High-speed copper-clad plate

Abstract

The utility model belongs to the technical field of copper-clad plates, and particularly relates to a high-speed copper-clad plate which comprises a base material plate and copper foil plates attached to the two side surfaces of the base material plate, a through groove is formed in the base material plate, supporting battens are arrayed in the through groove in a key shape at equal intervals, and one end of each supporting batten tilts up; wherein a gap between every two adjacent supporting battens is the same as the width of the supporting battens, the other set of supporting battens is reversely arranged in the gap, the length of the supporting battens is the same as the inner width of the through groove, and the supporting battens are filled into the through groove to form a flat-plate-shaped base material plate after being compressed by stress. According to the utility model, the base material plate can be gradually laminated with the copper foil plate by utilizing the arch-shaped structural characteristic of the base material plate, so that air generated by center deformation can be discharged outwards along gaps, the generation of bubbles is reduced, and meanwhile, the arch-shaped structural characteristic enables the edge frame part to be in relatively late contact with the copper foil plate, so that the deformation is relatively small, and the service life of the copper foil plate is prolonged. And the deformation rate of the product is controlled.

Description

Technical Field

[0001] The utility model belongs to the technical field of copper clad laminates, and in particular relates to a high-speed copper clad laminate. Background Art

[0002] High-speed copper-clad laminates (CCLs) have important applications in a variety of fields, including electronic communications, data centers, and automotive radar. Demand is growing significantly, particularly with the development of 5G communications and high-frequency circuits. High-speed circuits operate at high frequencies, supporting high signal transmission speeds, high characteristic impedance accuracy, and low signal transmission loss, making them suitable for scenarios requiring higher signal integrity.

[0003] From a material perspective, high-speed copper-clad laminates (CCLs) require low dielectric constants (Dk) and low dielectric loss (Df) to ensure both speed and quality during signal transmission. The material's dielectric constant directly impacts signal transmission rate, while dielectric loss affects signal quality. The production of these CCLs involves the selection and formulation of raw materials such as specialty resins, fillers, and fiberglass fabrics, all of which determine the CCL's electrical performance and mechanical strength.

[0004] Of course, there are still many copper-clad laminates made of liquid crystal polymers as the substrate. During the manufacturing process of this type of copper-clad laminate, the substrate and copper foil are directly hot-pressed and compounded at high temperature. When this type of substrate is pressed, due to the high temperature, it will change from a solid state to a viscous liquid state. The fluidity of the substrate after melting is relatively large, which can easily cause product deformation. If the deformed position is not tightly fitted, bubbles are likely to appear, affecting product quality. Utility Model Content

[0005] The purpose of the utility model is to provide a high-speed copper-clad laminate, which can utilize the arched structural characteristics of the base material plate to gradually press the base material plate with the copper foil plate, so that the air generated by the central deformation can be discharged outward along the gap, reducing the generation of bubbles. At the same time, the arched structural characteristics make the edge frame part contact with the copper foil plate later, so that the deformation is smaller, so that the product deformation rate is controlled.

[0006] The technical solutions adopted by this utility model are as follows:

[0007] A high-speed copper-clad laminate comprises a substrate plate and copper foil plates attached to two sides of the substrate plate;

[0008] The substrate plate is provided with a through slot, and the through slot is provided with a support strip in an array of equal intervals in the shape of piano keys, and one end of the support strip is tilted;

[0009] Among them, the gap between two adjacent support plates is the same as their width, and another group of support plates are arranged upside down in the gap. The length of the support plates is the same as the inner width of the through groove. After being compressed, the support plates are filled into the through groove to form a flat substrate plate.

[0010] As a preferred solution, the base plate and the support strip plate are an integrally formed structure, and the through groove and the base plate are virtually connected.

[0011] As a preferred solution, the support plates are arranged in an array on the substrate plate, and the support plates in two adjacent through grooves are symmetrically arranged, and the symmetrically arranged support plates are combined to form an arch shape.

[0012] As a preferred solution, the support plate and the base material plate have the same thickness.

[0013] As a preferred solution, two adjacent support strips located in the same through slot are interference fit.

[0014] As a preferred solution, the substrate plate and the support strip plate are made of a hot-melt substrate.

[0015] As a preferred solution, the tilting angle of the support plate compared to the plane of the base plate is 5°-45°.

[0016] The technical effects achieved by this utility model are:

[0017] The utility model provides a support plate on the base material plate, so that during the hot pressing process, the support plate is first exposed to the heat transferred from the copper foil plate, so that the base material plate is gradually pressed against the copper foil plate, thereby discharging the air generated by the central deformation outward along the gap, reducing the generation of bubbles. Moreover, since the base material plate contacts the copper foil plate later, the deformation amount is smaller, thereby maintaining the overall frame shape, reducing the deformation of the product, and improving the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of an original state of an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of the substrate plate in the embodiment of the present utility model;

[0020] Figure 3 It is a front view of the substrate plate in the embodiment of the present utility model;

[0021] Figure 4 is a top view of a substrate plate in an embodiment of the present utility model;

[0022] Figure 5It is a diagram of the pressing conversion state of the original state of the embodiment of the present utility model.

[0023] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0024] 1. Base material board;

[0025] 11. Through slot; 12. Support plate;

[0026] 2. Copper foil board. DETAILED DESCRIPTION

[0027] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is described in detail below with reference to the following embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention and does not strictly limit the scope of protection of the present invention.

[0028] like Figure 1-Figure 5 As shown, a high-speed copper-clad laminate comprises a base plate 1 and copper foil plates 2 attached to two sides of the base plate 1 .

[0029] Refer to the attached Figure 1 as well as Figure 2 In this embodiment, two groups of copper foil plates 2 are provided, which are respectively attached to the upper and lower surfaces of the substrate plate 1. A through groove 11 is opened on the substrate plate 1, and support plates 12 are arranged in an array of gaps in the shape of piano keys in the through groove 11, and the end of the support plate 12 that is not connected to the substrate plate 1 is raised.

[0030] In this embodiment, the tilting angle of the support plate 12 compared to the plane of the base plate 1 is 10°; of course, in other embodiments, the tilting angle can be selected between 5°-45° as needed, and the appropriate tilting angle can be selected according to the different materials and material thicknesses to achieve a better pressing effect.

[0031] Among them, the substrate plate 1 and the support plate 12 are an integrally formed structure, and the support plate 12 and the substrate plate 1 are virtually connected. The virtual connection here means that the support plate 12 and the substrate plate 1 are connected by a thin layer of the same material, so that they are connected to each other and will not fall off, but can rotate relative to each other, thereby satisfying the requirement that the support plate 12 can be embedded in the through groove 11 during the pressing process.

[0032] Refer to the attached Figure 3 as well as Figure 4 The gap between two adjacent support plates 12 is the same as their width, and another set of support plates 12 is arranged upside down in the gap. The length of the support plates 12 is the same as the inner width of the through groove 11. After being compressed, the support plates 12 are filled into the through groove 11 to form a flat substrate plate 1.

[0033] In this embodiment, the through grooves 11 are arranged in an array on the substrate plate 1, and the support plates 12 in two adjacent through grooves 11 are symmetrically arranged. The symmetrically arranged support plates 12 are combined into an arch shape, so that when the two sets of copper foil plates 2 and the substrate plate 1 are stacked (as shown in the attached figure), Figure 5 As shown above), when the hot pressing composite equipment is used for pressing, the support plate 12 will first come into contact with the heat and pressure transmitted from the copper foil plate 2, and then the support plate 12 will be gradually pressed into the interior of the through groove 11.

[0034] Secondly, in the process of continuously moving into the through groove 11, the support strip 12 also continuously changes into a viscous liquid state, and finally fully adheres to the upper and lower surfaces of the substrate plate 1 (as shown in the attached figure). Figure 5 As shown below), during the bonding process, the characteristics of the arch shape are utilized to gradually expand the bonding from the center to both sides, so that the air generated by the central deformation can be discharged outward along the gap to reduce the generation of bubbles.

[0035] Finally, during the attachment process, the base material plate 1 comes into contact with the copper foil plate 2 relatively late, and thus has a smaller deformation amount, thereby being able to maintain the overall frame shape, reduce product deformation, and improve product quality.

[0036] Of course, in other embodiments, the support strips 12 in adjacent through slots 11 can be arranged as needed, but should ultimately be combined into an arch shape.

[0037] Refer to the attached Figure 3 The support plate 12 and the base plate 1 need to maintain the same thickness, so that no gap will be generated during the bonding process, the bonding will be tighter, and the product quality will be better.

[0038] For further details, please refer to the attached Figure 2 In this embodiment, the two adjacent support plates 12 located in the same through groove 11 are interference fit, so that during the mutual pressing process, the separated support plates 12 can be tightly fused into one, thereby maintaining the overall structural strength of the product.

[0039] Furthermore, in this embodiment, the substrate plate 1 and the support plate 12 are made of liquid crystal polymer material; of course, other hot-melt substrates can also be selected for production as needed, such as modified polyphenylene ether resin, hydrocarbon resin, epoxy resin and other materials.

[0040] The working principle of the present invention is as follows: when in use, two sets of copper foil plates 2 and substrate plates 1 are stacked (as shown in the attached Figure 5As shown above), hot pressing composite equipment is then used for pressing. During the pressing process, the two sets of copper foil plates 2 are subjected to force synchronously from top to bottom, and then the support plate 12 is gradually pressed into the interior of the through groove 11. At the same time, during the hot pressing process, the support plate 12 first contacts the heat transferred from the copper foil plate 2. In the process of continuously moving into the interior of the through groove 11, it is also continuously transformed into a viscous liquid state, and then adheres to each other with the copper foil plate 2, and the separated support plates 12 are also fused into one, and finally fully adhere to the upper and lower surfaces of the substrate plate 1 (as shown in the attached figure). Figure 5 As shown below, during the bonding process, the air generated by the central deformation is discharged outward along the gap to reduce the generation of bubbles. In addition, since the base plate 1 contacts the copper foil plate 2 later, the deformation is smaller, thereby maintaining the overall frame shape, reducing product deformation and improving product quality.

[0041] The above description is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications should be considered within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained in this invention shall, unless otherwise specified or limited, be implemented in accordance with conventional means in the art.

Claims

1. A high-speed copper-clad laminate, characterized in that: include: A base material plate (1) and copper foil plates (2) attached to two side surfaces of the base material plate (1); The substrate plate (1) is provided with a through slot (11), and the through slot (11) is provided with a piano key-shaped array of support plates (12) with equal gaps, and one end of the support plate (12) is raised; The gap between two adjacent support plates (12) is the same as their width, and another group of support plates (12) is arranged upside down in the gap. The length of the support plates (12) is the same as the inner width of the through groove (11). After being compressed, the support plates (12) are filled into the through groove (11) to form a flat substrate plate (1).

2. The high-speed copper-clad laminate according to claim 1, characterized in that: The base plate (1) and the support plate (12) are an integrally formed structure, and a virtual connection is established between the support plate (12) and the base plate (1).

3. The high-speed copper-clad laminate according to claim 1, wherein: The through slots (11) are arranged in an array on the substrate plate (1), and the support strips (12) in two adjacent through slots (11) are symmetrically arranged, and the symmetrically arranged support strips (12) are combined to form an arch shape.

4. The high-speed copper-clad laminate according to claim 1, wherein: The support plate (12) has the same thickness as the base plate (1).

5. The high-speed copper-clad laminate according to claim 1, characterized in that: Two adjacent support strips (12) located in the same through slot (11) are interference-fitted with each other.

6. The high-speed copper-clad laminate according to claim 1, characterized in that: The base material plate (1) and the support strip plate (12) are made of a hot-melt base material.

7. The high-speed copper clad laminate according to claim 1, characterized in that: The tilting angle of the support plate (12) relative to the plane of the substrate plate (1) is 5°-45°.

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