Ultrasonic fingerprint identification structure and electronic equipment

Abstract

The utility model discloses an ultrasonic fingerprint identification structure and electronic equipment. The ultrasonic fingerprint recognition structure is used for being arranged in an area, not including a touch screen, of the electronic equipment and comprises a touch module and an ultrasonic module, the ultrasonic module comprises an ultrasonic chip and an ultrasonic circuit board, the ultrasonic chip is arranged on the ultrasonic circuit board, and the touch module is electrically connected with the ultrasonic circuit board. The touch module is used for detecting whether a finger approaches or not and triggering the ultrasonic chip to perform fingerprint identification when detecting that the finger approaches. According to the application, the fingerprint is identified by using ultrasonic waves, so that a thicker cover plate can be adapted, the product strength is increased, and the structural design freedom degree of the terminal is higher. And the ultrasonic fingerprint identification is less affected by the environment, so that the application scene is wider.

Description

Technical Field

[0001] The present application relates to the field of fingerprint recognition technology, and more specifically, to an ultrasonic fingerprint recognition structure and electronic equipment. Background Art

[0002] Ultrasonic modules are widely used in touch screens of mobile phones, tablet computers and other terminals, such as Figure 1 As shown in the figure, the ultrasonic module is bonded to the bottom side of the touch screen with copper foil adhesive. Compared with capacitive fingerprint recognition and optical fingerprint recognition, ultrasonic fingerprint recognition is more applicable and is not easily affected by environmental factors such as light, temperature, and humidity.

[0003] However, in non-touchscreen applications, such as smart door locks, time clocks, access control systems, and electric vehicles, accurate ultrasonic fingerprint recognition is impossible because they lack touchscreens and the ability to detect finger position and gestures. Existing technologies primarily use capacitive or optical fingerprint recognition in non-touchscreen applications. These two solutions are susceptible to factors such as the cover material, thickness, and light transmittance, as well as ambient light intensity, temperature, and finger humidity, leading to fingerprint recognition failures and a negative impact on the user experience. Utility Model Content

[0004] In response to the deficiencies of the existing technology, the present application innovatively provides an ultrasonic fingerprint recognition structure and electronic device that can solve at least some of the above technical problems.

[0005] To achieve the above technical objectives, the first aspect of the present application discloses an ultrasonic fingerprint recognition structure for being set in an area of ​​an electronic device that does not include a touch screen, comprising: a touch module and an ultrasonic module, wherein the ultrasonic module comprises an ultrasonic chip and an ultrasonic circuit board, wherein the ultrasonic chip is set on the ultrasonic circuit board.

[0006] The touch module is electrically connected to the ultrasonic circuit board. The touch module is used to detect whether a finger approaches and trigger the ultrasonic chip to perform fingerprint recognition when a finger is detected approaching.

[0007] Furthermore, the touch module includes a touch circuit board, a touch sensing circuit is formed on the touch circuit board, the touch circuit board is a ring structure, the ultrasonic chip is arranged in a hollow area inside the touch circuit board, and the touch circuit board is electrically connected to the ultrasonic circuit board.

[0008] Furthermore, the touch module includes a touch circuit board, a touch sensing circuit is formed on the touch circuit board, and the touch circuit board is electrically connected to the ultrasonic circuit board.

[0009] The ultrasonic chip is bonded to the touch circuit board.

[0010] Furthermore, the touch circuit board is a flexible circuit board, comprising a PI substrate layer and a copper foil layer, wherein the copper foil layer and the PI substrate layer are overlapped.

[0011] The thickness of the PI substrate layer is 18 μm-23 μm, and / or the thickness of the copper foil layer is 8 μm-15 μm.

[0012] Furthermore, the touch module includes copper foil adhesive, the copper foil adhesive includes a copper foil layer, and a touch sensing circuit is formed on the copper foil layer.

[0013] The copper foil layer is electrically connected to the ultrasonic circuit board, and the ultrasonic chip is adhered to the copper foil layer.

[0014] Furthermore, the copper foil adhesive includes an adhesive layer, the adhesive layer includes a first adhesive layer and a second adhesive layer, the first adhesive layer is arranged on the first surface of the copper foil layer, the second adhesive layer is arranged on the second surface of the copper foil layer, and the second adhesive layer is bonded to the ultrasonic chip.

[0015] A connection area is formed on the first surface and / or the second surface of the copper foil layer, the connection area is not covered by the adhesive layer, and the connection area is electrically connected to the ultrasonic circuit board.

[0016] In a second aspect of the present application, an electronic device is disclosed, comprising a cover plate and the ultrasonic fingerprint recognition structure, wherein the ultrasonic fingerprint recognition structure is bonded to the lower side of the cover plate.

[0017] Furthermore, a touch recognition area is provided on the first surface of the cover plate.

[0018] Furthermore, a bonding positioning area is provided on the second surface of the cover plate, the bonding positioning area is opposite to the touch recognition area, and the bonding positioning area is provided with a convex or concave structure.

[0019] The ultrasonic fingerprint recognition structure is bonded to the protruding or concave structure.

[0020] Furthermore, the electronic device further comprises a protective cover, which is arranged on the lower side of the cover plate, and the protective cover at least covers the ultrasonic chip inside.

[0021] In a third aspect of the present application, an electronic device is disclosed, comprising a cover plate and the ultrasonic fingerprint recognition structure, wherein the touch circuit board is bonded to the underside of the cover plate by adhesive.

[0022] The ultrasonic chip is bonded to the lower side of the cover plate by copper foil adhesive.

[0023] In a fourth aspect, the present application discloses an electronic device comprising a cover and the ultrasonic fingerprint recognition structure.

[0024] The PI substrate layer is bonded to the lower side of the cover plate by bonding adhesive.

[0025] In a fifth aspect, the present application discloses an electronic device comprising a cover and the ultrasonic fingerprint recognition structure.

[0026] The first adhesive layer is adhered to the lower side of the cover plate.

[0027] The beneficial effects of this application are:

[0028] The ultrasonic fingerprint recognition structure of this application is designed to be installed in areas of electronic devices that do not include touch screens. Using ultrasonic fingerprint recognition can accommodate thicker cover plates, increasing product strength and providing greater freedom in terminal structural design. Furthermore, because ultrasonic fingerprint recognition is less susceptible to environmental influences, its application scenarios are more extensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Shows a schematic cross-sectional view of the assembly of the touch screen and the ultrasonic module;

[0030] Figure 2 A schematic diagram showing the structure of an ultrasonic fingerprint recognition structure according to an embodiment of the present application is shown;

[0031] Figure 3 A schematic diagram showing the structure of an ultrasonic fingerprint recognition structure according to an embodiment of the present application is shown;

[0032] Figure 4 A schematic diagram showing the structure of an ultrasonic fingerprint recognition structure according to an embodiment of the present application is shown;

[0033] Figure 5 A schematic diagram showing the structure of an ultrasonic fingerprint recognition structure installed on a cover plate according to an embodiment of the present application is shown;

[0034] Figure 6 Show Figure 5 A partial cross-sectional schematic diagram of the middle structure;

[0035] Figure 7 A schematic diagram showing the structure of an ultrasonic fingerprint recognition structure installed on a cover plate according to an embodiment of the present application is shown;

[0036] Figure 8 Show Figure 7 A partial cross-sectional schematic diagram of the middle structure;

[0037] Figure 9 A schematic diagram showing the structure of an ultrasonic fingerprint recognition structure installed on a cover plate according to an embodiment of the present application is shown;

[0038] Figure 10A schematic structural diagram of a protective cover according to an embodiment of the present application is shown;

[0039] Figure 11 A schematic diagram showing the structure of a protective cover installed on a cover plate according to an embodiment of the present application is shown;

[0040] Figure 12 A schematic structural diagram of the first side of a cover plate according to an embodiment of the present application is shown;

[0041] Figure 13 A schematic diagram of the second surface structure of a cover plate according to an embodiment of the present application is shown.

[0042] In the figure,

[0043] 1. Touch module; 11. PI substrate layer; 12. Copper foil layer; 21. Ultrasonic chip; 22. Ultrasonic circuit board; 3. Laminating adhesive; 4. Copper foil adhesive; 41. Connection area; 5. Cover plate; 51. Touch recognition area; 52. Adhesive positioning area; 6. Protective cover. DETAILED DESCRIPTION

[0044] The ultrasonic fingerprint recognition structure and electronic device provided in this application are explained and illustrated in detail below in conjunction with the drawings in the specification.

[0045] According to the first aspect of the present application, an ultrasonic fingerprint recognition structure is provided for being set in an area of ​​an electronic device that does not include a touch screen to achieve fingerprint recognition unlocking or identity authentication. In some embodiments, such as Figure 2 、 Figure 3 、 Figure 4 As shown, the ultrasonic fingerprint recognition structure includes: a touch module 1 and an ultrasonic module. The ultrasonic module includes an ultrasonic chip 21 and an ultrasonic circuit board 22. The ultrasonic chip 21 is disposed on the ultrasonic circuit board 22, and the touch module 1 is electrically connected to the ultrasonic circuit board 22. Optionally, the ultrasonic circuit board 22 is an FPC (Flexible Printed Circuit). The touch module 1 is used to detect whether a finger is approaching. When a change in capacitance is detected due to the approach of a finger, a signal is transmitted to the ultrasonic chip 21 for fingerprint recognition through the ultrasonic module, making ultrasonic fingerprint recognition possible in non-touch screen scenarios.

[0046] In some embodiments, as Figure 2As shown, the touch module 1 includes a touch circuit board, optionally an FPC, on which a touch sensing circuit is formed. The touch circuit board is annular in structure, with a hollow area formed inside. The shape of the hollow area is the same as that of the ultrasonic chip 21. The ultrasonic chip 21 is disposed within the hollow area within the touch circuit board. The projection of the ultrasonic chip 21 in a direction perpendicular to the touch circuit board is located within the hollow area, placing the ultrasonic chip 21 within the detection area of ​​the touch module 1. The ultrasonic chip 21 and the touch module 1 can be independently bonded to the cover of the electronic device.

[0047] In some embodiments, as Figure 3 As shown, the touch module 1 includes a touch circuit board, optionally, the touch circuit board is an FPC. A copper foil layer is provided on the PI substrate layer inside the FPC, and the copper foil layer is overlapped with the PI (polyimide) base layer. Optionally, the thickness of the PI substrate layer is 18μm-23μm, and the thickness of the copper foil layer is 8μm-15μm. For example, the thickness of the PI substrate layer is 20μm, and the thickness of the copper foil layer is 12μm. A touch sensing circuit is formed on the copper foil layer, and the copper foil layer serves as an ultrasonic matching layer and a touch sensing layer. The touch circuit board is electrically connected to the ultrasonic circuit board 22 by connector plugging, FPC welding, etc. In this embodiment, the touch detection area of ​​the touch circuit board is a rectangular structure, and the ultrasonic chip 21 is bonded to the detection area of ​​the touch circuit board. Optionally, the ultrasonic chip 21 is bonded to the copper foil layer. In this embodiment, the touch module 1 and the ultrasonic chip 21 are bonded into one body, and can be bonded as a whole to the cover of the electronic device for easy assembly.

[0048] In some embodiments, as Figure 4 As shown, the touch module 1 includes copper foil adhesive 4, which includes a copper foil layer. A touch sensing circuit is formed on the copper foil layer, so that the copper foil layer serves as an ultrasonic matching layer and a touch sensing layer. The copper foil layer is electrically connected to the ultrasonic circuit board 22, and the ultrasonic chip 21 is bonded to the copper foil layer. At the same time, the copper foil adhesive 4 is also used to bond the ultrasonic chip 21 to the cover of the electronic device.

[0049] In this embodiment, the copper foil glue 4 includes an adhesive layer, which includes a first adhesive layer and a second adhesive layer. The first adhesive layer is arranged on the first side of the copper foil layer, and the second adhesive layer is arranged on the second side of the copper foil layer. The first adhesive layer and the second adhesive layer are both double-sided adhesives. The second adhesive layer is bonded to the ultrasonic chip 21, and the first adhesive layer is used to bond to the cover plate of the electronic device.

[0050] In this embodiment, the thickness of the copper foil layer is 6 μm, the thickness of the first adhesive layer is 3 μm, and the thickness of the second adhesive layer is 6 μm. A connection area 41 is formed on the copper foil layer, and the connection area 41 is located at the edge of the copper foil layer. The connection area 41 is electrically connected to the ultrasonic circuit board 22 by welding or other means. Optionally, the connection area 41 is formed on the first side of the copper foil layer, and the first adhesive layer covers the area on the first side except the connection area 41. Alternatively, the connection area 41 is formed on the second side of the copper foil layer, and the second adhesive layer covers the area on the second side except the connection area 41. Alternatively, the connection area 41 is provided on both the first and second sides of the copper foil layer.

[0051] A connection area 41 is formed on the first surface and / or the second surface of the copper foil layer. The connection area 41 is not covered by the adhesive layer. The connection area 41 is electrically connected to the ultrasonic circuit board 22 .

[0052] In this embodiment, the touch module 1 is integrated into the copper foil adhesive 4 and bonded to the ultrasonic chip 21 as a whole, which simplifies the overall structure and facilitates assembly with electronic equipment.

[0053] According to the second aspect of the present application, an electronic device is provided. In some embodiments, the electronic device includes a notebook, an attendance machine, a keyboard, an access control system, an in-vehicle device, and other devices that do not include a touch screen. The above-mentioned ultrasonic fingerprint recognition structure can be provided to realize fingerprint unlocking and other functions. Alternatively, the electronic device can also be provided with a touch screen, and the ultrasonic fingerprint recognition structure is provided in an area that does not include the touch screen. In some embodiments, such as Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 As shown, the electronic device includes a cover plate 5 and the ultrasonic fingerprint recognition structure described above, which is bonded to the underside of the cover plate 5. Optionally, the cover plate 5 can be made of materials including, but not limited to, glass, aluminum, and plastic. Due to the strong penetrability of ultrasonic waves, the cover plate 5 does not need to have holes, which improves the product's aesthetics and waterproofness.

[0054] Optionally, in some embodiments, Figure 10 、 Figure 11 As shown, the electronic device further includes a protective cover 6, which is arranged on the lower side of the cover plate 5 and at least covers the ultrasonic chip 21 therein to protect the ultrasonic chip 21. In one embodiment, as Figure 10 As shown, the protective cover 6 is a rectangular cover-like structure with an opening formed on one side thereof and connecting edges formed on the other three sides for connecting with the cover plate 5. A cavity is formed inside the protective cover 6 so that a gap is formed between its inner wall and the ultrasonic chip 21 to avoid affecting the ultrasonic chip 21.

[0055] In some embodiments, as Figure 12 As shown, a touch recognition area 51 is provided on the first surface of the cover plate 5, allowing users to quickly and accurately locate the fingerprint recognition area by touch in low-light conditions. Optionally, the touch recognition area 51 may have a concave or convex structure, preferably a concave structure, which allows for touch recognition. In other embodiments, the touch recognition area 51 may also be provided with a logo pattern, text, or other means to serve as a visual identifier.

[0056] Furthermore, if Figure 13 As shown, a bonding and positioning area 52 is provided on the second surface of the cover plate 5. This area opposes the touch recognition area 51 and includes a raised or recessed structure to which the ultrasonic fingerprint recognition structure is bonded. This facilitates the bonding and positioning of the ultrasonic fingerprint recognition structure, improving assembly accuracy and efficiency and ensuring alignment between the ultrasonic fingerprint recognition structure and the touch recognition area 51.

[0057] In some embodiments, as Figure 5 、 Figure 6 As shown, the touch module 1 includes a touch circuit board with touch sensing circuitry formed thereon. The touch circuit board is annular in structure, with a hollowed-out area formed on its inner side. The touch module 1 is bonded to the underside of the cover plate 5 with adhesive 3. The ultrasonic chip 21 is bonded to the cover plate 5 with copper foil adhesive 4, and the bonding point between the copper foil adhesive 4 and the cover plate 5 is located within the hollowed-out area of ​​the touch circuit board. The detection area of ​​the touch module 1 surrounds the ultrasonic chip 21, enhancing detection accuracy.

[0058] In some embodiments, as Figure 7 、 Figure 8 As shown, the touch module 1 includes a touch circuit board, which is an FPC. A copper foil layer 12 is provided on a PI substrate layer 11 within the FPC. A touch sensing circuit is formed on the copper foil layer 12. At least a portion of the copper foil layer 12 constitutes a touch electrode plate, serving as both an ultrasonic matching layer and a touch sensing layer. An ultrasonic chip 21 is bonded to the copper foil layer 12, and the PI substrate layer 11 is bonded to the cover plate 5 via adhesive 3. In this embodiment, the structure of the touch module 1 is simplified, and the touch module 1 and ultrasonic chip 21 are bonded together, allowing the entire unit to be bonded to the cover plate 5, making assembly more convenient.

[0059] In some embodiments, as Figure 9As shown, the touch module 1 includes a copper foil adhesive 4, which includes a copper foil layer and an adhesive layer. A touch sensing circuit is formed on the copper foil layer, making the copper foil layer serve as both an ultrasonic matching layer and a touch sensing layer. The copper foil layer is electrically connected to the ultrasonic circuit board 22. The adhesive layer includes a first adhesive layer and a second adhesive layer. The first adhesive layer is provided on the first side of the copper foil layer, and the second adhesive layer is provided on the second side of the copper foil layer. Both the first and second adhesive layers are double-sided adhesives. The second adhesive layer is bonded to the ultrasonic chip 21, and the first adhesive layer is used to bond to the cover plate 5 of the electronic device. In this embodiment, the touch module 1 is integrated on the copper foil adhesive 4 and bonded to the ultrasonic chip 21, further simplifying the structure and facilitating assembly with the cover plate 5.

[0060] In an embodiment of the present application, ultrasonic fingerprint recognition is used in non-touch screen electronic devices to adapt to thicker cover plates 5, greatly increasing product strength and providing greater freedom in the terminal's structural design. Furthermore, there is no need to drill holes in the cover plate 5, which can enhance the product's aesthetics and waterproofness. Furthermore, since ultrasonic fingerprint recognition is less affected by the environment, its application scenarios are more extensive. While ultrasonic fingerprint detection is in progress, heart rate can be detected simultaneously, and heart rate detection can assist fingerprint detection, preventing the intrusion of fake fingerprints and making the device more secure and stable.

[0061] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0062] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0063] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in an appropriate manner in any at least one embodiment or example. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0064] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0065] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and simple improvements made to the essential contents of the present application shall be included in the scope of protection of the present application.

Claims

1. An ultrasonic fingerprint recognition structure, characterized in that: It is used to be set in an area of ​​an electronic device that does not include a touch screen, including: a touch module and an ultrasonic module, the ultrasonic module includes an ultrasonic chip and an ultrasonic circuit board, the ultrasonic chip is set on the ultrasonic circuit board, The touch module is electrically connected to the ultrasonic circuit board, and is used to detect whether a finger approaches, and trigger the ultrasonic chip to perform fingerprint recognition when a finger is detected approaching. The touch module includes copper foil adhesive, the copper foil adhesive includes a copper foil layer, a touch sensing circuit is formed on the copper foil layer, the copper foil layer is electrically connected to the ultrasonic circuit board, and the ultrasonic chip is adhered to the copper foil layer.

2. The ultrasonic fingerprint recognition structure according to claim 1, characterized in that: The touch module includes a touch circuit board on which a touch sensing circuit is formed. The touch circuit board is an annular structure. The ultrasonic chip is arranged in a hollow area inside the touch circuit board. The touch circuit board is electrically connected to the ultrasonic circuit board.

3. The ultrasonic fingerprint recognition structure according to claim 1, characterized in that: The touch module includes a touch circuit board, a touch sensing circuit is formed on the touch circuit board, the touch circuit board is electrically connected to the ultrasonic circuit board, and the ultrasonic chip is adhered to the touch circuit board.

4. The ultrasonic fingerprint recognition structure according to claim 2 or 3, characterized in that: The touch circuit board is a flexible circuit board, including a PI substrate layer and a copper foil layer, the copper foil layer and the PI substrate layer are overlapped, the PI substrate layer has a thickness of 18 μm-23 μm, and / or the copper foil layer has a thickness of 8 μm-15 μm.

5. The ultrasonic fingerprint recognition structure according to claim 1, characterized in that: The copper foil glue includes an adhesive layer, and the adhesive layer includes a first adhesive layer and a second adhesive layer. The first adhesive layer is arranged on the first surface of the copper foil layer, and the second adhesive layer is arranged on the second surface of the copper foil layer. The second adhesive layer is bonded to the ultrasonic chip to form a connection area on the first surface and / or the second surface of the copper foil layer. The connection area is not covered by the adhesive layer, and the connection area is electrically connected to the ultrasonic circuit board.

6. An electronic device, characterized in that: It comprises a cover plate and the ultrasonic fingerprint recognition structure according to any one of claims 1 to 5, wherein the ultrasonic fingerprint recognition structure is bonded to the lower side of the cover plate.

7. The electronic device according to claim 6, wherein: A touch recognition area is provided on the first surface of the cover plate.

8. The electronic device according to claim 7, wherein: The second surface of the cover plate is provided with an adhesive positioning area, the adhesive positioning area is opposite to the touch recognition area, and the adhesive positioning area is provided with a convex or concave structure. The ultrasonic fingerprint recognition structure is bonded to the convex or concave structure of the bonding positioning area.

9. The electronic device according to claim 6, wherein: The electronic device further comprises a protective cover, which is arranged on the lower side of the cover plate and at least covers the ultrasonic chip inside the protective cover.

10. An electronic device, characterized in that: It comprises a cover plate and the ultrasonic fingerprint recognition structure according to claim 2, wherein the touch circuit board is bonded to the lower side of the cover plate by bonding adhesive. The ultrasonic chip is bonded to the lower side of the cover plate by copper foil adhesive.

11. An electronic device, characterized in that: It comprises a cover plate and the ultrasonic fingerprint recognition structure according to claim 4, The PI substrate layer is bonded to the lower side of the cover plate by bonding adhesive.

12. An electronic device, characterized in that: It comprises a cover plate and the ultrasonic fingerprint recognition structure according to claim 5, The first adhesive layer is adhered to the lower side of the cover plate.

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