assembly 10, a refrigeration assembly 20 is provided at the bottom of the housing assembly 10, and the refrigeration assembly 20 includes a heat dissipation water tank 21, a water inlet pipe 22, a water outlet pipe 23, a heat conducting plate 24, a heat dissipation fin 25, a sealing ring 26, a first semiconductor refrigeration sheet 27, a second semiconductor refrigeration sheet 28, a wire 29, a pressing plate 210 and a pressing block 211;

[0029] One side of the heat dissipation water tank 21 is connected to a water inlet pipe 22, and one side of the heat dissipation water tank 21 is connected to a water outlet pipe 23. The bottom of the heat dissipation water tank 21 is detachably fixedly connected to a heat conducting plate 24, and the top of the heat conducting plate 24 is evenly fixedly connected to a heat dissipation fin 25. A sealing ring 26 is provided between the heat dissipation water tank 21 and the heat conducting plate 24. A first semiconductor refrigeration sheet 27 is installed at the bottom of the heat conducting plate 24, and a second semiconductor refrigeration sheet 28 is installed at the bottom of the first semiconductor refrigeration sheet 27. A wire 29 is provided on one side of the first semiconductor refrigeration sheet 27 and the second semiconductor refrigeration sheet 28. The bottom of the heat conducting plate 24 is detachably fixedly connected to a pressure plate 210, and the pressure plate 210 is provided at The bottom of the second semiconductor refrigeration plate 28 and the bottom of the pressure plate 210 are fixedly connected with a pressure block 211. The water inlet pipe 22 and the water outlet pipe 23 are connected to the cooling water circulation system. Refrigeration is performed by superimposing the first semiconductor refrigeration plate 27 and the second semiconductor refrigeration plate 28. By precisely controlling the power input of the refrigeration plate, the overall cooling effect is maximized, and the cooling area and cooling capacity are significantly improved. It is suitable for low-temperature application scenarios below -55°C. The cold amount is transferred through the pressure plate 210 and the pressure block 211, thereby reducing the pressure head temperature. The heat is transferred through the heat conduction plate 24 and the heat dissipation fins 25, and this part of the heat is sent out through circulating cooling water.

[0030] In this embodiment, specifically: the housing assembly 10 includes a top plate 11 and an outer housing 12;

[0031] The bottom of the top plate 11 is fixedly connected to an outer shell 12 , which is formed by combining four side plates for easy installation and disassembly.

[0032] In this embodiment, specifically: a wiring hole 13 is opened on one side of the outer shell 12, and the wiring hole 13 can facilitate the wire 29 to pass through.

[0033] In this embodiment, specifically: the top plate 11 is slidably connected to the outer wall of the guide rod 14. When the pressure head is in use, the guide rod 14 is fixed on the base to guide the movement of the top plate 11.

[0034] In this embodiment, specifically: a spring 15 is provided on the outer wall of the guide rod 14. During the pressing process of the pressure head, the pressure block 211 is squeezed, pushing the top plate 11 to move along the guide rod 14. After the pressure head is released, the spring 15 drives the top plate 11 to return to its original position.

[0035] In this embodiment, specifically: a fixing bolt 17 is provided on the inner side wall of the top plate 11 , and the fixing bolt 17 passes through the bottom of the top plate 11 .

[0036] In this embodiment, specifically: the fixing bolt 17 is threadedly connected to the nut 18, and the nut 18 is fixedly connected to the top of the inner shell 16. The two parts of the shell are fixed together through the cooperation between the fixing bolt 17 and the nut 18.

[0037] In this embodiment, specifically: the heat dissipation water tank 21 is fixedly connected to the inner wall of the inner shell 16 , and the inner shell 16 is used to protect the heat dissipation water tank 21 to prevent the heat dissipation water tank 21 from being damaged by collision.

[0038] When the utility model is working: the water inlet pipe 22 and the water outlet pipe 23 are connected to the cooling water circulation system, and cooling is performed by superimposing the first semiconductor refrigeration plate 27 and the second semiconductor refrigeration plate 28. The structure is compact and the installation space is saved. By accurately controlling the power input of the refrigeration plate, the overall cooling effect is maximized, so that the cooling area and cooling capacity are significantly improved, and a lower temperature can be reached in a shorter time. It is suitable for low-temperature application scenarios below -55°C. The cold amount is transferred through the pressure plate 210 and the pressure block 211, thereby reducing the pressure head temperature. The heat is transferred through the heat conduction plate 24 and the heat dissipation fins 25, and this part of the heat is sent out through the circulating cooling water, so that the semiconductor refrigeration plate continues to cool.

[0039] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection of the claims.

Claims

1. A laminated semiconductor refrigeration pressure head, comprising a housing assembly (10), characterized in that: A refrigeration assembly (20) is provided at the bottom of the housing assembly (10), and the refrigeration assembly (20) comprises a heat dissipation water tank (21), a water inlet pipe (22), a water outlet pipe (23), a heat conducting plate (24), heat dissipation fins (25), a sealing ring (26), a first semiconductor refrigeration sheet (27), a second semiconductor refrigeration sheet (28), a wire (29), a pressing plate (210), and a pressing block (211); One side of the heat dissipation water tank (21) is connected to a water inlet pipe (22), and one side of the heat dissipation water tank (21) is connected to a water outlet pipe (23). The bottom of the heat dissipation water tank (21) is detachably fixedly connected to a heat conduction plate (24). The top of the heat conduction plate (24) is evenly fixedly connected to a heat dissipation fin (25). A sealing ring (26) is provided between the heat dissipation water tank (21) and the heat conduction plate (24). A first semiconductor refrigeration plate (27) is installed at the bottom of the heat conduction plate (24). A second semiconductor refrigeration plate (28) is installed at the bottom of the first semiconductor refrigeration plate (27). One side of the first semiconductor refrigeration plate (27) and the second semiconductor refrigeration plate (28) is provided with a wire (29). The bottom of the heat conduction plate (24) is detachably fixedly connected to a pressure plate (210). The pressure plate (210) is provided at the bottom of the second semiconductor refrigeration plate (28). The bottom of the pressure plate (210) is fixedly connected to a pressure block (211).

2. The laminated semiconductor refrigeration pressure head according to claim 1, characterized in that: The housing assembly (10) comprises a top plate (11) and an outer housing (12); The bottom of the top plate (11) is fixedly connected to an outer shell (12).

3. The laminated semiconductor refrigeration pressure head according to claim 2, characterized in that: A wiring hole (13) is provided on one side of the outer shell (12).

4. The laminated semiconductor refrigeration head according to claim 2, characterized in that: The top plate (11) is slidably connected to the outer side wall of the guide rod (14).

5. The laminated semiconductor refrigeration pressure head according to claim 4, characterized in that: The outer side wall of the guide rod (14) is sleeved with a spring (15).

6. The laminated semiconductor refrigeration head according to claim 4, characterized in that: The inner side wall of the top plate (11) is provided with fixing bolts (17).

7. The laminated semiconductor refrigeration pressure head according to claim 6, characterized in that: The fixing bolt (17) is threadedly connected to the nut (18), and the nut (18) is fixedly connected to the top of the inner shell (16).

8. The laminated semiconductor refrigeration pressure head according to claim 7, characterized in that: The heat dissipation water tank (21) is fixedly connected to the inner side wall of the inner shell (16).

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