Bearing device

Abstract

The utility model relates to the technical field of structural ceramic machining, in particular to a bearing device which comprises a supporting frame, a carrier and a top cover, and the carrier is arranged on the supporting frame. The top cover is arranged on the side, away from the supporting frame, of the carrier, a containing space is defined by the top cover and the carrier, and the silicon carbide biscuit is arranged in the containing space. The silicon carbide biscuit is placed on the carrier, and the carrier is arranged on the supporting frame, so that the height of the working position of the carrier is close to that of the working position of the silicon carbide biscuit processing equipment, and the silicon carbide biscuit can be conveniently taken and placed. A top cover is arranged on the side, away from the supporting frame, of the carrier, a containing space is defined by the top cover and the carrier, and the processed silicon carbide biscuit is arranged in the containing space so that the silicon carbide biscuit can be isolated from moisture in air outside the containing space, the situation that the moisture in the air outside the containing space enters the silicon carbide biscuit is relieved, and the service life of the silicon carbide biscuit is prolonged. Therefore, the problem that the silicon carbide biscuit absorbs water and deforms is solved, and the plane precision of the silicon carbide biscuit is effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of structural ceramic processing, and in particular to a bearing device. Background Art

[0002] Silicon carbide boats require very high flatness accuracy. To reduce grinding time, the flatness of the finished silicon carbide boats after sintering needs to be controlled. Therefore, the flatness of the silicon carbide boats needs to be controlled during the processing of the blanks. Currently, after processing, the silicon carbide blanks are usually placed next to the processing equipment. After the products are processed, they are put into the drying room to dry out the moisture. During this waiting time, air moisture can easily enter the blanks, causing them to absorb water and deform, thereby affecting the flatness accuracy of the blanks. Utility Model Content

[0003] In view of this, the present application provides a supporting device that can effectively improve the plane accuracy of the silicon carbide blank.

[0004] An embodiment of the present application provides a carrying device comprising a support frame, a carrier, and a top cover. The carrier is mounted on the support frame and is used to carry a silicon carbide blank. The top cover is mounted on a side of the carrier away from the support frame, and a storage space is enclosed between the top cover and the carrier. The silicon carbide blank is disposed within the storage space.

[0005] The aforementioned carrying device places the silicon carbide blank on a carrier mounted on a support frame, so that the carrier and the working position of the silicon carbide blank processing equipment are close in height, facilitating easy access to and placement of the silicon carbide blank. A top cover is provided on the side of the carrier away from the support frame, and the top cover and the carrier enclose a storage space. The processed silicon carbide blank is placed within the storage space to isolate the silicon carbide blank from moisture in the air outside the storage space, slowing the ingress of moisture from the air outside the storage space into the silicon carbide blank. This improves the problem of water absorption and deformation of the silicon carbide blank and effectively enhances the planar accuracy of the silicon carbide blank.

[0006] Optionally, a side of the carrier away from the support frame is defined as a bearing surface, and the bearing surface is provided with a bearing groove, and the bearing groove is used to bear the silicon carbide blank and limit the silicon carbide blank.

[0007] Optionally, the carrying device further includes a heating element, which is disposed on a side of the carrier close to the support frame, and is used to heat the carrier.

[0008] Optionally, a side of the carrier close to the support frame is defined as a heating surface, the heating surface is provided with a heating groove, and the heating element is arranged in the heating groove and close to the groove wall of the heating groove.

[0009] Optionally, a plurality of heating slots are provided, each of which is provided with a heating element, and a plurality of carrying slots are provided, each of which corresponds to at least one heating slot.

[0010] Optionally, a wire groove is provided on the side wall of the heating tank, the heating element includes a plate body and a wire, the plate body is provided in the heating tank, and the wire is electrically connected to the plate body and passed through the wire groove.

[0011] Optionally, the carrying device further includes a heat-insulating plate, which is arranged on a side of the carrier away from the top cover to keep the carrier warm.

[0012] Optionally, the carrier includes a main body and a sunken platform portion surrounding the main body, the sunken platform portion supports the side of the top cover close to the support frame, and the main body is at least partially located in the top cover.

[0013] Optionally, the top cover includes insulation material.

[0014] Optionally, the top cover includes a top cover portion and side portions, the side portions are arranged around the surface of the top cover portion, the sunken platform portion supports the side portions, and the main body portion is shielded by the top cover portion and the side portions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the carrying device in an embodiment of the present application.

[0016] Figure 2 It is a schematic diagram of the exploded structure of the carrying device in one embodiment of the present application.

[0017] Figure 3 It is a schematic diagram of the overall structure of a carrier in one embodiment of the present application.

[0018] Figure 4 yes Figure 3 The enlarged view of part A in the figure shows a schematic structural diagram of the wire duct in one embodiment of the present application.

[0019] Figure 5 It is a schematic diagram of the overall structure of the support frame in one embodiment of the present application.

[0020] Description of main component symbols

[0021] 1. Load-bearing device; 10. Support frame; 11. Long beam; 12. Wide beam; 13. Vertical beam; 20. Carrier; 21. Main body; 211. Load-bearing surface; 212. Load-bearing groove; 213. Heating surface; 214. Heating groove; 215. Wire trough; 22. Sinking platform; 30. Top cover; 31. Top cover; 32. Side; 40. Heating element; 41. Plate; 42. Wire; 50. Insulation board; 60. Mounting plate; 70. Casters; 9. Silicon carbide blank. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0023] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a centrally arranged element at the same time. When an element is considered to be "set on" another element, it may be directly set on the other element or there may be a centrally arranged element at the same time. In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the accompanying drawings are intended to cover non-exclusive inclusions.

[0025] In the description of the embodiments of this application, the technical terms "first," "second," etc. are used only to distinguish different objects and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise specifically defined.

[0026] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. The various embodiments of the present application may be combined with each other unless there is a conflict.

[0027] It should be noted that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary and should not constitute any limitation to the present application.

[0028] One embodiment of the present application provides a carrying device comprising a support frame, a carrier, and a top cover. The carrier is mounted on the support frame and is used to carry a silicon carbide blank. The top cover is mounted on a side of the carrier away from the support frame. The top cover and the carrier enclose a storage space within which the silicon carbide blank is disposed.

[0029] The aforementioned carrying device places the silicon carbide blank on a carrier mounted on a support frame, so that the carrier and the working position of the silicon carbide blank processing equipment are close in height, facilitating easy access to and placement of the silicon carbide blank. A top cover is provided on the side of the carrier away from the support frame, and the top cover and the carrier enclose a storage space. The processed silicon carbide blank is placed within the storage space to isolate the silicon carbide blank from moisture in the air outside the storage space, slowing the ingress of moisture from the air outside the storage space into the silicon carbide blank. This improves the problem of water absorption and deformation of the silicon carbide blank and effectively enhances the planar accuracy of the silicon carbide blank.

[0030] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. Unless there is a conflict, the features in the following embodiments and examples can be combined with each other.

[0031] Figure 1 FIG. 1 shows a schematic diagram of the overall structure of a carrying device 1 in an embodiment of the present application. Figure 2 A schematic diagram of the exploded structure of the carrying device 1 in one embodiment of the present application is shown.

[0032] See also Figure 1 and Figure 2 The embodiment of the present application provides a carrying device 1, comprising a support frame 10, a carrier 20, and a top cover 30. The carrier 20 is mounted on the support frame 10 and located on the upper surface of the support frame 10. The carrier 20 is used to carry a silicon carbide blank 9. By placing the silicon carbide blank 9 on the carrier 20, the carrier 20 is mounted on the support frame 10 so that the carrier 20 and the working position of the silicon carbide blank 9 processing equipment are close in height, facilitating the loading and unloading of the silicon carbide blank 9. The top cover 30 is disposed on the side of the carrier 20 away from the support frame 10. The top cover 30 and the carrier 20 enclose a storage space, and the silicon carbide blank 9 is disposed within the storage space.

[0033] In some embodiments, the carrier 20 is fixed to the upper surface of the support frame 10 by fasteners, which helps to improve the position stability of the carrier 20.

[0034] In other embodiments, the carrier 20 is detachably attached to the upper surface of the support frame 10, facilitating removal and replacement of the carrier 20. When the processing equipment processes a different specification of silicon carbide blanks 9, it is necessary to replace the carrier 20 with another model that is compatible with the silicon carbide blanks 9. By detachably connecting the carrier 20 to the support frame 10, it is possible to adapt to various models of silicon carbide blanks 9 by simply replacing the corresponding carrier 20, thereby increasing the application flexibility of the carrier device 1.

[0035] A top cover 30 is provided on the side of the carrier 20 away from the support frame 10. The top cover 30 and the carrier 20 enclose a receiving space. The silicon carbide blank 9 after processing is set in the receiving space to isolate the silicon carbide blank 9 from moisture in the air outside the receiving space, slowing down the entry of moisture in the air outside the receiving space into the silicon carbide blank 9, thereby improving the problem of water absorption and deformation of the silicon carbide blank 9 and effectively improving the plane accuracy of the silicon carbide blank 9.

[0036] Figure 3 FIG. 1 shows a schematic diagram of the overall structure of a carrier 20 in an embodiment of the present application.

[0037] See also Figure 2 and Figure 3 In some embodiments, the carrier 20 includes a main body 21 and a sinking portion 22 surrounding the main body 21. The main body 21 is used to support the silicon carbide blank 9, and the sinking portion 22 is used to support the top cover 30. The top cover 30 includes a top cover 31 and side portions 32 surrounding the surface of the top cover 31. When the top cover 30 is covered on the upper surface of the carrier 20, the sinking portion 22 supports the side portions 32 of the top cover 30, and the main body 21 is at least partially located in the top cover 30 and is shielded by the top cover 31 and the side portions 32. The main body 21 and the sinking portion 22 cooperate with the top cover 30 to limit the position of the top cover 30, thereby improving the accuracy of the cooperation between the top cover 30 and the carrier 20.

[0038] In some embodiments, a surface of the carrier 20, distal from the support frame 10, is defined as a bearing surface 211. Bearing surface 211 is provided with a bearing groove 212, which is recessed toward the side of the support frame 10. Bearing groove 212 is used to bear the silicon carbide preform 9. When the silicon carbide preform 9 is placed in bearing groove 212, the side edges of bearing groove 212 block the side surfaces of the silicon carbide preform 9, thereby providing a position-limiting function and improving the stability of the position of the silicon carbide preform 9.

[0039] In some embodiments, a plurality of loading slots 212 are provided, each of which can accommodate a silicon carbide blank 9. Providing multiple loading slots 212 on the upper surface of the carrier 20 allows for simultaneous loading of multiple silicon carbide blanks 9 and separates the multiple silicon carbide blanks 9, thereby increasing the capacity of the carrier 20.

[0040] In some embodiments, there are twelve carrying slots 212 on the carrier 20 , and the twelve carrying slots 212 are arranged in a 3×4 array on the upper surface of the carrier 20 .

[0041] In other embodiments, the carrying groove 212 can be configured according to the ratio between the actual size of the carrier 20 and the actual size of the silicon carbide blank 9 , which is not limited herein.

[0042] See also Figure 2 and Figure 3 In some embodiments, a surface on the carrier 20 close to the support frame 10 is defined as a heating surface 213 , wherein the heating surface 213 and the carrying surface 211 are opposite surfaces on the carrier 20 .

[0043] In some embodiments, the carrying device 1 further includes a heating element 40 , and the heating element 40 is used to heat the heating surface 213 of the carrier 20 .

[0044] In some embodiments, the heating surface 213 is provided with a heating groove 214 , and the heating element 40 is disposed in the heating groove 214 and fixedly connected by fasteners. Figure 3 In the figure, the heating tank 214 is located at the bottom of the carrier 20, which is indicated by a dotted line.

[0045] In some embodiments, the heating element 40 is provided as a single piece, with the surface area of ​​the heating element 40 facing the carrier 20 being slightly smaller than the surface area of ​​the main body 21 of the carrier 20 facing the heating element 40. The projection of the bearing groove 212, as viewed from the top cover 30 toward the support frame 10, lies within the projection of the heating element 40. Heating the carrier 20 with a single heating element 40 facilitates uniform heating across all locations on the carrier 20. Furthermore, a single heating element 40 is simple to install, requiring only a single installation, thus facilitating convenient installation of the heating element 40.

[0046] In some embodiments, the heating element 40 is provided in multiple pieces, and the supporting grooves 212 are provided with multiple pieces, and each supporting groove 212 corresponds to at least one heating groove 214. In this embodiment, each supporting groove 212 corresponds to a heating groove 214, and a heating element 40 is provided at the bottom of each heating groove 214. Heating a single supporting groove 212 by a single heating element 40 is conducive to achieving separate temperature control of different silicon carbide blanks 9, thereby improving the accuracy of temperature control. For example, the supporting groove 212 located at the edge of the upper surface of the carrier 20 has more severe heat loss due to its portion facing the side portion 32. Therefore, by increasing the heating temperature of the corresponding heating element 40 at its bottom, the lost heat can be compensated, which is conducive to improving the temperature consistency of multiple silicon carbide blanks 9 on the carrier 20.

[0047] In some embodiments, the heating element 40 is disposed in the heating tank 214 and is in close contact with the heating tank 214 , which is beneficial for rapid temperature conduction.

[0048] In other embodiments, the heating element 40 is disposed in the heating tank 214, and a heat spreader (not shown) is provided between the heating element 40 and the bottom wall of the heating tank 214, so that there is a certain distance between the heating element 40 and the bottom wall of the heating tank 214. The temperature of the heating element 40 is evenly transferred to the carrier 20 through the heat spreader, which is beneficial to improving the temperature consistency of various positions of the silicon carbide blank 9 in a single heating tank 214.

[0049] Figure 4 A schematic structural diagram of a wire duct 215 in an embodiment of the present application is shown.

[0050] See also Figure 2 、 Figure 3 and Figure 4 In some embodiments, a wire groove 215 is provided on the sidewall of the heating tank 214. The heating element 40 includes a plate 41 and a wire 42. The plate 41 is provided in the heating tank 214. The wire 42 is electrically connected to the plate 41 and passes through the wire groove 215. Providing the wire groove 215 on the sidewall of the heating tank 214 facilitates the straight extraction of the wire 42, thereby improving the flatness of the layout of the heating element 40.

[0051] In some embodiments, the heating element 40 is a plate-shaped structure.

[0052] In some embodiments, the carrier device 1 further includes an insulation plate 50 , which is disposed on a side of the carrier 20 away from the top cover 30 to keep the carrier 20 warm, thereby reducing heat loss from the carrier 20 and improving the temperature stability of the carrier 20 .

[0053] In some embodiments, insulation board 50 is an Extruded Polystyrene Board (XPS), a rigid foam plastic board made from polystyrene resin, other raw materials, and polymers, heated and mixed, with the addition of a catalyst, and then extruded and molded. In other embodiments, insulation board 50 is a polyurethane board.

[0054] In some embodiments, the top cover 30 includes a heat-insulating material, which helps to further reduce heat loss of the carrier 20 and improve the temperature stability of the carrier 20 .

[0055] Figure 5 A schematic diagram of the overall structure of the support frame 10 in one embodiment of the present application is shown.

[0056] See also Figure 2 and Figure 5In some embodiments, the support frame 10 includes four long beams 11, four wide beams 12, and four vertical beams 13. Two long beams 11 and two wide beams 12 are connected end to end to form a lower frame, and another two long beams 11 and another two wide beams 12 are connected end to end to form an upper frame. The four vertical beams 13 are connected to the lower frame and the upper frame respectively to form a rectangular parallelepiped frame, and the carrier 20 is connected to the upper frame.

[0057] In some embodiments, the long beam 11 , the wide beam 12 and the vertical beam 13 are all cut from square aluminum profiles. The long beam 11 and the wide beam 12 are connected by fasteners, and the wide beam 12 and the vertical beam 13 are connected by fasteners.

[0058] In some embodiments, the carrying device 1 further includes a connecting plate, which is disposed on a side of the support frame 10 away from the carrier 20 .

[0059] In some embodiments, four connecting plates are provided, and the four connecting plates are connected to the four corners of the lower frame respectively. A caster 70 is connected to the bottom of each connecting plate, so that the carrying device 1 can be moved by the caster 70 to facilitate the transportation of the silicon carbide blank 9.

[0060] Those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the essential technical scope of the present application, appropriate changes and modifications to the above embodiments fall within the scope disclosed in the present application.

Claims

1. A carrying device, characterized in that: include: Support frame; A carrier, the carrier being arranged on the support frame and used for carrying the silicon carbide blank; A top cover is arranged on a side of the carrier away from the support frame, and an accommodating space is formed between the top cover and the carrier, and the silicon carbide blank is arranged in the accommodating space.

2. The carrying device according to claim 1, characterized in that: A side of the carrier away from the support frame is defined as a bearing surface. The bearing surface is provided with a bearing groove, and the bearing groove is used to bear the silicon carbide blank and limit the position of the silicon carbide blank.

3. The carrying device according to claim 2, characterized in that: The carrying device further includes a heating element, which is disposed on a side of the carrier close to the support frame and is used to heat the carrier.

4. The carrying device according to claim 3, characterized in that: A side of the carrier close to the support frame is defined as a heating surface, and a heating groove is provided on the heating surface. The heating element is arranged in the heating groove and is closely attached to the groove wall of the heating groove.

5. The carrying device according to claim 4, characterized in that: There are a plurality of heating slots, each of which is provided with a heating element; there are a plurality of carrying slots, each of which corresponds to at least one heating slot.

6. The carrying device according to claim 4, characterized in that: A wire groove is provided on the side wall of the heating tank. The heating element includes a plate and a wire. The plate is provided in the heating tank. The wire is electrically connected to the plate and passes through the wire groove.

7. The carrying device according to claim 1, wherein: The carrying device further comprises a heat-insulating plate, which is arranged on a side of the carrier away from the top cover to keep the carrier warm.

8. The carrying device according to claim 1, wherein: The carrier includes a main body and a sunken platform portion surrounding the main body, the sunken platform portion supports the side of the top cover close to the support frame, and the main body is at least partially located in the top cover.

9. The carrying device according to claim 1, wherein: The top cover includes thermal insulation material.

10. The carrying device according to claim 8, characterized in that: The top cover includes a top cover portion and side portions, the side portions are arranged around the surface of the top cover portion, the sunken platform portion supports the side portions, and the main body portion is shielded by the top cover portion and the side portions.

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