Sensor structure of infrared thermometer

Abstract

The utility model discloses an infrared thermodetector sensor structure, which is applied to a thermodetector and comprises a thermopile sensor and a heating sheet. The thermopile sensor is arranged in a shell of the thermodetector, the thermopile sensor comprises a body and a pin, one end of the pin is connected with the body, the other end of the pin is arranged on a circuit board in the thermodetector, the heating sheet is arranged on the pin in a sleeving manner and is attached to the body, and the thermopile sensor is arranged on the thermodetector. And the heating sheet is electrically connected with the circuit board. Through the application of the thermopile sensor, the ambient temperature sensed by the thermopile sensor can be maintained in a stable range, the temperature measurement accuracy can be greatly improved when the ambient temperature is in the stable range according to the infrared temperature measurement principle, and compared with the prior art, a copper sleeve is omitted, so that various problems caused by the copper sleeve are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of thermometers, in particular to a sensor structure of an infrared thermometer. Background Art

[0002] Infrared thermometers use a thermopile infrared sensor for infrared temperature measurement. The core components are a thermopile and a thermistor. The thermopile's infrared heat-sensitive material absorbs infrared radiation from the target object, generating heat and increasing its own temperature. The thermocouple generates a voltage based on the temperature difference between its two ends. A large number of thermocouples are connected in series to produce a voltage output. This voltage signal is amplified and converted from analog to digital before being input to the MCU. The temperature difference ΔT between the target object and the ambient temperature is calculated or looked up in a table. The thermistor measures the temperature of the sensor package, i.e., the temperature of the cold contact. Specifically, the MCU collects the resistance of the thermistor and determines the ambient temperature Tamb by looking up the temperature-resistance table. The target temperature (the temperature of the target object) is the weighted sum of ΔT and Tamb.

[0003] Thermopile sensors are the core components of infrared thermometers / thermometers. Their function is to sense infrared radiation emitted by objects and convert it into electrical signals. The presence of ambient temperature inevitably affects the sensor temperature, leading to temperature measurement errors. When the ambient temperature rises, the sensor temperature also rises, resulting in an inaccurate temperature reading. Conversely, when the ambient temperature decreases, the sensor temperature decreases, resulting in an inaccurate temperature reading. Therefore, there is a close correlation between ambient temperature and sensor temperature, and temperature compensation is necessary to mitigate this environmental influence. Infrared radiation from an object's surface not only contains the object's own radiant energy but is also affected by the ambient temperature. This ambient temperature interferes with the infrared radiation emitted by the object's surface, affecting the accuracy of the temperature measurement. The effective surface temperature measured by a thermal radiation infrared thermometer is affected by the ambient temperature.

[0004] Currently, infrared thermometers on the market lack a clear technical solution to reduce the impact of ambient temperature. If the impact of ambient temperature still exists, the use of infrared thermometers will be more restricted, such as needing to stand in a similar ambient temperature for at least half an hour before use. Otherwise, the temperature measurement results may vary greatly, and there may even be a risk of delayed treatment. Figure 1 and Figure 2 ( Figure 1 This is a schematic diagram of the structure of a traditional thermometer. Figure 2 yes Figure 1As shown in the partial structural diagram of the device, in current infrared thermometer designs, a copper sleeve 5' is placed over the thermopile sensor 1' to quickly transmit the ambient temperature, enabling the thermopile sensor 1' to quickly sense the ambient temperature. However, the use of the copper sleeve 5' results in uneven or loose contact if structural or surface interference between the thermopile sensor 1' and the copper sleeve 5' causes significant error in the temperature transmitted from the copper sleeve 5' to the thermopile sensor 1', affecting the measured temperature. Furthermore, structural interference between the copper sleeve 5' and the thermopile sensor 1' can also cause sensor damage due to manufacturing issues during assembly.

[0005] Therefore, there is an urgent need to find a new design of infrared thermometer that can resist the interference of ambient temperature. Utility Model Content

[0006] In view of the above problems existing in the prior art, an infrared thermometer sensor structure is provided.

[0007] The specific technical solutions are as follows:

[0008] An infrared thermometer sensor structure is used in a thermometer; it mainly includes a thermopile sensor and a heating element;

[0009] The thermopile sensor is installed in the housing of the thermometer. The thermopile sensor includes a body and a pin. One end of the pin is connected to the body, and the other end of the pin is installed on the circuit board in the thermometer. The heating plate is sleeved on the pin and is arranged in contact with the body. The heating plate is electrically connected to the circuit board.

[0010] The above-mentioned infrared thermometer sensor structure also has such a feature that the heating element is electrically connected to the circuit board through a pin structure or a patch structure.

[0011] The above-mentioned infrared thermometer sensor structure also has such a feature that a heat-conducting material is provided between the body and the heating plate.

[0012] The above-mentioned infrared thermometer sensor structure also has such a feature that the thermal conductive material is one of thermal grease, thermal silicone pad, thermal adhesive, thermal filling adhesive or thermal silica gel.

[0013] The above-mentioned infrared thermometer sensor structure also has the feature that the diameter of the heating plate is larger than the diameter of the body.

[0014] The above-mentioned infrared thermometer sensor structure also has the feature that the heating element is a ceramic heating element.

[0015] The positive effects of the above technical solution are:

[0016] The utility model provides an infrared thermometer sensor structure, in which a thermopile sensor is arranged on a heating plate. The heat generated by the heating plate will be transferred to the thermopile sensor with extremely high transfer efficiency, so as to control the heating temperature range of the heating plate. The ambient temperature sensed by the thermopile sensor will be maintained in a stable range. According to the infrared temperature measurement principle, the accuracy of temperature measurement will be greatly improved if the ambient temperature is in a stable range. At the same time, compared with the existing technology, the copper sleeve is eliminated, thereby avoiding various problems caused by the copper sleeve. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of a traditional thermometer;

[0018] Figure 2 for Figure 1 Schematic diagram of the local structure;

[0019] Figure 3 This is a structural diagram of a thermometer of the present invention;

[0020] Figure 4 for Figure 3 Schematic diagram of the local structure.

[0021] In the accompanying drawings: 100, thermometer; 101, housing; 102, circuit board; 1, thermopile sensor; 11, body; 12, pin; 2, heating element; 1', thermopile sensor; 5', copper sleeve. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present utility model, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0024] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0025] See also Figure 3 and Figure 4 , showing a preferred embodiment, the utility model discloses an infrared thermometer sensor structure, which is applied to a thermometer 100, wherein the specific structure of the thermometer 100 is not described here in detail, the infrared thermometer sensor structure includes: a thermopile sensor 1 and a heating plate 2;

[0026] The thermopile sensor 1 is installed in the housing 101 of the thermometer 100. The thermopile sensor 1 includes a body 11 and a pin 12. One end of the pin 12 is connected to the body 11, and the other end of the pin 12 is installed on the circuit board 102 in the thermometer 100. The heating plate 2 is sleeved on the pin 12 and is arranged in contact with the body 11. The heating plate 2 is electrically connected to the circuit board 102.

[0027] The infrared thermometer sensor structure provided by the present invention is that the MCU of the circuit board 102 of the thermometer 100 controls the heating of the heating plate 2. The heat generated by the heating plate 2 will be transferred to the thermopile sensor 1 with extremely high transfer efficiency, controlling the heating temperature range of the heating plate 2. The ambient temperature sensed by the thermopile sensor 1 will be maintained in a stable range. It can be seen from the infrared temperature measurement principle that the ambient temperature in a stable range will greatly improve the accuracy of temperature measurement. Compared with the prior art, the copper sleeve is eliminated, avoiding various problems caused by the copper sleeve. The infrared thermometer sensor structure provided by the present invention assumes that the temperature range error of the heating plate 2 can be set to plus or minus 2 degrees Celsius, and the error of the final target temperature can reach plus or minus 0.1 degrees Celsius. This is only an example to illustrate the beneficial effects of the infrared thermometer sensor structure and is not used to limit the present invention.

[0028] Optionally, as a preferred embodiment, the heating sheet 2 is electrically connected to the circuit board 102 via a pin structure or a patch structure. The pin structure can refer to the pin 12 of the thermopile sensor 1 and is not described here. The patch structure can be a flexible metal sheet or a flexible circuit board, and the patch structure can be a Z-shaped sheet structure. One end of the patch structure is welded to the circuit board 102, and the other end of the patch structure is electrically connected to the heating sheet 2.

[0029] Preferably, a heat-conducting material is provided between the body 11 and the heating sheet 2. Optionally, the heat-conducting material can be one of thermal grease, thermal pad, thermal glue, thermal filling glue or thermal silica gel.

[0030] Optionally, the diameter of the heating sheet 2 is larger than the diameter of the body 11 .

[0031] Optionally, the heating element 2 is a ceramic heating element, wherein the heating element 2 can be controlled by the circuit board 102 to reach a preset temperature range.

[0032] Optionally, in this embodiment, the thermopile sensor 1 and the heating plate 2 are bonded together by thermally conductive silicone grease.

[0033] The infrared thermometer sensor structure provided by the present invention can generate a stable heat source by controlling the heating plate 2 through the circuit board 102, and does not need to rely on the high-precision temperature sensor (thermistor) of the thermopile sensor 1 to sense the ambient temperature. For manufacturers, realizing this function can obtain a wider range of sensor sources.

[0034] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An infrared thermometer sensor structure, used in a thermometer, characterized in that: include: Thermopile sensor and heating element; The thermopile sensor is installed in the housing of the thermometer. The thermopile sensor includes a body and a pin. One end of the pin is connected to the body, and the other end of the pin is installed on the circuit board in the thermometer. The heating plate is sleeved on the pin and is arranged in contact with the body. The heating plate is electrically connected to the circuit board.

2. The infrared thermometer sensor structure according to claim 1, characterized in that: The heating element is electrically connected to the circuit board via a pin structure or a patch structure.

3. The infrared thermometer sensor structure according to any one of claims 1 and 2, characterized in that: A heat-conducting material is provided between the main body and the heating plate.

4. The infrared thermometer sensor structure according to any one of claims 1 and 2, characterized in that: The diameter of the heating plate is greater than the diameter of the body.

5. The infrared thermometer sensor structure according to any one of claims 1 and 2, characterized in that: The heating element is a ceramic heating element.

Images