Liquid drainage structure of wafer thinning machine

Abstract

The utility model provides a liquid drainage structure of a wafer thinning machine, and belongs to the technical field of semiconductor processing equipment, in particular, the liquid drainage structure comprises a bottom plate and side plates installed on the periphery of the bottom plate, and the bottom plate is provided with an installation opening used for installing a grinding mechanism; a liquid outlet for discharging waste liquid is formed in the bottom plate, a filter screen is arranged at the liquid outlet, the liquid outlet is arranged to be a groove which is sunken downwards in the bottom plate, and the filter screen forms a box-shaped structure and is embedded in the groove. The liquid outlet is formed in the bottom plate, the filter screen is arranged at the liquid outlet, waste liquid generated after wafer grinding flows out of the liquid outlet in the bottom plate, compared with a traditional side wall drainage mode, the position of the liquid outlet is lower, waste liquid discharging is facilitated, the phenomenon of liquid accumulation on the bottom plate is reduced as much as possible, and side space occupation is avoided; the assembling process is simplified, and the potential water leakage risk is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a liquid drainage structure of a wafer thinning machine. Background Art

[0002] The semiconductor industry currently manufactures semiconductor chips using electronic circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integration) formed on the surface of semiconductor wafers. Before being sliced ​​into semiconductor chips, the wafers undergo a grinding and thinning process to grind the backside of the wafer, the side opposite the device surface where the electronic circuitry is formed. Wafer backside thinning involves high-precision grinding of various materials, such as silicon wafers or compound semiconductors, to a desired ultra-thin thickness before packaging.

[0003] When thinning the back of a wafer, it is necessary to grind and thin the wafer through a grinding mechanism. During the grinding and thinning process, coolant is added so that the grinding mechanism can continue to grind the wafer. The waste liquid that flows out will accumulate in the grinding mechanism. Traditional grinding mechanisms usually use a drainage structure on the side wall to discharge the waste liquid, but this method is prone to incomplete drainage. Utility Model Content

[0004] The purpose of the present application is to provide a drainage structure for a wafer thinning machine, aiming to solve the problem in the related art that the wafer thinning machine sets a drainage structure on the side wall to discharge waste liquid, resulting in incomplete drainage.

[0005] Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

[0006] According to a first aspect of the present application, a liquid drainage structure of a wafer thinning machine is provided, comprising:

[0007] A bottom plate and side plates installed around the bottom plate, wherein the bottom plate is provided with a mounting opening for mounting a grinding mechanism;

[0008] The bottom plate is provided with a drain port for discharging waste liquid, a filter screen is provided at the drain port, the drain port is configured as a groove sunken downwards on the bottom plate, and the filter screen forms a box-like structure embedded in the groove.

[0009] In an exemplary embodiment of the present application, the size of the groove is larger than the size of the filter screen, and a gap for accommodating solid impurities is formed between the filter screen and the side wall of the groove.

[0010] In an exemplary embodiment of the present application, the gap forms a coarse filter portion for fixing impurity deposits, and the mesh of the filter net forms a fine filter portion for filtering waste liquid.

[0011] In an exemplary embodiment of the present application, at least one side of the filter screen of the box-shaped structure is arranged in contact with the side wall of the groove.

[0012] In an exemplary embodiment of the present application, the bottom plate is designed to be inclined toward the drain port, and the side wall of the groove away from the inclined direction of the bottom plate is arranged to fit with one side of the filter screen.

[0013] In an exemplary embodiment of the present application, a top cover is further included, which is detachably mounted on the top surface of the filter screen.

[0014] In an exemplary embodiment of the present application, there are multiple drain ports.

[0015] In an exemplary embodiment of the present application, a circular baffle extends from the circumference of the mounting port along its axial direction, and a baffle is provided between the circular baffle and the side plate. The baffle divides the drainage area located on the bottom plate into multiple independent areas, each of which has a drainage port.

[0016] In an exemplary embodiment of the present application, there are four blocking pieces, which are respectively located at four sides of the installation opening, dividing the drainage area into four independent areas.

[0017] In an exemplary embodiment of the present application, there are further included two cross beams, which are arranged perpendicular to each other, a cross beam is connected between the two opposite side plates, and the blocking piece is formed between the cross beam and the bottom plate.

[0018] The exemplary embodiments of the present application may have some or all of the following beneficial effects:

[0019] The drainage structure of the wafer thinning machine provided in the example embodiment of the present application is achieved by opening a drainage port on the bottom plate and arranging a filter at the drainage port. The filter forms a box-shaped structure and is embedded in the groove, so that the waste liquid used to grind the wafer flows out from the drainage port on the bottom plate. The filter will block the solid impurities in the waste liquid to prevent the solid impurities from flowing into the drainage channel and causing channel blockage. Compared with the traditional side wall drainage method, by opening the drainage port on the bottom plate, the position of the drainage port is lower, which is more conducive to discharging waste liquid and avoids liquid accumulation on the bottom plate as much as possible. The bottom drainage method can not only achieve cleaner and faster drainage, but also avoid occupying side space, simplify the assembly process, and reduce the potential risk of water leakage. At the same time, the box-shaped filter has a certain height, which can avoid impurities accumulating on the outside of the filter and causing blockage.

[0020] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0022] Figure 1 A schematic structural diagram from a first angle of a liquid discharge structure of a wafer thinning machine according to an embodiment of the present application is shown;

[0023] Figure 2 A schematic structural diagram from a second angle of a liquid discharge structure of a wafer thinning machine according to an embodiment of the present application is shown;

[0024] Figure 3 A schematic diagram of the structure of a liquid discharge structure of a wafer thinning machine according to an embodiment of the present application is shown from a bottom angle;

[0025] Figure 4 A side view of a liquid drainage structure of a wafer thinning machine in an embodiment of the present application is shown.

[0026] Description of reference numerals:

[0027] 1. Bottom plate; 2. Side plate; 3. Drain port; 4. Filter screen; 5. Top cover; 6. Mounting port; 7. Circular baffle; 8. Baffle; 9. Crossbeam; 10. Drain pipe. DETAILED DESCRIPTION

[0028] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present application and are not necessarily drawn to scale.

[0029] While relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It should be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through the other structure.

[0030] The terms "a", "an", "the" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first" and "second" are used only as labels and do not limit the quantity of their objects.

[0031] Example

[0032] This embodiment provides a specific implementation of the liquid discharge structure of the wafer thinning machine, such as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, it includes a base plate 1, a mounting port 6 for installing a grinding mechanism is provided on the base plate 1, a drain port 3 for discharging waste liquid is provided on the base plate 1, and a filter screen 4 is provided at the drain port 3. The drain port 3 is arranged at the bottom of the drainage structure of the wafer thinning machine. Compared with the position of the side wall drainage port 3, the drain port 3 is lower, and the gravity can be more effectively utilized to achieve cleaner and faster drainage, thereby avoiding the phenomenon of liquid accumulation on the base plate 1 as much as possible, avoiding occupying the side space, simplifying the assembly process, and reducing the potential risk of water leakage. In addition, the bottom drainage design also significantly reduces the potential risk of water leakage. Since the drain port 3 is located at the bottom, even if a slight leak occurs, it can be quickly detected and handled, avoiding damage to other parts of the equipment by the leaked liquid and possible safety hazards.

[0033] In this embodiment, the drain port 3 is configured as a groove sunken downward on the bottom plate 1 , and the filter screen 4 is embedded in the groove, so that the waste liquid flowing through will be filtered by the filter screen 4 and then flow out through the drain port 3 .

[0034] Furthermore, the size of the groove is designed to be larger than the size of the filter screen 4. When the filter screen 4 is installed in the groove, a gap that can accommodate solid impurities is formed between the filter screen 4 and the side wall of the groove, so that impurities in the waste liquid can be blocked on the outside of the filter screen 4 and deposited in the gap, which not only facilitates the entry of waste liquid and ensures the thoroughness of drainage, but also provides sufficient space for precipitated impurities, avoiding impurities clogging the drain port 3.

[0035] When the filter screen 4 is installed in the groove, a narrow but effective gap is formed between the filter screen 4 and the sidewalls of the groove. This gap not only accommodates solid impurities in the waste liquid, but also provides a buffer zone when the waste liquid passes through the filter screen 4, allowing impurities to settle in the gap instead of directly blocking the drain port 3. In this way, impurities in the waste liquid are effectively blocked outside the filter screen 4 and deposited in the gap between the filter screen 4 and the sidewalls of the groove, thus ensuring smooth discharge of the waste liquid.

[0036] Furthermore, the width of the gap formed between the filter screen 4 and the side wall of the groove is several times or dozens of times larger than the diameter of the mesh of the filter screen 4, so that a certain amount of solid impurities can be deposited in the gap, forming a coarse filter part for solid impurity deposition, and the mesh of the filter screen 4 forms a fine filter part for filtering waste liquid. The two are combined to achieve the filtration of waste liquid. By allowing the waste liquid to enter the gap first, solid impurities are deposited in the gap, and the liquid flows through the filter screen 4. Larger impurities are deposited in the gap, and smaller impurities are filtered by the mesh of the filter screen 4, further improving the filtering effect of the filter screen 4.

[0037] In this embodiment, at least one side of the box-shaped filter screen 4 is fitted with the side wall of the groove. This design can prevent solid impurities from being deposited around the filter screen 4, making it easier to clean. Preferably, in this embodiment, both sides of the box-shaped filter screen 4 are respectively fitted with the side walls of the groove, that is, the box-shaped filter screen 4 is set in one of the corners of the groove. At this time, only the two side surfaces of the filter screen 4 and the side walls of the groove form a gap, which further facilitates cleaning by the operator.

[0038] In this embodiment, the bottom plate 1 is designed to be inclined toward the drain port 3, so that the waste liquid flows toward the drain port 3 under its own gravity, which promotes the rapid flow of waste liquid to the drain port 3, further ensures the thoroughness of the drainage, reduces residual water, and further improves the efficiency of the equipment. On the other hand, the inclined bottom plate 1 design also helps to reduce the accumulation and retention of waste liquid on the bottom plate 1. During the wafer thinning process, waste liquid may be generated and accumulated on the bottom plate 1. If the bottom plate 1 is horizontal, these waste liquids may be difficult to discharge, resulting in residual water and potential pollution problems. The inclined bottom plate 1 can guide the waste liquid to flow quickly to the drain port 3, avoiding the occurrence of these problems. Furthermore, the side wall of the groove away from the inclination direction of the bottom plate is arranged to fit with one side of the filter screen 4, that is, Figure 1 As shown, the bottom plate 1 is inclined toward the side plate 2 on the left, and one side of the box-shaped filter screen 4 is attached to the side wall of the groove near the left side plate 2. This design allows the solid impurities in the waste liquid to be deposited in the gap when it flows into the gap, thereby better utilizing the space in the drain port 3.

[0039] In this embodiment, a top cover 5 is also included, which is detachably mounted on the top surface of the filter 4. By opening the top cover 5, the operator can regularly clean the impurities that have entered the interior of the filter 4, thereby improving the convenience of equipment maintenance and ensuring that the drainage system remains in good condition for a long time. The top cover 5 is designed to be detachable, so that the operator can directly access the interior of the filter 4 and perform necessary cleaning work without having to disassemble the entire drainage structure or the filter 4. This not only greatly simplifies the maintenance process, but also reduces maintenance costs and time. In addition, the top cover 5 is made of a sturdy and durable material that can withstand a certain amount of pressure and impact force, ensuring that it will not fall off or be damaged during the operation of the equipment. At the same time, the connection method between the top cover 5 and the filter 4 can be a snap-on connection, a screw connection, etc., to ensure that the disassembly and installation process can be carried out easily and firmly.

[0040] In this embodiment, Figure 3 and Figure 4 As shown, there are multiple drain ports 3, and each drain port 3 is connected to a drain pipe 10, which can perform drainage work at the same time to quickly drain the waste liquid accumulated on the bottom plate 1.

[0041] Furthermore, the area corresponding to each drain port 3 is designed as an independent area, and each independent area is drained separately. In addition, in each independent area, the bottom plate 1 is designed to be tilted toward the drain port 3, so that the waste liquid in each independent area can flow quickly toward the drain port 3, ensuring the thoroughness of the waste liquid discharge, reducing residual water, and improving the efficiency of equipment use. In addition, it is ensured that the waste liquid in each area can be discharged in a timely and thorough manner, avoiding the mixing and cross-contamination of waste liquid between different areas. Secondly, since each area is treated with separate drainage, it is easier to monitor and manage the discharge of waste liquid, and to promptly discover and solve potential problems. In this embodiment, the independent drainage area design and the design of the bottom plate 1 tilted toward the drain port 3 in each area together achieve efficient and thorough discharge of waste liquid, reduce residual water, and improve the efficiency of equipment use.

[0042] In this embodiment, a circular baffle 7 extends along the axial direction of the installation port 6 for installing the grinding mechanism. The circular baffle 7 can prevent the waste liquid from flowing into the installation space of the grinding mechanism. At the same time, a plurality of baffles 8 are provided on the side plate 2, and the baffles 8 extend to connect with the circular baffle 7, so that independent areas are formed between the side plate 2 and the baffles 8 and the circular baffle 7. Each independent area is provided with a drain port 3 for discharging waste liquid.

[0043] Furthermore, there are four baffles 8, the mounting opening 6 is circular, and the four baffles 8 are respectively arranged on two mutually perpendicular diameter lines of the circular mounting opening 6, and the baffles 8 are connected to the side plate 2 to realize four independent areas for waste liquid discharge.

[0044] Furthermore, two cross beams 9 perpendicular to each other are installed above the mounting opening 6. From a top view, the two cross beams 9 divide the circular mounting opening 6 into four areas, and the baffle 8 is formed between the two cross beams 9 and the bottom plate 1, so that the four areas are independent and used to independently discharge waste liquid.

[0045] In this embodiment, a drain pipe 10 is connected below each drain port 3 to discharge waste liquid to a designated area or location.

[0046] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the embodiments of the present invention. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not covered by this application. The specification and embodiments are intended to be exemplary only, and the true scope and spirit of the present invention are indicated by the appended claims.

Claims

1. A liquid discharge structure for a wafer thinning machine, characterized in that: include: A bottom plate and side plates installed around the bottom plate, wherein the bottom plate is provided with a mounting opening for mounting a grinding mechanism; The bottom plate is provided with a drain port for discharging waste liquid, a filter screen is provided at the drain port, the drain port is configured as a groove sunken downwards on the bottom plate, and the filter screen forms a box-like structure embedded in the groove.

2. The liquid discharge structure of the wafer thinning machine according to claim 1, characterized in that: The size of the groove is larger than that of the filter screen, and a gap for accommodating solid impurities is formed between the filter screen and the side wall of the groove.

3. The liquid discharge structure of the wafer thinning machine according to claim 2, characterized in that: The gap forms a coarse filter portion for fixing impurities deposited therein, and the mesh of the filter screen forms a fine filter portion for filtering waste liquid.

4. The liquid discharge structure of the wafer thinning machine according to claim 2, characterized in that: At least one side of the filter screen of the box-shaped structure is arranged in contact with the side wall of the groove.

5. The liquid discharge structure of the wafer thinning machine according to claim 4, characterized in that: The bottom plate is designed to be inclined toward the drain port, and the side wall of the groove away from the inclined direction of the bottom plate is arranged to fit with one side of the filter screen.

6. The liquid drainage structure of the wafer thinning machine according to claim 1, characterized in that: The utility model also comprises a top cover which is detachably mounted on the top surface of the filter screen.

7. The liquid drainage structure of a wafer thinning machine according to any one of claims 1 to 6, characterized in that: There are multiple drain ports.

8. The liquid discharge structure of the wafer thinning machine according to claim 7, characterized in that: A circular baffle extends from the circumference of the mounting port along its axial direction, and a baffle is provided between the circular baffle and the side plate. The baffle divides the drainage area on the bottom plate into multiple independent areas, each of which has a drainage port.

9. The liquid discharge structure of the wafer thinning machine according to claim 8, characterized in that: There are four blocking pieces, which are respectively located at the four sides of the installation opening, dividing the drainage area into four independent areas.

10. The liquid drainage structure of the wafer thinning machine according to claim 9, characterized in that: It also includes two cross beams, which are arranged perpendicular to each other. A cross beam is connected between two opposite side plates, and the blocking piece is formed between the cross beam and the bottom plate.

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