Efficient radiator with through grooves

Abstract

The utility model belongs to the technical field of radiators of electronic equipment, and particularly relates to a high-efficiency radiator with through grooves, which comprises a radiator body and a radiating fan, the radiator body comprises a heat conduction base and radiating fins, the radiating fins are integrally formed on the upper surface of the heat conduction base, and the radiating fins are arranged on the upper surface of the heat conduction base. Heat conduction walls and supporting columns are arranged on the upper surface of the heat conduction base, the heat conduction walls are arranged on the two edges of the heat conduction base, connecting bases are arranged at the top ends of the supporting columns, and the cooling fan is fixedly installed on the radiator body through the connecting bases. At least one through groove is formed in the upper surface of the heat conduction base in the direction perpendicular to the heat dissipation fins, and the through groove penetrates through all the heat dissipation fins. The through grooves are formed in the heat-conducting fins and are divided, so that the heat-conducting fins are convenient to clean, meanwhile, the through grooves are communicated with the gaps between the heat-conducting fins, air introduced from a cooling fan rapidly circulates on the radiator, cooling is rapid, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of radiators of electronic equipment, and in particular relates to a high-efficiency radiator with through grooves. Background Art

[0002] Patent publication number CN2594984Y discloses a side-slotted heat sink device, comprising a heat sink body and a cooling fan. The device features air guide slots on both sides of the heat sink body, which is in direct contact with electronic components. This allows the airflow generated by the cooling fan to not only remove heat from the fins but also directly blow it toward the electronic components, dissipating any heat that accumulates around them. This allows heat from all three heat transfer modes to be promptly dissipated.

[0003] The utility model is not easy to clean and the heat dissipation effect is still not ideal, so it is necessary to improve this existing technology. Utility Model Content

[0004] The purpose of the utility model is to provide a high-efficiency radiator with through slots, aiming to solve the technical problems of being difficult to clean and having unsatisfactory heat dissipation in the prior art.

[0005] To achieve the above-mentioned objectives, an embodiment of the present invention provides a high-efficiency radiator with through-slots, comprising a radiator body and a cooling fan, the radiator body comprising a heat-conducting base and heat dissipation fins, the heat-conducting fins being integrally formed on the upper surface of the heat-conducting base, the upper surface of the heat-conducting base being provided with a heat-conducting wall and a support column, the heat-conducting wall being provided at both edges of the heat-conducting base, the top of the support column being provided with a connecting seat, the cooling fan being mounted and fixed on the radiator body through the connecting seat, the upper surface of the heat-conducting base being provided with at least one through-slot perpendicular to the direction of the heat dissipating fins, and the through-slot passing through all the heat dissipating fins.

[0006] Optionally, the heat-conducting wall, the supporting column and the outermost heat dissipation fins form two air-guiding grooves, and the air-guiding grooves are connected to the through groove.

[0007] Optionally, the through slot is communicated with the gap between the heat dissipation fins.

[0008] Optionally, a heat pipe groove is provided on the outer side of the heat-conducting wall.

[0009] Optionally, four support columns are provided, which are respectively located at four corners of the upper surface of the heat-conducting base.

[0010] Optionally, the heat-conducting wall and the supporting column are both higher than the heat dissipating fins.

[0011] Optionally, a groove and a plurality of notches are provided on the lower surface of the heat-conducting base.

[0012] Optionally, the heat-conducting base is further provided with four mounting holes and two positioning columns.

[0013] The above one or more technical solutions in the high-efficiency radiator with through slots provided by the embodiment of the present invention have at least one of the following technical effects: by providing through slots in the thermal fins to divide them, cleaning the thermal fins becomes easy, and at the same time, the through slots are connected to the gaps between the thermal fins, so that the wind introduced from the cooling fan can circulate quickly on the radiator, quickly cool down, and improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0015] Figure 1 A schematic structural diagram of a high-efficiency radiator with through slots provided in an embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of a radiator body according to an embodiment of the present utility model;

[0017] Figure 3 This is a structural schematic diagram of the radiator body from another angle according to an embodiment of the present invention.

[0018] Among them, the reference numerals in the figures are:

[0019] 100. Radiator body; 110. Thermal base; 111. Groove; 112. Notch; 113. Positioning column; 114. Mounting hole; 120. Thermal wall; 121. Thermal pipe groove; 130. Support column; 140. Connecting seat; 150. Through groove; 155. Air guide groove 155; 180. Heat dissipation fins; 200. Cooling fan. DETAILED DESCRIPTION

[0020] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0021] In the description of the embodiments of the present invention, it should be understood that if there are directional indications in the embodiments of the present invention, such as the orientation or position relationship of up, down, left, right, front, back, inside, and outside, which are based on the orientation or position relationship shown in the accompanying drawings, it is only for the convenience of describing the embodiments of the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0023] In the embodiments of the present invention, unless otherwise specified or limited, terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0024] In one embodiment of the present invention, Figures 1 to 3 As shown, a high-efficiency heat sink with a through slot 150 is provided, comprising a heat sink body 100 and a heat dissipation fan 200. The heat sink body 100 comprises a heat-conducting base 110 and heat-dissipating fins 180. The heat-dissipating fins 180 are integrally formed on the upper surface of the heat-conducting base 110. A heat-conducting wall 120 and a support column 130 are provided on the upper surface of the heat-conducting base 110. The heat-conducting wall 120 is provided on both edges of the heat-conducting base 110. Specifically, the heat-conducting wall 120 is provided on the front and rear edges to share the heat dissipation of the heat-dissipating fins 180. However, the location of the heat-conducting wall 120 is not limited to the edge and can be located anywhere on the upper surface of the heat-conducting base 110. A heat-conducting pipe groove 121 is provided on the outer surface of the heat-conducting wall 120 to accommodate a heat pipe.

[0025] A connecting seat 140 is provided at the top of the support column 130 for installing the cooling fan 200. There are four support columns 130, which are respectively located at the four corners of the upper surface of the thermal base 110. It is worth mentioning that the number of support columns 130 is not limited to four, as long as it can stably support the cooling fan 200, two, three, etc. The upper surface of the thermal base 110 is also provided with at least one through groove 150, which vertically passes through all the cooling fins 180.

[0026] The heat-conducting wall 120, the support column 130 and the outermost heat dissipating fins 180 form two air guide grooves 155. In this embodiment, there are two through grooves 150 on the upper surface of the heat-conducting base 110. The two through grooves 150 are connected to and perpendicular to the two air guide grooves 155, and the two form a well shape.

[0027] Preferably, the two through slots 150 are connected to the gap between the heat dissipation fins 180 , so as to facilitate air circulation between the heat dissipation fins 180 .

[0028] Preferably, the heights of the heat conducting wall 120 and the support column 130 are both higher than the heat dissipating fins 180 , so that after the heat dissipating fan 200 is installed, there is still a large gap at the top of the heat dissipating fins 180 , thereby allowing air to circulate at the top of the heat dissipating fins 180 .

[0029] Preferably, the lower surface of the heat-conducting base 110 is provided with a groove 111 and a plurality of notches 112. In this embodiment, the groove 111 is rectangular in shape, which is convenient for fitting with the electronic components that need heat dissipation. The notches 112 are used to insert some heat-conducting sheets to conduct heat to another radiator.

[0030] Preferably, the lower surface of the heat-conducting base 110 is further provided with four mounting holes 114 and two positioning posts 113. The positioning posts 113 are used to guide the electronic device to be inserted for heat dissipation, and the mounting holes 114 are used to screw the heat sink to the electronic device. The number of mounting holes 114 and positioning posts 113 is not limited to that of this embodiment, as long as the installation, fixing and guiding functions are achieved. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high-efficiency radiator with a through slot, comprising a radiator body (100) and a cooling fan (200), wherein the radiator body (100) comprises a heat-conducting base (110) and heat-dissipating fins (180), wherein the heat-dissipating fins (180) are integrally formed on the upper surface of the heat-conducting base (110), and wherein: The upper surface of the heat-conducting base (110) is provided with a heat-conducting wall (120) and a support column (130), the heat-conducting wall (120) is provided on the two edges of the heat-conducting base (110), the top of the support column (130) is provided with a connecting seat (140), the cooling fan (200) is installed and fixed on the radiator body (100) through the connecting seat (140), and the upper surface of the heat-conducting base (110) is perpendicular to the direction of the heat dissipation fins (180) and is provided with at least one through groove (150), and the through groove (150) passes through all the heat dissipation fins (180).

2. The high-efficiency radiator with through grooves according to claim 1, characterized in that: The heat-conducting wall (120), the supporting column (130) and the outermost heat dissipation fins (180) form two air guide grooves (155), and the air guide grooves (155) are connected to the through groove (150).

3. The high-efficiency radiator with through grooves according to claim 1, characterized in that: The through slot (150) is communicated with the gap between the heat dissipation fins (180).

4. The high-efficiency radiator with through grooves according to claim 1, characterized in that: A heat-conducting pipe groove (121) is provided on the outer side surface of the heat-conducting wall (120).

5. The high-efficiency radiator with through grooves according to claim 1, characterized in that: Four support columns (130) are provided, and are respectively located at four corners of the upper surface of the heat-conducting base (110).

6. The high-efficiency radiator with through grooves according to claim 1, characterized in that: The heights of the heat-conducting wall (120) and the supporting column (130) are both higher than the heat dissipation fins (180).

7. The high-efficiency radiator with through grooves according to claim 1, characterized in that: The lower surface of the heat-conducting base (110) is provided with a groove (111) and a plurality of notches (112).

8. The high-efficiency radiator with through grooves according to claim 1, characterized in that: The heat-conducting base (110) is further provided with four mounting holes (114) and two positioning columns (113).

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