Magnetron device heat dissipation system and microwave oven

Abstract

The utility model relates to the technical field of microwave ovens, and provides a magnetron device heat dissipation system and a microwave oven, the magnetron device heat dissipation system comprises a bottom mounting plate, a first magnetron assembly, a second magnetron assembly, a first fan device and a second fan device, the two opposite ends of the first magnetron assembly and the second magnetron assembly are provided with the air inlet ducts and the air guide hoods, two independent air duct systems are formed to conduct efficient heat dissipation on the two magnetron assemblies, and the first fan device and the second fan device are responsible for feeding cold air into the corresponding air inlet ducts respectively. According to the radiating system of the magnetron device, the independent air duct system is combined with the fan device, so that each magnetron component can obtain sufficient cold air supply, a uniform and efficient radiating effect is realized, the working temperature of the magnetron is effectively reduced, the performance reduction or damage caused by overheating is avoided, the service life of the magnetron device is prolonged, and the service life of the magnetron device is prolonged. The structure is simple and design is reasonable.

Description

Technical Field

[0001] The utility model relates to the technical field of microwave ovens, in particular to a heat dissipation system of a magnetron device and a microwave oven. Background Art

[0002] In the field of microwave oven technology, the magnetron, as a core component, directly impacts the overall performance of the microwave oven, with its performance stability and service life. During operation, the magnetron generates a significant amount of heat. Failure to dissipate heat promptly and effectively will lead to excessive heat buildup, impacting its efficiency and lifespan, and potentially even causing safety incidents. Therefore, magnetron heat dissipation has always been a key concern in microwave oven design.

[0003] Existing microwave oven magnetron cooling systems mostly rely on natural cooling or simple fan cooling. Natural cooling relies on natural convection within the microwave oven, but this approach has limited effectiveness and is difficult to meet the cooling requirements of high-power microwave ovens. While simple fan cooling can improve cooling efficiency to a certain extent, it often suffers from issues such as irrational air duct design and uneven air volume distribution, resulting in suboptimal cooling and high fan noise, which impacts user experience.

[0004] Furthermore, with the continuous advancement of microwave oven technology, the requirements for magnetron cooling systems are becoming increasingly stringent. Traditional cooling systems are often designed only for a single magnetron. However, for microwave ovens with multiple magnetrons, this approach cannot effectively meet the cooling requirements of all magnetrons, causing some magnetrons to overheat, impacting overall performance.

[0005] In response to the above problems, although some improvement solutions have emerged in the existing technology, such as using more efficient cooling fans and optimizing air duct design, these solutions often have problems such as complex structure, high cost, and difficult maintenance, making them difficult to be widely used in microwave oven products.

[0006] Therefore, how to design a heat dissipation system for a magnetron device with a simple structure, low cost and good heat dissipation effect has become a technical problem that needs to be solved urgently in the current field of microwave oven technology. Utility Model Content

[0007] In view of this, the present invention aims to provide a heat dissipation system for a magnetron device and a microwave oven to solve at least one of the above technical problems.

[0008] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0009] The first object of the present application is to disclose a heat dissipation system for a magnetron device, comprising:

[0010] A bottom mounting plate is arranged below the bottom plate of the furnace chamber assembly;

[0011] a first magnetron assembly mounted on the bottom mounting plate, with a first air inlet duct and a first air guide cover respectively provided at opposite ends of the first magnetron assembly, and a first air inlet provided at an end of the first air inlet duct away from the first magnetron assembly;

[0012] A second magnetron assembly is mounted on the bottom mounting plate, and a second air inlet duct and a second air guide cover are respectively provided at opposite ends of the second magnetron assembly, and a second air inlet is provided on the second air inlet duct;

[0013] a first fan device for introducing air into the first air inlet duct and cooling the first magnetron assembly with air, and then discharging the air through the first air guide cover;

[0014] The second fan device is used to take air into the second air inlet duct and cool the second magnetron assembly with air, and then discharge the air through the second air guide cover.

[0015] Furthermore, the first fan device is arranged inside the first air inlet duct, and the first air inlet duct is arranged in a gradually increasing shape from an end close to the first air inlet to a cross section close to the first fan device.

[0016] Furthermore, the first air inlet duct is arranged with a uniform cross-section or a tapered cross-section from a cross-section close to the first fan device to a cross-section close to the first magnetron assembly.

[0017] Furthermore, the first air inlet duct includes a first shell and a second shell, the first shell and the second shell are detachably plugged and fixed, and the first fan device is arranged near the middle of the first air inlet duct.

[0018] Furthermore, a first limiting groove is provided at the connection between the first shell and the second shell.

[0019] Furthermore, the first air guide cover includes a first guide plate and a first air outlet baffle arranged in sequence, the first air outlet baffle is located at the rear end of the air outlet of the first magnetron assembly, the first guide plate is arranged in an inclined shape, and one end thereof is connected to the first magnetron assembly, forming a first air outlet cavity between the first air outlet baffle and the first magnetron assembly.

[0020] Furthermore, a second guide plate is provided at one end of the first air outlet baffle away from the first guide plate, for guiding the airflow in the first air outlet cavity outward.

[0021] Furthermore, the second fan device is arranged inside the second air inlet duct, and the airflow introduced into the second air inlet duct by the second fan device flows at an angle.

[0022] Furthermore, the second air inlet duct includes a detachable third shell and a fourth shell, and relatively independent first and second cavities are formed between the third shell and the fourth shell, wherein the second air inlet is connected to the first cavity, the second fan device is arranged in the first cavity, and the first frequency conversion device is arranged in the second cavity.

[0023] Compared with the prior art, the heat dissipation system of the magnetron device described in the present invention has the following advantages:

[0024] (1) The heat dissipation system for the magnetron device described in the present invention ensures that each magnetron component can obtain sufficient cold air supply by adopting an independent air duct system combined with a fan device, thereby achieving a uniform and efficient heat dissipation effect, effectively reducing the operating temperature of the magnetron, and avoiding performance degradation or damage due to overheating.

[0025] (2) The heat dissipation system of the magnetron device described in the present invention has a compact structure and a reasonable design, which not only improves the heat dissipation efficiency but also reduces the noise level and enhances the user experience.

[0026] Another object of the present invention is to provide a microwave oven, comprising a cavity assembly, a door assembly and a shell assembly, wherein the door assembly is arranged at the front end of the cavity assembly and can open or cover its opening, and a magnetron device heat dissipation system as described above is arranged at the bottom of the cavity assembly.

[0027] The microwave oven and the magnetron device heat dissipation system have the same advantages over the prior art, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0029] Figure 1 This is a schematic diagram of the partial explosion structure of the microwave oven according to an embodiment of the present utility model;

[0030] Figure 2 This is a schematic structural diagram of the heat dissipation system of the magnetron device according to an embodiment of the present utility model being assembled on a furnace chamber assembly;

[0031] Figure 3 This is a schematic structural diagram of the heat dissipation system of the magnetron device according to an embodiment of the present invention being assembled on the furnace cavity assembly from a second perspective;

[0032] Figure 4 This is a schematic structural diagram of the heat dissipation system of the magnetron device according to an embodiment of the present invention being assembled on a furnace cavity assembly from a third perspective;

[0033] Figure 5 This is a schematic structural diagram of the heat dissipation device of the first magnetron assembly according to an embodiment of the present utility model;

[0034] Figure 6 for Figure 5 Schematic diagram of the exploded structure of the structure shown in;

[0035] Figure 7 This is a structural diagram of the first shell according to an embodiment of the present utility model;

[0036] Figure 8 This is a structural schematic diagram of the first magnetron assembly heat dissipation device according to an embodiment of the utility model from a second perspective;

[0037] Figure 9 This is a schematic structural diagram of the second magnetron assembly heat dissipation device according to an embodiment of the present utility model;

[0038] Figure 10 for Figure 9 Schematic diagram of the exploded structure of the structure shown in;

[0039] Figure 11 for Figure 9 A schematic diagram of the exploded structure of the second perspective of the structure shown in ;

[0040] Description of reference numerals:

[0041] 100-furnace chamber assembly; 200-door sealing assembly; 300-housing assembly; 301-U-shaped housing; 302-bottom plate housing; 1-bottom mounting plate; 2-first magnetron assembly; 3-second magnetron assembly; 4-first air inlet duct; 5-first air guide hood; 501-first guide plate; 502-first air outlet baffle; 503-second guide plate; 504-first connecting plate; 505-second connecting plate; 506-first stop rib; 507-first air outlet cavity; 6-second air inlet duct; 7-second air guide hood; 8-first air inlet; 9-second air inlet; 10-first housing; 1001-first guide plate; 1002-first mounting plate; 1 003-second guide plate; 1004-first limiting plate; 1005-first side plate; 1006-second side plate; 11-second shell; 1101-third guide plate; 1102-second mounting plate; 1103-fourth guide plate; 1104-third side plate; 1105-fourth side plate; 1106-first limiting groove; 1107-second limiting plate; 12-first fan device; 13-third shell; 14-fourth shell; 15-second fan device; 16-first cavity; 17-second cavity; 18-first frequency conversion device; 19-third fan device; 20-fourth fan device; 21-fourth air duct assembly; 22-waveguide box assembly. DETAILED DESCRIPTION

[0042] In order to make the technical means, objectives and effects of the present invention easier to understand, embodiments of the present invention are described in detail below with reference to specific drawings.

[0043] It should be noted that all terms used in this utility model to indicate direction and position, such as "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside", "top", "low", "lateral", "longitudinal", "center", etc., are only used to explain the relative positional relationship and connection status between the various components in a certain specific state (as shown in the accompanying drawings). They are only for the convenience of describing this utility model, and do not require that the utility model must be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the utility model. In addition, the descriptions of "first", "second", etc. in this utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated.

[0044] In the description of this utility model, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections; they can refer to direct connections, indirect connections through an intermediary, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0045] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0046] like Figures 1 to 11 As shown, the present application discloses a heat dissipation system for a magnetron device, comprising:

[0047] The bottom mounting plate 1 is arranged below the bottom plate of the furnace chamber assembly 100;

[0048] A first magnetron assembly 2 is mounted on the bottom mounting plate 1, and a first air inlet duct 4 and a first air guide cover 5 are respectively provided at opposite ends of the first magnetron assembly 2, and a first air inlet 8 is provided at an end of the first air inlet duct 4 away from the first magnetron assembly 2;

[0049] A second magnetron assembly 3 is mounted on the bottom mounting plate 1, and a second air inlet duct 6 and a second air guide cover 7 are respectively provided at opposite ends of the second magnetron assembly 3, and a second air inlet 9 is provided on the second air inlet duct 6;

[0050] The first fan device 12 is used to draw air into the first air inlet duct 4 and cool the first magnetron assembly 2 and then guide the air out through the first air guide cover 5;

[0051] The second fan device 15 is used for taking air into the second air inlet duct 6 and cooling the second magnetron assembly 3 with air, and then discharging the air through the second air guide cover 7 .

[0052] The present application discloses a heat dissipation system for a magnetron device, in which a first magnetron assembly 2 and a second magnetron assembly 3 are respectively mounted on a bottom mounting plate 1 of a furnace chamber assembly 100, and air inlet ducts and air guide covers are arranged at opposite ends thereof, forming two independent air duct systems to efficiently dissipate heat for the two magnetron assemblies. A first fan device 12 and a second fan device 15 are respectively responsible for supplying cold air into their respective corresponding air inlet ducts. The cold air absorbs and carries away heat when flowing through the magnetron assemblies, and is then guided and discharged through the air guide covers, thereby achieving accurate and efficient air cooling of the magnetron assemblies.

[0053] The magnetron device cooling system described in this application utilizes an independent air duct system combined with a fan device to ensure that each magnetron assembly receives an adequate supply of cooling air, achieving uniform and efficient heat dissipation. This effectively reduces the magnetron's operating temperature and avoids performance degradation or damage due to overheating. Its simple structure and rational design not only improve heat dissipation efficiency but also reduce noise levels, enhancing the user experience. Furthermore, the independence of the air duct system makes installation and maintenance more convenient, reducing maintenance costs and enhancing the product's market competitiveness.

[0054] As a preferred example of the present application, the first fan device 12 is arranged inside the first air inlet duct 4, and the first air inlet duct 4 is arranged in a gradually increasing cross-section from one end close to the first air inlet 8 to the end close to the first fan device 12.

[0055] This design optimizes the structure of the first air inlet duct 4, places the first fan device 12 directly inside the first air inlet duct 4, and specially designs the duct cross-section to gradually increase from the end close to the first air inlet 8 to the position of the first fan device 12, so that the airflow can be quickly sucked in and accelerated by the fan device after entering the air duct, effectively improving the airflow suction efficiency and stability, reducing airflow resistance, and improving air intake efficiency, so that more and more uniform cold air can directly act on the first magnetron assembly 2, significantly reducing its operating temperature.

[0056] Preferably, the first air inlet duct 4 is arranged to be equal or tapered from a section close to the first fan device 12 to a section close to the first magnetron assembly 2 .

[0057] This design enables the cross-section of the air inlet direction duct at the front end of the first magnetron assembly 2 to adopt a uniform cross-section design or a tapered cross-section design. The uniform cross-section design ensures that the airflow is stable in the process of flowing to the first magnetron assembly 2, reduces the generation of eddies and turbulence, and makes the heat dissipation more uniform and efficient; while the tapered cross-section design further accelerates and concentrates the airflow, so that the hot spot area of ​​the first magnetron assembly 2 can obtain a stronger cooling effect, further reduces the operating temperature of the magnetron, aims to reduce the airflow resistance in the air duct, improve the operating efficiency of the fan, reduce noise and energy consumption, and enhance the heat dissipation performance of the heat dissipation system of the magnetron device.

[0058] As a preferred example of the present application, the first air inlet duct 4 includes a first shell 10 and a second shell 11. The first shell 10 and the second shell 11 are detachably plugged and fixed, and the first fan device 12 is arranged near the middle of the first air inlet duct 4. In the example of the present application, the first shell 10 includes a first guide plate 1001, a first mounting plate 1002, and a second guide plate 1003 arranged in sequence, and a first side plate 1005 and a second side plate 1006 are respectively arranged at the edge positions on both sides perpendicular to the air inlet direction thereof, and one or two first limiting plates 1004 are arranged on the first mounting plate 1002 and on the opposite sides of the first mounting plate 1002 along the air inlet direction. Correspondingly, the second shell 11 includes a third guide plate 1101, a second mounting plate 1102, and a fourth guide plate 1103 arranged in sequence, and a third side plate 1104 and a fourth side plate 1105 are respectively arranged at the edge positions on both sides perpendicular to the air inlet direction thereof, and one or two second limiting plates 1107 are arranged on the opposite sides of the second mounting plate 1102 along the air inlet direction, and the first fan device 12 is limited and fixed by the first limiting plate 1004 and the second limiting plate 1107 inside the first air inlet duct 4. Preferably, the third guide plate 1101 is arranged in an inclined shape.

[0059] The arrangement discloses a structural form of a first air inlet duct 4, which introduces a detachable plug-in limit fixed first shell 10 and a second shell 11 structure, wherein the first shell 10 is provided with a first guide plate 1001, a first mounting plate 1002, a second guide plate 1003 and a first side plate 1005 and a second side plate 1006 on both sides, and cooperates with the third guide plate 1101, the second mounting plate 1102, the fourth guide plate 1103 and the third side plate 1104 and the fourth side plate 1105 on both sides to form an air guide channel, and the air guide channel is formed between the two mounting plates. The first limiting plate 1004 and the second limiting plate 1107 are positioned to cooperate with each other to jointly limit and fix the first fan device 12, which simplifies the assembly and disassembly process of the first air inlet duct 4, reduces maintenance costs, and facilitates users to adjust and optimize the duct structure according to needs. In addition, the tilted third guide plate 1101 is used to adjust the air inlet cross-section on the air inlet side of the first fan device 12, effectively improving the guidance of the airflow, reducing the resistance of the airflow in the air duct, so that the cold air can flow to the first magnetron assembly 2 more quickly and more concentratedly, thereby improving the heat dissipation efficiency.

[0060] As a preferred example of the present application, a first limiting groove 1106 is provided at the connection between the first shell 10 and the second shell 11. Preferably, the first limiting groove 1106 is provided on the third side plate 1104 and the fourth side plate 1105 near the connection end of the first shell 10, and the first limiting groove 1106 extends from the end of the second shell 11 near the first air inlet 8 to the end near the first magnetron assembly 2. The first side plate 1005 and the second side plate 1006 of the first shell 10 are inserted into the first limiting groove 1106 for position fixation. By providing the first limiting groove 1106 at the connection between the first shell 10 and the second shell 11, the precise docking and firm positioning of the first air inlet duct 4 shell are achieved. The first limiting groove 1106 extends from one end near the first air inlet 8 to one end near the first magnetron assembly 2, which not only ensures the airtightness of the air duct, but also enhances the overall rigidity of the air duct structure, making the overall air duct structure more stable and reliable when subjected to airflow impact. In addition, the plug-in limit method simplifies the assembly steps of the air duct components, reduces the difficulty of installation, and also provides convenience for subsequent maintenance and replacement.

[0061] As a preferred example of the present application, the first air guide hood 5 includes a first guide plate 501 and a first air outlet baffle 502 arranged in sequence. The first air outlet baffle 502 is located at the rear end of the air outlet of the first magnetron assembly 2. The first guide plate 501 is arranged in an inclined shape, and one end thereof is connected to the first magnetron assembly 2. A first air outlet cavity 507 is formed between the first air outlet baffle 502 and the first magnetron assembly 2. This setting discloses a specific structure of a first air guide hood 5. After the cooling airflow introduced by the first fan device 12 absorbs heat through the first magnetron assembly 2, it is smoothly guided to the first air outlet baffle 502 through the inclined first guide plate 501, reducing the resistance and turbulence of the airflow during the flow. The first air outlet baffle 502 is located at the rear end of the air outlet of the first magnetron assembly 2, and a first air outlet cavity 507 is formed between the first magnetron assembly 2, which effectively collects and concentrates the discharged hot air, avoids the secondary heating of the magnetron assembly by the hot air backflow, and improves the overall efficiency of the heat dissipation system, thereby realizing efficient heat transfer and dissipation with a compact structure.

[0062] As a preferred example of the present application, a second guide plate 503 is provided at one end of the first air outlet baffle 502 away from the first guide plate 501, for guiding the airflow in the first air outlet cavity 507 outward. As a specific example of the present application, the first guide plate 501 forms an obtuse angle with the first air outlet baffle 502, and the first air outlet baffle 502 forms an obtuse angle with the second guide plate 503. The first air inlet 8 is designed to face the front end of the microwave oven, and the second guide plate 503 is located on the left side of the microwave oven and is designed to guide air toward the left side. A first connecting plate 504 and a second connecting plate 505 are respectively provided on the other two opposite sides of the first air outlet baffle 502. A first stop rib 506 is provided on the side of the first connecting plate 504 and the second connecting plate 505 close to the first guide plate 501, for detachably fixing and limiting the first air guide cover 5 and the first magnetron assembly 2. This configuration, by adding a second guide plate 503 and optimizing the angle, reduces resistance to airflow at turns. This allows for smoother discharge of absorbed heat, preventing the accumulation of hot air within the microwave oven and further enhancing heat dissipation. Furthermore, the first air inlet 8 is positioned toward the front of the microwave oven to facilitate the introduction of fresh, cool air, while the second guide plate 503 directs air toward the left side of the microwave oven, optimizing the airflow path and stabilizing its direction, ensuring efficient operation of the heat dissipation system.

[0063] As a preferred example of the present application, the second fan device 15 is disposed within the second air inlet duct 6, and the airflow introduced into the second air inlet duct 6 by the second fan device 15 flows at an angle. Preferably, the air duct structure of the second air inlet duct 6 is vertically arranged. In the example of the present application, the second air inlet 9 of the second air inlet duct 6 is designed to face the front of the microwave oven, and the second fan device 15 guides air in the left-right direction within the second air inlet duct 6. The structure of the second air duct 7 is similar to that of the first air duct 5, and guides air toward the rear of the microwave oven.

[0064] This setting optimizes the structure of the second air inlet duct 6 and designs it into an angled or vertical duct structure, which not only saves space but also enhances the guidance of the airflow. The airflow flowing at an angle improves the utilization rate and cooling efficiency of the airflow, thereby forming an orderly airflow circulation in the entire heat dissipation system, achieving efficient cooling of the second magnetron assembly 3, and improving the heat dissipation effect.

[0065] As a preferred example of the present application, the second air inlet duct 6 includes a detachable third shell 13 and a fourth shell 14, and relatively independent first cavity 16 and second cavity 17 are formed between the third shell 13 and the fourth shell 14, wherein the second air inlet 9 is connected to the first cavity 16, the second fan device 15 is arranged in the first cavity 16, and the first frequency conversion device 18 is arranged in the second cavity 17.

[0066] This arrangement splits the second air inlet duct 6 into a detachable third shell 13 and a fourth shell 14, and a relatively independent first cavity 16 and second cavity 17 are formed between these two shells, which are used for air cooling and heat dissipation of the second magnetron assembly 3 and the first frequency conversion device 18, respectively, thereby achieving orderly guidance of the airflow, avoiding thermal interference between different components, improving the overall heat dissipation efficiency, making full use of the air duct space, and achieving a perfect combination of heat dissipation and space utilization. The structure is convenient for processing, production and assembly.

[0067] As a preferred example of the present application, a third fan device 19 is provided in the second cavity 17 for introducing air into the second cavity 17 and cooling the first frequency conversion device 18. As a specific example of the present application, the third fan device 19 is provided at the front end of the first frequency conversion device 18, forming a third air inlet at the front end or lateral to the front end of the second cavity 17, and forming a third air outlet at the rear end of the second cavity 17 for the air to flow out after the heat is dissipated by the first frequency conversion device 18.

[0068] This arrangement further enhances the heat dissipation capability of the microwave oven, particularly for key components such as the first frequency conversion device 18, thereby achieving a more efficient and precise heat dissipation effect, thereby improving the overall operational stability of the microwave oven. Furthermore, by reducing heat accumulation and lowering the internal temperature, it also indirectly provides heat dissipation protection for the second magnetron assembly 3 in the microwave oven.

[0069] As a preferred example of the present application, a fourth fan device 20 and a fourth air duct assembly 21 structure are also provided on the bottom mounting plate 1, and a second frequency conversion device (not marked in the figure) is provided in the fourth air duct assembly 21, so as to realize independent frequency conversion control of the two magnetron assemblies, and an independent air-cooling heat dissipation structure is provided for the two frequency conversion devices. The first magnetron assembly 2 is provided near the middle position on the left side of the bottom mounting plate 1, and the second magnetron assembly 3 is provided near the middle position on the rear side of the bottom mounting plate 1. The air-cooling duct accommodating space where the first frequency conversion device 18 and the second frequency conversion device are located is located at the corner positions on opposite sides of the second magnetron assembly 3, and the first magnetron assembly 2 and the second magnetron assembly 3 are both connected to the waveguide box assembly 22.

[0070] The present application also discloses a microwave oven, comprising an oven cavity assembly 100, a door sealing assembly 200 and a shell assembly 300. The door sealing assembly 200 is arranged at the front end of the oven cavity assembly 100 and can open or seal its opening. The bottom of the oven cavity assembly 100 is provided with a magnetron device heat dissipation system as described in the above embodiment.

[0071] As a preferred example of the present application, the shell assembly 300 includes a U-shaped shell 301 and a bottom plate shell 302. The U-shaped shell 301 and the bottom plate shell 302 are arranged in a U-shaped cover on the outside of the furnace chamber assembly 100, and the bottom plate shell 302 is located below the first magnetron assembly 2 and the second magnetron assembly 3.

[0072] The microwave oven described in the present application optimizes the heat dissipation structure of the dual magnetron assembly within the microwave oven structure, and realizes accurate and efficient air cooling of the magnetron assembly through an independent air duct system combined with a high-efficiency fan device and air guide cover design. The reasonable air duct layout and bottom plate position setting greatly improve the heat dissipation efficiency of the microwave oven, effectively solve the problem of the magnetron device being prone to overheating during operation of the microwave oven, reduce the noise level, and improve the user experience.

[0073] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation system for a magnetron device, characterized in that: include: A bottom mounting plate (1) is disposed below the bottom plate of the furnace chamber assembly (100); A first magnetron assembly (2) is mounted on the bottom mounting plate (1), and a first air inlet duct (4) and a first air guide cover (5) are respectively provided at opposite ends of the first magnetron assembly (2), and a first air inlet port (8) is provided at an end of the first air inlet duct (4) away from the first magnetron assembly (2); A second magnetron assembly (3) is mounted on the bottom mounting plate (1), and a second air inlet duct (6) and a second air guide cover (7) are respectively provided at opposite ends of the second magnetron assembly (3), and a second air inlet (9) is provided on the second air inlet duct (6); A first fan device (12) is used to introduce air into the first air inlet duct (4) and to cool the first magnetron assembly (2) and then guide the air out through the first air guide cover (5); The second fan device (15) is used to draw air into the second air inlet duct (6) and to cool the second magnetron assembly (3) with air, and then guide the air out through the second air guide cover (7).

2. The heat dissipation system for a magnetron device according to claim 1, wherein: The first fan device (12) is arranged inside the first air inlet duct (4), and the first air inlet duct (4) is arranged in a gradually increasing shape from one end close to the first air inlet (8) to a cross section close to the first fan device (12).

3. The heat dissipation system for a magnetron device according to claim 2, wherein: The first air inlet duct (4) is arranged in a uniform cross-section or in a tapered shape from a cross-section close to the first fan device (12) to a cross-section close to the first magnetron assembly (2).

4. The heat dissipation system for a magnetron device according to claim 2 or 3, characterized in that: The first air inlet duct (4) comprises a first shell (10) and a second shell (11); the first shell (10) and the second shell (11) are detachably plugged and fixed in a limited manner; and the first fan device (12) is arranged in a position near the middle of the first air inlet duct (4).

5. The heat dissipation system for a magnetron device according to claim 4, characterized in that: A first limiting groove (1106) is provided at the connection between the first shell (10) and the second shell (11).

6. The heat dissipation system for a magnetron device according to claim 1, wherein: The first air guide cover (5) comprises a first guide plate (501) and a first air outlet baffle (502) which are arranged in sequence. The first air outlet baffle (502) is located at the air outlet rear end of the first magnetron assembly (2). The first guide plate (501) is arranged in an inclined shape, and one end thereof is connected to the first magnetron assembly (2). A first air outlet cavity (507) is formed between the first air outlet baffle (502) and the first magnetron assembly (2).

7. The heat dissipation system for a magnetron device according to claim 6, wherein: A second guide plate (503) is provided at one end of the first air outlet baffle (502) away from the first guide plate (501) for guiding the airflow in the first air outlet cavity (507) outwards.

8. The heat dissipation system for a magnetron device according to claim 1, wherein: The second fan device (15) is arranged inside the second air inlet duct (6), and the airflow introduced into the second air inlet duct (6) by the second fan device (15) flows in an angled manner.

9. The heat dissipation system for a magnetron device according to claim 8, wherein: The second air inlet duct (6) comprises a detachable third shell (13) and a fourth shell (14), and a relatively independent first cavity (16) and a second cavity (17) are formed between the third shell (13) and the fourth shell (14), wherein the second air inlet (9) is connected to the first cavity (16), the second fan device (15) is arranged in the first cavity (16), and the first frequency conversion device (18) is arranged in the second cavity (17).

10. A microwave oven, characterized in that: The invention comprises a furnace chamber assembly (100), a sealing door assembly (200) and a shell assembly (300), wherein the sealing door assembly (200) is arranged at the front end of the furnace chamber assembly (100) and can open or cover the opening thereof, and the magnetron device heat dissipation system according to any one of claims 1 to 9 is arranged at the bottom of the furnace chamber assembly (100).

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