Wafer processing device

Abstract

The utility model relates to the field of wafer processing, and relates to a wafer processing device. The processing jig disclosed by the utility model is used for positioning a wafer product, and the driving assembly drives the wafer product on the processing jig to rotate or lift, so that the positioning effect is good, and rapid processing of the wafer product can be realized; the first damping assembly is arranged between the base plate and the machine frame, the second damping assembly is arranged between the base plate and the base plate, and by the adoption of the multiple damping structures, vibration to the machine frame and / or a shell can be effectively relieved in the working process that the driving assembly moves up and down and rotates to adjust a product, and the machining precision is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing and particularly to a wafer processing device. Background Art

[0002] Wafer dispensing technology is a critical technology in the advanced electronics manufacturing industry. It is widely used in chip packaging and integrated circuit equipment. Its purpose is to reduce the probability of component failure caused by factors such as thermal fluctuations, drops, and vibrations during product use, thereby extending the service life of the product.

[0003] During the processing, wafer products generally need to be rotated / lifted for position adjustment. During the drive adjustment, a large rotational / lifting torque will be generated, which is prone to vibration and causes uneven coating, thereby affecting the performance and quality of the wafer. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a wafer processing device with good positioning effect, which can realize rapid processing of wafer products, effectively reduce vibration during processing, and improve processing accuracy.

[0005] In order to solve the above technical problems, the technical solutions adopted by the present invention are as follows:

[0006] A wafer processing device, comprising:

[0007] A frame, wherein a processing station is provided on the frame;

[0008] A processing jig is provided on the processing station and is used to position the wafer product;

[0009] A drive assembly is provided on the frame, the drive assembly is connected to the processing jig, and the drive assembly is used to drive the wafer product on the processing jig to rotate or lift and adjust;

[0010] A base plate is arranged below the frame, and a first shock absorbing assembly is arranged between the base plate and the frame;

[0011] The bottom plate is arranged below the base plate, and a second shock absorbing component is arranged between the bottom plate and the base plate.

[0012] In one embodiment of the present invention, the first shock-absorbing assembly includes a plurality of shock-absorbing blocks, each of which is a rubber structure or a spring group structure. The plurality of shock-absorbing blocks are arranged around the base plate, a support plate is provided on the shock-absorbing blocks, the support plate is connected to the frame, and the shock-absorbing blocks are connected to the base plate through a connecting piece.

[0013] In one embodiment of the present invention, the connecting member includes a support screw, a support hole is opened on the base plate, a pad is provided between the shock absorbing block and the base plate, and the support screw passes through the support hole and is connected to the support nut.

[0014] In one embodiment of the present invention, the second shock absorbing assembly includes a plurality of shock absorbing components, the plurality of shock absorbing components are evenly arranged between the bottom plate and the base plate, and the shock absorbing components and the first shock absorbing assembly are staggered.

[0015] In one embodiment of the present invention, the shock absorbing component includes a mounting seat, which is fixedly arranged on the base plate. A mounting groove is provided on the mounting seat, a rubber block is provided in the mounting groove, and a free end of the rubber block is connected to the base plate.

[0016] In one embodiment of the present invention, a mounting screw is provided on the mounting groove, the rubber block is sleeved on the mounting screw, a connecting hole is provided on the base plate, and the mounting screw passes through the connecting hole and is connected to a fixing nut.

[0017] In one embodiment of the present invention, a strip groove is provided on the upper row of the base plate, the connecting hole is provided on the strip groove, the connecting hole is a strip structure, and the mounting screw is slidably provided on the connecting hole.

[0018] In one embodiment of the present utility model, the driving assembly includes a driving frame, which is arranged on a frame, and a plurality of driving cylinders are provided on the driving frame, and the driving cylinders are driven and connected to the processing frame, and the processing jig is arranged on the processing frame, and the driving cylinders are used to drive the processing jig on the processing frame to perform lifting movements, and the processing frame is provided with a driving motor, and the driving motor is driven and connected to the processing jig, and the driving motor is used to drive the processing jig to rotate.

[0019] In one embodiment of the present invention, the processing jig includes a jig frame, which is driven and connected to the drive assembly. A jig plate is provided on the jig frame, a jig groove is provided on the jig plate, a porous ceramic plate is provided in the jig groove, and a plurality of clamping components are evenly provided on the jig plate, and the wafer product is positioned by the clamping components and the porous ceramic plate.

[0020] In one embodiment of the present invention, the clamping component includes a positioning plate, a rotating shaft is provided on the positioning plate, a clamping plate is provided on the rotating shaft, a torsion spring is provided between the clamping plate and the rotating shaft, and the clamping plate is used to press the edge of the wafer product to position it on the positioning plate.

[0021] Beneficial effects of the utility model:

[0022] The processing jig of the present invention positions the wafer product, and the driving component drives the wafer product on the processing jig to rotate or lift and adjust, with good positioning effect, which can realize rapid processing of the wafer product; a first shock-absorbing component is arranged between the substrate and the frame, and a second shock-absorbing component is arranged between the bottom plate and the substrate. By adopting the above-mentioned multiple shock-absorbing structures, the vibration of the frame and / or the shell can be effectively reduced during the up and down movement and rotation adjustment of the product by the driving component, thereby improving the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of a wafer processing device of the present invention.

[0024] Figure 2 It is a schematic diagram of a processing jig of the present utility model.

[0025] Figure 3 It is a schematic diagram of the first shock absorbing component of the present utility model.

[0026] Explanation of the numbers in the figure: 1. Base plate; 2. Bottom plate; 3. Second shock-absorbing assembly; 31. Strip groove; 32. Mounting screw; 33. Fixing nut; 34. Mounting seat; 35. Rubber block; 4. Processing fixture; 41. Fixing plate; 42. Porous ceramic plate; 43. Processing frame; 44. Driving frame; 45. Driving cylinder; 46. Driving motor; 5. Housing; 51. Mounting part; 6. Clamping component; 61. Positioning plate; 62. Rotating shaft; 63. Clamping plate; 7. Driving assembly; 8. First shock-absorbing assembly; 81. Shock-absorbing block; 82. Pad; 83. Support screw; 84. Support plate; 9. Frame. DETAILED DESCRIPTION

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0028] Reference Figure 1 As shown, a wafer processing device includes:

[0029] A frame 9, wherein a processing station is provided on the frame 9;

[0030] A processing jig 4 is provided on the processing station and is used to position the wafer product;

[0031] A drive assembly 7 is provided on the frame 9, and the drive assembly 7 is connected to the processing jig 4 in a driving manner. The drive assembly 7 is used to drive the wafer product on the processing jig 4 to rotate or lift and adjust;

[0032] A base plate 1 is provided below the frame 9, a first shock absorbing assembly 8 is provided between the base plate 1 and the frame 9, a housing 5 is provided on the base plate 1, the housing 5 is covered on the processing jig 4, and the housing 5 is connected to the base plate 1 via a mounting member 51;

[0033] The bottom plate 2 is arranged below the base plate 1 , and a second shock absorbing assembly 3 is arranged between the bottom plate 2 and the base plate 1 .

[0034] The processing jig 4 of the present invention positions the wafer product, and the driving component 7 drives the wafer product on the processing jig 4 to rotate or lift and adjust, with good positioning effect, which can realize rapid processing of the wafer product; a first shock-absorbing component 8 is arranged between the substrate 1 and the frame 9, and a second shock-absorbing component 3 is arranged between the bottom plate 2 and the substrate 1. By adopting the above-mentioned multiple shock-absorbing structures, the vibration of the frame 9 and / or the shell 5 can be effectively reduced during the up and down and rotation adjustment of the product by the driving component 7, thereby improving the processing accuracy.

[0035] In one embodiment of the present invention, the first shock-absorbing assembly 8 includes a plurality of shock-absorbing blocks 81, which are rubber structures or spring group structures. The shock-absorbing blocks 81 mainly realize the functions of shock absorption and buffering. The above structure can better reduce the vibration of the frame 9 and / or the shell 5. The plurality of shock-absorbing blocks 81 are arranged on the base plate 1, and a support plate 84 is provided on the shock-absorbing blocks 81. The support plate 84 is connected to the frame 9, and the shock-absorbing blocks 81 are connected to the base plate 1 through a connecting piece.

[0036] In one embodiment of the present invention, the connecting member includes a support screw 83, a support hole is opened on the base plate 1, a pad 82 is provided between the shock absorbing block 81 and the base plate 1, and the support screw 83 passes through the support hole and is connected to the support nut.

[0037] Specifically, a pad 82 is provided between the shock-absorbing block 81 and the substrate 1, which can effectively increase the contact area with the substrate 1 and improve the stability of installation and use. The support screw 83 passes through the support hole and is connected to the support nut. The shock-absorbing block 81 is locked between the substrate 1 and the frame 9 through the support screw 83 and the support nut, ensuring the installation stability of the shock-absorbing block 81 and improving the shock-absorbing effect.

[0038] In one embodiment of the present invention, the second shock absorbing assembly 3 includes a plurality of shock absorbing components, which are evenly arranged between the bottom plate 2 and the base plate 1 , and the shock absorbing components and the first shock absorbing assembly 8 are staggered.

[0039] Specifically, the shock-absorbing components are staggered with the first shock-absorbing assembly 8, which can further reduce the vibration of the frame 9 and / or the housing 5 during the up and down and rotation adjustment of the driving assembly 7, thereby improving the wafer processing and coating accuracy.

[0040] In one embodiment of the present invention, the shock-absorbing component includes a mounting seat 34, which is fixedly arranged on the base plate 2. A mounting groove is provided on the mounting seat 34, and a rubber block 35 is provided in the mounting groove. The free end of the rubber block 35 is connected to the base plate 1.

[0041] Specifically, the installation is performed by combining a mounting seat 34 and a rubber block 35. The mounting seat 34 can position the rubber block 35, effectively reducing the difficulty of assembly. At the same time, arranging the rubber block 35 in the mounting groove can further ensure the relative position of the rubber block 35 and the substrate 1, thereby improving the shock absorption effect.

[0042] In one embodiment of the present invention, a mounting screw 32 is provided on the mounting groove, the rubber block 35 is sleeved on the mounting screw 32, a connecting hole is provided on the base plate 1, and the mounting screw 32 passes through the connecting hole and is connected to the fixing nut 33.

[0043] Specifically, the rubber block 35 is sleeved on the mounting screw 32, and the mounting screw 32 passes through the connecting hole and is connected to the fixing nut 33. The position of the rubber block 35 is limited by the mounting screw 32, thereby ensuring the shock-absorbing effect of the second shock-absorbing assembly 3, while reducing the assembly difficulty of the second shock-absorbing assembly 3 and making it easy to use.

[0044] In one embodiment of the present invention, a strip groove 31 is provided on the upper row of the base plate 1 , the connection hole is provided on the strip groove 31 , the connection hole is a strip-shaped structure, and the mounting screw 32 is slidably provided on the connection hole.

[0045] Specifically, the mounting screw 32 is slidably mounted on the connecting hole, which is a bar-shaped structure. By changing the locking position of the mounting screw 32 on the connecting hole, the relative position between the substrate 1 and the bottom plate 2 can be adjusted to ensure the shock absorption effect and improve the cleaning and coating accuracy.

[0046] In one embodiment of the present utility model, the driving assembly 7 includes a driving frame 44, which is arranged on the frame 9, and a plurality of driving cylinders 45 are provided on the driving frame 44, and the driving cylinders 45 are driven and connected to the processing frame 43. The processing jig 4 is arranged on the processing frame 43, and the driving cylinders 45 are used to drive the processing jig 4 on the processing frame 43 to perform lifting movements. The processing frame 43 is provided with a driving motor 46, and the driving motor 46 is driven and connected to the processing jig 4, and the driving motor 46 is used to drive the processing jig 4 to rotate.

[0047] Specifically, during the processing, the driving cylinder 45 drives the processing jig 4 on the processing frame 43 to perform lifting movements, and the driving motor 46 is used to drive the processing jig 4 to rotate, which can adjust the position of the wafer product up and down and rotate the product, and can more conveniently and quickly adjust the position of the product. The product posture can be adjusted online in real time, making subsequent processing more accurate.

[0048] In one embodiment of the present invention, the processing jig 4 includes a jig frame, which is driven and connected to the driving assembly 7. A jig plate 41 is provided on the jig frame, a jig groove is provided on the jig plate 41, and a porous ceramic plate 42 is provided in the jig groove. A plurality of clamping parts 6 are evenly arranged on the jig plate 41, and the wafer product is positioned by the clamping parts 6 and the porous ceramic plate 42.

[0049] Specifically, the wafer product is positioned by the clamping component 6 and the porous ceramic plate 42, so that the wafer product can be positioned quickly, ensuring the stability of wafer processing, and has the advantages of fast positioning speed and accurate wafer positioning.

[0050] In one embodiment of the present invention, the clamping component 6 includes a positioning plate 61, a rotating shaft 62 is provided on the positioning plate 61, a clamping plate 63 is provided on the rotating shaft 62, a torsion spring is provided between the clamping plate 63 and the rotating shaft 62, and the clamping plate 63 is used to press the edge of the wafer product to position it on the positioning plate 61.

[0051] Specifically, under the reaction force of the torsion spring, the end of the clamping plate 63 abuts against the wafer product, pressing the edge of the wafer product to be positioned on the positioning plate 61. Under the action of the torsion spring, the clamping plate 63 always presses against the product surface, thereby completing the multi-point positioning and clamping of the wafer product.

[0052] Usage process

[0053] The wafer product is placed on the porous ceramic plate 42 of the jig plate 41. Under the reaction force of the torsion spring, the end of the clamping plate 63 abuts against the wafer product, and the edge of the wafer product is pressed and positioned on the positioning plate 61, thereby completing the positioning of the wafer product. During the processing, the driving cylinder 45 drives the processing jig 4 on the processing frame 43 to perform lifting and lowering movements, and the driving motor 46 is used to drive the processing jig 4 to rotate, which can adjust the position of the wafer product up and down and rotate it, and has the advantages of fast positioning speed and accurate wafer positioning; a first shock-absorbing component 8 is provided between the substrate 1 and the frame 9, and a second shock-absorbing component 3 is provided between the bottom plate 2 and the substrate 1. By adopting the above-mentioned multiple shock-absorbing structure, the vibration of the frame 9 and / or the shell 5 can be effectively reduced during the working process of the driving component 7 to adjust the product up and down and rotate it, thereby improving the cleaning and coating accuracy.

[0054] The above-described embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A wafer processing device, characterized in that: include: A frame, wherein a processing station is provided on the frame; A processing jig is provided on the processing station and is used to position the wafer product; A drive assembly is provided on the frame, the drive assembly is connected to the processing jig, and the drive assembly is used to drive the wafer product on the processing jig to rotate or lift and adjust; A base plate is arranged below the frame, and a first shock absorbing assembly is arranged between the base plate and the frame; The bottom plate is arranged below the base plate, and a second shock absorbing component is arranged between the bottom plate and the base plate.

2. The wafer processing apparatus according to claim 1, wherein: The first shock-absorbing assembly includes a plurality of shock-absorbing blocks, each of which is a rubber structure or a spring group structure. The plurality of shock-absorbing blocks are arranged around the base plate, a support plate is provided on the shock-absorbing block, the support plate is connected to the frame, and the shock-absorbing block is connected to the base plate through a connecting piece.

3. The wafer processing apparatus according to claim 2, wherein: The connecting member includes a supporting screw, a supporting hole is opened on the base plate, a pad is arranged between the shock absorbing block and the base plate, and the supporting screw passes through the supporting hole and is connected with the supporting nut.

4. The wafer processing apparatus according to claim 1, wherein: The second shock absorbing assembly includes a plurality of shock absorbing components, which are evenly arranged between the bottom plate and the base plate, and the shock absorbing components and the first shock absorbing assembly are staggered.

5. The wafer processing apparatus according to claim 4, wherein: The shock absorbing component includes a mounting seat, which is fixedly arranged on the bottom plate. A mounting groove is provided on the mounting seat. A rubber block is provided in the mounting groove. The free end of the rubber block is connected to the base plate.

6. The wafer processing apparatus according to claim 5, wherein: The mounting groove is provided with a mounting screw, the rubber block is sleeved on the mounting screw, the base plate is provided with a connecting hole, the mounting screw passes through the connecting hole and is connected with a fixing nut.

7. The wafer processing apparatus according to claim 6, wherein: The upper row of the base plate is provided with a strip groove, the connecting hole is provided on the strip groove, the connecting hole is a strip structure, and the mounting screw is slidably provided on the connecting hole.

8. The wafer processing apparatus according to claim 1, wherein: The driving assembly includes a driving frame, which is arranged on a frame. A plurality of driving cylinders are provided on the driving frame. The driving cylinders are drivingly connected to the processing frame. The processing jig is arranged on the processing frame. The driving cylinders are used to drive the processing jig on the processing frame to perform lifting movements. A driving motor is provided on the processing frame. The driving motor is drivingly connected to the processing jig. The driving motor is used to drive the processing jig to rotate.

9. The wafer processing apparatus according to claim 1, wherein: The processing jig includes a jig frame, which is driven and connected to the drive assembly. A jig plate is provided on the jig frame, a jig groove is provided on the jig plate, a porous ceramic plate is provided in the jig groove, and a plurality of clamping components are evenly provided on the jig plate. The wafer product is positioned by the clamping components and the porous ceramic plate.

10. The wafer processing apparatus according to claim 9, wherein: The clamping component includes a positioning plate, a rotating shaft is provided on the positioning plate, a clamping plate is provided on the rotating shaft, a torsion spring is provided between the clamping plate and the rotating shaft, and the clamping plate is used to press the edge of the wafer product to position it on the positioning plate.

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