Radiator of power module and power module

Abstract

The utility model discloses a radiator and a power module, the radiator comprises a bottom plate, the bottom plate is provided with a first surface and a second surface which are opposite, and the second surface is connected with the power module; the heat dissipation structure protrudes out of the first surface of the bottom plate, and the heat dissipation structure comprises a plurality of heat dissipation columns arranged in an array; the first baffle is located on the first surface of the bottom plate and arranged on the first side edge and the second side edge which are opposite to each other; wherein the first side edge of the heat dissipation structure is parallel to the second side edge, the third side edge of the heat dissipation structure is parallel to the fourth side edge, the first side edge is perpendicular to the third side edge, the heat dissipation columns near the first side edge and the second side edge in the heat dissipation structure are connected with the first baffle to form a turbulent flow structure, and a heat dissipation medium flows to the fourth side edge from the third side edge of the heat dissipation structure. The heat dissipation design has better heat dissipation capability, the flow rate of the heat dissipation medium flowing through the chip area can be improved, the heat exchange amount between the heat dissipation medium and the heat dissipation bottom plate is improved, and a better heat dissipation effect on the power module chip is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, and more particularly to a radiator of a power module and the power module. Background Art

[0002] The heat sink of a power module is a key component for effectively reducing the module's temperature and ensuring its proper operation. As the power density of electronic devices continues to increase, the heat generated by the power module is also increasing. Traditional heat dissipation methods rely primarily on a combination of heat sinks and fans. However, due to the small size and high density of power modules, traditional heat sinks often cannot meet the heat dissipation requirements. Therefore, improving the heat dissipation performance of power modules has become a key technical issue.

[0003] Excessive temperatures not only affect the maximum output power of the chip, but also the performance and lifespan of the power module and even the entire vehicle. Therefore, within the highly integrated space of new energy vehicles, effective heat dissipation design is essential. This allows for simple, effective, and cost-effective heat dissipation, ensuring that the power module operates within its effective temperature range and preventing chip failure caused by excessive temperatures.

[0004] In recent years, heat sinks using liquid cooling technology have emerged, capable of achieving efficient heat dissipation in a small space, meeting the cooling requirements of power modules while saving space. However, existing liquid-cooled heat sink designs often feature evenly spaced heat columns. When the heat dissipation medium flows through the heat columns, the heat exchange effect in the area surrounding each column is the same. However, the temperature of the heat sink corresponding to the chip's active area is higher, while the temperature of the remaining areas is lower. This makes it difficult to effectively dissipate heat from the active area, while the heat dissipation capacity of the remaining areas is wasted. This results in poor heat dissipation from the heat sink substrate, making it difficult to meet the product's high-power, long-term operation requirements. Utility Model Content

[0005] In view of this, an object of the present invention is to provide a heat sink for a power module and a power module, so as to enhance the heat dissipation capability and improve the performance of the corresponding power module.

[0006] The utility model provides a heat sink for a power module, comprising: a base plate, the base plate having a first surface and a second surface opposite to each other, the second surface being connected to the power module; a heat dissipation structure, the heat dissipation structure protruding from the first surface of the base plate, the heat dissipation structure comprising a plurality of heat dissipation columns arranged in an array; a first baffle, located on the first surface of the base plate and arranged on first and second side edges opposite to each other of the heat dissipation structure; wherein the first side edge of the heat dissipation structure is parallel to the second side edge, the third side edge of the heat dissipation structure is parallel to the fourth side edge, and the first side edge of the heat dissipation structure is perpendicular to the third side edge of the heat dissipation structure.

[0007] Optionally, the heat dissipation columns near the first side and the second side of the heat dissipation structure are connected to the first baffle to form a spoiler structure, and the heat dissipation medium flows from the third side to the fourth side of the heat dissipation structure.

[0008] Optionally, a second baffle is further included, which is located on the first surface of the base plate, and connects at least two adjacent heat dissipation columns. The second baffle includes multiple second baffles, and the multiple second baffles are respectively located near the first side and the second side of the heat dissipation structure.

[0009] Optionally, the second baffle is perpendicular to the flow direction of the heat dissipation medium.

[0010] Optionally, the cross-section of the heat dissipation column includes any one of a circular shape, an elliptical shape, a triangular shape, a rectangular shape, a diamond shape, and a teardrop shape.

[0011] Optionally, the cross-sectional shapes of the plurality of heat dissipation columns arranged in an array in the heat dissipation structure are the same.

[0012] Optionally, the characteristic diameter of the heat dissipation column is 1mm~2mm, and the characteristic diameter of the heat dissipation column refers to the diameter of the circular cross-section, the minor axis length of the elliptical cross-section, the diameter of the inscribed circle of the triangular cross-section, the diagonal length of the rectangular cross-section, the diagonal length of the diamond cross-section, and the width of the teardrop-shaped cross-section.

[0013] Optionally, the second baffle is connected to 2-5 heat dissipation columns adjacent to the second baffle.

[0014] Optionally, at least one of the two adjacent second baffles is connected to the first baffle via a heat dissipation column near the first side edge or the second side edge.

[0015] Optionally, an area of ​​the heat dissipation structure where the second baffle is not provided corresponds to a position of the power module.

[0016] The utility model also provides a power module, which includes the above-mentioned radiator.

[0017] Beneficial effects of the utility model:

[0018] The heat sink and power module of the power module provided by the present invention are configured such that a first baffle is provided on the first side and the second side of the heat dissipation structure, and the first baffle is connected to a nearby heat dissipation column to form a turbulent structure, so that the flow rate of the heat dissipation medium in the middle of the heat dissipation structure corresponding to the chip is increased, thereby improving the heat exchange between the heat dissipation medium and the heat sink, and achieving a better heat dissipation effect. Furthermore, the heat dissipation medium flows from the third side to the fourth side of the heat dissipation structure. This design enables the heat sink of the present invention to be applicable to a series liquid cooling solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings.

[0020] Figure 1 A perspective schematic diagram showing a radiator according to a first embodiment of the present invention;

[0021] Figure 2 A front view of a radiator according to a first embodiment of the present invention is shown;

[0022] Figure 3 A front view of a radiator according to a second embodiment of the present invention is shown;

[0023] Figure 4 A front view of a radiator according to a third embodiment of the present invention is shown;

[0024] Figure 5 A front view of a radiator according to a fourth embodiment of the present invention is shown;

[0025] Figure 6 A front view of a radiator according to a fifth embodiment of the present invention is shown;

[0026] Figure 7 A front view of a radiator according to a sixth embodiment of the present invention is shown. DETAILED DESCRIPTION

[0027] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by identical or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Figure 1A perspective schematic diagram of a heat sink according to a first embodiment of the present invention is shown. The heat sink includes a base plate 100 and a heat dissipation structure 200 located on a first surface of the base plate 100. The heat dissipation structure 200 protrudes from the first surface of the base plate 100 and includes a plurality of heat dissipation columns arranged in an array. The second surface of the base plate 100 is opposite to the first surface and is connected to the power module. The heat dissipation structure 200 is, for example, rectangular. First baffles 210 are provided on both the upper and lower sides of the heat dissipation structure 200. Heat dissipation medium flows into the heat dissipation structure 200, for example, through the left side of the heat dissipation structure 200 and flows out from the right side of the heat dissipation structure 200. The first baffles 210 are, for example, integrated with a portion of the heat dissipation columns near the first baffles 210 to form a flow disturbance structure, thereby increasing the flow resistance in the region, creating a significant difference in flow velocity between the heat dissipation medium inside and outside the region, and increasing the flow velocity of the heat dissipation medium in the non-flow disturbance structure region. This region corresponds to the high heat generation area such as the power module chip, which can significantly improve the heat exchange capacity and make the heat sink temperature more balanced.

[0030] Figure 2 A front view of a radiator according to a first embodiment of the present invention is shown; Figure 2 As can be seen in the figure, the cross-section of the heat sink 201 in the heat dissipation structure 200 of the heat sink of the first embodiment is, for example, elliptical. The heat sink also includes a plurality of second baffles 220, which are, for example, perpendicular to the first baffles 210 and connect some adjacent heat sinks 201. On the same side of the heat dissipation structure 200, the first baffles 210 and the second baffles 220 and the heat sinks 201 connected thereto form a meandering channel for the heat dissipation structure to flow. This creates a significant difference in flow velocity between the heat dissipation structure inside and outside the meandering channel, increasing the flow velocity of the heat dissipation medium outside the meandering channel, thereby improving its heat exchange capacity. Compared to a solution with evenly arranged heat sinks, this design can effectively reduce the temperature of the power module located on the second surface of the base plate 100.

[0031] Figure 3 and Figure 4 The front views of the radiators of the second and third embodiments of the present utility model are shown respectively; Figure 3 As shown, in the heat sink of the second embodiment, the second baffle 220 connects three adjacent heat dissipation columns 201. Specifically, on the same side of the heat dissipation structure 200, at least one of the two adjacent second baffles 220 is connected to the first baffle 210 through the heat dissipation column 201 near the side, so as to form a longer meandering channel with a larger coverage area. Figure 4 As shown, similar to the second embodiment, in the heat sink of the third embodiment, the second baffle 220 connects four adjacent heat dissipation columns 201 .

[0032] Figure 5 、 Figure 6 and Figure 7 The main views of the radiators of the fourth embodiment, the fifth embodiment and the sixth embodiment of the present invention are respectively shown. The fourth, fifth and sixth embodiments are similar to the first embodiment, except that, in the radiator of the fourth embodiment, the cross-section of the heat dissipation column 201 is diamond-shaped; in the radiator of the fifth embodiment, the cross-section of the heat dissipation column 201 is circular; in the radiator of the sixth embodiment, the cross-section of the heat dissipation column 201 is teardrop-shaped.

[0033] In the present invention, the cross-section of the heat dissipation column 201 can be any one of circular, elliptical, triangular, rectangular, diamond, and teardrop-shaped. In the same embodiment, the cross-sectional shape of the heat dissipation column 201 in the heat dissipation structure 200 is the same. Specifically, the characteristic diameter of the heat dissipation column 201 is, for example, 1mm~2mm. The characteristic diameter of the heat dissipation column 201 refers to, for example, the diameter of the circular cross-section, the short axis length of the elliptical cross-section, the diameter of the inscribed circle of the triangular cross-section, the diagonal length of the rectangular cross-section, the diagonal length of the diamond cross-section, and the width of the teardrop-shaped cross-section.

[0034] The heat sink and power module of the power module provided by the present invention are configured such that a first baffle is provided on the first side and the second side of the heat dissipation structure, and the first baffle is connected to a nearby heat dissipation column to form a turbulent structure, so that the flow rate of the heat dissipation medium in the middle of the heat dissipation structure corresponding to the chip is increased, thereby improving the heat exchange between the heat dissipation medium and the heat sink, and achieving a better heat dissipation effect. Furthermore, the heat dissipation medium flows from the third side to the fourth side of the heat dissipation structure. This design enables the heat sink of the present invention to be applicable to a series liquid cooling solution.

[0035] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0036] While embodiments of the present invention have been described above, these embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A heat sink for a power module, characterized in that: include: a bottom plate having a first surface and a second surface opposite to each other, wherein the second surface is connected to the power module; a heat dissipation structure, the heat dissipation structure protruding from the first surface of the base plate, the heat dissipation structure comprising a plurality of heat dissipation columns arranged in an array; a first baffle, located on the first surface of the base plate and disposed on first and second opposite sides of the heat dissipation structure; The first side of the heat dissipation structure is parallel to the second side, the third side of the heat dissipation structure is parallel to the fourth side, and the first side of the heat dissipation structure is perpendicular to the third side of the heat dissipation structure.

2. The radiator according to claim 1, characterized in that The heat dissipation columns near the first and second sides of the heat dissipation structure are connected to the first baffle to form a spoiler structure, and the heat dissipation medium flows from the third side to the fourth side of the heat dissipation structure.

3. The radiator according to claim 2, characterized in that It also includes a second baffle, which is located on the first surface of the base plate and connects at least two adjacent heat dissipation columns. The second baffle includes multiple second baffles, and the multiple second baffles are respectively located near the first side and the second side of the heat dissipation structure.

4. The radiator according to claim 3, characterized in that The second baffle is perpendicular to the flow direction of the heat dissipation medium.

5. The radiator according to claim 3, characterized in that The cross-section of the heat dissipation column includes any one of a circle, an ellipse, a triangle, a rectangle, a diamond, and a water drop shape.

6. The radiator according to claim 3, characterized in that The cross-sectional shapes of the plurality of heat dissipation columns arranged in an array in the heat dissipation structure are the same.

7. The radiator according to claim 5, characterized in that The characteristic diameter of the heat dissipation column is 1mm~2mm, and the characteristic diameter of the heat dissipation column refers to the diameter of the circular cross-section, the minor axis length of the elliptical cross-section, the diameter of the inscribed circle of the triangular cross-section, the diagonal length of the rectangular cross-section, the diagonal length of the diamond cross-section, and the width of the teardrop-shaped cross-section.

8. The radiator according to claim 3, characterized in that The second baffle is connected to 2-5 heat dissipation columns adjacent to the second baffle.

9. The radiator according to claim 3, characterized in that At least one of the two adjacent second baffles is connected to the first baffle through a heat dissipation column near the first side edge or the second side edge.

10. The radiator according to claim 8, characterized in that An area of ​​the heat dissipation structure where the second baffle is not provided corresponds to a position of the power module.

11. A power module, characterized in that: The power module includes the heat sink for the power module according to any one of claims 1 to 10.

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