Signal processing circuit and vehicle

Abstract

The utility model discloses a signal processing circuit and a vehicle. The signal processing circuit comprises a sending chip which is connected with a common bonding pad and is used for sending a signal to be processed; a plurality of resistors, each of which comprises a common pin and a non-common pin; the common bonding pad is connected with the common pin; the plurality of non-shared bonding pads are connected with the non-shared pins, the number of the non-shared bonding pads is the same as that of the resistors, and different non-shared bonding pads are different in shape; and the plurality of receiving chips are connected with the non-shared bonding pads and used for processing received signals, and the number of the receiving chips is the same as that of the non-shared bonding pads. According to the utility model, the technical problem of low signal transmission quality in the signal processing circuit is solved.

Description

Technical Field

[0001] The utility model relates to the field of vehicles, and in particular to a signal processing circuit and a vehicle. Background Art

[0002] Currently, compatibility design during the product development phase can encounter issues such as soldering component placement and signal transmission quality. Introducing a resistor between the transmitter chip and the receiver chip can affect signal quality between the transmitter and receiver chips, potentially leading to communication degradation or signal interference. Consequently, the technical issue of low signal transmission quality within the signal processing circuitry still exists.

[0003] Currently, no effective solution has been proposed to the technical problem of low signal transmission quality in the above-mentioned signal processing circuit. Utility Model Content

[0004] The embodiments of the present utility model provide a signal processing circuit and a vehicle, so as to at least solve the technical problem of low quality of signal transmission in the signal processing circuit.

[0005] According to one aspect of an embodiment of the present invention, a signal processing circuit is provided. The signal processing circuit includes: a transmitting chip connected to a shared pad for transmitting a signal to be processed; a plurality of resistors, wherein the resistors include shared pins and non-shared pins; a shared pad connected to the shared pin; a plurality of non-shared pads connected to the non-shared pins, wherein the number of non-shared pads is the same as the number of resistors, and different non-shared pads have different shapes; and a plurality of receiving chips, respectively connected to the plurality of non-shared pads, for processing the signal to be processed, wherein the number of receiving chips is the same as the number of non-shared pads.

[0006] Optionally, the common pad includes: a first package pad connected to the common pin; and a first solder resist area arranged at the periphery of the first package pad to prevent a short circuit in the signal processing circuit.

[0007] Optionally, the common pad is circular, the diameter of the first package pad is related to the size of the resistor, the first solder resist area is a circular ring arranged outside the first package pad and concentric with the first package pad, and the width of the first solder resist area is related to the diameter of the first package pad.

[0008] Optionally, the first packaging pad is also connected to the transmitting chip.

[0009] Optionally, the non-shared pad includes: a second package pad connected to the non-shared pin; and a second solder resist area arranged at the periphery of the second package pad to prevent a short circuit in the signal processing circuit.

[0010] Optionally, the shape of the non-shared pad is a regular octagon, the distance from the upper edge to the lower edge of the second package pad is related to the size of the resistor, the second solder resist area is a regular octagonal ring arranged around the outer periphery of the second package pad, and the width of the second solder resist area is related to the distance from the upper edge to the lower edge of the second package pad.

[0011] Optionally, the shape of the non-shared pad is circular, the diameter of the second package pad is related to the size of the resistor, the second solder resist area is a circular ring arranged outside the second package pad and concentric with the second package pad, and the width of the second solder resist area is related to the diameter of the second package pad.

[0012] Optionally, the second packaging pad is also connected to the receiving chip.

[0013] Optionally, a center distance between the center of the shared pad and the center of the non-shared pad is related to a size of the resistor.

[0014] According to another aspect of the present invention, a vehicle is provided, which may include any one of the above-mentioned signal processing circuits.

[0015] In an embodiment of the present invention, a transmitting chip is connected to a common pad and is used to transmit a signal to be processed; a plurality of resistors, wherein the resistors include a common pin and a non-shared pin; a common pad is connected to the common pin; a plurality of non-shared pads are connected to the non-shared pin, wherein the number of non-shared pads is the same as the number of resistors, and the shapes of different non-shared pads are different; a plurality of receiving chips are respectively connected to the plurality of non-shared pads and are used to process received signals, wherein the number of receiving chips is the same as the number of non-shared pads. In this embodiment, in the above-mentioned signal processing circuit, resistors can be connected by utilizing common pads and non-shared pads, which can replace the transmission lines connecting the resistors in the traditional signal processing circuit, thereby achieving the purpose of removing the influence of the transmission lines on signal transmission, thereby achieving the technical effect of improving the signal transmission quality of the signal processing circuit, and solving the technical problem of low signal transmission quality in the signal processing circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 is a schematic diagram of a signal processing circuit according to an embodiment of the present utility model;

[0018] Figure 2 is a schematic diagram of a signal processing circuit in a related art;

[0019] Figure 3 This is a schematic diagram of a 0402 resistor compatible package design according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of a 0402 resistor compatible package circuit according to an embodiment of the present utility model;

[0021] Figure 5 Schematic diagram of another 0402 resistor compatible package design according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0023] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar items and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0024] According to an embodiment of the present invention, an embodiment of a signal processing circuit is provided.

[0025] Figure 1 Schematic diagram of a signal processing circuit according to an embodiment of the present utility model. Figure 1 As shown, the signal processing circuit 100 may include: a transmitting chip 102 , a shared pad 104 , a resistor 106 , a non-shared pad 108 and a receiving chip 110 .

[0026] The sending chip 102 is connected to the common pad and is used to send the signal to be processed.

[0027] In this embodiment, the transmitting chip can be connected to the shared pad and can be used to transmit the signal to be processed. The signal processing circuit can be a 0402 resistor package circuit, which can also be called a 0402 resistor compatible package circuit. The 0402 resistor package circuit refers to a common electronic component packaging specification, where 0402 represents the package size of the resistor. In electronic components, the package specification is usually expressed in numbers, representing the size and packaging form of the component. The 0402 resistor package is a surface mount technology component package. The signal processing circuit can be packaged using integrated circuit packaging technology, such as ball grid array (BGA). The transmitting chip can be a BGA chip.

[0028] Alternatively, 0402 can indicate a resistor package size of 0.04 inches (40 mils) by 0.02 inches (20 mils), or converted to millimeters, 1.0 mm by 0.5 mm. Resistor packages of this size are often referred to as "0402 packages." 0402 package resistors are relatively small and suitable for high-density circuit board designs, saving space and increasing circuit integration. The circuit board can be a printed circuit board (PCB).

[0029] Alternatively, the 0402 resistor package circuit can be used in a variety of products and systems to support the vehicle's electronic control and communication functions.

[0030] It should be noted that the above-mentioned signal processing circuit is only an example. There is no specific restriction on the size of the signal processing circuit and the specific electronic components contained therein. As long as the signal processing circuit can connect resistors and chips through shared pads and non-shared pads to replace the transmission line, it is within the scope of protection of this utility model.

[0031] For example, in engine control units, packaged resistor circuits are used to support signal transmission, data processing, and control functions between sensors and actuators. In-vehicle entertainment systems, including audio, navigation, and communication systems, typically require circuit boards and electronic components to support their functions. Within these systems, 0402 packaged resistor circuits can be used for signal processing, filtering, amplification, and other functions. A vehicle's braking system is a critical component of vehicle safety. Within this system, packaged resistor circuits are used to support the proper operation of functions such as brake sensors and the anti-lock braking system. A vehicle's lighting control system, including headlights, taillights, and turn signals, requires circuits to control their on / off and brightness. 0402 packaged resistor circuits can be used in the circuit design of these lighting control systems. A vehicle's air conditioning control system requires an electronic control unit to adjust parameters such as temperature and air speed. Within this system, packaged resistor circuits can be used for sensor signal processing and control logic.

[0032] It should be noted that the usage and system of the above-mentioned signal processing circuit are only examples and are not specifically limited here.

[0033] Optionally, during the layout of the signal processing circuit, the transmitting chip and the common pad may be soldered together, so that the signal sent by the transmitting chip may be transmitted to the common pad.

[0034] The common pad 104 is connected to the common pin.

[0035] In this embodiment, the pads can connect the pins of different resistors, sharing a common function. This design has the advantage of reducing the number of pads on the circuit board, saving space, and facilitating layout and soldering. The presence of shared pads allows flexibility in selecting one resistor for use while leaving the other unconnected, thus preventing unused links from interfering with the signal transmission link and improving signal quality.

[0036] Optionally, the shared pad may also be connected to a shared pin of a resistor in the signal processing circuit, so that the signal to be processed of the transmitting chip received by the shared pad can be transmitted to the connected resistor.

[0037] A plurality of resistors 106 , wherein the resistors include shared pins and non-shared pins.

[0038] In this embodiment, the information processing circuit may include a plurality of resistors, and each resistor may include a shared pin and a non-shared pin.

[0039] Alternatively, a shared pin is one pin of a resistor connected to a common pad shared with other components. This pad can be connected to different components or signal lines, thus achieving multiple functions. The presence of a shared pin can reduce the number of pads on the circuit board, saving space and facilitating signal transmission and connection.

[0040] Alternatively, a non-shared pin refers to a resistor with another pin connected to an independent non-shared pad. This pad is connected only to the resistor pin and not to other components or signal lines. Non-shared pins are typically used to connect to specific signal lines or components and perform specific functions.

[0041] In the embodiment of the present invention, the arrangement of shared pins and non-shared pins can make the circuit layout more flexible, and also facilitate the simplification of signal transmission and connection.

[0042] A plurality of non-shared pads 108 are connected to the non-shared pins, wherein the number of the non-shared pads is the same as the number of the resistors, and different non-shared pads have different shapes.

[0043] In this embodiment, the non-shared pads can be connected to the non-shared pins of the corresponding resistors, so that the signal to be processed received by the resistors can be transmitted to the non-shared pads through the non-shared pins. The number of non-shared pads can be the same as the number of resistors in the signal processing circuit. In order to facilitate the distinction between different non-shared pads, the shapes of the non-shared pads can be different.

[0044] Optionally, a non-shared pad means that one pin of each resistor is connected to a separate pad. This pad is connected only to the pin of that resistor and not to other components or signal lines. According to the description, the number of non-shared pads is the same as the number of resistors, and the shapes of different non-shared pads are also different. This arrangement allows different resistors to have independent soldering locations on the circuit board, making them easier to distinguish and connect.

[0045] In an embodiment of the present invention, by connecting the non-shared pins of each resistor to non-shared pads of different shapes, flexible circuit layout and design can be achieved. This arrangement can effectively avoid welding errors or confusion, improving the reliability and stability of the circuit. At the same time, the non-shared pads of different shapes can also help engineers more easily identify and distinguish different resistor pins during the design and maintenance process, improving work efficiency. Therefore, the above arrangement has important advantages for the layout and connection of circuit boards.

[0046] A plurality of receiving chips 110 are respectively connected to a plurality of non-shared pads for processing signals to be processed, wherein the number of the receiving chips is the same as the number of the non-shared pads.

[0047] In this embodiment, a receiving chip can be connected to a non-shared pad, thereby receiving a signal to be processed on the non-shared pad and processing the received signal to be processed. A receiving chip refers to an integrated circuit chip used to receive and process a signal to be processed. Each receiving chip is connected to a non-shared pad, and this non-shared pad is only connected to the receiving chip and is not connected to other components or signal lines. According to the description, the number of receiving chips is the same as the number of non-shared pads, which means that each receiving chip has an independent welding position.

[0048] By connecting receiving chips to non-shared pads, signal reception and processing can be achieved. Each receiving chip can receive the signal to be processed on the corresponding non-shared pad and perform processing operations such as decoding, amplification, and filtering. This arrangement modularizes the circuit's signal processing functions, with each receiving chip responsible for processing a specific signal, improving system reliability and stability.

[0049] Furthermore, connecting the receiver chip to non-shared pads simplifies circuit layout and connections, preventing signal aliasing and interference. By clearly defining the connection between each receiver chip and its corresponding non-shared pad, circuit board design, debugging, and maintenance are much easier. Therefore, the placement of receiver chips and non-shared pads plays a crucial role in signal processing circuits.

[0050] In an embodiment of the present invention, a transmitting chip is connected to a common pad for transmitting a signal to be processed; a plurality of resistors, wherein the resistors include a common pin and a non-shared pin; a common pad is connected to the common pin; a plurality of non-shared pads are connected to the non-shared pin, wherein the number of non-shared pads is the same as the number of resistors, and the shapes of different non-shared pads are different; a plurality of receiving chips are respectively connected to the plurality of non-shared pads for processing the signal to be processed, wherein the number of receiving chips is the same as the number of non-shared pads. In this embodiment, in the above-mentioned signal processing circuit, resistors can be connected by utilizing common pads and non-shared pads, which can replace the transmission lines connecting the resistors in the traditional signal processing circuit, thereby achieving the purpose of removing the influence of the transmission lines on signal transmission, thereby achieving the technical effect of improving the signal transmission quality of the signal processing circuit, and solving the technical problem of low signal transmission quality in the signal processing circuit.

[0051] The above-mentioned device of this embodiment is further introduced below.

[0052] As an optional implementation, the common pad includes: a first package pad connected to the common pin; and a first solder resist area disposed at the periphery of the first package pad to prevent a short circuit in the signal processing circuit.

[0053] In this embodiment, the shared pad may include a first package pad and a first solder resist area. The first package pad may be connected to the shared pin. The first solder resist area may be provided around the first package pad to prevent a short circuit in the signal processing circuit.

[0054] Optionally, the first package pad is a pad connected to a common pin. It serves as the connection point between the pins of an electronic component (such as a resistor or receiver chip) and the circuit board, securing the pins to the circuit board through soldering. The first package pad typically has a specific shape and size to accommodate the pin size and layout of a specific component. By connecting to the common pin, the first package pad ensures a reliable connection between the component and the circuit board.

[0055] Optionally, a first solder mask area is provided around the first package pad to prevent short circuits in the signal processing circuit. Solder mask is a protective layer applied to the surface of a circuit board, typically consisting of a mixture of solder paste and resin. During the soldering process, the solder mask area prevents solder from flowing to areas that should not contact the pads, thereby avoiding short circuits. Furthermore, solder mask prevents oxidation and corrosion, improving the stability and durability of the circuit board. Solder mask is a thin film layer used to prevent solder diffusion, prevent short circuits, protect components, and facilitate debugging. The solder mask layer typically covers the periphery of the package pads, preventing solder from diffusing in areas where soldering is not required, thereby avoiding short circuits and poor connections. Furthermore, solder mask provides protection, shielding components from environmental influences. During debugging, the transparency of the solder mask facilitates observation of the soldering condition and the making of necessary corrections.

[0056] In the embodiment of the present invention, by providing the first solder mask area around the first package pad, the shared pad and surrounding circuit components can be effectively protected to prevent accidental short circuits. This arrangement helps improve the reliability and stability of the circuit, while also facilitating operational safety during production and maintenance. Therefore, the first package pad and the first solder mask area play an important role in the shared pad design.

[0057] As an optional embodiment, the common pad is circular, the diameter of the first package pad is related to the size of the resistor, the first solder resist area is a circular ring arranged outside the first package pad and concentric with the first package pad, and the width of the first solder resist area is related to the diameter of the first package pad.

[0058] In this embodiment, the common pad may be circular. The diameter of the first package pad may be determined according to the size of the resistor. The first solder resist area may be a circular ring disposed around the first package pad and concentric with the first package pad. The width of the first solder resist area is determined based on the diameter of the first package pad.

[0059] Optionally, the shared pad serves as an interface for connecting electronic components and circuit boards, and adopts a circular design. The circular pad shape usually has good guidance and stability, which can ensure accurate welding and connection, and is also conducive to the reliability of signal transmission. The diameter of the first package pad is determined based on the size of the resistor. Resistive components usually have standard size specifications, and their pin size and spacing are also fixed. Therefore, the diameter of the first package pad needs to adapt to the pin size and spacing of the resistor to ensure good welding and connection effects.

[0060] Optionally, the first solder mask area is a circular ring disposed around the first package pad and concentric with the first package pad. This area prevents accidental short circuits and protects the shared pad and surrounding circuit components. The width of the first solder mask area is determined based on the diameter of the first package pad, typically with a margin to ensure effective protection.

[0061] In the embodiments of the present invention, the above arrangement ensures a stable and reliable connection between the common pad and the resistor, while also providing protection against unexpected situations such as short circuits. The overall design takes into account component size, connection performance, and safety, thereby improving the reliability and stability of the circuit.

[0062] For example, for a 0402 resistor, the diameter of the first package pad can be set to 0.52 mm, and the circular area outside the first package pad that is larger than the package pad can be the first solder resist area, and the circular width of the solder resist area can be 0.026 mm.

[0063] It should be noted that the sizes of the above-mentioned first package pad and first solder resist area are only for illustration and are not specifically limited here. They can be determined according to the size of the actual resistor and the size of the circuit board of the signal processing circuit.

[0064] As an optional implementation, the first package pad is also connected to the transmitting chip.

[0065] In this embodiment, the first package pad may be connected to the transmitting chip to receive a signal sent by the transmitting chip.

[0066] Optionally, signal transmission functionality on the circuit board is achieved by connecting the first package pad to the transmitting chip. The transmitting chip is typically used to generate and transmit signals, while the first package pad serves as a connection point for receiving signals sent by the transmitting chip. This connection ensures that signals are transmitted from the transmitting chip to other components or modules on the circuit board, enabling signal transfer and processing.

[0067] Optionally, the first package pad serves as a connection point to receive signals sent by the transmitting chip. These signals may be data or control signals from devices such as sensors, controllers, and processors. By connecting to the transmitting chip, the first package pad can receive these signals and transmit them to other components for further processing or to perform corresponding operations. The connection between the first package pad and the transmitting chip enables signal transmission. The signals generated by the transmitting chip are transmitted via the first package pad to other components or modules on the circuit board, thus completing the signal transmission and processing process. This configuration enables the various components on the circuit board to work together to achieve complex functions and tasks.

[0068] In this embodiment of the present invention, the first package pad is connected to the transmitting chip, enabling signal transmission and reception, ensuring communication and coordination between various components on the circuit board. This arrangement helps improve the overall performance and reliability of the system, while also providing an effective solution for data transmission and control.

[0069] As an optional implementation, the non-shared pad includes: a second package pad connected to the non-shared pin; and a second solder resist area disposed at the periphery of the second package pad to prevent a short circuit in the signal processing circuit.

[0070] In this embodiment, the non-shared pad may include a second package pad and a second solder resist area. The second package pad may be connected to the non-shared pin of the corresponding resistor. The second solder resist area may be provided around the second package pad to prevent the signal processing resistor from short-circuiting.

[0071] Optionally, the second package pad is a pad connected to a non-shared pin and is used to connect a resistor element on a circuit board. Each resistor element has two pins, one of which is connected to the shared pad and the other to the non-shared pad (i.e., the second package pad). By connecting to the second package pad, the resistor element can be connected to other components or signal lines to implement circuit functions.

[0072] Optionally, a second solder mask area is provided around the second package pad to prevent short circuits in the signal processing circuit. Similar to the first solder mask area, the second solder mask area is a protective layer, typically composed of a mixture of solder paste and resin, used to prevent solder from flowing to areas that should not be contacted, thereby avoiding short circuits. The provision of the second solder mask area helps protect the resistor elements on the circuit board, ensuring their normal operation and stability. Solder mask is a thin film layer used to prevent solder diffusion, prevent short circuits, protect components, and facilitate debugging. The solder mask layer usually covers the periphery of the package pad to prevent solder from diffusing in areas where soldering is not required, avoiding short circuits and poor connections. In addition, solder mask can also provide protection to prevent components from being affected by the environment. During the debugging process, the transparency of the solder mask makes it easy to observe the welding condition and make necessary corrections.

[0073] In an embodiment of the present invention, by connecting the second package pad to the non-shared pin and providing a second solder mask area for protection, the connection and operation of the resistor element on the circuit board can be ensured to be stable and reliable. The above arrangement helps to improve the reliability and durability of the circuit, and is also beneficial to operational safety during production and maintenance. Overall, the second package pad and the second solder mask area play an important role in the non-shared pad design.

[0074] As an optional embodiment, the shape of the non-shared pad is a regular octagon, the distance from the upper edge to the lower edge of the second package pad is related to the size of the resistor, the second solder resist area is a regular octagonal ring arranged outside the second package pad, and the width of the second solder resist area is related to the distance from the upper edge to the lower edge of the second package pad.

[0075] In this embodiment, if the non-shared pad of a resistor is shaped like a regular octagon, the distance from the top to the bottom of the second package pad can be determined based on the size of the resistor. The second solder resist area can be provided around the second package pad, forming a regular octagonal ring around the second package pad. The width of the second solder resist area can be determined based on the distance from the top to the bottom of the second package pad.

[0076] Optionally, the shape of the non-shared pad is a regular octagon, the distance from the upper edge to the lower edge of the second package pad is determined based on the size of the resistor, the second solder resist area is a regular octagonal ring arranged around the outer periphery of the second package pad, and the width of the second solder resist area is determined based on the distance from the upper edge to the lower edge of the second package pad.

[0077] Optionally, the resistor's non-shared pads are shaped like a regular octagon. This octagonal pad shape offers excellent stability and connectivity, making it suitable for connecting components on a circuit board. Furthermore, the regular octagonal shape facilitates layout and differentiation, making soldering and maintenance easier. The distance from the top to the bottom of the second package pad is determined based on the size of the resistor. This means that the size and position of the second package pad are determined based on the size of the resistor component and the position of its pins, ensuring the accuracy and stability of the solder connection.

[0078] Optionally, a second solder resist region is provided around the second package pad and is in the shape of a regular octagonal ring. The width of the second solder resist region is determined based on the distance from the top to the bottom of the second package pad. This arrangement helps prevent short circuits in the signal processing circuit and improves the stability and reliability of the circuit board.

[0079] In the embodiments of the present invention, by adopting a regular octagonal non-shared pad shape, determining the size of the second package pad based on the resistor size, and providing a regular octagonal ring-shaped second solder resist area, accurate and stable circuit connections can be achieved while protecting circuit components from problems such as short circuits. This arrangement helps improve the performance and reliability of the circuit board, while also facilitating operational efficiency during production and maintenance.

[0080] For example, for a 0402 resistor, the distance from the upper side to the lower side of the regular octagonal second package pad may be 0.52 mm, and a second solder resist area with a width of 0.026 mm may be provided around the second package pad.

[0081] It should be noted that the sizes of the second package pad and the second solder resist area are only examples and are not specifically limited here. They can be determined according to the size of the actual resistor and the size of the circuit board of the signal processing circuit.

[0082] As an optional embodiment, the shape of the non-shared pad is circular, the diameter of the second package pad is related to the size of the resistor, the second solder resist area is a circular ring arranged outside the second package pad and concentric with the second package pad, and the width of the second solder resist area is related to the diameter of the second package pad.

[0083] In this embodiment, if the non-shared pad of a resistor is circular, the diameter of the second package pad can be determined based on the size of the resistor. The second solder resist area can be arranged around the second package pad and can be a circular ring concentric with the second package pad. The width of the second solder resist area can be determined based on the diameter of the second package pad.

[0084] Alternatively, if the non-shared pad of a resistor is circular, the diameter of the second package pad can be determined based on the size of the resistor. The diameter of the second package pad can be determined based on the size and pin position of the resistor element to ensure a perfect match with the resistor pins and a stable solder connection.

[0085] Optionally, a second solder mask area can be provided around the second package pad, in the form of a circular ring concentric with the second package pad. This arrangement helps prevent short circuits in the signal processing circuitry, improving the stability and reliability of the circuit board. The width of the second solder mask area can be determined based on the diameter of the second package pad, typically with a margin to ensure effective protection.

[0086] In this embodiment of the utility model, by configuring the non-shared resistor pads to be circular, the diameter of the second package pad can be determined based on the resistor size, thereby achieving a suitable solder connection. Furthermore, providing a second solder resist area as a protective layer effectively prevents short circuits and improves the stability and reliability of the circuit board. This configuration takes into account component size, connection performance, and safety, helping to improve the performance and reliability of the circuit.

[0087] For example, for a 0402 resistor, the diameter of the second package pad can be set to 0.52 mm, and the circular area outside the second package pad that is larger than the package pad can be the second solder resist area, and the circular width of the solder resist area can be 0.026 mm.

[0088] It should be noted that the sizes of the second package pad and the second solder resist area are only examples and are not specifically limited here. They can be determined according to the size of the actual resistor and the size of the circuit board of the signal processing circuit.

[0089] As an optional implementation manner, the second package pad is also connected to the receiving chip.

[0090] In this embodiment, the second package pad may be connected to the receiving chip to transmit the signal to be processed sent by the transmitting chip to the receiving chip.

[0091] Optionally, signal transmission functionality on the circuit board is achieved by connecting the second package pad to the receiving chip. The receiving chip is typically used to receive, decode, and process signals, and the second package pad serves as a connection point for transmitting the received signal to the receiving chip. This connection ensures that the signal is transmitted from the transmitting chip through the second package pad to the receiving chip, completing signal transmission and processing.

[0092] Optionally, after the second package pad is connected to the receiving chip, the signals to be processed, sent by the transmitting chip, can be transmitted to the receiving chip. These signals may be data, control signals, or other types of information that need to be processed by the receiving chip and perform corresponding operations. The connection between the second package pad and the receiving chip enables the transmission and processing of the signals to be processed.

[0093] Optionally, the second package pads connect to the receiving chip, enabling both signal transmission and reception. Signals from the transmitting chip are transmitted via the second package pads to the receiving chip, which then processes the signal and performs the corresponding operation. This design enables various components on the circuit board to work together to achieve complex functions and tasks.

[0094] In summary, the connection between the second package pad and the receiving chip enables signal transmission and reception, ensuring communication and collaboration between the various components on the circuit board. This setup helps improve the overall performance and reliability of the system while also providing an effective solution for data transmission and control.

[0095] As an optional implementation, the center distance between the center of the shared pad and the center of the non-shared pad is related to the size of the resistor.

[0096] In this embodiment, the center distance between the center of the shared pad and the center of the non-shared pad is determined according to the size of the resistor.

[0097] Optionally, the centers of the shared pad and the non-shared pad are the center points of the pads, respectively, for connecting to pins of electronic components. The shared pad is generally used to connect common pins of multiple components, while the non-shared pad is connected to the pin of a specific component.

[0098] Optionally, the center-to-center distance between the center of the shared pad and the center of the unshared pad is determined based on the size of the resistor. The resistor's dimensions include the spacing and size of the pins, which affect the connection method and distance between the resistor element and the pads. By properly determining the center-to-center distance, an accurate and stable connection between the resistor element's pins and the pads can be ensured.

[0099] Optionally, determining the center distance between shared pads and non-shared pads requires consideration of factors such as the circuit board layout, component size, and pin location. Ensuring a reasonable center distance can improve circuit reliability and stability and avoid circuit failures or signal transmission issues caused by improper connections.

[0100] In summary, the center-to-center distance between the shared and unshared pads is determined based on the resistor size. This design helps ensure the quality and stability of the connection between the resistor and the pads. By properly setting this center-to-center distance, the performance and reliability of the circuit board can be effectively improved.

[0101] For example, in the case of a 0402 resistor, the center of the shared pad may be aligned with the center of the non-shared pad, with a center distance of 0.8 mm between the two.

[0102] It should be noted that the above-mentioned center distance is only for illustration and is not specifically limited here. It can be determined according to the size of the actual resistor and the size of the circuit board of the signal processing circuit.

[0103] In this embodiment, corresponding first silk screen information and second silk screen information can also be printed next to the shared pad and the non-shared pad. The first silk screen information can be printed on the side of the shared pad and can be filled with the attribute information of the shared pad. The second silk screen information can be printed on the side of the non-shared pad and can be filled with the attribute information of the non-shared pad. The first silk screen information and the second silk screen information can also be called resistor silk screen. The first silk screen information and the second silk screen information can also be used to distinguish different pads or components, which helps to identify and distinguish them during circuit layout and connection. Silk screen information plays an important role in PCB design, helping engineers to better understand and operate circuit boards. For example, the first silk screen information can be the number 1 and the second silk screen information can be the number 2. It should be noted that the above-mentioned silk screen information is only for illustration and is not specifically limited here.

[0104] Optionally, in addition to the connection of the pad, a first silk screen information and a second silk screen information can also be printed. The first silk screen information is on the side of the shared pad and is used to fill in the attribute information of the shared pad. Shared pads are usually used to connect the common pins of multiple components. Therefore, marking the attribute information of the shared pad on the side of the pad, such as component name, pin function, connection method, etc., helps engineers to accurately identify and use it during the design, assembly and maintenance process. The second silk screen information can be set on the side of the non-shared pad and is used to fill in the attribute information of the non-shared pad. Non-shared pads are usually connected to the pins of a single component. Therefore, marking the attribute information of the non-shared pad on the side of the pad helps to distinguish the pins of different components and improve the efficiency of assembly and maintenance.

[0105] The first and second silkscreen information, also commonly referred to as resistor silkscreen, is used to mark the properties and connection methods of the pads. The resistor silkscreen allows engineers to quickly identify and understand the function and purpose of the pads, ensuring correct component connection and avoiding errors.

[0106] In summary, primary and secondary silkscreen information plays an important role in signal processing circuits. Adding attribute information to shared and unshared pads helps engineers better understand and use pads, improving the maintainability and reliability of circuit boards. Setting resistor silkscreen information also helps improve production and maintenance efficiency, ensuring proper operation and stable performance of circuits.

[0107] The technical solution of the embodiment of the present utility model is illustrated below with reference to an implementation method corresponding to a preferred resistor of 0402.

[0108] at present, Figure 2 is a schematic diagram of a signal processing circuit in a related art, such as Figure 2 As shown in the figure, a compatible design is often performed. A pin of chip B and a pin of chip C are simultaneously connected to a pin of chip A. However, during the circuit debugging phase, only one of chip B and chip A is selected for debugging. Assuming chip A and chip B are used, the soldered components are: chip A, resistor 1, and chip B. Resistor 2 is not soldered. In this case, the transmission line from resistor 2 to chip A and resistor 1 will affect the signal quality between chips A and B. If chip A is a BGA chip and is the transmitting chip, resistors 1 and 2 should be placed as close as possible to the pins of chip A. In other words, resistors R1 and R2 should be placed as close as possible to the bottom of the BGA chip. Due to the large number of decoupling capacitors under the chip, layout using conventional 0402 resistors would be extremely difficult.

[0109] Therefore, the related art still has the technical problem of low signal transmission quality of the signal processing circuit.

[0110] However, an embodiment of the present invention proposes a 0402 resistor-compatible package circuit design. To address the impact of resistor 2 and its partial transmission lines on the link and facilitate the placement of the 0402 resistor beneath BGA chip A, a resistor-compatible package is invented. The package design takes into account the size of the 0402 resistor, allowing the circuit board to accommodate and use 0402-sized resistors. This package design allows the resistor to be conveniently placed beneath BGA chip A, thereby addressing the impact of resistor 2 and its partial transmission lines on the link. This new package design effectively eliminates the impact of resistor 2 and its partial transmission lines on the link. A new package structure can be adopted to minimize the impact of resistor 2 and its transmission lines, thereby improving the stability and performance of the entire circuit link. Because the bottom of the BGA chip contains a large number of components such as decoupling capacitors, the traditional placement of 0402 resistors may be limited. Therefore, this resistor-compatible package design makes it easier to place the 0402 resistor beneath BGA chip A, thereby optimizing circuit layout and signal transmission quality. Overall, this resistor-compatible package design aims to address circuit layout challenges, improve circuit link performance and stability, and facilitate the placement of resistor components beneath the BGA chip. This improves signal transmission quality in signal processing circuits and addresses the inherent issue of low signal transmission quality.

[0111] In this embodiment, a 0402 resistor compatible package circuit design is disclosed.

[0112] Optionally, Figure 3 Schematic diagram of a 0402 resistor compatible package design according to an embodiment of the present invention. Figure 3 As shown, only one of resistors R1 and R2 is used during debugging. In this invention, one of the pins of resistors R1 and R2 is used, and the circular pad near the number 2 is a shared pin. Resistor 1 and resistor 2 use a regular octagonal and circular pad, respectively. This configuration eliminates the impact of unused link stubs on the signal transmission link, improving signal quality. Using circular and regular octagonal pads reduces pad area, facilitating layout and improving work efficiency. The non-shared pins of resistors R1 and R2 use different pad shapes for easy identification.

[0113] Figure 4 Schematic diagram of a 0402 resistor compatible package circuit according to an embodiment of the present invention, such as Figure 4As shown in the figure, when transmitting a signal from chip A to chip B, the resistors are soldered to the octagonal pins and the shared pad. This way, the unsoldered link does not affect the transmission link from chip A to chip B. Similarly, when transmitting a signal from chip A to chip C, the resistors are soldered to the shared pad and another circular pad. The unsoldered link also does not affect the signal. The shared footprint of the two resistors and the modified pad shape make layout easier.

[0114] Alternatively, as Figure 4 As shown in the figure, the black filled area represents the resistor package pad. The circular pad has a diameter of 0.52mm. The distance from top to bottom of the regular octagonal pad is 0.52mm. A larger circular area, larger than the package pad, forms a ring with a width of 0.026mm. The entire ring is the solder mask area. The same applies to the regular octagonal pads. The distance from the center of the shared pad to the center of the remaining pads is 0.8mm. Numbers 1 and 2 are silkscreen information.

[0115] Figure 5 Schematic diagram of another 0402 resistor compatible package design according to an embodiment of the present invention. Figure 5 As shown, resistor silkscreen (PCB silkscreen) primarily displays text-based information, including circuit points, components, and circuit symbols. The silkscreen varies depending on the PCB size. If space is limited, prioritize the most critical information. Components are soldered to the package pads to complete the circuit connection. Solder mask areas prevent short circuits, protect components, limit solder spread, and facilitate debugging.

[0116] According to another aspect of the present invention, a vehicle is provided, which may include any one of the above-mentioned signal processing circuits.

[0117] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0118] In the above embodiments of the present invention, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0119] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A signal processing circuit, characterized in that: include: A sending chip, connected to the common pad, for sending a signal to be processed; a plurality of resistors, wherein the resistors include shared pins and unshared pins; The common pad is connected to the common pin; a plurality of non-shared pads connected to the non-shared pins, wherein the number of the non-shared pads is the same as the number of the resistors, and different non-shared pads have different shapes; A plurality of receiving chips are respectively connected to the plurality of the non-shared pads and are used to process the signals to be processed, wherein the number of the receiving chips is the same as the number of the non-shared pads.

2. The signal processing circuit according to claim 1, wherein: The shared pad includes: A first package pad connected to the common pin; The first solder resist area is arranged at the periphery of the first package pad and is used to prevent the signal processing circuit from short-circuiting.

3. The signal processing circuit according to claim 2, wherein: The common pad is circular, the diameter of the first package pad is related to the size of the resistor, the first solder resist area is a circular ring arranged outside the first package pad and concentric with the first package pad, and the width of the first solder resist area is related to the diameter of the first package pad.

4. The signal processing circuit according to claim 2, wherein: The first packaging pad is also connected to the transmitting chip.

5. The signal processing circuit according to claim 1, wherein: The non-shared pads include: A second package pad connected to the non-shared pin; The second solder resist area is arranged at the periphery of the second package pad and is used to prevent the signal processing circuit from short-circuiting.

6. The signal processing circuit according to claim 5, wherein: The shape of the non-shared pad is a regular octagon, the distance from the upper edge to the lower edge of the second package pad is related to the size of the resistor, the second solder resist area is a regular octagonal ring arranged on the periphery of the second package pad, and the width of the second solder resist area is related to the distance from the upper edge to the lower edge of the second package pad.

7. The signal processing circuit according to claim 5, wherein: The shape of the non-shared pad is circular, the diameter of the second package pad is related to the size of the resistor, the second solder resist area is a circular ring arranged outside the second package pad and concentric with the second package pad, and the width of the second solder resist area is related to the diameter of the second package pad.

8. The signal processing circuit according to claim 5, wherein: The second packaging pad is also connected to the receiving chip.

9. The signal processing circuit according to claim 1, wherein: A center distance between the center of the shared pad and the center of the non-shared pad is related to the size of the resistor.

10. A vehicle, characterized in that: At least comprising the signal processing circuit according to any one of claims 1 to 9.

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