Dynamic bending type soaking substrate structure

Abstract

The utility model discloses a dynamically bendable soaking substrate structure. The substrate structure comprises a first plate body, a second plate body and a third plate body, the first plate body is provided with a bending part, a first end and a second end, and the bending part is located between the first end and the second end. The first plate body comprises a first substrate, a first copper layer and a second copper layer, wherein the first copper layer and the second copper layer are respectively arranged on opposite surfaces of the first substrate. The second plate body comprises a second substrate, a third copper layer and a fourth copper layer, wherein the third copper layer and the fourth copper layer are respectively arranged on opposite surfaces of the second substrate. The third copper layer and the second copper layer at the first end are attached to each other to form a first air chamber. The third plate body comprises a third substrate, a fifth copper layer and a sixth copper layer, wherein the fifth copper layer and the sixth copper layer are respectively arranged on opposite surfaces of the third substrate. And the fifth copper layer and the second copper layer at the second end are attached to each other to form a second air chamber. When the first plate body is stressed, the first end is bent relative to the second end by the bending part, and the second plate body is close to or far away from the third plate body.

Description

Technical Field

[0001] A dynamically bendable heat-dissipating substrate structure, in particular a substrate structure having a bending portion for connecting air chambers on two sides for heat dissipation to achieve a mutual heat conduction effect. Background Art

[0002] Generally speaking, bendable smartphones require efficient heat conduction and distribution to ensure chip stability and performance. In this case, liquid cooling vapor chambers are commonly used as a heat dissipation method.

[0003] However, liquid-cooled vapor chambers are limited by three-dimensional space and cannot be effectively bent. For example, to achieve effective heat dissipation, liquid-cooled vapor chambers are designed with three-dimensional air chambers. However, the presence of these air chambers makes them unsuitable for dynamic bending. Utility Model Content

[0004] In view of this, according to one embodiment, a dynamically bendable heat-saturating substrate structure is provided, comprising a first plate, a second plate, and a third plate. The first plate has a bend, a first end, and a second end, the bend being located between the first and second ends. The first plate also includes a first substrate, a first copper layer, and a second copper layer, the first and second copper layers being located on opposite surfaces of the first substrate. The second plate includes a second substrate, a third copper layer, and a fourth copper layer, the third and fourth copper layers being located on opposite surfaces of the second substrate, and the third copper layer and the second copper layer at the first end of the first plate being bonded together to form a first air chamber. The third plate includes a third substrate, a fifth copper layer, and a sixth copper layer, the fifth and sixth copper layers being located on opposite surfaces of the third substrate, and the fifth copper layer and the second copper layer at the second end of the first plate being bonded together to form a second air chamber. When a force is applied to the first plate, the first end bends relative to the second end at the bend, causing the second plate to move closer to or further away from the third plate.

[0005] In some embodiments, the first air chamber is provided with a first mesh copper structure, and the second air chamber is provided with a second mesh copper structure.

[0006] In some embodiments, the bending portion has a plurality of hollow areas, and the plurality of hollow areas are of random geometric shapes and are arranged at intervals from each other.

[0007] In some embodiments, the bent portion has a hollow area with any geometric shape.

[0008] In some embodiments, the bent portion has a copper surface hollow area with an arbitrary geometric shape.

[0009] In some embodiments, the second copper layer at the first and second ends of the first plate has a patterned structure, the third copper layer of the second plate has a first air chamber patterned structure, and the fifth copper layer of the third plate has a second air chamber patterned structure. The patterned structures, together with the first and second air chamber patterned structures, form first and second air chambers, respectively. However, the air chamber patterned structures are not limited thereto.

[0010] In some embodiments, the second substrate of the second board is connected to the third substrate of the third board, and the fourth copper layer of the second board is connected to the sixth copper layer of the third board.

[0011] In some embodiments, the first copper layer, the second copper layer, the fourth copper layer, and the sixth copper layer are respectively provided with a first protective layer, a second protective layer, a third protective layer, and a fourth protective layer.

[0012] In some embodiments, a first protective layer and a second protective layer are respectively disposed on surfaces of the first copper layer and the second copper layer of the bending portion.

[0013] In some embodiments, the thickness between the first to fourth copper layers at the first end is ≦0.3 mm, and the thickness between the first to sixth copper layers at the second end is ≦0.3 mm.

[0014] In some embodiments, the thickness between the first copper layer and the second copper layer at the bending portion is ≦0.12 mm.

[0015] In summary, according to one embodiment, a dynamically bendable heat-dissipating substrate structure is provided, wherein a first plate is connected to a second plate and a third plate, respectively, and a first air chamber and a second air chamber are formed at the first end and the second end, respectively. When the first plate is subjected to force, the first end bends relative to the second end at the bending portion of the first plate. In this way, since no air chamber is formed at the bending portion, the first plate can be effectively bent. Furthermore, by connecting the second plate and the third plate through the first plate, the effect of mutual heat conduction between the first and second air chambers is achieved, thereby effectively improving heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of a dynamically bendable heat soaking substrate structure according to a first embodiment;

[0017] Figure 2 is a top view of the dynamically bendable heat soaking substrate structure according to the first embodiment;

[0018] Figure 3 is a schematic diagram of a dynamically bendable heat soaking substrate structure according to a second embodiment;

[0019] Figure 4 is a schematic diagram of a dynamically bendable heat soaking substrate structure according to a third embodiment;

[0020] Figure 5 is a top view of a dynamically bendable heat soaking substrate structure according to a fourth embodiment;

[0021] Figure 6 is a top view of a dynamically bendable heat soaking substrate structure according to a fifth embodiment;

[0022] Figure 7 is a top view of a dynamically bendable heat soaking substrate structure according to a sixth embodiment;

[0023] Figure 8 is a schematic diagram of a dynamically bendable heat soaking substrate structure according to a seventh embodiment;

[0024] Figure 9 FIG. 4 is a schematic diagram of a dynamically bendable heat-sinking substrate structure according to an eighth embodiment.

[0025]

Explanation of symbols

[0026] 100: Dynamically bendable heat-saturating substrate structure

[0027] 110: First plate

[0028] 110A: First end

[0029] 110B: Second end

[0030] 110C: bending part

[0031] 111: first substrate

[0032] 112: First copper layer

[0033] 1122: First protective layer

[0034] 113: Second copper layer

[0035] 1131: Pattern structure

[0036] 1132: Second protective layer

[0037] 114: Hollow area

[0038] 130: Second plate

[0039] 131: Second substrate

[0040] 132: The third copper layer

[0041] 1321: First air chamber pattern structure

[0042] 133: The fourth copper layer

[0043] 1332: The third protection layer

[0044] 150: The third plate

[0045] 151: Third substrate

[0046] 152: Fifth copper layer

[0047] 1521: Second air chamber pattern structure

[0048] 153: Sixth copper layer

[0049] 1532: The fourth protection layer

[0050] 170: First air chamber

[0051] 171: First network copper structure

[0052] 190: Second air chamber

[0053] 191: Second network copper structure DETAILED DESCRIPTION

[0054] See also Figure 1 . Figure 1 The dynamically bendable heat-sinking substrate structure 100 is hereinafter referred to as the substrate structure 100 and includes a first plate 110 , a second plate 130 , and a third plate 150 .

[0055] The first plate 110 has a first end 110A, a second end 110B and a bending portion 110C. The bending portion 110C is located between the first end 110A and the second end 110B. In this embodiment, the first end 110A and the second end 110B can be bent toward or away from each other by the bending portion 110C. Figure 1 From the perspective of the first end 110A, the first end 110A can be bent from the bending portion 110C to the upper side or the lower side of the second end 110B. The first plate body 110 further includes a first substrate 111, a first copper layer 112 and a second copper layer 113. The first copper layer 112 and the second copper layer 113 are respectively located on opposite surfaces of the first substrate 111. Figure 1 As shown, the first copper layer 112 is located on the lower surface of the first substrate 111 , and the second copper layer 113 is located on the upper surface of the first substrate 111 .

[0056] The second plate 130 includes a second substrate 131, a third copper layer 132, and a fourth copper layer 133. The third copper layer 132 and the fourth copper layer 133 are respectively located on opposite surfaces of the second substrate 131. Figure 1As shown, the third copper layer 132 is located on the lower surface of the second substrate 131, and the fourth copper layer 133 is located on the upper surface of the second substrate 131. Furthermore, the third copper layer 132 and the second copper layer 113 at the first end 110A of the first plate 110 are bonded to each other to form a first air chamber 170.

[0057] The third plate 150 includes a third substrate 151, a fifth copper layer 152, and a sixth copper layer 153. The fifth copper layer 152 and the sixth copper layer 153 are respectively located on opposite surfaces of the third substrate 151. Figure 1 As shown, the fifth copper layer 152 is located on the lower surface of the third substrate 151, and the sixth copper layer 153 is located on the upper surface of the third substrate 151. Furthermore, the fifth copper layer 152 and the second copper layer 113 at the second end 110B of the first plate 110 are bonded to each other to form a second air chamber 190.

[0058] The first plate 110 can be bent by a user's force. For example, the first end 110A can be bent relative to the second end 110B at the bent portion 110C to move the second plate 130 closer to or further away from the third plate 150. In this case, because the first air chamber 170 and the second air chamber 190 are formed at the first end 110A and the second end 110B, respectively, the bent portion 110C does not contain any air chambers. Therefore, when the first plate 110 is bent, it is not affected by the first and second air chambers 170, 190, preventing it from bending smoothly. Furthermore, the first and second air chambers 170, 190 are connected by the bent portion 110C of the first plate 110. Heat energy can be transferred between the two chambers through the bent portion 110C, effectively enhancing heat dissipation.

[0059] Specifically, by forming the first air chamber 170 and the second air chamber 190 at the first end 110A and the second end 110B of the first plate 110, respectively, the first plate 110 can be bent via the bending portion 110C without being affected by the first air chamber 170 and the second air chamber 190. Furthermore, the first air chamber 170 and the second air chamber 190 can achieve heat conduction through the connection of the first plate 110, thereby enhancing heat dissipation.

[0060] In this embodiment, the first air chamber 170 is provided with a first copper mesh structure 171, and the second air chamber 190 is provided with a second copper mesh structure 191. Thus, the first copper mesh structure 171 and the second copper mesh structure 191 provide a liquid water cooling and heat equalization effect in the first air chamber 170 and the second air chamber 190 respectively.

[0061] See also Figure 2 . Figure 21 is a top view of a dynamically bendable heat-saturating substrate structure according to a first embodiment. In this embodiment, the bending portion 110C has a plurality of hollow areas 114, which are arranged at intervals. By providing the hollow areas 114, the physical structure at the bending portion 110C is reduced, thereby improving the bendability of the bending portion 110C. In this embodiment, the hollow areas 114 can be any geometric shape, such as a rectangle, a circle, an ellipse, a triangle, etc. Furthermore, in this embodiment, the hollow areas 114 are hollow areas extending from the second copper layer 113 to the first copper layer 112, but are not limited thereto. The hollow areas can also be copper surface hollow areas, that is, a portion of the second copper layer 113 is grooved to expose the first substrate 111.

[0062] See again Figure 1 In this embodiment, the second copper layer 113 at the first end 110A and the second end 110B of the first plate 110 has a pattern structure 1131. The third copper layer 132 of the second plate 130 has a first air chamber pattern structure 1321. The fifth copper layer 152 of the third plate 150 has a second air chamber pattern structure 1521. The pattern structure 1131, the first air chamber pattern structure 1321, and the second air chamber pattern structure 1521 are arbitrary pattern structures formed by processes such as etching. When the third copper layer 132 and the second copper layer 113 at the first end 110A of the first plate 110 are bonded together, the first air chamber pattern structure 1321 corresponds to the pattern structure 1131 at the first end 110A, forming the first air chamber 170. When the fifth copper layer 152 and the second copper layer 113 at the second end 110B of the first plate 110 are attached to each other, the second air chamber pattern structure 1521 corresponds to the pattern structure 1131 at the second end 110B, forming a second air chamber 190 .

[0063] In this embodiment, the thickness between the first copper layer 112 and the fourth copper layer 133 at the first end 110A is ≤0.3 mm, and the thickness between the first copper layer 112 and the sixth copper layer 153 at the second end 110B is ≤0.3 mm. The thickness between the first copper layer 112 and the second copper layer 113 at the bend 110C is ≤0.12 mm. As a result, the bend 110C has a smaller thickness, effectively improving its bendability.

[0064] See also Figure 3 . Figure 3This is a schematic diagram of a dynamically bendable heat-saturating substrate structure according to a second embodiment. In this second embodiment, a first protective layer 1122 is provided on the surface of the first copper layer 112. A second protective layer 1132 is provided on the surface of the second copper layer 113 not in contact with the third copper layer 132 and the fifth copper layer 152. A third protective layer 1332 is provided on the surface of the fourth copper layer 133. A fourth protective layer 1532 is provided on the surface of the sixth copper layer 153. The provision of these protective layers further improves the service life of the substrate structure 100.

[0065] See also Figure 4 . Figure 4 This is a schematic diagram of a dynamically bendable heat spreader substrate structure according to a third embodiment. While the second embodiment illustrates protective layers disposed on the first copper layer 112, the second copper layer 113, the fourth copper layer 133, and the sixth copper layer 153, the present invention is not limited thereto. In this embodiment, the first protective layer 1122 and the second protective layer 1132 may be disposed only on the surfaces of the first copper layer 112 and the second copper layer 113 at the bend portion 110C, respectively, to reduce structural losses caused by bending of the substrate structure 100.

[0066] See also Figures 5 to 7 . Figure 5 FIG. 1 is a top view of a dynamically bendable heat-sinking substrate structure according to a fourth embodiment. Figure 6 FIG. 1 is a top view of a dynamically bendable heat-sinking substrate structure according to a fifth embodiment. Figure 7 1 is a top view of a dynamically bendable heat-saturating substrate structure according to the sixth embodiment. In the first embodiment, the bending portion 110C is shown to have a plurality of hollow areas 114 arranged at intervals, but the present invention is not limited thereto. In the fourth embodiment, the bending portion 110C may also have only one hollow area 114. Furthermore, in the fifth embodiment, two hollow areas 114 are respectively provided on opposite sides of the bending portion 110C. Furthermore, in the sixth embodiment, the hollow area 114 may also be provided on only one side of the bending portion 110C. In this way, by providing the hollow area 114, the physical structure at the bending portion 110C is reduced to match the structural design of the mechanism.

[0067] See also Figure 8 . Figure 8This is a schematic diagram of a dynamically bendable heat-dissipating substrate structure according to the seventh embodiment. In the first embodiment, the bending portion 110C is illustrated as a heat conduction structure between the first air chamber 170 and the second air chamber 190, but the present invention is not limited thereto. In this embodiment, the second substrate 131 of the second plate 130 is connected to the third substrate 151 of the third plate 150, and the fourth copper layer 133 of the second plate 130 is connected to the sixth copper layer 153 of the third plate 150. In this way, heat conduction between the first air chamber 170 and the second air chamber 190 can be achieved not only through the bending portion 110C, but also through the connection structure between the substrate and the copper layer between the second plate 130 and the third plate 150, further enhancing the heat dissipation effect.

[0068] See also Figure 9 . Figure 9 Schematic diagram of a dynamically bendable heat-saturating substrate structure according to the eighth embodiment. In the first embodiment, a substrate structure 100 having a first air chamber 170 and a second air chamber 190 is illustrated, but the present invention is not limited thereto. In this embodiment, as Figure 9 As shown, the substrate structure 100 may also be formed with three air chambers, such as a third air chamber located between the first air chamber 170 and the second air chamber 190, and having two bent portions 110C. The structure forming the air chambers will not be described again. Furthermore, more air chambers, such as four or five or more, may be provided based on design requirements.

[0069] In summary, the substrate structure 100 can achieve this by forming the first air chamber 170 and the second air chamber 190 at the first end 110A and the second end 110B of the first plate 110, respectively, with a bendable portion 110C disposed therebetween. This allows the first plate 110 to provide a bending effect through the bend portion 110C without being affected by the first air chamber 170 and the second air chamber 190. Furthermore, the connection between the first air chamber 170 and the second air chamber 190 through the first plate 110 allows for heat conduction, thereby enhancing heat dissipation.

Claims

1. A dynamically bendable heat soaking substrate structure, characterized in that: include: A first plate having a bent portion, a first end, and a second end, wherein the bent portion is located between the first end and the second end, the first plate further comprising a first substrate, a first copper layer, and a second copper layer, wherein the first copper layer and the second copper layer are respectively located on opposite surfaces of the first substrate; a second plate body, comprising a second substrate, a third copper layer, and a fourth copper layer, wherein the third copper layer and the fourth copper layer are respectively located on opposite surfaces of the second substrate, and the third copper layer and the second copper layer at the first end of the first plate body are bonded to each other to form a first air chamber; and a third plate body, comprising a third substrate, a fifth copper layer, and a sixth copper layer, wherein the fifth copper layer and the sixth copper layer are respectively located on opposite surfaces of the third substrate, and the fifth copper layer and the second copper layer at the second end of the first plate body are bonded to each other to form a second air chamber; When the first plate is subjected to a force, the first end is bent relative to the second end at the bending portion, and the second plate is moved closer to or away from the third plate.

2. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The first air chamber is provided with a first mesh copper structure, and the second air chamber is provided with a second mesh copper structure.

3. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The bending portion has a plurality of hollow areas, which are of random geometric shapes and are arranged at intervals from each other.

4. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The bent portion has a hollow area, and the hollow area is of any geometric shape.

5. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The bending portion has a copper surface hollow area, and the copper surface hollow area is in a random geometric shape.

6. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The second copper layer at the first end and the second end of the first plate has a pattern structure, the third copper layer of the second plate has a first air chamber pattern structure, and the fifth copper layer of the third plate has a second air chamber pattern structure, which respectively form the first air chamber and the second air chamber with the first air chamber pattern structure and the second air chamber pattern structure.

7. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The second substrate of the second board is connected to the third substrate of the third board, and the fourth copper layer of the second board is connected to the sixth copper layer of the third board.

8. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The first copper layer, the second copper layer, the fourth copper layer and the sixth copper layer are respectively provided with a first protective layer, a second protective layer, a third protective layer and a fourth protective layer.

9. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: A first protective layer and a second protective layer are respectively provided on the surfaces of the first copper layer and the second copper layer of the bending portion.

10. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The thickness between the first copper layer and the fourth copper layer at the first end is less than or equal to 0.3 mm, and the thickness between the first copper layer and the sixth copper layer at the second end is less than or equal to 0.3 mm.

11. The dynamically bendable heat soaking substrate structure according to claim 1, wherein: The thickness between the first copper layer and the second copper layer at the bending portion is less than or equal to 0.12 mm.

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