Industrial camera

Abstract

The utility model discloses an industrial camera, which comprises a casing and a plurality of electrical modules arranged in the casing, the industrial camera further comprises at least one heat dissipation conduction piece, the at least one electrical module corresponds to the heat dissipation conduction piece, the heat dissipation conduction piece is connected with the corresponding electrical module, and the heat dissipation conduction piece is connected with the casing. The heat dissipation conduction piece comprises a first heat dissipation face and a second heat dissipation face, the first heat dissipation face is opposite to the corresponding electrical module, the distance between the first heat dissipation face and the electrical module does not exceed a set distance, and the second heat dissipation face abuts against the inner side wall of the machine shell. The LED lamp has a good heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of machine vision, in particular to an industrial camera. Background Art

[0002] Industrial cameras are often used in industrial production. During use, the electrical modules inside the cameras generally need to be in operation for a long time, which causes the industrial cameras to generate a lot of heat. To ensure the normal operation of the industrial cameras, the electrical modules inside the industrial cameras need to be cooled in a timely manner.

[0003] The internal cavity space of the industrial standard small array camera is small and the number of electrical modules is large. Therefore, heat dissipation becomes a key factor to be considered when designing industrial standard small array cameras. Utility Model Content

[0004] The present invention aims to solve one of the technical problems in the related art to a certain extent. To this end, the present invention provides an industrial camera that can improve the heat dissipation of the camera and is easy to assemble, and has a good heat dissipation effect.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An industrial camera includes a housing and multiple electrical modules disposed within the housing. The industrial camera also includes at least one heat dissipation conductive member. At least one of the electrical modules corresponds to the heat dissipation conductive member, and the heat dissipation conductive member is connected to the corresponding electrical module. The heat dissipation conductive member includes a first heat dissipation surface and a second heat dissipation surface. The first heat dissipation surface is opposite to the corresponding electrical module, and the distance between the first heat dissipation surface and the electrical module does not exceed a set distance. The second heat dissipation surface abuts against the inner wall of the housing.

[0007] In this technical solution, a heat dissipation conductor connected to the electrical module is set up in the casing. The heat dissipation conductor can transfer the heat generated by the electrical module to the casing. Compared with the prior art in which the electrical module directly contacts the casing, the heat dissipation conductor occupies a small space and can conduct heat, and can increase the heat dissipation area, thereby improving the heat dissipation effect of the industrial camera, which helps to standardize the miniaturization setting of the industrial camera and improve the working efficiency of the industrial camera.

[0008] Furthermore, the heat dissipation component is arranged on the outer side of the side wall where the second heat dissipation surface abuts against the housing.

[0009] Furthermore, the heat dissipation conductive element includes a heat-conducting substrate and at least one heat-conducting plate. The heat-conducting substrate includes a first heat dissipation surface and a substrate back surface opposite the first heat dissipation surface. The heat-conducting plate is located on the back surface of the heat-conducting substrate. The inner surface of the heat-conducting plate is in contact with the substrate back surface. The outer surface of the heat-conducting plate is opposite the inner surface of the heat-conducting plate and forms the second heat dissipation surface. By providing the heat-conducting substrate opposite the end surface of the electrical module, the heat-conducting substrate can cover all heat-generating components on the electrical module, thereby increasing the heat dissipation area at the input end of the heat dissipation conductive element. In addition, the design of the heat-conducting plate can increase the contact area between the heat dissipation conductive element and the housing, that is, increase the heat dissipation area at the output end of the heat dissipation conductive element, thereby improving the heat dissipation effect. Moreover, the heat dissipation conductive element is provided as an integrated structure, which is easier to install and has better integrity than a split structure, and can further improve the heat conduction efficiency.

[0010] Furthermore, the heat dissipation conductive member includes at least one vertical plate and at least one connecting plate, the vertical plate corresponding to the connecting plate in a one-to-one relationship. Both the vertical plate and the connecting plate are located on the back side of the thermally conductive base plate. One end of the vertical plate is connected to the thermally conductive base plate, and the other end of the vertical plate is provided with a corresponding connecting plate, which is connected to the corresponding electrical module. The connecting plate and the thermally conductive base plate are arranged in a non-planar structure, and the connecting plate is positioned away from the electrical module, which can also facilitate the avoidance of connecting wires, avoid interference with other components of the industrial camera, and prevent damage to the electrical module during installation.

[0011] Furthermore, the heat dissipation conductive member further includes a convex bump provided on the first heat dissipation surface of the heat conductive substrate and protruding toward the back side of the corresponding electrical module, so that the heat dissipation conductive member is closer to the electrical module to achieve a better heat dissipation effect.

[0012] Furthermore, a first connecting portion is provided on the electrical module corresponding to the heat dissipation conductive member, and a threaded hole is formed on the first connecting portion. A connecting hole corresponding to the threaded hole is provided on the heat dissipation conductive member, and the connecting hole and the threaded hole are connected by screws to connect the heat dissipation conductive member to the corresponding electrical module.

[0013] Furthermore, the industrial camera includes a heat sink assembly disposed on an outer wall of the housing for dissipating heat from the housing. The heat sink assembly is disposed outside the housing, eliminating the need to occupy space within the housing, contributing to a more compact design for the industrial camera and improving heat dissipation during use.

[0014] Furthermore, the heat dissipation component is arranged on the outer side of the side wall where the second heat dissipation surface abuts against the housing.

[0015] Furthermore, the heat dissipation assembly includes a heat dissipation mounting plate and a plurality of fins arranged on a first end surface of the heat dissipation mounting plate. The heat dissipation mounting plate is fixedly connected to the outer wall of the casing, and the second end surface of the heat dissipation mounting plate opposite to the first end surface is arranged opposite to the surface of the outer wall of the casing.

[0016] Furthermore, the heat dissipation assembly further includes a phase change material layer, and the phase change material layer is provided between the second end surface of the heat dissipation mounting plate and the corresponding outer side wall of the housing.

[0017] Furthermore, a thermal pad is provided on the end surface of the thermally conductive substrate facing the corresponding electrical module to improve the heat dissipation effect.

[0018] Furthermore, the plurality of electrical modules include a mainboard assembly and a sensor assembly, the sensor assembly and the mainboard assembly are arranged opposite to each other and spaced apart, and both the sensor assembly and the mainboard assembly have corresponding heat dissipation conductive parts.

[0019] Furthermore, the casing includes a front cover assembly, a rear cover assembly and an outer cover, one of the front cover assembly or the rear cover assembly includes a side panel extending toward the other, the front cover assembly and the rear cover assembly are arranged opposite to each other, the front cover assembly and the rear cover assembly are connected through the side panel and the outer cover, and the front cover assembly, the rear cover assembly and the outer cover jointly define an installation space for installing the heat dissipation conductor and the plurality of electrical modules.

[0020] Furthermore, the electrical module also includes an interface board arranged on the rear cover assembly, and a corresponding heat dissipation conductor is arranged between the interface board and the main board assembly, and one end of the heat dissipation conductor is connected to the interface board, and the other end of the heat dissipation conductor is connected to the main board assembly, and the sensor assembly is arranged on the front cover assembly, and the front of the sensor assembly faces the front end of the front cover assembly.

[0021] Furthermore, the sensor assembly is electrically connected to the mainboard assembly via a flexible circuit board, and the sensor assembly is communicatively connected to the mainboard assembly via a board-to-board connector.

[0022] Furthermore, the front cover assembly includes a front cover, a photosensitive shell protruding from the front face of the front cover, and the side panel arranged at the edge of the back face of the front cover, the cavity of the photosensitive shell is opposite to the through hole, the front cover is provided with a mounting groove at the back end face of the through hole, at least a part of the sensor assembly is fixed in the mounting groove, and the front cover assembly also includes a filter, a filter silicone pad, and a filter pressure plate sequentially arranged on one side of the front face of the sensor assembly, and the filter is close to the front face of the sensor assembly.

[0023] These features and advantages of the present invention will be detailed in the following detailed description and accompanying drawings. The preferred embodiments or means of the present invention will be fully illustrated in conjunction with the accompanying drawings, but are not intended to limit the technical solutions of the present invention. Furthermore, although multiple features, elements, and components may be present and are labeled with different symbols or numbers for convenience, they all represent components with the same or similar structure or function. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings:

[0025] Figure 1 This is a diagram showing the internal structure of an industrial camera according to one embodiment of the present invention;

[0026] Figure 2 This is an overall appearance diagram of one embodiment of the present utility model;

[0027] Figure 3 This is an overall appearance diagram of one embodiment of the present utility model;

[0028] Figure 4 This is a structural diagram of the front cover assembly of one embodiment of the present utility model;

[0029] Figure 5 This is a structural diagram of the outer cover of one embodiment of the present utility model;

[0030] Figure 6 This is a structural diagram of a rear cover assembly according to one embodiment of the present invention;

[0031] Figure 7 This is a structural diagram of the sensor assembly and heat dissipation conductor assembly of one embodiment of the present invention;

[0032] Figure 8 This is a structural diagram of a heat dissipation conductive member according to one embodiment of the present invention;

[0033] Figure 9 This is a structural diagram of a heat dissipation conductive member according to one embodiment of the present invention;

[0034] Figure 10 This is a structural diagram of a heat dissipation conductive member according to one embodiment of the present invention;

[0035] Figure 11 This is an overall appearance diagram of an industrial camera according to one embodiment of the present invention.

[0036] in,

[0037] 11. Front cover assembly; 111. Front cover; 112. Side panel; 113. Photosensitive housing; 114. Mounting slot;

[0038] 12. Rear cover assembly; 121. Rear cover; 122. Interface board; 13. Outer cover;

[0039] 20. Sensor assembly; 21. Mainboard assembly; 22. Adapter board; 23. Flexible circuit board; 24. Board-to-board connector;

[0040] 30. Heat dissipation conductive member; 31. Heat conductive substrate; 32. Heat conductive plate; 33. Vertical plate; 34. Connecting plate; 35. Connecting hole; 36. Convex hull;

[0041] 40. Heat dissipation assembly; 41. Heat dissipation mounting plate; 42. Fins. DETAILED DESCRIPTION

[0042] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described in the embodiments are intended to explain the present invention and are not to be construed as limiting the present invention.

[0043] References in this specification to "one embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment itself can be included in at least one embodiment disclosed herein. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0044] During the installation process of industrial cameras, the photosensitive sensor assembly is generally installed using the AA process (a process that automatically adjusts the relative position between the photosensitive sensor and the front cover, including equipment and related software, etc., the purpose is to ensure that the photosensitive sensor is fixed in the front cover and maintains a predetermined relative position with the front cover). When using this process, the edges of the front cover and the photosensitive sensor are fixed with glue, so the photosensitive sensor cannot contact the front cover, resulting in poor heat dissipation.

[0045] To solve the above problems, see the attached Figure 1 、 11 One embodiment of the present invention discloses an industrial camera, comprising a housing and a plurality of electrical modules disposed in the housing. The industrial camera further comprises at least one heat dissipation conductive member 30. At least one of the electrical modules corresponds to the heat dissipation conductive member 30, and the heat dissipation conductive member 30 is connected to the corresponding electrical module. The heat dissipation conductive member 30 comprises a first heat dissipation surface and a second heat dissipation surface. The first heat dissipation surface is opposite to the corresponding electrical module, and the distance between the first heat dissipation surface and the electrical module does not exceed a set distance. The second heat dissipation surface abuts against the inner side wall of the housing.

[0046] In this embodiment, a heat dissipation conductive member 30 is provided, which can transfer the heat generated by the electrical module to the housing. Compared with the prior art in which the electrical module directly contacts the housing, the heat dissipation area can be increased, thereby improving the heat dissipation effect of the industrial camera.

[0047] It should be noted that the present embodiment does not specifically limit the structure of the heat dissipation conductive member 30. It can be configured as a plate or a bracket, and the specific shape can be selected based on actual needs. The heat dissipation conductive member 30 can be a single component or a combination of multiple components. Furthermore, the location of the heat dissipation conductive member 30 is not specifically limited. The heat dissipation conductive member 30 can be arranged parallel to or side by side with the electrical module, or in other possible locations. Furthermore, in a specific arrangement, the heat dissipation conductive member 30 can be arranged in contact with the electrical module and / or the housing, or can be spatially close but not in contact. Furthermore, the heat dissipation conductive member 30 can be made of a metal with good thermal conductivity or other materials with good thermal conductivity. In short, it is sufficient to ensure that the heat dissipation conductive member 30 can transfer heat from the electrical module to the housing.

[0048] Moreover, the heat dissipation conductive member 30 in this embodiment is directly connected to the electrical module, so that during assembly, it is easy to control the gap between the heat dissipation conductive member 30 and the electrical module, thereby reducing the problem of the electrical module being affected by the distance being too close and the poor heat dissipation effect being too far due to assembly errors.

[0049] The set distance in this embodiment represents the distance between the heat dissipation conductive member and the electrical module, which has a certain limit. In actual settings, the set distance can be set to 0, in which case the heat dissipation conductive member can fit closely to the electrical module. Of course, it can also be set to leave a gap between the heat dissipation conductive member and the electrical module, such as 5mm or 10mm. This gap can be set as needed. During specific assembly, the gap can be filled with a thermal pad, the size of the gap being adapted to the thickness of the thermal pad. Of course, it is also possible to not set a thermal pad and only retain the gap, which can also achieve the same heat dissipation effect.

[0050] As one of the embodiments of the present invention, the heat dissipation conductive member 30 includes a heat-conducting substrate 31 and at least one heat-conducting plate 32. The heat-conducting substrate 31 includes the first heat dissipation surface and a substrate back surface opposite to the first heat dissipation surface. The heat-conducting plate is located on the back surface side of the heat-conducting substrate. The inner surface of the heat-conducting plate is connected to the back surface of the substrate. The outer surface of the heat-conducting plate is opposite to the inner surface of the heat-conducting plate 32 and forms the second heat dissipation surface.

[0051] This embodiment provides a specific structure of a heat dissipation conductive member 30. This embodiment provides a heat-conducting substrate 31 opposite to the end face of the electrical module. The heat-conducting substrate 31 is close to one end face of the electrical module. In actual arrangement, it can be set at a location where more heat is generated. The end face of the heat-conducting substrate 31 and the end face of the electrical module can be set to be parallel and opposite to each other. A small gap can be reserved between the two (to prevent the heat-conducting substrate 31 from damaging the electrical module), or it can be directly abutted against the electrical module, so as to achieve a better heat conduction effect.

[0052] The heat-conducting substrate 31 is arranged opposite to the electrical module so that it can cover all the heat-generating components on the electrical module, that is, the area of ​​the first heat-dissipating surface of the heat-dissipating conductor 30 is larger; in addition, in this embodiment, a heat-conducting plate 32 is arranged on the side of the heat-conducting substrate 31. The heat-conducting plate 32 can be arranged to fit the inner wall of the casing, or it can be just close to the inner wall of the casing as mentioned above. Of course, the fit between the heat-conducting plate 32 and the inner wall of the casing can improve the heat conduction efficiency; in actual setting, if space permits, the area of ​​the heat-conducting plate 32 can be set as large as possible, so that the contact area between the heat-dissipating conductor 30 and the casing can be increased, that is, the second heat-dissipating surface of the heat-dissipating conductor 30 is larger, thereby improving the heat dissipation effect. It should be noted that the heat-conducting plate 32 in this embodiment is formed by bending the side edge of the heat-conducting substrate 31, see the attached Figure 8 、 9 , 10, that is, the heat-conducting substrate 31 and the heat-conducting plate 32 are integrated. Compared with the split structure, the number of components is reduced, the installation is convenient, the integrity is good, and the integrated structure can improve the heat conduction efficiency.

[0053] In order to achieve the connection between the heat dissipation conductive member and the electrical module, a connection hole 35 can be provided on the heat conductive substrate. In this embodiment, the connection hole 35 can be directly provided on the end surface of the heat conductive substrate 31. Figure 8 、 9 , 10, other supporting components can also be set on the edge of the heat-conducting substrate 31, and the connecting holes 35 are set on the supporting components. This embodiment does not make specific restrictions on this, and it is only necessary to meet the requirement that the heat dissipation conductive member 30 can be fixed through the connecting holes 35.

[0054] It should be noted that in order to ensure the stability of heat dissipation, the heat dissipation conductor 30 generally needs to be relatively fixed in position with the corresponding electrical module. The heat dissipation conductor 30 can be fixed on the electrical module, or directly fixed on the casing, or fixed on other components in the casing. This embodiment does not make specific restrictions on this, as long as the position of the heat dissipation conductor 30 and the electrical module can be relatively fixed.

[0055] In addition, in this embodiment, there is no specific restriction on the number and arrangement orientation of the heat conducting plates 32 on the heat dissipation conductive member 30.

[0056] As one embodiment of the present invention, the heat dissipation conductive member 30 further includes at least one upright plate 33 and at least one connecting plate 34. Each upright plate 33 corresponds to each connecting plate 34 and is located on the back side of the thermally conductive base plate 31. One end of each upright plate 33 is connected to the thermally conductive base plate 31, and the other end of each upright plate 33 is provided with a corresponding connecting plate 34, which is connected to the corresponding electrical module.

[0057] See attached Figure 8 In this embodiment, a connecting plate 34 is formed on the edge of the heat-conducting substrate 31 on a different surface from the heat-conducting substrate 31. The connecting plate 34 is connected to the heat-conducting substrate 31 through a vertical plate 33. The height of the vertical plate 33 is the distance between the heat-conducting substrate 31 and the connecting plate 34. This arrangement structure can keep the connecting plate 34 away from the electrical module, making it easy to avoid the connection harness during installation (see attached Figure 1 This design avoids interference with other components of the industrial camera by placing the flexible circuit board 23 between the sensor assembly 20 and the mainboard assembly 21. It also prevents damage to the electrical module during installation due to being too close to the electrical module. Furthermore, this structural design allows the thermally conductive substrate 31 to be placed closer to the electrical module, achieving better heat dissipation.

[0058] In order to make the heat dissipation conductive member 30 closer to the electrical module, see the attached Figure 9 、 10 In one embodiment of the present invention, one end surface of the heat-conducting substrate 31 is provided with a convex bump 36 bulging toward the corresponding electrical module.

[0059] In this embodiment, the bumps 36 can be formed by stamping or other processes within the thermally conductive substrate 31 itself. This allows the heat dissipation conductor 30 to be positioned closer to the electrical module within a preferred installation space, achieving both ease of installation and improved heat dissipation. In practice, the bumps 36 can be positioned in the center of the thermally conductive substrate 31. Alternatively, a plurality of bumps can be arranged in an array. During use, the bumps can be aligned one-to-one with the upper heat generating elements of the electrical module, further enhancing heat dissipation.

[0060] Of course, it is conceivable that, in order to further improve the heat dissipation effect, a thermal pad (not shown) is provided on the end surface of the heat-conducting substrate 31 facing the corresponding electrical module in one embodiment of the present invention. The thermal pad can be made of a non-metallic material, such as thermal grease. On the one hand, the thermal pad allows the heat dissipating conductive element 30 to directly contact the electrical module. On the other hand, the thermal pad has a certain buffering effect, preventing the heat dissipating conductive element 30 from directly contacting the electrical module and causing damage to the electrical module.

[0061] The thermal pad in this embodiment can be fixed on the thermally conductive substrate 31 by bonding or other means, and can also be provided as a separate component and installed between the electrical module and the heat dissipation conductive member 30 when in use.

[0062] In order to further improve the heat dissipation effect, the industrial camera in one embodiment of the present invention further includes a heat dissipation component, which is arranged on the outer side wall of the housing to dissipate heat from the housing.

[0063] In this embodiment, a heat dissipation component is provided on the outer wall of the casing. The heat dissipation component can reduce the temperature at the outer wall of the casing, thereby increasing the temperature difference between the inner and outer walls of the casing. Since the heat dissipation conductive member 30 conducts the heat of the electrical module to the inner wall of the casing, the higher temperature difference between the inner and outer walls of the casing can improve the heat dissipation effect. Figure 2 、 3 As can be seen from the figure, the heat dissipation component in this embodiment is arranged outside the casing to avoid occupying the space inside the casing, which can adapt to the small size of the industrial standard small array camera.

[0064] As can be seen from the above, the heat dissipation conductor 30 in the present invention is used to transfer heat to the side wall of the casing. This embodiment can improve the heat dissipation effect at the casing by arranging a heat dissipation component 40 on the casing, thereby improving the heat dissipation effect of the casing, and then improving the heat dissipation effect of the electrical module in the casing, wherein the heat dissipation component 40 can be arranged on one side wall or multiple side walls of the casing, and the heat dissipation component 40 can be arranged on the side wall that abuts against the heat conducting plate 32, or it can be arranged on the side wall adjacent to the side wall that abuts against the heat conducting plate 32. Since the side plate 112 and the outer cover 13 are connected as a whole after assembly, arranging a heat dissipation component 40 on one side wall will also enhance the heat dissipation effect of other side walls. In actual use, the heat dissipation component 40 can be arranged on a suitable side wall according to the installation environment.

[0065] In actual arrangement, the heat dissipation assembly can be arranged outside the side wall where the second heat dissipation surface abuts the housing. In this way, the heat dissipation conductor 30 and the heat dissipation assembly 40 are arranged on the inner and outer sides of the same side wall of the housing. The heat dissipation conductor 30 and the heat dissipation assembly 40 act on the same side wall, which can improve the heat dissipation effect.

[0066] Of course, it is conceivable that the heat dissipation component in the present invention can also be configured in other forms, such as a heat dissipation fan.

[0067] See attached Figure 2 、 3As one embodiment of the present invention, a heat dissipation assembly includes a heat dissipation mounting plate and a plurality of fins 42 disposed on a first end surface of the heat dissipation mounting plate 41. The heat dissipation mounting plate 41 is fixedly connected to the outer wall of the housing, and a second end surface of the heat dissipation mounting plate 41, opposite the first end surface, is disposed opposite the surface of the outer wall of the housing. The heat dissipation mounting plate 41 is disposed opposite the surface of the housing side wall during installation, increasing the contact area between the two. This not only improves installation stability but also increases the heat dissipation area, thereby enhancing the heat dissipation effect.

[0068] As one embodiment of the present invention, the heat dissipation assembly further includes a phase change material layer disposed between the second end surface of the heat dissipation mounting plate 41 and the corresponding outer wall of the housing. The phase change material layer can absorb and store a large amount of heat through a change in physical state, thereby improving the heat dissipation effect on the housing.

[0069] As one of the embodiments of the present invention, see the attached Figure 2-6 The casing includes a front cover assembly 11, a rear cover assembly 12 and an outer cover 13. One of the front cover assembly 11 or the rear cover assembly 12 includes a side panel 112 extending toward the other. The front cover assembly 11 and the rear cover assembly 12 are arranged opposite to each other and are connected to the outer cover 13 through the side panel 112. The front cover assembly 11, the rear cover assembly 12 and the outer cover jointly define an installation space for installing the heat dissipation conductor 30 and the electrical module.

[0070] The side panel 112 and the outer cover 13 in this embodiment jointly form the side wall of the housing of the industrial camera. The front cover assembly 11 is located at the front end, and the rear cover assembly 12 is located at the rear end. The front cover assembly 11 and the rear cover assembly 12 are positioned by the side panel 112. The front cover assembly 11, the rear cover assembly 12 and the outer cover jointly define an installation space for installing the heat dissipation conductor 30 and the electrical module. The heat dissipation conductor 30 and the electrical module are both arranged in the installation space. The heat dissipation conductor 30 is used to conduct heat to the side panel 112 and / or the outer cover 13.

[0071] In this embodiment, the specific structure of the side plate 112 and the outer cover 13 is not limited, as long as the two can be assembled to form a closed housing. Figure 5 、 6 In one embodiment of the present invention, the outer cover 13 is set as a U-shaped structure. The side panel 112 and the outer cover 13 of the U-shaped structure cooperate with each other to form the side wall of the casing, and cooperate with the front cover 111 and the rear cover 121 at both ends to form a closed casing.

[0072] As one of the embodiments of the present invention, see the attached Figure 1 The electrical module includes a sensor component 20 and a mainboard component 21 arranged in the installation space. The sensor component 20 and the mainboard component 21 are opposite to each other and spaced apart. The sensor component 20 and the mainboard component 21 are electrically connected through a flexible circuit board 23. The sensor component 20 and the mainboard component 21 are communicatively connected through a board-to-board connector 24. The housing is provided with the heat dissipation conductive member 30 corresponding to the sensor component 20 and the mainboard component 21. The front cover component 11 is provided with a through hole corresponding to the lens component of the industrial camera. The sensor component 20 is arranged on the front cover component 11 and the front face of the sensor component 20 is opposite to the through hole. The heat dissipation conductive member 30 is arranged on the back face of the sensor component 20, and the heat dissipation conductive member 30 abuts against the side panel 112 or the inner side wall of the outer cover 13.

[0073] The electrical module in this embodiment includes a sensor assembly 20 and a mainboard assembly 21, which are electrically connected and communicated via a flexible circuit board 23 and a board-to-board connector 24. Figure 1 As shown in the figure, the sensor assembly 20 and the mainboard assembly 21 will generate heat during operation, so the sensor assembly 20 and the mainboard assembly 21 are respectively equipped with a heat dissipation conductor 30. Each heat dissipation conductor 30 can conduct the heat generated by the corresponding electrical module to the side plate 112 or the inner wall of the outer cover 13 as mentioned above. It should be noted that there is a certain distance between different heat dissipation conductors 30, and the heat conduction plates 32 of the two can abut on the same side wall of the casing (for example, they can abut on the side plate 112 or the same side wall of the outer cover 13 at the same time), and of course they can also abut on different positions respectively (for example, the heat conduction plate 32 of one heat dissipation conductor 30 abuts the side plate 112, and the other abuts the outer cover 13).

[0074] As one of the embodiments of the present utility model, the front cover assembly 11 includes a front cover 111, a photosensitive shell 113 protruding from the front side of the front cover 111, and the side panel 112 arranged at the edge of the back side of the front cover 111, the cavity of the photosensitive shell 113 is opposite to the through hole, the front cover 111 is provided with a mounting groove 114 at the back end face of the through hole, at least a part of the sensor assembly 20 is fixed in the mounting groove 114, the front cover assembly 11 also includes a filter, a filter silicone pad, and a filter pressure plate sequentially arranged on the front side of the sensor assembly 20, and the filter is close to the front side of the sensor assembly 20.

[0075] The back cover assembly 12 includes a back cover 121 and an interface board 122 arranged on the back cover 121. The heat dissipation conductor 30 corresponding to the mainboard assembly 21 is fixedly connected to the interface board 122. One end face of the mainboard assembly 21 is connected to the heat dissipation conductor 30 corresponding to the mainboard assembly 21. The other end face of the mainboard assembly 21 is connected to the adapter circuit board. The adapter circuit board is communicatively connected to the mainboard assembly 21 through a board-to-board connector 24.

[0076] See attached Figure 1 、 7 , the sensor assembly 20 in this embodiment is arranged on the front cover assembly 11, and the main board assembly 21 is arranged on the rear cover assembly 12. The two are arranged separately to avoid heat accumulation in the same position during operation, which is more conducive to heat dissipation. The industrial camera in this embodiment can be installed in the following way: 1. Assemble the components on the rear cover assembly 12 and lock the interface board 122 on the rear cover 121 (this process also includes the installation of other components, such as the light guide column installed on the rear cover 121 by dispensing glue); 2. Fix the heat dissipation conductive member 30 corresponding to the main board assembly 21 on the interface board 122; 3. Fix the main board assembly 21 and the corresponding heat dissipation conductive member 30 as a whole, and make the heat dissipation conductive member 3 0 faces the end face of the mainboard assembly 21; 4. Lock the adapter plate 22 on the mainboard assembly 21, so that the back cover 121, the mainboard assembly 21, the adapter plate 22 and the heat dissipation conductive member 30 corresponding to the mainboard assembly 21 form a whole; 5. Fix the sensor assembly 20 in the front cover 111, wherein the front cover assembly includes a filter pressing plate, a filter silicone pad, a filter, a photosensitive sensor and a heat dissipation conductive member 30 corresponding to the sensor assembly 20 from the front end to the rear end; at this time, the front cover assembly 11 also forms a whole; 6. Encapsulate the front cover assembly 11, the back cover assembly 12 and the outer cover 13, and make the heat conduction plate 32 of the heat dissipation conductive member 30 fit with the side plate 112 or the outer cover 13.

[0077] The sensor component 20 in this embodiment is electrically connected to the mainboard component 21 through a flexible circuit board 23, and the sensor component 20 and the mainboard component 21 are communicatively connected through a board-to-board connector 24, which can improve the stability of the electrical connection between the sensor component 20 and the mainboard component 2, and the flexible structure can adapt to the connection requirements of the stacked setting of multiple electrical modules in a small volume space, thereby improving the compactness of the structure and the reliability of the connection.

[0078] It should be noted that the connection between the heat dissipation conductor 30 and the electrical module or the back cover assembly 12 in the present invention can be fixed by bolts or screws. In actual use, a first connection part corresponding to the above-mentioned connection hole 35 can be provided on the electrical module (generally, it can be provided as a threaded connection column), and a threaded hole is formed on the first connection part. During installation, the electrical module and the heat dissipation conductor are connected by screws. The screws pass through the connection hole 35 and are threadedly connected to the threaded hole on the first connection part to achieve a fixed connection between the electrical module and the heat dissipation conductor.

[0079] This makes it easier to assemble and control the gap between the heat dissipation conductor 30 and the corresponding electrical module to be constant, ensuring that the compression value of the thermal pad between the heat dissipation conductor 30 and the corresponding electrical module is stable, and the studs connecting the interface board 122, the heat dissipation conductor 30, the main board assembly 21 and the adapter board 22 can be set to be relative, see the attached Figure 1 , so that the connection parts of each component are concentrated on the same axis, which can improve the strength of the overall structure after installation; from the above installation process and the attached Figure 1 It can be seen that the heat dissipation conductor 30 corresponding to the mainboard assembly 21 is arranged between the interface board 122 and the mainboard assembly 21. In the subsequent development process, if the interface board 122 has a heat dissipation requirement, the heat dissipation conductor 30 can also be provided with a convex bulge 36 toward the interface board 122 to achieve heat dissipation of the interface board 122.

[0080] In the present invention, by providing the heat dissipation conductive member 30 , the heat dissipation effect of the sensor assembly 20 and the mainboard assembly 21 can be improved, thereby being adaptable to the subsequent development of high-power consumption sensor assemblies, and having good application prospects.

[0081] The above are only specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modifications that do not deviate from the functional and structural principles of the present invention are included within the scope of the claims.

Claims

1. An industrial camera, comprising a housing and a plurality of electrical modules disposed in the housing, characterized in that: The industrial camera further comprises at least one heat dissipation conductive member (30), at least one of the electrical modules corresponds to the heat dissipation conductive member (30), the heat dissipation conductive member (30) comprises a first heat dissipation surface and a second heat dissipation surface, the first heat dissipation surface is opposite to the corresponding electrical module, and the distance between the first heat dissipation surface and the electrical module does not exceed a set distance, and the second heat dissipation surface abuts against the inner side wall of the housing.

2. The industrial camera according to claim 1, wherein: The heat dissipation conductive member (30) includes a heat-conducting substrate (31) and at least one heat-conducting plate (32), wherein the heat-conducting substrate includes the first heat dissipation surface and a substrate back surface opposite to the first heat dissipation surface, and the heat-conducting plate (32) is located on the substrate back side of the heat-conducting substrate (31), the inner surface of the heat-conducting plate (32) is in contact with the substrate back surface, and the outer surface of the heat-conducting plate (32) is opposite to the inner surface of the heat-conducting plate (32) and forms the second heat dissipation surface.

3. The industrial camera according to claim 2, wherein: The heat dissipation conductive member (30) further comprises at least one vertical plate (33) and at least one connecting plate (34), wherein the vertical plate (33) corresponds to the connecting plate (34) one by one, and both the vertical plate (33) and the connecting plate (34) are located on the back side of the heat-conducting substrate (31), one end of the vertical plate (33) is connected to the heat-conducting substrate (31), and the other end of the vertical plate (33) is provided with the corresponding connecting plate (34), and the connecting plate (34) is connected to the corresponding electrical module.

4. The industrial camera according to claim 2, wherein: The heat dissipation conductive member (30) further includes a convex bump (36) provided on the first heat dissipation surface of the heat-conducting substrate (31) and protruding toward the back side of the corresponding electrical module.

5. The industrial camera according to claim 1, wherein: The heat dissipation conductive member (30) is provided with a first connection portion on the electrical module corresponding to the heat dissipation conductive member (30), wherein the first connection portion is formed with a threaded hole, and the heat dissipation conductive member is provided with a connection hole (35) corresponding to the threaded hole, wherein the connection hole (35) and the threaded hole are connected by screws, so that the heat dissipation conductive member (30) is connected to the corresponding electrical module.

6. The industrial camera according to any one of claims 1 to 5, characterized in that: The industrial camera further comprises a heat dissipation component (40), which is arranged on the outer side wall of the housing and is used to dissipate heat from the housing.

7. The industrial camera according to claim 6, wherein: The heat dissipation component (40) is arranged on the outside of the side wall where the second heat dissipation surface abuts against the housing.

8. The industrial camera according to claim 6, wherein: The heat dissipation assembly (40) comprises a heat dissipation mounting plate (41) and a plurality of fins (42) arranged on a first end surface of the heat dissipation mounting plate (41); the heat dissipation mounting plate (41) is fixedly connected to the outer side wall of the housing, and a second end surface of the heat dissipation mounting plate (41) opposite to the first end surface is arranged opposite to the surface of the outer side wall of the housing.

9. The industrial camera according to claim 8, wherein: The heat dissipation assembly (40) further comprises a phase change material layer, and the phase change material layer is provided between the second end surface of the heat dissipation mounting plate (41) and the corresponding outer side wall of the housing.

10. The industrial camera according to any one of claims 1 to 5, characterized in that: The plurality of electrical modules include a mainboard assembly (21) and a sensor assembly (20), wherein the sensor assembly (20) and the mainboard assembly (21) are arranged opposite to each other and spaced apart, and each of the sensor assembly (20) and the mainboard assembly (21) corresponds to the heat dissipation conductive member (30).

11. The industrial camera according to claim 10, characterized in that The housing includes a front cover assembly (11), a rear cover assembly (12) and an outer cover (13); one of the front cover assembly (11) or the rear cover assembly (12) includes a side panel (112) extending toward the other; the front cover assembly (11) and the rear cover assembly (12) are arranged relative to each other; the front cover assembly (11) and the rear cover assembly (12) are connected to the outer cover (13) via the side panel (112); the front cover assembly (11), the rear cover assembly (12) and the outer cover (13) jointly define an installation space for installing the heat dissipation conductor (30) and a plurality of the electrical modules.

12. The industrial camera according to claim 11, wherein: The electrical module further comprises an interface board arranged on the rear cover assembly, a corresponding heat dissipation conductive member (30) is arranged between the interface board and the main board assembly (21), one end of the heat dissipation conductive member (30) is connected to the interface board, and the other end of the heat dissipation conductive member (30) is connected to the main board assembly (21), and the sensor assembly (20) is arranged on the front cover assembly, and the front face of the sensor assembly (20) faces the front end of the front cover assembly.

13. The industrial camera according to claim 12, wherein: The sensor assembly (20) is electrically connected to the mainboard assembly (21) via a flexible circuit board (23), and the sensor assembly (20) is communicatively connected to the mainboard assembly (21) via a board-to-board connector (24).

Images