Silicon rod splicing device

Abstract

The utility model relates to the technical field of solar cells, and provides a silicon rod splicing device which comprises a base and a plurality of positioning parts arranged on the base, a silicon rod placing cavity is defined by the base and the positioning parts, each positioning part is provided with a positioning face matched with a silicon rod, and an adhesive tape taking cavity is formed in the side, close to the silicon rod placing cavity, of each positioning part. And the adhesive tape taking cavities correspond to the splicing positions of the adjacent silicon rods. The silicon rod placing cavity is defined by the base and the plurality of positioning parts, the silicon rod is placed on the base, and the positioning parts are provided with the positioning surfaces in contact with the silicon rod, so that the silicon rod is positioned through the positioning surfaces; and the adhesive tape taking cavity is formed through the positioning part, so that the anti-overflow adhesive tape on the outer side surface of the splicing position of the silicon rods can be conveniently torn off after adhesive overflowing at the splicing position of the adjacent silicon rods is completed, the splicing quality is improved, and the defect that the splicing quality of the silicon rods is relatively poor in the prior art is overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cells, in particular to a silicon rod splicing device. Background Art

[0002] Currently, silicon wafers, the primary material for solar cells, are processed using diamond wire multi-wire sawing (DWS). This process begins with the sticking process, which involves applying adhesive to the wafer holder and adhesive sheet, respectively. The adhesive sheet and ingot are then bonded to the wafer holder and adhesive sheet, respectively. After the adhesive cures for the required time, the ingot is ready for cutting. However, after inspection, abnormal portions of single-crystal silicon ingots are often cut off and discarded, resulting in inconsistent lengths for each cut ingot to meet slicing requirements.

[0003] In the prior art, before slicing the multiple shorter square silicon rods obtained after truncation, the multiple short square silicon rods are spliced ​​together, but the splicing quality between the silicon rods is poor. Utility Model Content

[0004] The utility model provides a silicon rod splicing device, which is used to solve the defect of poor splicing quality between silicon rods in the prior art.

[0005] The utility model provides a silicon rod splicing device, comprising:

[0006] base;

[0007] A plurality of positioning components are arranged on the base, and the base and the plurality of positioning components form a silicon rod placement cavity. The positioning components have positioning surfaces that cooperate with the silicon rods. A rubber strip removal cavity is formed on one side of the positioning component close to the silicon rod placement cavity, and the rubber strip removal cavity corresponds to the splicing position of adjacent silicon rods.

[0008] According to a silicon rod splicing device provided by the present invention, the positioning component includes:

[0009] A first positioning member is provided on the base;

[0010] a second positioning member, the second positioning member having the strip removal cavity;

[0011] An adjusting member is provided between the first positioning member and the second positioning member, and the adjusting member is suitable for adjusting the installation height of the second positioning member on the first positioning member.

[0012] According to a silicon rod splicing device provided by the present invention, the first positioning member is provided with multiple first connecting holes along the height direction, the second positioning member is provided with multiple second connecting holes along the height direction, and the adjusting member is connected to the first connecting holes and the second connecting holes.

[0013] According to the silicon rod splicing device provided by the present invention, the positioning component is detachably connected to the base.

[0014] According to a silicon rod splicing device provided by the present invention, the base is provided with a first positioning portion, and the positioning component has a second positioning portion that cooperates with the first positioning portion.

[0015] According to a silicon rod splicing device provided by the present invention, the base has a third positioning portion that cooperates with the silicon rod.

[0016] According to the silicon rod splicing device provided by the present invention, the third positioning portion is provided with a flexible pad.

[0017] According to the silicon rod splicing device provided by the utility model, the positioning surface has a flexible layer.

[0018] According to a silicon rod splicing device provided by the present invention, the base has a first connecting portion, the positioning component has a second connecting portion, and the second connecting portion is slidably connected to the first connecting portion to adjust the distance between the positioning components.

[0019] According to a silicon rod splicing device provided by the present invention, the positioning component has a convex portion facing away from one side of the silicon rod placement cavity, and the convex portion forms the rubber strip removal cavity.

[0020] The silicon rod splicing device provided by the utility model forms a silicon rod placement cavity by a base and a plurality of positioning components. The silicon rod is placed on the base. The positioning components have positioning surfaces that contact the silicon rod, so that the position of the silicon rod is positioned by the positioning surfaces. A glue strip removal cavity is formed by the positioning components, which facilitates the tearing off of the anti-overflow adhesive tape on the outer side surface of the silicon rod splicing position after glue overflow is completed at the adjacent silicon rod splicing positions, thereby improving the splicing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the assembly structure of the silicon rod splicing device and the silicon rods provided by the utility model.

[0023] Figure 2 It is a structural schematic diagram of the silicon rod splicing device provided by the utility model.

[0024] Figure 3 It is a structural schematic diagram of the positioning component provided by the utility model.

[0025] Reference numerals:

[0026] 100, base;

[0027] 200, positioning component; 210, positioning surface; 220, rubber strip removal cavity; 230, first positioning member; 231, first connecting hole; 232, second positioning portion; 240, second positioning member; 241, second connecting hole; 242, protrusion; 250, adjusting member; 310, first silicon rod; 320, second silicon rod; 400, silicon rod placement cavity. DETAILED DESCRIPTION

[0028] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0030] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0031] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0033] The following combination Figure 1-Figure 3 The silicon rod splicing device according to an embodiment of the present utility model is described.

[0034] The embodiment of the first aspect of the present utility model provides a silicon rod splicing device, such as Figures 1 to 3 As shown, the silicon rod splicing device includes a base 100 and a plurality of positioning components 200 arranged on the base 100. The base 100 and the plurality of positioning components 200 surround a silicon rod placement cavity 400. The positioning components 200 have a positioning surface 210 that cooperates with the silicon rods. A rubber strip removal cavity 220 is formed on one side of the positioning component 200 close to the silicon rod placement cavity 400. The rubber strip removal cavity 220 corresponds to the splicing position of adjacent silicon rods.

[0035] It can be understood that multiple positioning components 200 are arranged on the base 100, and the base 100 and the multiple positioning components 200 form a silicon rod placement cavity 400. The positioning component 200 has a positioning surface 210 on the side close to the silicon rod placement cavity 400, and the silicon rod is arranged in the silicon rod placement cavity 400. The positioning surface 210 of the positioning component 200 contacts the side of the silicon rod, thereby realizing the positioning of the silicon rod position through the positioning surfaces 210 of the multiple positioning components 200. In this way, multiple silicon rods are stacked in the silicon rod placement cavity 400, and the positioning surfaces 210 of the multiple positioning components 200 can be used to realize the common positioning of the positions of the multiple silicon rods, so as to improve the splicing quality between the silicon rods.

[0036] It should be noted that when two adjacent silicon rods are spliced, the splicing surfaces of the two silicon rods are coated with adhesive. The adhesive easily overflows from the splicing surfaces of the two silicon rods and contaminates the outer side surfaces of the silicon rods, resulting in poor splicing quality between the silicon rods. Therefore, the positioning component 200 of the present invention is formed with a glue strip removal cavity 220 on the side close to the silicon rod placement cavity 400. The glue strip removal cavity 220 corresponds to the splicing position of adjacent silicon rods. Before the adhesive is applied to the splicing surfaces of the silicon rods, an anti-overflow adhesive tape is adhered to the outer side surfaces of the silicon rods close to the splicing surfaces. The two silicon rods are bonded in the silicon rod placement cavity 400 by the adhesive. After the adhesive is completely removed, the anti-overflow adhesive tape can be torn off from the glue strip removal cavity 220 to avoid contamination of the silicon rods.

[0037] The silicon rod splicing device provided by the embodiment of the present invention is characterized in that a silicon rod placement cavity 400 is formed by a base 100 and a plurality of positioning components 200. The silicon rod is placed on the base 100, and the positioning component 200 has a positioning surface 210 in contact with the silicon rod, so that the position of the silicon rod is positioned by the positioning surface 210; and a glue strip removal cavity 220 is formed by the positioning component 200, so that the anti-overflow adhesive tape on the outer side of the silicon rod splicing position can be torn off after glue overflow is completed at the adjacent silicon rod splicing positions, so as to improve the splicing quality.

[0038] According to the embodiment of the present utility model, Figure 3 As shown, the positioning component 200 has a protrusion 242 on a side away from the silicon rod placement cavity 400 , and the protrusion 242 forms the rubber strip removal cavity 220 .

[0039] It is understandable that the positioning component 200 protrudes toward the side away from the silicon rod placement cavity 400 to form a convex portion 242 , and the convex portion 242 forms a concave rubber strip removal cavity 220 on the side close to the silicon rod placement cavity 400 .

[0040] In one embodiment of the present invention, Figure 3 As shown, the positioning component 200 includes a first positioning member 230, a second positioning member 240 and an adjusting member 250. The first positioning member 230 is arranged on the base 100, and the rubber strip cavity 220 is formed on the second positioning member 240; the adjusting member 250 is arranged between the first positioning member 230 and the second positioning member 240, and the adjusting member 250 is suitable for adjusting the installation height of the second positioning member 240 on the first positioning member 230.

[0041] It can be understood that the first positioning member 230 is connected to the base 100, and the second positioning member 240 is connected to the first positioning member 230 through the adjusting member 250. The installation height of the second positioning member 240 is adjusted by the adjusting member 250, and then the height of the rubber strip cavity 220 on the second positioning member 240 is adjusted to adapt to the splicing of silicon rods of different lengths.

[0042] Optionally, the first positioning member 230 has a positioning surface 210 on a side close to the silicon rod placement cavity 400, and the second positioning member 240 is disposed on a side of the first positioning member 230 facing away from the silicon rod placement cavity 400. The first positioning member 230 is provided with a plurality of first connection holes 231 along the height direction, and the second positioning member 240 is provided with a plurality of second connection holes 241 along the height direction. The adjusting member 250 is connected to the first connection holes 231 and the second connection holes 241.

[0043] It can be understood that the first positioning member 230 is connected to the base 100, and the second positioning member 240 can move up and down relative to the first positioning member 230 to adjust the installation height of the second positioning member 240, and the adjustment member 250 passes through the second connecting hole 241 and the first connecting hole 231 to achieve the fixation of the first positioning member 230 and the second positioning member 240.

[0044] Optionally, the adjustment member 250 is a connecting screw, and the first connecting hole 231 and the second connecting hole 241 are connecting through holes adapted for the connecting screw. There are multiple connecting screws, and the multiple connecting screws are connected to the multiple second connecting holes 241 and their respective corresponding first connecting holes 231. It should be noted that the multiple first connecting holes 231 are evenly spaced along the height direction, and the multiple second connecting holes 241 are evenly spaced along the height direction. The spacing between two adjacent first connecting holes 231 is equal to the spacing between two adjacent second connecting holes 241. The second positioning member 240 can move up and down relative to the first positioning member 230 by a distance that is an integer multiple of the spacing between two adjacent first connecting holes 231.

[0045] Optionally, the first connecting hole 231 can be an elongated hole along the height direction, and the second connecting hole 241 can be a connecting through hole adapted to the connecting screw. The position of the second positioning member 240 in the height direction can be adjusted by adjusting the matching position of the second connecting hole 241 and the elongated hole.

[0046] In one embodiment of the present invention, the positioning component 200 is detachably connected to the base 100. After the silicon rods are spliced ​​and solidified, the positioning component 200 on the base 100 is first removed, and then the spliced ​​silicon rods are removed from the base 100 to facilitate the removal of the silicon rods after splicing.

[0047] In one embodiment of the present invention, the base 100 is provided with a first positioning portion (not shown in the figure), and the positioning component 200 has a second positioning portion 232 that cooperates with the first positioning portion. The positioning of the installation position of the positioning component 200 is achieved through the positioning cooperation between the first positioning portion and the second positioning portion 232.

[0048] Alternatively, the first positioning portion may be a positioning groove (or positioning hole), and the second positioning portion 232 may be a positioning protrusion that cooperates with the positioning groove (or positioning hole). The positioning protrusion is inserted into the positioning groove (or positioning hole) to achieve the positioning of the installation position of the positioning component 200. Of course, the first positioning portion and the second positioning portion 232 may also adopt other positioning structures such as cooperating positioning columns and positioning holes.

[0049] In one embodiment of the present invention, the base 100 has a third positioning portion that cooperates with the silicon rod, and the third positioning portion can be a positioning groove that adapts to the silicon rod.

[0050] For example, if the silicon rod is a square rod, the cross section of the silicon rod is square, and the positioning groove is a square groove that matches the cross section of the silicon rod. The silicon rod is positioned by the positioning groove, and the number of positioning components 200 is at least four, and the four positioning components 200 are respectively positioned on the four sides of the silicon rod, and the positioning surface 210 of the positioning component 200 is a plane that matches the silicon rod. Furthermore, the number of positioning components 200 can be more, and each side of the silicon rod is positioned by multiple positioning components 200; it should be noted here that the number of positioning components 200 on the four sides of the silicon rod can be equal or different. Preferably, the number of positioning components 200 on the side of the silicon rod is equal; in this embodiment, the number of positioning components 200 is 8, and each side of the silicon rod is positioned by two positioning components 200.

[0051] It should be noted that the silicon rod can also be a round rod, in which case the cross-section of the silicon rod is circular, and the positioning groove is a circular groove adapted to the cross-section of the silicon rod, and the silicon rod is positioned by the positioning groove. The number of positioning members 200 is at least two, and at least two positioning members 200 are evenly distributed along the circumference of the silicon rod. The positioning surfaces 210 of the positioning members 200 are arc-shaped surfaces adapted to the outer surface of the silicon rod.

[0052] Furthermore, the third positioning portion is provided with a flexible pad to prevent the base 100 from abrading the silicon rod. For example, the flexible pad is a silicone pad. Of course, the positioning surface 210 of the positioning component 200 also has a flexible layer to prevent the positioning component 200 from abrading the silicon rod.

[0053] In one embodiment of the present invention, the positioning component 200 is detachably connected to the base 100, and the positioning component 200 can slide relative to the base 100 to adjust the distance between the positioning components 200, thereby adjusting the size of the silicon rod placement cavity 400 to adapt to silicon rods with different cross-sectional dimensions.

[0054] Optionally, the base 100 has a first connection portion, the positioning component 200 has a second connection portion, and the second connection portion is slidably connected to the first connection portion to adjust the distance between the positioning components 200.

[0055] For example, the first connecting part is a track groove provided on the base 100, and the second connecting part is a slider provided at the lower end of the positioning component 200. The slider moves through the track groove to adjust the size of the silicon rod placement cavity 400; at the same time, bolts are passed through the track groove and the slider to connect and fix the positioning component 200 and the base 100.

[0056] In a specific embodiment of the present invention, Figures 1 to 3 As shown, the silicon rod splicing device is used to splice two silicon rods, namely a first silicon rod 310 and a second silicon rod 320. The first silicon rod 310 and the second silicon rod 320 are both square silicon rods with a cross-sectional dimension of 210 mm x 210 mm. The heights of the first silicon rod 310 and the second silicon rod 320 are 435 mm and 400 mm, respectively. The silicon rod splicing device of this embodiment includes a base 100 and eight positioning components 200 disposed on the base 100.

[0057] A third positioning portion is provided in the middle of the base 100. The third positioning portion is a 210mm×210mm square positioning groove. A flexible pad is provided on the bottom of the square positioning groove. The base 100 is made of stainless steel, and the flexible pad can be made of a buffering material such as silicone. In this embodiment, the flexible pad is a 210×210×5mm silicone soft pad; the base 100 is provided with 8 first positioning portions located outside the third positioning portion. The 8 first positioning portions are arranged in a square, and each side of the third positioning portion has two first positioning portions.

[0058] Eight positioning components 200 are arranged on the base 100. The base 100 and the eight positioning components 200 surround a silicon rod placement cavity 400. When the silicon rod is placed in the silicon rod placement cavity 400, each side of the silicon rod has two positioning components 200. The positioning component 200 has a positioning surface 210 that contacts the silicon rod. The positioning surface 210 contacts the side of the silicon rod to ensure that the spliced ​​silicon rods are flush on all sides; a rubber strip removal cavity 220 is formed on the side of the positioning component 200 close to the silicon rod placement cavity 400, and the rubber strip removal cavity 220 corresponds to the splicing position of adjacent silicon rods.

[0059] Specifically, the positioning component 200 includes a first positioning member 230, a second positioning member 240 and an adjusting member 250. The first positioning member 230 has a second positioning portion 232 that cooperates with the first positioning portion. The second positioning member 240 has a rubber strip removal cavity 220. The second positioning member 240 is arranged on the inner side of the first positioning member 230. The second positioning member 240 can move up and down relative to the first positioning member 230 to adjust the installation height of the second positioning member 240, and then adjust the height of the rubber strip removal cavity 220 on the second positioning member 240, so that the rubber strip removal cavity 220 is located at the splicing position of the two silicon rods; and the adjusting member 250 is passed through the second connecting hole 241 and the first connecting hole 231 to realize the fixation of the first positioning member 230 and the second positioning member 240. In this embodiment, the height of the first positioning member 230 and the second positioning member 240 after connection is 900 mm; the second positioning member 240 is arranged close to one side of the silicon rod placement cavity 400, and the second positioning member 240 is a positioning bar with a width of 40 mm and a thickness of 10 mm. The second positioning member 240 is made of engineering plastic; the first positioning member 230 can be a positioning shell, and the material can be stainless steel.

[0060] The splicing process of the silicon rod splicing device in this embodiment is as follows:

[0061] Place the first silicon rod 310 into the silicon rod placement cavity 400 and place it on the bottom surface along the positioning surface 210 of the positioning component 200;

[0062] Move the second positioning member 240 up and down relative to the first positioning member 230 to adjust the installation height of the second positioning member 240 so that the strip cavity 220 is positioned at a height of 435 mm, and fix the first positioning member 230 and the second positioning member 240 with the adjusting member 250;

[0063] Apply stick glue to the upper end surface of the first silicon rod 310, then place the second silicon rod 320 into the silicon rod placement cavity 400 and place it on the upper end surface of the first silicon rod 310 along the positioning surface 210 of the positioning component 200. It should be noted that before the first silicon rod 310 and the second silicon rod 320 are placed into the silicon rod placement cavity 400, anti-overflow adhesive tape is adhered to the outer side surfaces of the first silicon rod 310 and the second silicon rod 320 near the joint surface.

[0064] Place a counterweight block (e.g., 10 kg) on ​​the second silicon rod 320 and allow to stand for solidification;

[0065] After curing is completed, the anti-overflow adhesive tapes of the second silicon rod 320 and the first silicon rod 310 are removed from the adhesive strip removal cavity 220;

[0066] Remove the positioning component 200 on the base 100, flip the entire base 100 horizontally by 90 degrees, and remove the base 100 to facilitate the subsequent bonding process.

[0067] It should be noted that in the prior art, short rods and long rods are bonded together, with the sides of the short rods bonded to the sides of the long rods. A gap of 0.5-3 mm must be maintained between the two short rods. However, during the bonding process, the adhesive from the sides of the short rods and the long rods will flow into the gap, preventing the adhesive from overflowing the adhesive surface, resulting in empty glue. In addition, the width of the wire mesh must be adjusted according to the width of the gap before cutting, resulting in reduced production change efficiency. In contrast, in this embodiment, the end faces of the two silicon rods (short rods) are bonded together using adhesive. During the side bonding between the silicon rods, since adhesive is present between the end faces of the silicon rods, the adhesive from the sides of the silicon rods will not flow into the gap between the end faces of the silicon rods, allowing the adhesive to overflow the adhesive surface, reducing the empty glue problem and improving the quality of the splicing between the silicon rods. In addition, there is only the thickness of the adhesive layer between the end faces of the silicon rods, eliminating the need to adjust the wire mesh according to the gap between each square rod, thereby reducing production change time.

[0068] Specifically, an experiment was conducted to compare the conventional silicon rod (short rod) end surface non-bonding and long rod combination bonding, and the silicon rod (short rod) end surface bonding and long rod combination bonding of the present application. The production change time and empty glue rate are shown in Table 1 below.

[0069] Table 1

[0070]

[0071] As can be seen from Table 1, compared with the existing solution, the silicon rod (short rod) end face bonding and long rod combination bonding in this embodiment reduce the production change time by 16.67% and reduce the empty glue rate by 0.15%.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A silicon rod splicing device, characterized in that: include: base; A plurality of positioning components are arranged on the base, and the base and the plurality of positioning components form a silicon rod placement cavity. The positioning components have positioning surfaces that cooperate with the silicon rods. A rubber strip removal cavity is formed on one side of the positioning component close to the silicon rod placement cavity, and the rubber strip removal cavity corresponds to the splicing position of adjacent silicon rods.

2. The silicon rod splicing device according to claim 1, characterized in that: The positioning component includes: A first positioning member is provided on the base; a second positioning member, the second positioning member having the strip removal cavity; An adjusting member is provided between the first positioning member and the second positioning member, and the adjusting member is suitable for adjusting the installation height of the second positioning member on the first positioning member.

3. The silicon rod splicing device according to claim 2, characterized in that: The first positioning member is provided with a plurality of first connection holes along the height direction, the second positioning member is provided with a plurality of second connection holes along the height direction, and the adjusting member is connected to the first connection holes and the second connection holes.

4. The silicon rod splicing device according to any one of claims 1 to 3, characterized in that: The positioning component is detachably connected to the base.

5. The silicon rod splicing device according to claim 4, characterized in that: The base is provided with a first positioning portion, and the positioning component has a second positioning portion that cooperates with the first positioning portion.

6. The silicon rod splicing device according to claim 4, characterized in that: The base has a third positioning portion that cooperates with the silicon rod.

7. The silicon rod splicing device according to claim 6, characterized in that: The third positioning portion is provided with a flexible pad.

8. The silicon rod splicing device according to any one of claims 1 to 3, characterized in that: The positioning surface has a flexible layer.

9. The silicon rod splicing device according to claim 4, characterized in that: The base has a first connecting portion, the positioning component has a second connecting portion, and the second connecting portion is slidably connected to the first connecting portion to adjust the size of the silicon rod placement cavity.

10. The silicon rod splicing device according to any one of claims 1 to 3, characterized in that: The positioning component has a convex portion facing away from one side of the silicon rod placement cavity, and the convex portion forms the rubber strip removal cavity.

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