Thermal printing head substrate and thermal printing head

Abstract

The utility model relates to the technical field of thermal printing head manufacturing, in particular to a thermal printing head substrate and a thermal printing head, which are reasonable in structure and low in cost and can overcome the problems of paper scratching and paper returning and colliding in the existing printing process. Organic silicon coatings are arranged on the edge of the paper outlet side of the ceramic substrate and the edges of the two sides of the ceramic substrate respectively, the upper surfaces of the edges of the ceramic substrate and the upper edges of the side faces of the ceramic substrate are coated with the organic silicon coatings at the same time, and the thickness of the organic silicon coatings does not exceed 20 micrometers.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal print head manufacturing, in particular to a thermal print head substrate and a thermal print head with reasonable structure and low cost, which can overcome the problems of paper scratching, paper returning and paper collision in the existing printing process. Background Art

[0002] Some printing consumables currently in use on the market are wider than the length of the thermal printhead substrate. During the printing process, due to the high pressure from the rubber roller and the sharp corners and edges of the thermal printhead substrate, scratches can easily occur on the printing consumables. For consumables with very demanding printing results, such as labels and photos, the image quality must be free of visible scratches. Furthermore, due to the sharp tip of the thermal printhead substrate and the printer's paper rewind function, paper collisions (scratching off the label paper) can occur. Thermal transfer printers can also have the sharp edges of the substrate scratch the ribbon, causing paper feed problems.

[0003] To address the above problems, at present, the edge of the ceramic substrate of the thermal print head is generally ground and chamfered. Although there has been some improvement, ceramic grinding will increase the difficulty of production and manufacturing. If all three sides of the ceramic substrate need to be ground, the processing cost will be increased invisibly. In addition, for the side scraping problem, the chamfered C angle cannot eliminate the scraping, but will aggravate the scratches caused by the scraping. The R angle processing is relatively difficult, and it is easy to cause the surface protective layer of the substrate to be chipped or broken during the processing. In addition, the cleanliness of the ceramic plate needs to be controlled and static electricity needs to be removed, resulting in quality risks in the final product and increased costs. Summary of the Invention

[0004] In view of the shortcomings and deficiencies in the prior art, the utility model proposes a thermal print head substrate and a thermal print head with reasonable structure and low cost, which can overcome the problems of paper scratching, paper returning and paper collision in the prior printing process.

[0005] The utility model is achieved through the following measures:

[0006] A thermal print head substrate comprises a ceramic substrate, a glaze layer is arranged on the surface of the ceramic substrate, and a heating resistor and an electrode wire are also arranged on the surface of the ceramic substrate. The invention is characterized in that the paper outlet side edge of the ceramic substrate and the two side edges of the ceramic substrate are respectively provided with an organic silicon coating, and the organic silicon coating simultaneously covers the upper surface and the upper edge of the side of the ceramic substrate edge, and the thickness of the organic silicon coating does not exceed 20 μm.

[0007] In the present invention, in order to prevent the silicone coating from affecting the pressure of the rubber roller during printing, the silicone coating on the edges of both sides of the ceramic substrate is only arranged on the upper surface of the ceramic substrate within 1 mm from the paper outlet side, usually 0.5~1 mm. If the coating width is too wide, it will be close to the heating element, which may easily cause structural interference and reduce the printing quality. If the coating width is too small, the edge wrapping effect will be uneven.

[0008] In order to improve the bonding strength between the organic silicon coating and the edge of the ceramic substrate, the organic silicon coating at the paper outlet side edge and the two side edges of the ceramic substrate is an integrated structure, and is in a [-shaped structure] on the upper surface of the ceramic substrate to prevent the independently provided organic silicon coating from peeling off from the edge of the substrate during subsequent use. The insulating protective layer below the organic silicon coating needs to use a protective coating with a large roughness, usually Ra of 0.2~0.4um, to increase the bonding strength between the organic silicon and the substrate.

[0009] When the utility model is in use, the organic silicone coating is applied on the fixed positions of the front edge (paper outlet side) and the side edge of the ceramic substrate, and the natural fluidity of the organic silicone coating is used to wrap the sharp edges. After curing, a smooth transition surface is formed on the edge of the ceramic substrate, which can solve the above-mentioned problems of the side of the ceramic sheet scratching and hitting the paper, and scratching the ribbon. At the same time, this special structure can improve the problem of printing sticking to the paper. Since the organic silicone coating provided in this solution is a high-performance resin coating, it has good adhesion and wear resistance to the substrate. The use of flexible resin fillers ensures that it has a certain elasticity after curing, and the surface characteristics have good hydrophobicity.

[0010] Compared with the prior art, the utility model has the significant advantages of reasonable structure, reliable operation, and the ability to effectively improve product printing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The figure is a schematic diagram of printing by a thermal print head in the prior art.

[0012] Figure 2 This is a schematic diagram of the cross-sectional structure of the print head and rubber roller consumables in the prior art.

[0013] Figure 3 This is a schematic diagram of the front structure of the print head, rubber roller and consumables in the utility model.

[0014] Figure 4 This is a schematic diagram of the side structure of the print head, rubber roller and consumables in the utility model.

[0015] Figure 5 This is a schematic diagram of the side structure of the print head, rubber roller and consumables in the utility model.

[0016] Figure 6This is a schematic diagram of the cross-sectional structure of the print head, rubber roller, and consumables in the present invention.

[0017] Reference numerals: DETAILED DESCRIPTION

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments. Example

[0019] This example provides a thermal print head, which is provided with a thermal print head substrate with anti-scratch paper. Specifically, the thermal print head in this example is as shown in the attached Figure 3 As shown, it includes a heat sink 1, a ceramic substrate 2, a silicone coating 3, a protective adhesive layer 4, a control chip IC5, a PCB circuit board 6, a connector 7, printing consumables 8, and a printer roller 9. The ceramic substrate 2 is provided with a glaze layer, a heating resistor and an electrode wire. Its structure is the same as that of the prior art and is not described in detail here.

[0020] The purpose of this example is to solve the problems of paper scratching and paper collision in the existing thermal printing process, by providing an organic silicon coating 3 on the ceramic substrate 2, and Figure 4 , Figure 5 , Figure 6 As shown, a special device is used to apply a silicone coating at designated positions on the front end, sides, and corners of the substrate, and the thickness and width of the applied organic coating are controlled (thickness: 10~20um, width: 0.5~1mm from the edge of the substrate). The silicone coating 3 is used to wrap the corners and sides. After the applied coating is cured, a flexible wrapping transition surface is formed on the surface of the ceramic substrate. The printing consumables are in contact with the wrapping transition surface on the side of the ceramic substrate. This structural setting can avoid direct contact between the consumables and both sides of the substrate, thereby solving the problem of paper scratching.

[0021] like Figure 5 As shown, the front end of the ceramic substrate 2 also forms a smooth transition surface to solve the problem of paper back-feeding, bumping into the paper, and scratching the label paper. The existing problem can be solved by coating silicone coating on three sides of the substrate.

[0022] Compared with the prior art, the utility model has the significant advantages of reasonable structure, reliable operation, and the ability to effectively improve product printing quality.

Claims

1. A thermal print head substrate, comprising a ceramic substrate, a glaze layer disposed on the surface of the ceramic substrate, a heating resistor, and an electrode conductor, wherein: The paper outlet side edge of the ceramic substrate and both side edges of the ceramic substrate are respectively provided with an organic silicon coating, which covers the upper surface and side upper edges of the edge of the ceramic substrate at the same time. The thickness of the organic silicon coating does not exceed 20μm.

2. A thermal print head substrate according to claim 1, characterized in that: The organic silicon coatings on both side edges of the ceramic substrate are only disposed on the upper surface of the ceramic substrate within 1 mm of the paper outlet side.

3. The thermal print head substrate according to claim 1, wherein: The organic silicon coating at the paper outlet side edge and both side edges of the ceramic substrate is an integrated structure and presents a [] structure on the upper surface of the ceramic substrate.

4. A thermal print head, characterized in that: A thermal print head substrate as claimed in any one of claims 1 to 3 is provided.

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