Sealing bag, vacuum assembly and pressing device

By using sealed bags to vacuum-fill the pre-core board with liquid resin, the problems of uneven PCB thickness and unstable resin filling are solved, achieving a more uniform dielectric thickness distribution and higher reliability.

CN223328122UActive Publication Date: 2025-09-12DONGGUAN SHENGYI ELECTRONICS
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Patent Information

Application Number
CN202422573805.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-23
Publication Date
2025-09-12
Estimated Expiration
2034-10-23

AI Technical Summary

Technical Problem

In the existing technology of PCB board manufacturing, there are problems with dielectric thickness unevenness and resin filling instability, especially the easy formation of voids and excessive dielectric thickness in small gaps, which affect the reliability and performance of the PCB board.

Method used

The pre-arranged core boards are sealed with sealing bags, and the liquid resin is filled into the gaps between the core boards by vacuuming. The negative pressure is used to ensure the uniform distribution of the resin and to maintain it before curing to avoid loss.

Benefits of technology

The uniformity of dielectric thickness of PCB boards is improved, voids and dielectric thickness deviations are avoided, and the reliability and performance of PCB boards are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a sealing bag, a vacuum assembly and a pressing device, the sealing bag comprises an inner bag, a containing space is formed in the inner bag, the containing space is used for containing a pre-discharging plate, a liquid suction opening and a first vacuumizing opening are formed in the inner bag in a spaced mode, and the liquid suction opening and the first vacuumizing opening both communicate with the containing space. Before the pre-arrangement plate is filled with liquid resin, the sealing bag can be vacuumized, air in the gaps of the core plates in the pre-arrangement plate is exhausted, and bubbles are prevented from being generated when the pre-arrangement plate is filled with the liquid resin. By utilizing the sealing effect of the sealing bag, liquid resin can be sucked into the sealing bag through vacuumizing, and the problem that holes are formed due to the fact that the positions with small intervals cannot be filled with the resin is solved; the liquid resin can be prevented from being lost before being pressed and cured by utilizing the retaining effect of the sealing bag on the liquid resin, so that the problem that the thickness of the liquid resin in the preset gap is unstable is solved, the dielectric thickness is prevented from being out of tolerance, and the dielectric thickness uniformity of the PCB is improved.
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Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a sealing bag, a vacuum assembly and a pressing device. Background Art

[0002] PCBs typically require the core board and prepreg to be pressed together. During the pressing process, the resin in the prepreg softens due to high temperature, reducing its viscosity and allowing it to flow and fill the open areas. After etching the core board, areas with a high residual copper ratio (copper area / total area) have less resin filling, while areas with a low residual copper ratio have more resin filling, which results in a thinner dielectric thickness. When the core board has a thicker copper thickness (for example, up to 3 oz), at a similar residual copper ratio, the greater the core board's copper thickness, the larger the empty volume that needs to be filled with resin, resulting in a thinner dielectric thickness. This not only reduces dielectric uniformity, but also affects the reliability of the finished PCB, such as impedance, insertion loss, and withstand voltage.

[0003] In the related art, in order to make the dielectric thickness of the PCB more uniform, the method of first applying resin in the gaps of the core board surface pattern, and then vacuuming and curing is usually adopted. However, this solution has at least the following problems: for some closed small-pitch positions, when rolling the resin, the bubbles in the small gaps are easily covered by the resin and are not easy to escape, which will cause voids to form during pressing, affecting reliability. For this reason, there is an urgent need for an auxiliary tool that can seal the pre-arranged core board, so that the core board can be vacuumed before or during the resin filling process, and the resin can be retained and prevented from leaking before the resin is cured. Utility Model Content

[0004] In order to solve at least one of the above technical problems, the present application provides a sealing bag, a vacuum assembly and a pressing device. The sealing bag can fill the gaps of the pre-arranged board with liquid resin and seal and maintain the liquid resin before it solidifies, thereby improving the uniformity of the dielectric thickness after the core board is pressed. The technical solution adopted is as follows.

[0005] In the first aspect, the sealing bag provided in the present application includes an inner bag, in which a accommodating space is formed, and the accommodating space is used to place the pre-arrangement plate. A liquid suction port and a first vacuum port are arranged at intervals on the inner bag, and the liquid suction port and the first vacuum port are both connected to the accommodating space.

[0006] In certain embodiments of the first aspect of the present application, the first vacuum port is provided with a first elastic bushing, which can be used to place the pre-arrangement plate when expanded, and can be used to seal the first vacuum port when contracted.

[0007] In certain embodiments of the first aspect of the present application, the first elastic bushing is a conical sleeve, and an opening at one end of the cone top of the conical sleeve is connected to the first vacuum port.

[0008] In certain embodiments of the first aspect of the present application, the sealed bag also includes an outer bag, which is arranged on the outer periphery of the inner bag, and the outer bag is provided with a first opening corresponding to the position of the liquid suction port, the liquid suction port is exposed from the first opening, and the outer periphery of the liquid suction port is sealed with the first opening, the outer bag is provided with a second opening corresponding to the first vacuum port, the first vacuum port is exposed from the second opening, and the outer periphery of the first vacuum port is sealed with the second opening, and the outer bag is also provided with a second vacuum port, and the first opening, the second opening and the second vacuum port are arranged at intervals.

[0009] In certain embodiments of the first aspect of the present application, the inner bag further comprises a rigid joint connected to the liquid suction port, the first opening is provided with a flexible sleeve, the flexible sleeve is sleeved on the outer periphery of the rigid joint, and the rigid joint is exposed from the flexible sleeve, and the flexible sleeve is sealed to the rigid joint.

[0010] In certain embodiments of the first aspect of the present application, the second opening is provided with a second elastic sleeve, which can be used to put in or take out the inner bag when opened, and can be used to be sealed and connected to the first vacuum port when contracted.

[0011] In certain embodiments of the first aspect of the present application, the first vacuum port is provided with a first elastic bushing, which can be used to place the pre-arrangement plate when expanded, and can be used to seal the first vacuum port when contracted;

[0012] The second elastic sleeve is a conical sleeve, and the opening at one end of the cone top of the conical sleeve is connected to the second opening. When the outer bag and the inner bag are connected, the second elastic sleeve is connected to the outer periphery of the first elastic sleeve, and the second elastic sleeve can be sealed and connected to the first elastic sleeve when it shrinks.

[0013] In certain embodiments of the first aspect of the present application, the inner bag and the outer bag are both configured as cubic bags, the liquid suction port and the first vacuum port are respectively configured on the top corners of the inner bag, and the second vacuum port is configured on the top corner of the outer bag.

[0014] In the second aspect, the present application also provides a vacuum assembly, comprising a pressure vessel, a liquid storage tank and the sealing bag of the first aspect, wherein the pressure vessel is used to accommodate the sealing bag, a third opening is provided in the pressure vessel, the liquid suction port is exposed from the third opening, the liquid suction port is connected to the liquid storage tank, the pressure vessel is further provided with a fourth opening for exposing the first vacuum port, and a fifth opening for exposing the second vacuum port, the pressure vessel is provided with a third vacuum port for vacuuming the pressure vessel, and the third vacuum port is spaced apart from the third opening, the fourth opening and the fifth opening.

[0015] In a third aspect, the present application further provides a pressing device, comprising a press and the sealing bag of the first aspect, wherein a sealing cabin is formed in the press, and the sealing cabin is used to heat, pressurize and pressurize the sealing bag.

[0016] The embodiments of the present application have at least the following beneficial effects: by using a sealing bag to accommodate the pre-arrangement board, the pre-arrangement board can be sealed in the accommodating space. First, before filling the pre-arrangement board with liquid resin, the sealing bag can be vacuumed to expel the air in the gaps between the core boards in the pre-arrangement board, thereby avoiding the formation of bubbles or bulges when filling the liquid resin and improving the filling quality of the liquid resin. Secondly, by utilizing the sealing effect of the sealing bag, the liquid resin can be sucked into the sealing bag by vacuuming, and the liquid resin can be filled into the gaps between the core boards by utilizing the fluidity of the resin under the action of negative pressure, solving the problem of voids formed by the lack of resin in locations with smaller spacing, improving the filling effect of the resin, and making the dielectric thickness of the core boards more uniform after lamination. Finally, by utilizing the sealing bag to retain the liquid resin, the liquid resin can be prevented from being lost before being pressed and solidified, thereby solving the problem of unstable thickness of the liquid resin in the preset gap, avoiding dielectric thickness deviations, and avoiding the problem of too thin dielectric thickness in areas with low residual copper rates, which helps to improve the dielectric thickness uniformity of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The aspects and advantages described and / or attached in the embodiments of the present application will become apparent and easily understood in conjunction with the following drawings. It should be noted that the embodiments embodied in the following drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0018] Figure 1 A schematic diagram of the structure of a sealing bag provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of the structure of the inner bag and outer bag of the sealed bag provided in an embodiment of the present application;

[0020] Figure 3 A schematic structural diagram of a first example of a vacuum assembly provided in an embodiment of the present application;

[0021] Figure 4 A schematic structural diagram of a second example of a vacuum assembly provided in an embodiment of the present application;

[0022] Figure 5 A schematic structural diagram of the pressing device provided in an embodiment of the present application.

[0023] Figure markings: 100, sealing bag; 10, inner bag; 11, accommodating space; 12, liquid suction port; 13, first vacuum port; 131, first elastic bushing; 14, rigid joint; 20, outer bag; 21, first opening; 211, flexible sleeve; 22, second opening; 221, second elastic bushing; 23, second vacuum port; 30, vacuum assembly; 31, pressure vessel; 311, third opening; 312, fourth opening; 313, fifth opening; 314, third vacuum port; 32, liquid storage tank; 33, vacuum equipment; 34, buffer device; 35, electric valve; 36, liquid level measuring instrument; 37, controller; 200, pressing device; 201, press; 2011, sealed cabin; 202, pressure pump; 203, heating device; 204, exhaust device; 300, core plate. DETAILED DESCRIPTION

[0024] The following combination Figures 1 to 5 Embodiments of the present application are described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limiting the present application.

[0025] In the description of this application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, "multiple" means two or more.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0027] In the related art, in order to make the dielectric thickness of the PCB more uniform, it is usually adopted to first apply resin to the pattern gap on the surface of the core board, and then press and cure the core board. This will have the following problems. First, for some closed small-pitch positions, when rolling the resin, the bubbles in the small gaps are easily covered by the resin and are not easy to escape, which will cause the formation of voids during pressing, affecting reliability. Moreover, the method of first applying liquid resin and then stacking the core board will cause the coating thickness to be unstable due to the fluidity of the liquid resin, and the liquid resin may be lost before curing, which will easily cause the dielectric thickness to exceed the tolerance range, making it difficult to solve the problem of uneven dielectric thickness. It will also cause the dielectric thickness to be difficult to meet the design requirements, and the performance of the PCB board product will be difficult to guarantee.

[0028] Based on this, the present application proposes a sealing bag suitable for a PCB board manufacturing method in which the pre-arranged core boards are sealed and filled with liquid resin, wherein the pre-arranged core boards are sealed and filled with liquid resin. Specifically, the core boards are pre-arranged according to the stacking order of the PCB board design, and then the pre-arranged core boards are placed in a sealing bag and sealed. The sealing bag is vacuumed, so that the liquid resin is drawn into the sealing bag by the negative pressure and filled into the gaps between the core boards. Finally, the sealing bag containing the core boards is pressed at high temperature and high pressure to solidify the liquid resin to achieve the pressing of the core boards. In this process, the sealing bag can realize the above-mentioned PCB board manufacturing method, thereby improving the uniformity of the dielectric thickness of the PCB board.

[0029] Therefore, see Figure 1In a first aspect, the present application provides a sealing bag 100 including an inner bag 10, wherein a accommodating space 11 is formed in the inner bag 10, and the accommodating space 11 is used to place pre-arrangement boards. A liquid suction port 12 and a first vacuum port 13 are provided on the inner bag 10 at intervals, and both the liquid suction port 12 and the first vacuum port 13 are connected to the accommodating space 11. By accommodating the pre-arrangement boards (pre-arranged core boards 300) in the sealing bag 100, the pre-arrangement boards can be sealed in the accommodating space 11. First, before filling the pre-arrangement boards with liquid resin, the sealing bag 100 can be vacuumed to discharge the air in the gaps between the core boards 300 in the pre-arrangement boards, thereby avoiding the generation of bubbles or bulges when filling with liquid resin, thereby improving the filling quality of the liquid resin. Secondly, the sealing effect of the sealing bag 100 can also be used to suck the liquid resin into the sealing bag 100 through vacuum, and the liquid resin can be filled into the gaps of the core board 300 due to the fluidity of the resin under the action of negative pressure. This solves the problem of small gaps where the resin cannot be filled and form voids, improves the resin filling effect, and makes the dielectric thickness of the core board 300 more uniform after lamination. Finally, the sealing bag 100 can prevent the liquid resin from escaping before being pressed and cured, thereby solving the problem of unstable thickness of the liquid resin in the preset gap, avoiding excessive dielectric thickness, and also avoiding the problem of too thin dielectric thickness in areas with low residual copper rate, which helps to improve the dielectric thickness uniformity of the PCB board.

[0030] Optionally, the inner bag 10 of the sealed bag 100 can be provided with an opening through which the pre-arrangement plate is placed into the accommodating space 11. The opening can be elastically contracted, or can be tied, sealed, or pasted with other auxiliary structures to achieve sealing of the inner bag 10. Alternatively, the pre-arrangement plate can be placed through the first vacuum port 13. That is, the first vacuum port 13 can not only be used to vacuum the inner bag 10, but also serve as an entrance for the pre-arrangement plate. This can reduce the number of openings provided in the sealed bag 100 and improve the sealing effect of the sealed bag 100.

[0031] Specifically, in some embodiments, the first vacuum port 13 is provided with a first elastic bushing 131. When the first elastic bushing 131 is opened, it can be used to place the pre-arrangement plate. When the first elastic bushing 131 is contracted, it can be used to seal the first vacuum port 13. By utilizing the elastic effect of the first elastic bushing 131, on the one hand, the first vacuum port 13 can be opened to a size that allows the pre-arrangement plate to pass through, and under the action of its own elasticity, it can be retracted to achieve the closure of the first vacuum port 13. On the other hand, the first elastic bushing 131 can also achieve sealing by tying, and the first elastic bushing 131 can increase the connection area of ​​the vacuum pipe or joint between the inner bag 10 and the vacuum equipment 33, thereby improving the sealing performance between the inner bag 10 and the vacuum equipment 33 and improving the vacuuming effect of the inner bag 10.

[0032] In some embodiments, the first elastic bushing 131 is a conical sleeve, and the opening at the top of the cone is connected to the first vacuum port 13. The conical sleeve has two opposing ends, wherein the opening at the top is smaller than the opening at the bottom. By configuring the first elastic bushing 131 as a conical sleeve, on the one hand, the opening at the top is smaller. By connecting the top to the first vacuum port 13, the opening size of the first vacuum port 13 can be reduced, thereby improving the sealing effect of the first vacuum port 13. On the other hand, the larger opening at the bottom helps to open when the pre-arrangement plate is placed, and guides the pre-arrangement plate into the accommodating space 11, thereby improving the convenience of operation.

[0033] After the sealing bag 100 and the pre-layout board are pressed together, the liquid resin filled in the sealing bag 100 will adhere to the sealing bag 100 after curing. Therefore, after the pre-layout board is pressed together and formed into a PCB board, the sealing bag 100 must be broken to remove the PCB board. To make the sealing bag 100 recyclable and reusable, the sealing bag 100 can be used in combination with an inner bag 10 and an outer bag 20.

[0034] Therefore, in some embodiments, see Figure 2The sealed bag 100 also includes an outer bag 20, which is sleeved on the outer periphery of the inner bag 10. The outer bag 20 is provided with a first opening 21 corresponding to the position of the liquid suction port 12, and the liquid suction port 12 is exposed from the first opening 21. The outer periphery of the liquid suction port 12 is sealed with the first opening 21. The outer bag 20 is provided with a second opening 22 corresponding to the first vacuum port 13, and the first vacuum port 13 is exposed from the second opening 22. The outer periphery of the first vacuum port 13 is sealed with the second opening 22. The outer bag 20 is also provided with a second vacuum port 23. The first opening 21, the second opening 22 and the second vacuum port 23 are arranged at intervals. By combining the inner bag 10 and the outer bag 20 for the sealing bag 100, on the one hand, the outer bag 20 can be removed before the pre-arrangement board is pressed, and only the inner bag 10 containing the pre-arrangement board is pressed, and the outer bag 20 can be recycled and reused. After the pre-arrangement board is pressed, the liquid resin filled in the inner bag 10 solidifies and adheres to the inner bag 10, and the inner bag 10 can be removed by milling or other methods without affecting the recycling of the outer bag 20 (of course, in other examples, the outer bag 20 can also be pressed together, and after pressing is completed, the inner bag 10 and the outer bag 20 are separated and the outer bag 20 is recycled). On the other hand, by setting a two-layer bag structure, the sealing performance of the sealing bag 100 can be further improved. By making the air pressure in the inner bag 10 reach a preset value, it can be ensured that there is a good vacuum degree in the inner bag 10 before filling with liquid resin, thereby preventing the residual air in the gap between the core plates 300 from generating voids or bubbles during the liquid resin filling process. The second vacuum port 23 can be used to evacuate the outer bag 20. For example, when evacuating the sealed bag 100, the outer bag 20 is evacuated first, and then the inner bag 10 is evacuated, thereby ensuring a good vacuum level in the accommodating space 11 of the inner bag 10. When the inner bag 10 needs to be separated from the outer bag 20, the second vacuum port 23 can be used to inflate the outer bag 20, releasing the seal between the inner bag 10 and the outer bag 20. The second opening 22 can then be opened to remove the inner bag 10 from the outer bag 20.

[0035] For example, the inner bag 10 can be made of a film material that is both airtight and heat-resistant. This ensures that the structure and sealing properties of the inner bag 10 are not compromised when the inner bag 10 is placed in the press 201 for compression. The inner bag 10 can be made of a material that is non-reactive with the resin. The outer bag 20 can be made of a flexible material capable of supporting the weight of multiple core panels 300. Optionally, the outer bag 20 can be thicker than the inner bag 10.

[0036] Providing the outer bag 20 with the first opening 21 and the second opening 22 facilitates the exposure of the liquid suction port 12 and the first vacuum port 13 of the inner bag 10 from the outer bag 20, thereby enabling vacuuming of the inner bag 10 and the absorption of liquid resin. It will be appreciated that the portion of the inner bag 10 extending from the first opening 21 and the second opening 22 of the outer bag 20 needs to be sealed to the outer bag 20 to ensure a sealing effect when the outer bag 20 is vacuumed.

[0037] In some embodiments, the inner bag 10 further includes a rigid joint 14 connected to the liquid suction port 12, and the first opening 21 is provided with a flexible sleeve 211, which is sleeved on the outer periphery of the rigid joint 14, and the rigid joint 14 is exposed from the flexible sleeve 211, and the flexible sleeve 211 is sealed and connected to the rigid joint 14. The rigid joint 14 is connected to the liquid suction port 12, and further, the rigid joint 14 can be connected to the liquid storage tank 32 containing liquid resin through a pipeline to suck the liquid resin into the inner bag 10. The rigid joint 14 can ensure that the inner walls of the liquid suction port 12 of the inner bag 10 will not adhere to each other under the negative pressure of vacuum, thereby ensuring the patency of the liquid suction port 12. Exemplarily, the rigid joint 14 can be a hard pipe, which can maintain the rigidity of the pipe wall under the action of negative pressure to ensure the patency of the pipe. The flexible cuff 211 of the outer bag 20 can, on the one hand, expose the rigid joint 14, ensuring that the inner bag 10 can be connected to the external liquid resin storage tank 32 through the liquid suction port 12. On the other hand, the flexible cuff 211 can, through its own flexibility or elasticity, be sealed to the periphery of the rigid joint 14, thereby improving the sealing between the first opening 21 of the outer bag 20 and the liquid suction port 12 of the inner bag 10. Optionally, the flexible cuff 211 can further improve the sealing with the rigid joint 14 by tying.

[0038] In some embodiments, the second opening 22 is provided with a second elastic sleeve 221. When the second elastic sleeve 221 is opened, it can be used to insert or remove the inner bag 10. When the second elastic sleeve 221 is contracted, it can be used to seal and connect with the first vacuum port 13. By utilizing the elastic effect of the second elastic sleeve 221, on the one hand, the second opening 22 can be opened to a size that allows the inner bag 10 to pass through, and under the action of its own elasticity, it can be retracted to achieve the closure of the second opening 22. On the other hand, the second elastic sleeve 221 can increase the contact area with the first elastic sleeve 131, thereby improving the sealing effect between the first vacuum port 13 and the second opening 22. Optionally, the second elastic sleeve 221 and the first elastic sleeve 131 can be tied to further improve the sealing performance.

[0039] In some embodiments, the second elastic bushing 221 is also configured as a conical sleeve, and the opening at one end of the cone top of the conical sleeve is connected to the second opening 22. When the outer bag 20 and the inner bag 10 are sleeved, the second elastic bushing 221 is sleeved on the outer periphery of the first elastic bushing 131, and when the second elastic bushing 221 contracts, it can be sealed and connected to the first elastic bushing 131. By configuring the second elastic bushing 221 as a conical sleeve, on the one hand, it can meet the requirements of connecting the cone top end to the second opening 22 to reduce the opening size of the second opening 22 and improve the sealing effect, and it can also meet the requirements of opening the cone bottom end to be large enough to facilitate the removal and placement of the inner bag 10; on the other hand, the second elastic bushing 221 and the first elastic bushing 131 are configured to have the same shape, which can make the two fit more closely when sealing with each other, thereby improving the sealing effect between the second opening 22 and the first vacuum port 13.

[0040] In some embodiments, the inner bag 10 and the outer bag 20 are both configured as cubic bags, the liquid suction port 12 and the first vacuum port 13 are respectively provided at the top corners of the inner bag 10, and the second vacuum port 23 is provided at the top corners of the outer bag 20. Since the core board 300 is generally rectangular in shape, the pre-arrangement board formed by stacking multiple core boards 300 is in the shape of a cube. Therefore, configuring the inner bag 10 and the outer bag 20 as cubic bags can also improve the fit between the sealing bag 100 and the pre-arrangement board, making the outline of the sealing bag 100 containing the pre-arrangement board more regular, facilitating the compact arrangement and simultaneous pressing of multiple sealing bags 100, reducing the space occupied by each sealing bag 100, and improving the efficiency of PCB board production. It is understandable that the inner bag 10 and the outer bag 20 can flexibly select appropriate sizes according to the actual specifications of the core board 300, and the specific sizes of the inner bag 10 and the outer bag 20 are not limited here.

[0041] Second, see Figure 3 and Figure 4The present application also provides a vacuum assembly 30, comprising a pressure vessel 31, a liquid storage tank 32, and the sealing bag 100 provided in the first aspect. The pressure vessel 31 is used to accommodate the sealing bag 100. The pressure vessel 31 is provided with a third opening 311, through which the liquid suction port 12 is exposed. The liquid suction port 12 is connected to the liquid storage tank 32. The pressure vessel 31 is also provided with a fourth opening 312 for exposing the first vacuum port 13, and a fifth opening 313 for exposing the second vacuum port 23. The pressure vessel 31 is provided with a third vacuum port 314 for vacuuming the pressure vessel 31. The third vacuum port 314 is spaced apart from the third opening 311, the fourth opening 312, and the fifth opening 313. The liquid storage tank 32 can be used to store liquid resin. The liquid storage tank 32 can be connected to the liquid suction port 12 of the inner bag 10 via a pipe. During the vacuuming process of the inner bag 10, the liquid resin can enter the inner bag 10 and fill the gaps between the core plates 300 of the pre-arranged plate. The pressure vessel 31 itself has a certain degree of rigidity. On the one hand, it can support and fix the sealing bag 100 during the vacuuming process, thereby improving the stability of the sealing bag 100 during the vacuuming process. On the other hand, the pressure vessel 31 itself can be vacuumed, so that the sealing bag 100 can be attached to the inner wall of the pressure vessel 31, providing sufficient space for the flow of liquid resin in the sealing bag 100, thereby improving the filling effect of the liquid resin. On this basis, the sealing bag 100 (including the inner bag 10 and the outer bag 20) can be set as a flexible bag. The flexible sealing bag 100 has a certain degree of deformation ability, which can help adapt to the shape of the core board 300. When the flexible sealing bag 100 is vacuumed, the flexible sealing bag 100 can be attached to the outer surface of the core board 300, which helps to better retain the liquid resin filled in the gap of the core board 300, and further prevent the liquid resin from leaking from the gap before solidification.

[0042] In some embodiments, the vacuum assembly 30 further includes a vacuum pump 33, an electric valve 35, a liquid level meter 36, and a controller 37. The electric valve 35 is connected to the liquid suction port 12 of the inner bag 10. The electric valve 35 is configured to be opened to allow liquid resin to enter the inner bag 10, or closed to prevent the liquid resin from flowing into the inner bag 10. The liquid level meter 36 can be used to detect the vacuum level in the inner bag 10. The electric valve 35 is opened only when the vacuum level in the inner bag 10 reaches a preset value. This ensures that the inner bag 10 has a sufficient vacuum level before the liquid resin enters the inner bag 10, preventing residual air in the inner bag 10 from causing bubbles when the liquid resin is filled, thereby ensuring that the liquid resin can achieve a good filling effect.

[0043] Optionally, both the liquid level meter 36 and the electric valve 35 are electrically connected to a controller 37. The controller 37 uses the liquid level meter 36 to detect the vacuum level of the inner bag 10. When the air pressure in the inner bag 10 exceeds a preset value, the electric valve 35 remains closed, preventing liquid resin from entering the inner bag 10. The inner bag 10 is evacuated until the vacuum level reaches a preset value. At this point, the controller 37 controls the electric valve 35 to open, allowing the vacuum device 33 to draw liquid resin into the inner bag 10 to fill the gaps between the sub-plates. For example, a conductive liquid (e.g., mercury) can be placed in the liquid level meter 36. Changes in the conductive liquid's level can generate different electrical signals, thereby enabling detection of the vacuum level of the inner bag 10.

[0044] Optionally, a buffer device 34 may be provided between the vacuuming device 33 and the first vacuuming port 13 of the inner bag 10 . The buffer device 34 is used to store the liquid resin waste extracted from the inner bag 10 , and the resin volatiles can be discharged after condensation.

[0045] Thirdly, please refer to Figure 5 The present application also provides a pressing device 200, which includes a press 201 and the sealing bag 100 provided in the first aspect. A sealed cabin 2011 is formed in the press 201, and the sealed cabin 2011 is used to heat, pressurize and pressurize the sealing bag 100. The sealed cabin 2011 can be pressurized and heated so that the core board 300 can be pressed together under high temperature and high pressure to form a finished PCB board. Exemplarily, the press 201 can be a cabin pressure press 201, which has a sealed cabin 2011 structure.

[0046] In some embodiments, an inert gas can be introduced into the press 201 during operation. The inert gas does not react with the core plate 300, the resin, etc. The inert gas can be pressurized and heated by the pressure pump 202 and the heating device 203, and then introduced into the chamber pressure press 201 after reaching the set pressure and temperature. This high temperature and high pressure environment can further improve the pressing effect of the pre-arranged plate.

[0047] Optionally, see Figure 5 , Figure 5 The middle arrow indicates the flow direction of the high-temperature, high-pressure inert gas. The inert gas can be introduced through the top, bottom, and peripheral sides of the cabin press 201 to create a surrounding airflow around the sealed bag 100 and pre-assembled sheets placed in the cabin press 201. This ensures more uniform heating and pressure distribution during the press process, thereby improving the press quality of the pre-assembled sheets. The cabin press 201 can also be equipped with an exhaust device 204 connected to the cabin to extract the inert gas to control the air pressure within the cabin.

[0048] In some embodiments, the pressing device 200 may also be provided with a buffer device 34 connected to the sealing bag 100. The buffer device 34 has the function of storing liquid. When the sealing bag 100 is vacuumed before or during pressing, the waste liquid formed after the volatile gas in the sealing bag 100 is cooled and the overflowed part of the resin in the sealing bag 100 after the heat expands can be discharged into the buffer device 34, thereby avoiding the volatile gas and the overflowed resin from affecting the pressing quality of the pre-arrangement plate, and further improving the pressing effect of the pre-arrangement plate.

[0049] In the description of this specification, if the reference terms "one embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" appear, it means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0050] The above describes the implementation methods of the present application in detail in conjunction with the accompanying drawings, but the present application is not limited to the above implementation methods. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.

[0051] In the description of this application, if the "," appears in the patent title, it indicates an "and" relationship, not an "or" relationship. For example, if the patent title is "A, B", it means that the content protected by this application is: the technical solution of the subject name A and the technical solution of the subject name B.

Claims

1. A sealed bag, characterized in that: include An inner bag is provided with a storage space for placing a pre-arrangement plate. A liquid suction port and a first vacuum port are provided at intervals on the inner bag. Both the liquid suction port and the first vacuum port are connected to the storage space.

2. The sealed bag according to claim 1, wherein: The first vacuum port is provided with a first elastic bushing. When the first elastic bushing is expanded, it can be used to place the pre-arrangement plate. When the first elastic bushing is contracted, it can be used to seal the first vacuum port.

3. The sealed bag according to claim 2, wherein: The first elastic bushing is a conical bushing, and an opening at one end of the cone top of the conical bushing is connected to the first vacuum port.

4. The sealed bag according to claim 1, wherein: The sealed bag also includes an outer bag, which is sleeved on the outer periphery of the inner bag. The outer bag is provided with a first opening corresponding to the position of the liquid suction port, the liquid suction port is exposed from the first opening, and the outer periphery of the liquid suction port is sealed with the first opening. The outer bag is provided with a second opening corresponding to the first vacuum port, the first vacuum port is exposed from the second opening, and the outer periphery of the first vacuum port is sealed with the second opening. The outer bag is also provided with a second vacuum port, and the first opening, the second opening and the second vacuum port are arranged at intervals.

5. The sealed bag according to claim 4, characterized in that: The inner bag also includes a rigid joint connected to the liquid suction port. The first opening is provided with a flexible sleeve. The flexible sleeve is sleeved on the outer periphery of the rigid joint, and the rigid joint is exposed from the flexible sleeve. The flexible sleeve is sealed and connected to the rigid joint.

6. The sealed bag according to claim 4, wherein: The second opening is provided with a second elastic sleeve. When the second elastic sleeve is expanded, it can be used to put in or take out the inner bag. When the second elastic sleeve is contracted, it can be used to be sealed and connected with the first vacuum port.

7. The sealed bag according to claim 6, characterized in that: The first vacuum port is provided with a first elastic bushing, which can be used to place the pre-arrangement plate when it is expanded, and can be used to seal the first vacuum port when it is contracted; The second elastic sleeve is a conical sleeve, and the opening at one end of the cone top of the conical sleeve is connected to the second opening. When the outer bag and the inner bag are connected, the second elastic sleeve is connected to the outer periphery of the first elastic sleeve, and the second elastic sleeve can be sealed and connected to the first elastic sleeve when it shrinks.

8. The sealed bag according to claim 4, wherein: The inner bag and the outer bag are both configured as cubic bags, the liquid suction port and the first vacuum port are respectively configured on the top corners of the inner bag, and the second vacuum port is configured on the top corner of the outer bag.

9. A vacuum assembly, characterized in that: The method comprises a pressure vessel, a liquid storage tank and a sealing bag as described in any one of claims 1 to 8, wherein the pressure vessel is used to accommodate the sealing bag, a third opening is provided in the pressure vessel, the liquid suction port is exposed from the third opening, the liquid suction port is connected to the liquid storage tank, the pressure vessel is further provided with a fourth opening for exposing the first vacuum port, and a fifth opening for exposing the second vacuum port, the pressure vessel is provided with a third vacuum port for vacuuming the inside of the pressure vessel, and the third vacuum port is spaced apart from the third opening, the fourth opening and the fifth opening.

10. A pressing device, characterized in that: The invention comprises a press and the sealing bag according to any one of claims 1 to 8, wherein a sealing cabin is formed in the press, and the sealing cabin is used to heat, pressurize and seal the sealing bag.