Wafer vertical defect detection device

Abstract

The utility model relates to a wafer vertical defect detection device. The wafer vertical defect detection device comprises an equipment framework, a wafer detection assembly and a wafer bearing and overturning assembly, the wafer detection assembly comprises a straightness retesting device and a detection guide driving part, and the detection guide driving part is used for driving the straightness retesting device to perform vertical reciprocating motion detection on a wafer; the wafer bearing and overturning assembly comprises a wafer bearing adsorption frame and overturning guide driving parts, and the overturning guide driving parts are in linkage with each other and drive the wafer bearing adsorption frame to complete switching between a wafer horizontal feeding state and a vertical detection state and between a front face detection state and a back face detection state and drive the wafer to conduct horizontal reciprocating motion detection. Automatic detection of defects on the front and back surfaces of the wafer is realized, so that the detection efficiency is improved; meanwhile, wafer vertical state detection is adopted, so that interference factors caused by middle concave due to gravity in a wafer horizontal detection state are eliminated, and the accuracy of a detection result is ensured.

Description

Technical Field

[0001] The utility model relates to a wafer detection device, and more particularly to a wafer vertical defect detection device. Background Art

[0002] In the wafer manufacturing process, wafer defect detection is a crucial step. Existing wafer inspection devices have some limitations in the wafer inspection process, mainly including the following aspects:

[0003] First, existing wafer inspection equipment places the wafer horizontally for inspection, causing the backside of the wafer to contact the inspection platform, making defects on the backside difficult to detect.

[0004] Second, when conventional wafer inspection equipment performs horizontal inspection, the center of thinner wafers tends to sag, causing the wafer to warp and affecting the accuracy of the inspection results.

[0005] Third, existing wafer inspection equipment often requires manual flipping during inspection, which is time-consuming and labor-intensive.

[0006] Fourth, existing wafer inspection devices usually adopt a clamping fixation method, which can easily cause damage to the wafer due to uneven force.

[0007] Therefore, it is necessary to improve the wafer inspection device. Utility Model Content

[0008] In order to solve at least one of the above technical problems, the present invention provides a wafer vertical defect detection device, which can realize vertical detection and automatic flipping, thereby improving detection efficiency and further improving the accuracy of detection results.

[0009] The device for detecting vertical defects of a wafer comprises:

[0010] The equipment frame includes a base and columns, and the columns are arranged on the base;

[0011] A wafer inspection assembly, comprising a straightness re-measurement device, an inspection guide drive component, and an adapter frame. The inspection guide drive component is disposed on the vertical surface of the column. The straightness re-measurement device is disposed on the inspection guide drive component via the adapter frame and is driven by the inspection guide drive component to perform vertical reciprocating motion in the Z direction along the inspection guide drive component. The straightness re-measurement device includes an imaging module.

[0012] The wafer carrying and flipping assembly is mounted on the base. The wafer carrying and flipping assembly includes a wafer carrying adsorption frame and a flipping guide drive component. The wafer carrying adsorption frame is ring-shaped. The flipping guide drive component includes a circular direct-drive motor θ axis, a circular direct-drive motor T axis, a direct-drive motor X axis, and a direct-drive motor Y axis. The direct-drive motor Y axis is arranged on the base. The direct-drive motor X axis is arranged on the direct-drive motor Y axis and is driven by the direct-drive motor Y axis to perform horizontal reciprocating motion along the direct-drive motor Y axis in the Y direction. The circular direct-drive motor T axis is arranged on the direct-drive motor X axis and is driven by the direct-drive motor X axis to perform horizontal reciprocating motion along the direct-drive motor X axis in the X direction. The circular direct-drive motor θ axis is mounted on the circular direct-drive motor T axis and is driven by the circular direct-drive motor T axis to perform horizontal rotational motion along the circular direct-drive motor T axis. The wafer carrying adsorption frame is connected to the circular direct-drive motor θ axis and is driven by the circular direct-drive motor θ axis to perform vertical rotational motion around the circular direct-drive motor θ axis.

[0013] In some embodiments, the horizontal rotation angle of the circular direct drive motor T axis is 180 degrees, and the vertical rotation angle of the circular direct drive motor θ axis is 90 degrees.

[0014] In some embodiments, the straightness remeasurement device is further provided with a Y-direction fine-tuning device, a first mounting plate and a second mounting plate. The Y-direction fine-tuning device is fixed to the adapter frame through the second mounting plate, and is connected to the imaging module through the first mounting plate. The Y-direction fine-tuning device is used to drive the imaging module to perform Y-direction horizontal reciprocating motion along the Y-direction fine-tuning device.

[0015] In some embodiments, the Y-axis fine-tuning device is a manually adjustable slide, comprising a first screw rod, a first slide rail and a first slider; the first slider is arranged on the first slide rail, and the thread on the first screw rod matches the thread on the first slider, so that the rotation of the first screw rod drives the first slider and the first slide rail to slide relative to each other; the first slide rail and the first slider are respectively connected to the first mounting plate and the second mounting plate, or the first slider and the first slide rail are respectively connected to the first mounting plate and the second mounting plate.

[0016] In some embodiments, the base and columns are made of marble.

[0017] In some embodiments, the adapter bracket is L-shaped.

[0018] In some embodiments, the adapter frame is rectangular.

[0019] In some embodiments, the wafer support adsorption rack adopts vacuum adsorption, and a surface thereof in contact with an edge of the wafer without detection units is provided with vacuum adsorption holes.

[0020] In some embodiments, the vacuum adsorption holes are evenly distributed.

[0021] In some embodiments, the detection guide drive component is a direct drive motor Z axis.

[0022] Compared with the existing technology, the beneficial effects of the present invention are reflected in: the present invention adopts vertical state detection, that is, the wafer carrying adsorption frame performs vertical rotation around the circular direct-drive motor Θ axis to realize the conversion of the wafer from a horizontal state to a vertical state, thereby avoiding the situation where the middle of the wafer is sunken due to gravity during detection, and the wafer carrying adsorption frame of the present invention adopts a ring design, so that the detection result of the wafer's test position will not be disturbed by the existence of the wafer carrying adsorption frame, thereby improving the accuracy of the detection result. At the same time, the utility model adopts one-time loading to meet the automatic detection of the front and back sides of the wafer, that is, the wafer carrying adsorption frame is driven by the circular direct-drive motor T axis through the connection of the circular direct-drive motor Θ axis, so that the wafer carrying adsorption frame makes horizontal rotation along the direct-drive motor T axis, so that the wafer is converted from the front state to the back state. At the same time, the wafer carrying adsorption frame is driven by the direct-drive motor Y axis to make horizontal reciprocating motion along the direct-drive motor Y axis through the mutual connection of the circular direct-drive motor Θ axis, the circular direct-drive motor T axis, the direct-drive motor X axis, and the direct-drive motor Y axis, thereby automatically adjusting the detection distance between the wafer carrying adsorption frame and the straightness retest device, and entering the detection state after the adjustment is completed, that is, the wafer carrying adsorption frame is driven by the direct-drive motor X axis to make horizontal reciprocating motion along the direct-drive motor X axis, and the detection guide drive component drives the straightness retest device to make vertical reciprocating motion along the Z axis, thereby performing all-round automatic detection of the wafer, thereby improving the detection efficiency.

[0023] In addition, in some embodiments of the present invention, the Y-axis fine-tuning device added to the straightness re-measurement device enables further manual and precise fine-tuning of the detection distance, thereby improving the accuracy of the detection results.

[0024] Furthermore, in some embodiments of the present invention, the wafer is fixed by vacuum adsorption, which applies force evenly and does not damage the wafer, thereby improving the safety of the detection process.

[0025] The concept, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a wafer vertical defect detection device according to the first embodiment of the present invention.

[0027] Figure 2 for Figure 1 The diagram shows the action of switching from wafer loading state to inspection state.

[0028] Figure 3 for Figure 1 The schematic diagram of wafer inspection action is shown.

[0029] Figure 4 for Figure 1 The diagram shows the action of switching from wafer front-side inspection to back-side inspection.

[0030] Figure 5 for Figure 1 The structural schematic diagram of the straightness re-measurement device shown.

[0031] Reference numerals:

[0032] 1-Equipment skeleton, 11-Base, 12-Column, 2-Wafer detection assembly, 21-Straightness re-measurement device, 22-Detection guide drive component, 23-Adapter frame, 211-First mounting plate, 212-Imaging module, 213-Y-axis fine-tuning device, 214-Second mounting plate, 2131-First screw rod, 2132-First slide rail, 2133-First slider, 3-Wafer carrying and flipping assembly, 31-Wafer carrying adsorption frame, 32-Flipping guide drive component, 321-Circular direct drive motor θ axis, 322-Circular direct drive motor T axis, 323-Direct drive motor X axis; 324-Direct drive motor Y axis. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects of the utility model easier to understand, the utility model is further described below with reference to specific figures. However, the utility model is not limited to the following implementation cases.

[0034] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification so that people familiar with this technology can understand and read them. They are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in this utility model without affecting the effects and purposes that can be achieved by the present utility model.

[0035] Terms such as “comprise” and “include” indicate that in addition to the components directly and clearly stated in the specification and claims, the technical solution of the present invention does not exclude the situation where it has other components that are not directly or clearly stated.

[0036] In addition, the terms "first" and "second" are used only for descriptive purposes to distinguish one entity or operation from another entity or operation, and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or any such actual relationship or order between these entities or operations. For any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature shown or implied in the drawings, the present invention still allows for any combination or deletion between these technical features (or their equivalents) without any technical obstacles, and thus it should be considered that these more embodiments according to the present invention are also within the scope of the description herein.

[0037] The utility model provides a wafer vertical defect detection device, which is mainly used to solve the problems of the existing wafer detection device using horizontal detection resulting in inaccurate detection data, manual flip detection resulting in low detection efficiency, and the use of clamping fixation method that easily causes wafer damage, and provides the following technical solutions, which will be combined with Figure 1-Figure 5 Give detailed instructions:

[0038] Example 1

[0039] Figure 1 FIG2 shows the structure of the wafer vertical defect detection device disclosed in this embodiment. In this embodiment, the wafer vertical defect detection device includes an equipment frame 1, a wafer detection component 2, and a wafer supporting and flipping component 3.

[0040] Among them, the equipment skeleton 1 includes a base 11 and a column 12, the column 12 is set on the base 11, and the wafer detection component 2 includes a straightness re-measurement device 21, a detection guide drive component 22 (in this embodiment, the detection guide drive component 22 is a direct drive motor Z axis) and an adapter frame 23. The straightness re-measurement device 21 is used to detect defects in the wafer. The detection guide drive component 22 is set on the vertical surface of the column 12. The detection guide drive component 22 is connected to the straightness re-measurement device 21 through the adapter frame 23. Therefore, the straightness re-measurement device 21 is driven by the detection guide drive component 22 to make vertical reciprocating motion along the detection guide drive component 22 in the Z direction, thereby realizing the detection of the vertical direction of the wafer. Reference Figure 5The straightness remeasurement device 21 includes, sequentially connected from top to bottom, a second mounting plate 214, a Y-axis fine-tuning device 213, a first mounting plate 211, and an imaging module 212. The Y-axis fine-tuning device 213 is a manually adjustable slide comprising a first screw rod 2131, a first slide rail 2132, and a first slider 2133. The first slider 2133 is mounted on the first slide rail 2132. The threads on the first screw rod 2131 match those on the first slider 2133, allowing the rotation of the first screw rod 2131 to drive the first slider 2133 and the first slide rail 2132 to slide relative to each other. The first slide rail 2132 and the first slider 2133 are connected to the second mounting plate 214 and the first mounting plate 211, respectively. Driven by the Y-axis fine-tuning device 213, the imaging module 212 performs horizontal reciprocating Y-axis motion along the Y-axis fine-tuning device. Because the Y-axis fine-tuning device is manually adjusted, the wafer detection distance is further adjusted to the optimal value. The wafer carrying and flipping assembly 3 includes a wafer carrying adsorption frame 31 and a flipping guide driving component 32, wherein the flipping guide driving component 32 includes a circular direct drive motor θ axis 321, a circular direct drive motor T axis 322, a direct drive motor X axis 323, and a direct drive motor Y axis 324. The direct drive motor Y axis 324 is arranged on the base 11, and the direct drive motor Y axis 324 is provided with a direct drive motor X axis 323. The direct drive motor X axis 323 is driven by the direct drive motor Y axis 324 to make a Y-direction horizontal reciprocating motion along the direct drive motor Y axis 324. The direct drive motor X axis 323 is provided with a circular direct drive motor T axis 322, and the circular direct drive motor The drive motor T axis 322 is driven by the direct drive motor X axis 323 to make horizontal reciprocating motion along the X direction of the direct drive motor X axis 323. A circular direct drive motor θ axis 321 is provided on the circular direct drive motor T axis 322. The circular direct drive motor θ axis 321 is driven by the circular direct drive motor T axis 322 to make horizontal rotation motion along the circular direct drive motor T axis 322. That is, the circular direct drive motor T axis uses its axis center as a fixed point and rotates horizontally around its axis center to drive the wafer carrying adsorption frame 31 to rotate, thereby converting the wafer from the front state to the back state. Therefore, the horizontal rotation angle of the circular direct drive motor T axis 322 is 180 degrees. The circular direct-drive motor Θ shaft 321 is connected to the wafer carrying adsorption frame 31, and the wafer carrying adsorption frame 31 relies on the circular direct-drive motor Θ shaft 321 to make vertical rotation movement around the circular direct-drive motor Θ shaft 321, that is, the circular direct-drive motor Θ shaft 321 takes its axis as the fixed point, and rotates in the vertical direction around its axis, thereby driving the wafer carrying adsorption frame 31 to rotate to realize the conversion of the wafer between the horizontal state and the vertical state, so the vertical rotation angle of the circular direct-drive motor Θ shaft 321 is 90 degrees.Since there is no detection unit at the edge of the wafer, the wafer carrying adsorption frame 31 is designed to be ring-shaped, that is, the middle part is hollow, so that when the back of the wafer is inspected, the detection result will not be disturbed by the physical obstruction of the wafer carrying adsorption frame 31, thereby ensuring the accuracy of the detection result. At the same time, a vacuum adsorption hole is provided on the wafer carrying adsorption frame 31, and the vacuum adsorption hole is in contact with the edge of the wafer without the detection unit. The wafer is thereby adsorbed on the surface of the wafer carrying adsorption frame 31. The vacuum adsorption holes are evenly distributed on the surface of the wafer carrying adsorption frame, so that the wafer is evenly stressed and will not be damaged, thereby ensuring the safety of the detection process.

[0041] refer to Figure 2 In the initial state, the wafer is placed on the upper part of the wafer carrying adsorption rack 31. The wafer carrying adsorption rack 31 extracts the air from the contact part between the wafer and the wafer carrying adsorption rack 31 through the vacuum adsorption holes on it to form a negative pressure state to fix the wafer. Since there is no detection unit on the edge of the wafer, this fixing method will not affect the accuracy of the detection result. After the loading is completed, the circular direct-drive motor θ axis 321 and the direct-drive motor Y axis 324 are linked, that is, the circular direct-drive motor θ axis 321 drives the wafer carrying adsorption frame 31 thereon to flip from a horizontal state to a vertical state. At the same time, the direct-drive motor Y axis 324 drives the sequentially connected direct-drive motor X axis 323, the circular direct-drive motor T axis 322, the circular direct-drive motor θ axis 321, and the wafer carrying adsorption frame 31 to make Y-direction horizontal movement to adjust the detection distance between the wafer carrying adsorption frame 31 and the imaging module 212 to a suitable position, and then, by rotating the Y-direction fine-tuning device 213, the imaging module 212 connected to the first mounting plate 211 is driven to make Y-direction horizontal movement to further adjust the detection distance of the wafer to the optimal position.

[0042] refer to Figure 3 During the front detection, the direct drive motor X-axis 323 is linked with the detection guide drive component 22, that is, the direct drive motor X-axis 323 drives the circular direct drive motor T-axis 322, the circular direct drive motor θ-axis 321, and the wafer carrying adsorption frame 31 connected in sequence to perform horizontal reciprocating motion in the X direction (such as Figure 3 The horizontal reciprocating arrow in the middle) changes the relative position of the wafer support adsorption frame 31 and the imaging module 212 in the X direction, and the detection guide drive component 22 drives the straightness re-measurement device 21 to perform vertical reciprocating motion in the Z direction (as shown in FIG. Figure 3 The imaging module 212 and the wafer support frame 31 are moved relative to each other in the Z direction (as indicated by the vertical reciprocating arrows in the middle) to change the relative position of the imaging module 212 and the wafer support frame 31 in the Z direction, so that the front side of the wafer can be inspected in all directions by the imaging module 212.

[0043] refer to Figure 4After the front detection is completed, the direct drive motor Y axis 324 and the circular direct drive motor T axis 322 are linked, that is, the circular direct drive motor T axis 322 drives the wafer support adsorption frame 31 to rotate 180 degrees horizontally (such as Figure 4 As shown by the arc arrow in the middle left figure, it can also rotate in the opposite direction of the arc arrow), thereby converting the front side of the wafer to the back side. At the same time, the direct drive motor Y axis 324 drives the direct drive motor X axis 323, the circular direct drive motor T axis 322, the circular direct drive motor θ axis 321, and the wafer carrying adsorption frame 31 connected in sequence to make a Y-axis horizontal reciprocating motion (as shown in the middle left figure). Figure 4 As shown by the straight arrow in the middle left figure, horizontal movement in the opposite direction of the straight arrow can also be performed) to adjust the detection distance between the wafer support adsorption frame 31 and the imaging module 212 to a suitable position, and then, by rotating the Y-direction fine-tuning device 213 to drive the imaging module 212 to perform Y-direction horizontal reciprocating movement along the Y-direction fine-tuning device to further adjust the detection distance to the optimal position. At this point, the wafer is switched from the front side to the back side and enters the detection state.

[0044] refer to Figure 3 After the inspection state is switched to the back side, the direct-drive motor X-axis 323 and the inspection guide drive component 22 are linked. Specifically, the direct-drive motor X-axis 323 drives the circular direct-drive motor T-axis 322, the circular direct-drive motor θ-axis 321, and the wafer carrier 31 to perform horizontal reciprocating motion in the X direction to change the relative position of the wafer carrier 31 and the imaging module 212 in the X direction. The inspection guide drive component 22 drives the straightness re-measurement device 21 to perform vertical reciprocating motion in the Z direction along the inspection guide drive component 22 to change the relative position of the imaging module 212 and the wafer carrier 31 in the Z direction, allowing the back side of the wafer to receive all-round inspection by the imaging module. After the inspection is completed, each device is reset to its initial state, the wafer is removed, the next wafer is placed in, and the above steps are repeated.

[0045] Example 2

[0046] In this embodiment, the straightness re-measurement device does not include the first mounting plate, the second mounting plate and the Y-axis fine-tuning device, and the rest is the same as in the first embodiment.

[0047] Example 3

[0048] In this embodiment, the wafer fixing method of the wafer carrying adsorption rack is magnetic fixing, and the rest is the same as that of the first embodiment.

[0049] Example 4

[0050] In this embodiment, the adapter frame is an L-shaped structure, one section of which is connected to the detection guide drive component, and the other section is connected to the straightness re-measurement device. The rest is the same as in embodiment 1.

[0051] Example 5

[0052] In this embodiment, the adapter frame is a rectangular structure, one section of which is connected to the detection guide drive component, and the other section is connected to the straightness re-measurement device. The rest is the same as in embodiment 1.

[0053] Example 6

[0054] In this embodiment, the base and the columns are made of marble, and the rest is the same as in embodiment 1.

[0055] Example 7

[0056] In this embodiment, the first sliding block and the first sliding rail are connected to the second mounting plate and the first mounting plate respectively, and the rest is the same as in Embodiment 1.

[0057] The above describes in detail the preferred embodiments of the present invention. It should be understood that a person skilled in the art can make numerous modifications and variations based on the concepts of the present invention without inventive effort. Therefore, any technical solution that can be derived by a person skilled in the art based on the concepts of the present invention through logical analysis, reasoning, or limited experimentation based on the existing technology shall be within the scope of protection defined by the claims.

Claims

1. A wafer vertical defect detection device, characterized in that: include: An equipment frame (1) comprises a base (11) and a column (12), wherein the column (12) is arranged on the base (11); A wafer inspection assembly (2) comprising a straightness re-measurement device (21), a detection guide drive component (22) and an adapter frame (23), wherein the detection guide drive component (22) is arranged on the vertical surface of the column (12), the straightness re-measurement device (21) is arranged on the detection guide drive component (22) through the adapter frame (23) and is driven by the detection guide drive component (22) to perform vertical reciprocating motion in the Z direction along the detection guide drive component (22), and the straightness re-measurement device (21) comprises an imaging module (212); A wafer carrying and flipping assembly (3) is mounted on the base (11). The wafer carrying and flipping assembly (3) comprises a wafer carrying adsorption frame (31) and a flipping guide driving component (32). The wafer carrying adsorption frame (31) is annular. The flipping guide driving component (32) comprises a circular direct drive motor θ axis (321), a circular direct drive motor T axis (322), a direct drive motor X axis (323), and a direct drive motor Y axis (324). The direct drive motor Y axis (324) is arranged on the base (11). The direct drive motor X axis (323) is arranged on the direct drive motor Y axis (324) and is driven by the direct drive motor Y axis (324) to rotate along the direct drive motor Y axis (3 24) performs horizontal reciprocating motion in the Y direction, the circular direct drive motor T axis (322) is arranged on the direct drive motor X axis (323) and is driven by the direct drive motor X axis (323) to perform horizontal reciprocating motion in the X direction along the direct drive motor X axis (323), the circular direct drive motor θ axis (321) is mounted on the circular direct drive motor T axis (322) and is driven by the circular direct drive motor T axis (322) to perform horizontal rotational motion along the circular direct drive motor T axis (322), and the wafer carrying adsorption frame (31) is connected to the circular direct drive motor θ axis (321) and is driven by the circular direct drive motor θ axis (321) to perform vertical rotational motion around the circular direct drive motor θ axis (321).

2. The wafer vertical defect detection device according to claim 1, characterized in that: The horizontal rotation angle of the circular direct-drive motor T axis (322) is 180 degrees, and the vertical rotation angle of the circular direct-drive motor θ axis (321) is 90 degrees.

3. The wafer vertical defect detection device according to claim 1, characterized in that: The straightness re-measurement device (21) is further provided with a Y-direction fine-tuning device (213), a first mounting plate (211) and a second mounting plate (214); the Y-direction fine-tuning device (213) is fixed to the adapter frame (23) via the second mounting plate (214), and is connected to the imaging module (212) via the first mounting plate (211); the Y-direction fine-tuning device (213) is used to drive the imaging module (212) to perform Y-direction horizontal reciprocating motion along the Y-direction fine-tuning device (213).

4. The wafer vertical defect detection device according to claim 3, characterized in that: The Y-axis fine-tuning device (213) is a manually adjustable slide, comprising a first screw rod (2131), a first slide rail (2132) and a first slider (2133); the first slider (2133) is arranged on the first slide rail (2132), and the thread on the first screw rod (2131) matches the thread on the first slider (2133) so that the first slider (2133) and the first slide rail (2132) are driven to slide relative to each other by the rotation of the first screw rod (2131); the first slide rail (2132) and the first slider (2133) are respectively connected to the first mounting plate (211) and the second mounting plate (214), or the first slider (2133) and the first slide rail (2132) are respectively connected to the first mounting plate (211) and the second mounting plate (214).

5. The wafer vertical defect detection device according to claim 1, characterized in that: The adapter frame (23) is L-shaped.

6. The wafer vertical defect detection device according to claim 1, characterized in that: The adapter frame (23) is rectangular.

7. The wafer vertical defect detection device according to claim 1, characterized in that: The base (11) and the column (12) are made of marble.

8. The wafer vertical defect detection device according to claim 1, characterized in that: The wafer carrying adsorption rack (31) is vacuum adsorbed, and a surface of the wafer carrying adsorption rack (31) in contact with an edge of the wafer without a detection unit is provided with a vacuum adsorption hole.

9. The wafer vertical defect detection device according to claim 8, characterized in that: The vacuum adsorption holes are evenly distributed.

10. The wafer vertical defect detection device according to claim 1, characterized in that: The detection guide driving component (22) is a direct drive motor Z axis.

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