Electronic device

By independently arranging the protection module, the main board module and the battery cell module in the electronic device, the problem of the protection board being unable to be recycled is solved, the independent recycling and reuse of the protection module is achieved, and the environmental protection performance is improved.

CN223321316UActive Publication Date: 2025-09-09BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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Patent Information

Application Number
CN202422395708.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-29
Publication Date
2025-09-09
Estimated Expiration
2034-09-29

AI Technical Summary

Technical Problem

The protection board and battery cell in electronic equipment are packaged together, which makes the protection board unable to be recycled and reused, affecting environmental performance.

Method used

An electronic device structure is designed so that a protection module is arranged independently from a mainboard module and a battery cell module. The protection module is accommodated by an avoidance gap on a rib structure. The protection module is electrically connected to the mainboard module and the battery cell module and can be independently produced and recycled.

Benefits of technology

The independent recycling and reuse of the protection module is realized, and the environmental performance of the electronic equipment is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides electronic equipment, and belongs to the technical field of electronics. The electronic equipment comprises a middle frame module, a mainboard module, a battery cell module and a protection module, a mainboard bin and a battery bin are arranged on the middle frame module, and the mainboard bin and the battery bin are separated from each other through a rib structure; the mainboard module is located in the mainboard bin, and the battery cell module is located in the battery bin; the rib structure is provided with an avoiding notch, the protection module is located in the avoiding notch, and the protection module is electrically connected with the mainboard module and the battery cell module. According to the electronic equipment, the protection module and the battery cell module are independently arranged and can be independently produced, assembled and disassembled, and the protection module is not affected by aging of materials such as electrolyte in the battery cell module and can be independently recycled, so that the electronic equipment has better environment-friendly performance.
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Description

Technical Field

[0001] The utility model relates to the technical field of electronics, in particular to an electronic device. Background Art

[0002] With the continuous development of electronic devices such as mobile phones, the speed of electronic device updates is getting faster and faster. In this context, the recycling and reuse of components in waste electronic devices and other green environmental protection needs are becoming more and more important.

[0003] In related technologies, electronic devices rely on battery modules for power. Battery modules typically consist of packaged cells and protective boards. The cells store and provide power, while the protective boards protect the cells. However, as materials such as the electrolyte and lithium cobalt oxide in the cells age, their performance significantly degrades, rendering them unreusable. Furthermore, the protective boards, packaged together with the cells, cannot be recycled. Utility Model Content

[0004] The utility model provides an electronic device, which can solve the problem that the protection plate of the battery module cannot be recycled.

[0005] The technical solution is as follows:

[0006] In one aspect, an electronic device is provided, comprising: a middle frame module, a mainboard module, a battery module, and a protection module;

[0007] The middle frame module is provided with a mainboard compartment and a battery compartment, and the mainboard compartment and the battery compartment are separated from each other by a rib structure;

[0008] The mainboard module is located in the mainboard compartment, and the battery cell module is located in the battery compartment;

[0009] The rib structure is provided with an avoidance gap, the protection module is located in the avoidance gap, and the protection module is electrically connected to the mainboard module and the battery core module respectively.

[0010] In some embodiments, a first abutment contact is provided on a side of the protection module facing the mainboard module, and a second abutment contact is provided on a side of the protection module facing the battery module;

[0011] The mainboard module is provided with a mainboard contact on the side facing the protection module, and the mainboard contact is in abutment with the first abutment contact; the battery cell module is provided with a battery cell contact on the side facing the protection module, and the battery cell contact is in abutment with the second abutment contact.

[0012] In some embodiments, the protection module is provided with at least one first clip structure, and at least one of the mainboard module and the battery cell module is provided with a second clip structure, and the first clip structure and the second clip structure are clip-connected.

[0013] In some embodiments, a narrowing rib is provided at the bottom of the avoidance gap, and the narrowing rib extends in a direction parallel to the rib structure and respectively connects the rib structures on both sides of the avoidance gap.

[0014] In some embodiments, the protection module is provided with a groove structure, the groove structure has the same shape as the narrowing rib, and the groove structure is clip-connected to the narrowing rib.

[0015] In some embodiments, the protection module includes a first circuit board, a chip device, and a resistor and capacitor device;

[0016] The first circuit board is arranged along the thickness direction of the middle frame module, and two working surfaces of the first circuit board face the main board module and the battery cell module respectively;

[0017] The chip device is embedded in the first circuit board, and the resistor and capacitor device is located on one of the working surfaces.

[0018] In some embodiments, the protection module further includes an encapsulation layer, the encapsulation layer is located on the two working surfaces, and the resistor and capacitor components located on the working surfaces are all immersed in the corresponding encapsulation layer;

[0019] When the protection module includes a first abutting contact point and a second abutting contact point, the first abutting contact point and the second abutting contact point are respectively located on the packaging layers corresponding to the two working surfaces.

[0020] In some embodiments, the protection module also includes a second circuit board, which is vertically connected to the working surface where the resistor and capacitor components are located and is located on one side edge of the working surface. The second circuit board is used for circuit bridging between the first circuit board and the corresponding first abutment contact or the second abutment contact.

[0021] In some embodiments, the working surface includes a first working surface and a second working surface, and the encapsulation layer includes a first encapsulation layer and a second encapsulation layer;

[0022] The first working surface faces the mainboard module, and the second working surface faces the battery core module;

[0023] The resistor-capacitor component and the first packaging layer are respectively located on the first working surface, and the resistor-capacitor component is completely immersed in the first packaging layer, and the first abutting contact point is located on the first packaging layer;

[0024] The second packaging layer is located on the second working surface, and the second abutting contact is located on the second packaging layer.

[0025] In some embodiments, when the protection module includes a groove structure, the groove structure is located on a side surface of the first circuit board facing the bottom of the avoidance gap;

[0026] and / or,

[0027] When the protection module includes a second circuit board, the second circuit board is located on an edge of the first working surface facing the bottom of the avoidance gap.

[0028] In some embodiments, the protection module includes a charging circuit, a discharging circuit, and a protection module, the charging circuit being electrically connected to the mainboard module and the battery module, respectively, and the discharging circuit being electrically connected to the mainboard module and the battery module, respectively;

[0029] The protection module is electrically connected to the charging circuit and the discharging circuit respectively. The protection module is used to monitor the working status of the charging circuit and / or the discharging circuit and control the charging circuit and / or the discharging circuit to be shut down under abnormal conditions.

[0030] The beneficial effects of the technical solution provided by the utility model include at least:

[0031] In the electronic device of the present invention, the mainboard module and the battery module are respectively arranged in the mainboard compartment and the battery compartment of the middle frame module. The rib structure between the mainboard compartment and the battery compartment utilizes an avoidance gap to accommodate the protection module. The protection module can be connected to the mainboard module and the battery module battery cells respectively to play the role of power transmission and battery cell protection. The protection module and the battery cell module are independently arranged and can be independently produced and assembled and disassembled. The protection module will not be affected by the aging of materials such as the electrolyte in the battery cell module and can be independently recycled and reused, so that the electronic device has better environmental performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1It is a structural diagram of an electronic device provided by an embodiment of the present utility model;

[0034] Figure 2 This is a schematic structural diagram of the middle frame module provided by an embodiment of the present utility model;

[0035] Figure 3 This is a schematic diagram of the connection between the protection module, the mainboard module, and the battery module provided by the embodiment of the utility model;

[0036] Figure 4 This is a schematic structural diagram of the first abutment contact, the second abutment contact, the mainboard contact, and the battery cell contact provided in an embodiment of the present utility model;

[0037] Figure 5 This is a schematic diagram of the connection between the protection module and the narrowing rib provided in an embodiment of the present utility model;

[0038] Figure 6 This is a schematic structural diagram of a protection module provided by an embodiment of the present utility model;

[0039] Figure 7 Schematic diagram of the circuit structure of the protection module provided by the embodiment of the present utility model.

[0040] The reference numerals in the figures represent respectively:

[0041] 1. Middle frame module;

[0042] 11. Mainboard compartment; 12. Battery compartment; 13. Rib structure; 131. Avoidance gap; 1311. Narrowing ribs;

[0043] 2. Mainboard module;

[0044] 21, mainboard contact; 211, second P+ contact; 212, second P- contact; 213, second control contact;

[0045] 3. Battery cell module;

[0046] 31, battery cell contact; 311, second B+ contact; 312, second B- contact;

[0047] 4. Protect the module;

[0048] 41. First abutting contact; 411. First P+ contact; 412. First P- contact; 413. First control contact; 42. Second abutting contact; 421. First B+ contact; 422. First B- contact; 43. Groove structure; 44. First circuit board; 4401. First working surface; 4402. Second working surface; 45. Chip device; 46. Resistor and capacitor device; 47. Encapsulation layer; 4701. First encapsulation layer; 4702. Second encapsulation layer; 48. Second circuit board;

[0049] 401, charging circuit; 402, discharging circuit; 403, protection module. DETAILED DESCRIPTION

[0050] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0051] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate directions or positional relationships based on the attached figures. Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] It should be understood that in this application, "electrical connection" can be understood as the physical contact and electrical conduction of components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals. "Communication connection" can refer to electrical signal transmission, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to a connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship, that is, A is connected to B or A and B are connected to each other, which means that there is a fastening component (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0053] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those skilled in the art.

[0054] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0055] Combine Figure 1 and Figure 2As shown, this embodiment provides an electronic device, which includes: a middle frame module 1, a mainboard module 2, a battery module 3 and a protection module 4.

[0056] The middle frame module 1 is provided with a mainboard compartment 11 and a battery compartment 12 , which are separated from each other by a rib structure 13 ; the mainboard module 2 is located in the mainboard compartment 11 , and the battery cell module 3 is located in the battery compartment 12 .

[0057] An avoidance gap 131 is provided on the rib structure 13 , and the protection module 4 is located in the avoidance gap 131 . The protection module 4 is electrically connected to the mainboard module 2 and the battery module 3 , respectively.

[0058] In the electronic device of this embodiment, the mainboard module 2 and the battery module 3 are respectively arranged in the mainboard compartment 11 and the battery compartment 12 of the middle frame module 1. The rib structure 13 between the mainboard compartment 11 and the battery compartment 12 uses an avoidance gap 131 to accommodate the protection module 4. The protection module 4 can be connected to the mainboard module 2 and the battery module 3 cells respectively, playing the role of power transmission and battery cell protection.

[0059] In this embodiment, the protection module 4 and the battery module 3 are arranged independently and can be independently produced and assembled and disassembled. The protection module 4 will not be affected by the aging of materials such as the electrolyte in the battery module 3 and can be independently recycled and reused, so that the electronic device has better environmental performance.

[0060] The motherboard module 2, also known as the mainboard, is the core component of any electronic device. It's also called the main control board or main chip board. The motherboard integrates key electronic components like the processor, memory, storage chips, wireless communication chips, and power management chips. It controls the various functions and operations of the phone. For example, the processor handles data operations, the storage chips store data, and the wireless communication chips transmit phone signals.

[0061] Combine Figure 3 As shown, in some embodiments, a first abutment contact 41 is provided on a side of the protection module 4 facing the mainboard module 2 , and a second abutment contact 42 is provided on a side of the protection module 4 facing the battery module 3 .

[0062] The mainboard module 2 is provided with a mainboard contact 21 on the side facing the protection module 4 , and the mainboard contact 21 is in contact with the first abutting contact 41 ; the battery cell module 3 is provided with a battery cell contact 31 on the side facing the protection module 4 , and the battery cell contact 31 is in contact with the second abutting contact 42 .

[0063] Through the above arrangement, the protection module 4 can be contacted and connected with the mainboard module 2 and the battery cell module 3 respectively through the first abutment contact 41 and the second abutment contact 42. When the protection module 4, the mainboard module 2 and the battery cell module 3 are respectively assembled into the middle frame module 1, the first abutment contact 41 of the protection module 4 is exactly abutted with the position of the mainboard contact 21 of the mainboard module 2, and the second abutment contact 42 of the protection module 4 is exactly abutted with the position of the battery cell contact 31 of the battery cell module 3, so that the battery cell module 3 and the mainboard module 2 establish an electrical connection.

[0064] In some possible implementations, reference Figure 4 As shown, the first abutting contact 41 includes a first P+ contact, a first P-contact 412, and at least one first control contact 413, and the mainboard contact 21 includes a second P+ contact, a second P-contact 212, and at least one second control contact 213. The first P+ contact and the second P+ contact are in corresponding abutment contact, the first P-contact 412 and the second P-contact 212 are in corresponding abutment contact, and the at least one control contact and the at least one second control contact 213 are in one-to-one abutment contact.

[0065] The second abutting contact 42 includes a first B+ contact and a second B- contact 312, and the cell contact 31 includes a second B+ contact and a second B- contact 312. The first B+ contact and the second B+ contact are in corresponding abutting contact, and the second B- contact 312 and the second B- contact 312 are in corresponding abutting contact.

[0066] In some embodiments, the protection module 4 is provided with at least one first clamping structure, and at least one of the mainboard module 2 and the battery cell module 3 is provided with a second clamping structure, and the first clamping structure and the second clamping structure are clamped and connected.

[0067] Through the above arrangement, the protection module 4 can be connected to the mainboard module 2 or the battery cell module 3 by using the first clamping structure and the second clamping structure, ensuring the reliability of the contact connection between the first abutment contact 41 and the mainboard contact 21, and the second abutment contact 42 and the battery cell contact 31.

[0068] Combine Figure 2 As shown, in some embodiments, a narrowing rib 1311 is provided at the bottom of the avoidance gap 131 . The narrowing rib 1311 extends in a direction parallel to the rib structure 13 and connects the rib structures 13 on both sides of the avoidance gap 131 .

[0069] In this embodiment, to compensate for the strength loss caused by the provision of the relief notch 131 in the rib structure 13, a narrowing rib 1311 is arranged within the relief notch 131, parallel to the rib structure 13 and connected to the rib structure 13 on both sides. The narrowing rib 1311 compensates for the strength of the rib structure 13, ensuring the structural strength of the middle frame module 1. Furthermore, the narrow width of the narrowing rib 1311 does not affect the assembly of the protection module 4 within the relief notch 131.

[0070] Combine Figure 5 As shown, in some embodiments, the protection module 4 is provided with a groove structure 43 , which has the same shape as the narrowing rib 1311 , and the groove structure 43 is snap-connected to the narrowing rib 1311 .

[0071] Through the above arrangement, the protection module 4 can utilize the groove structure 43 to engage with the narrowing rib 1311 , thereby improving the reliability and stability of the protection module 4 in the avoidance gap 131 .

[0072] Combine Figure 5 and Figure 6 As shown, in some embodiments, the protection module 4 includes a first circuit board 44 , a chip device 45 and a resistor and capacitor device 46 .

[0073] First circuit board 44 is arranged along the thickness of middle frame module 1, with two working surfaces (e.g., first working surface 4401 and second working surface 4402) facing mainboard module 2 and battery cell module 3, respectively. Chip components 45 are embedded within first circuit board 44, and resistor and capacitor components 46 are located on one of the working surfaces.

[0074] In this embodiment, considering that the rib structure 13 has a larger dimension along the thickness direction, but a smaller dimension along the direction between the main board module 2 and the battery cell module 3, and the first circuit board 44 in the protection module 4 needs to carry chip devices 45 and resistor and capacitor devices 46, the dimension parallel to the working surface is difficult to be compressed, but the dimension perpendicular to the working surface can be further compressed by embedding the chip device 45.

[0075] Therefore, through the above arrangement, the first circuit board 44 of the protection module 4 is arranged along the thickness direction of the middle frame module 1, with one working surface facing the mainboard module 2 and the other protection module 4 facing the battery cell module 3, and the chip device 45 is embedded in the design, and the resistor and capacitor devices 46 are arranged on the working surface. The structure of the protection module 4 conforms to the spatial shape of the avoidance gap 131 and can make full use of the space within the avoidance gap 131.

[0076] Exemplarily, the first circuit board 44 is a printed circuit board (PCB).

[0077] Combine Figure 5 As shown, in some embodiments, the protection module 4 further includes a packaging layer 47 . The packaging layer 47 is located on the two working surfaces, and the resistor and capacitor components 46 located on the working surfaces are all immersed in the corresponding packaging layer 47 .

[0078] When the protection module 4 includes the first abutting contact 41 and the second abutting contact 42 , the first abutting contact 41 and the second abutting contact 42 are respectively located on the packaging layer 47 corresponding to the two working surfaces.

[0079] Through the above arrangement, both working surfaces of the first circuit board 44 are covered by the packaging layer 47 , which can protect the wiring structure and the resistor and capacitor components 46 on the working surfaces.

[0080] Combine Figure 5 As shown, in some embodiments, the protection module 4 also includes a second circuit board 48, which is vertically connected to the working surface where the resistor and capacitor components 46 are located and is located on one side edge of the working surface. The second circuit board 48 is used for circuit bridging between the first circuit board 44 and the corresponding first abutment contact 41 or the second abutment contact 42.

[0081] In this embodiment, since a certain number of resistors and capacitors 46 are necessarily present in protection module 4, these resistors and capacitors 46 can only be arranged on the working surface of first circuit board 44. To address the placement of first abutting contacts 41 or second abutting contacts 42, the thickness of encapsulation layer 47 is increased so that encapsulation layer 47 covers all resistors and capacitors 46, thereby allowing first abutting contacts 41 and second abutting contacts 42 to be arranged on the surface of encapsulation layer 47. However, this structure places first abutting contacts 41 and second abutting contacts 42 at a large distance from the working surface of first circuit board 44, lacking a reliable electrical connection. Therefore, a second circuit board 48 is arranged perpendicularly to one side edge of the working surface. One end of second circuit board 48 is connected to the working surface, and the other end extends to the surface of encapsulation layer 47. This second circuit board 48 can be used as a circuit bridge between first circuit board 44 and first abutting contacts 41 or second abutting contacts 42.

[0082] In addition, for another working surface of the first circuit board 44 where the resistor and capacitor components 46 are not provided, the thickness of the packaging layer 47 is relatively small, and the corresponding first abutting contact 41 or second abutting contact 42 can be directly connected to the circuit of the working surface.

[0083] Exemplarily, the second circuit board 48 is a printed circuit board (PCB).

[0084] Combine Figure 3 、 Figure 5 and Figure 6As shown, in some embodiments, the working surface includes a first working surface 4401 and a second working surface 4402 , and the encapsulation layer 47 includes a first encapsulation layer 4701 and a second encapsulation layer 4702 .

[0085] The first working surface 4401 faces the mainboard module 2, and the second working surface 4402 faces the battery cell module 3; the resistor and capacitor component 46 and the first packaging layer 4701 are respectively located on the first working surface 4401, and the resistor and capacitor component 46 are completely immersed in the first packaging layer 4701, and the first abutment contact 41 is located on the first packaging layer 4701; the second packaging layer 4702 is located on the second working surface 4402, and the second abutment contact 42 is located on the second packaging layer 4702.

[0086] Through the above arrangement, the first working surface 4401 of the first circuit board 44 faces the main board module 2, and the resistor and capacitor components 46 are arranged thereon. After being sealed by the packaging layer 47, the first abutting contact 41 is arranged on the surface of the packaging layer 47. The part of the resistor and capacitor component 46 on the first working surface 4401 can be cut and connected to the main board module 2 with the help of the first abutting contact 41 for battery connection.

[0087] Combine Figure 5 As shown, in some embodiments, when the protection module 4 includes a groove structure 43, the groove structure 43 is located on the side surface of the first circuit board 44 facing the bottom of the avoidance gap 131; since the first circuit board 44 is arranged along the thickness direction of the middle frame module 1, when the groove structure 43 is arranged on the first circuit board 44, it is only formed by using the side surface of the first circuit board 44 to form a depression, which has no effect on the two working surfaces of the first circuit board 44, and has little effect on the chip devices 45, resistor and capacitor devices 46 and wiring structures on the first circuit board 44, and is easy to process and has low cost.

[0088] Combine Figure 5 As shown, in some embodiments, when the protection module 4 includes the second circuit board 48 , the second circuit board 48 is located on the edge of the first working surface 4401 facing the bottom of the avoidance gap 131 .

[0089] Through the above arrangement, the second circuit board 48 is arranged on the edge of the bottom of the first working surface 4401 facing the avoidance gap 131, which can realize the circuit bridging of the first abutting contact 41 and the first circuit board 44, and the position of the second circuit board 48 corresponds to the position of the groove structure 43 of the first circuit board 44, which can compensate for the strength loss of the bottom of the first circuit board 44 due to the opening of the groove structure 43.

[0090] Combine Figure 7As shown, in some embodiments, the protection module 4 includes a charging circuit 401, a discharging circuit 402, and a protection module 403. The charging circuit 401 is electrically connected to the mainboard module 2 and the battery module 3, respectively, and the discharging circuit 402 is electrically connected to the mainboard module 2 and the battery module 3, respectively. The protection module 403 is electrically connected to the charging circuit 401 and the discharging circuit 402, respectively. The protection module 403 is used to monitor the operating status of the charging circuit 401 and / or the discharging circuit 402, and control the charging circuit 401 and / or the discharging circuit 402 to be shut down in an abnormal state.

[0091] Through the above arrangement, the protection module 4 can monitor the working status of the battery module 3 and control charging or discharging to stop in an abnormal state, thereby protecting the battery module 3 and the mainboard module 2.

[0092] In some embodiments, the electronic device can be any of various types of computer system devices that are mobile or portable and perform wireless communication. Specifically, the electronic device can be a mobile phone or smart phone (e.g., an iPhone™-based phone, an Android™-based phone), a portable gaming device (e.g., a Nintendo DS™, a PlayStation Portable™, a Gameboy Advance™, an iPhone™), a laptop computer, a PDA, a portable internet device, a music player, a data storage device, other handheld devices, and devices such as headphones. The electronic device can also be other wearable devices that require charging (e.g., a head-mounted device (HMD) such as an electronic bracelet, an electronic necklace, an electronic device, or a smart watch).

[0093] The electronic device can also be any one of a plurality of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices, and digital cameras and combinations thereof.

[0094] In some cases, the electronic device can perform multiple functions (e.g., play music, display video, store pictures, and receive and send phone calls). If desired, the electronic device can be a cellular phone, a media player, other handheld device, a wristwatch device, a pendant device, an earpiece device, or other compact portable device.

[0095] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0096] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0097] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention.

[0098] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that: The electronic device comprises: a middle frame module (1), a mainboard module (2), a battery module (3) and a protection module (4); The middle frame module (1) is provided with a mainboard compartment (11) and a battery compartment (12), and the mainboard compartment (11) and the battery compartment (12) are spaced apart from each other by a rib structure (13); The mainboard module (2) is located in the mainboard compartment (11), and the battery cell module (3) is located in the battery compartment (12); The rib structure (13) is provided with an avoidance notch (131), the protection module (4) is located in the avoidance notch (131), and the protection module (4) is electrically connected to the mainboard module (2) and the battery core module (3) respectively.

2. The electronic device according to claim 1, wherein The side of the protection module (4) facing the mainboard module (2) is provided with a first abutment contact (41), and the side of the protection module (4) facing the battery module (3) is provided with a second abutment contact (42); The mainboard module (2) is provided with a mainboard contact (21) on the side facing the protection module (4), and the mainboard contact (21) is in abutment contact with the first abutment contact (41); the battery cell module (3) is provided with a battery cell contact (31) on the side facing the protection module (4), and the battery cell contact (31) is in abutment contact with the second abutment contact (42).

3. The electronic device according to claim 2, wherein: The protection module (4) is provided with at least one first clamping structure, and at least one of the mainboard module (2) and the battery core module (3) is provided with a second clamping structure, and the first clamping structure and the second clamping structure are clamped and connected.

4. The electronic device according to claim 1, wherein: A narrowing rib (1311) is provided at the bottom of the avoidance gap (131), and the narrowing rib (1311) extends in a direction parallel to the rib structure (13) and respectively connects the rib structure (13) on both sides of the avoidance gap (131).

5. The electronic device according to claim 4, characterized in that The protection module (4) is provided with a groove structure (43), the groove structure (43) has the same shape as the narrowing rib (1311), and the groove structure (43) is connected to the narrowing rib (1311) by snapping.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The protection module (4) includes a first circuit board (44), a chip device (45) and a resistor and capacitor device (46); The first circuit board (44) is arranged along the thickness direction of the middle frame module (1), and two working surfaces of the first circuit board (44) face the main board module (2) and the battery core module (3) respectively; The chip device (45) is embedded in the interior of the first circuit board (44), and the resistor and capacitor device (46) is located on one of the working surfaces.

7. The electronic device according to claim 6, wherein: The protection module (4) further comprises an encapsulation layer (47), the encapsulation layer (47) being located on the two working surfaces, and the resistor and capacitor components (46) located on the working surfaces are all immersed in the corresponding encapsulation layer (47); When the protection module (4) includes a first abutting contact point (41) and a second abutting contact point (42), the first abutting contact point (41) and the second abutting contact point (42) are respectively located on the packaging layers (47) corresponding to the two working surfaces.

8. The electronic device according to claim 7, wherein: The protection module (4) further includes a second circuit board (48), the second circuit board (48) being vertically connected to the working surface where the resistor and capacitor components (46) are located and being located at one side edge of the working surface, the second circuit board (48) being used for circuit bridging between the first circuit board (44) and the corresponding first abutting contact (41) or the second abutting contact (42).

9. The electronic device according to claim 8, wherein: The working surface includes a first working surface (4401) and a second working surface (4402); the encapsulation layer (47) includes a first encapsulation layer (4701) and a second encapsulation layer (4702); The first working surface (4401) faces the mainboard module (2), and the second working surface (4402) faces the battery core module (3); The resistor-capacitor component (46) and the first packaging layer (4701) are respectively located on the first working surface (4401), and the resistor-capacitor component (46) is completely immersed in the first packaging layer (4701), and the first abutting contact point (41) is located on the first packaging layer (4701); The second packaging layer (4702) is located on the second working surface (4402), and the second abutting contact point (42) is located on the second packaging layer (4702).

10. The electronic device according to claim 9, characterized in that When the protection module (4) includes a groove structure (43), the groove structure (43) is located on the side surface of the first circuit board (44) facing the bottom of the avoidance gap (131); and / or, When the protection module (4) includes a second circuit board (48), the second circuit board (48) is located on the edge of the first working surface (4401) facing the bottom of the avoidance gap (131).

11. The electronic device according to claim 1, wherein The protection module (4) comprises a charging circuit (401), a discharging circuit (402) and a protection module (403); the charging circuit (401) is electrically connected to the mainboard module (2) and the battery module (3), respectively; the discharging circuit (402) is electrically connected to the mainboard module (2) and the battery module (3), respectively; The protection module (403) is electrically connected to the charging circuit (401) and the discharging circuit (402) respectively. The protection module (403) is used to monitor the working status of the charging circuit (401) and / or the discharging circuit (402), and control the charging circuit (401) and / or the discharging circuit (402) to be turned off in an abnormal state.