Pressing plate type double-sided electroplating device for integrated circuit lead frame

Abstract

The utility model belongs to the technical field of electroplating, and particularly relates to an integrated circuit lead frame pressing plate type double-sided electroplating device which comprises a glass box, a base which is horizontally arranged at the bottom end of the glass box and coincides with the bottom end of the glass box, and a plating solution tank is connected to the inner bottom wall of the glass box and is close to the right end of the glass box. The middle part of the plating solution tank is vertically connected with two sliding rails which are symmetrically arranged relative to the center of the plating solution tank, the inner side wall of the plating solution tank is horizontally connected with two baffles and is close to the right end of the plating solution tank, an anode strip is slidably inserted between the inner side wall of the plating solution tank and the two baffles, and the right end of the plating solution tank is vertically connected with a power supply box. According to the utility model, the separation window and the mechanical arm are adopted, so that the electroplating process of the integrated circuit frame is in a dust-free state, the cleanness and tidiness of the electroplating process are ensured, the electroplating loss degree can be reduced, and the manual operation amount is reduced by adopting the assistance of the mechanical arm.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a pressure plate type double-sided electroplating device for an integrated circuit lead frame. Background Art

[0002] The double-sided electroplating device for integrated circuit lead frames is a device used in the electronics manufacturing industry, which is mainly used to electroplate on both sides of the integrated circuit lead frames to ensure their good electrical conductivity and reliability.

[0003] However, the integrated circuit lead frame is the main board of the instrument. During the electroplating process, the circuit frame needs to be kept clean and tidy. It is also necessary to prevent it from being attached by other pollutants such as dust during the electroplating process, resulting in uneven electroplating and damage to the frame.

[0004] To solve the above problems, we propose an integrated circuit lead frame press plate type double-sided electroplating device. Utility Model Content

[0005] The purpose of the utility model is to solve the problems in the background technology and to propose a press plate type double-sided electroplating device for an integrated circuit lead frame.

[0006] The top of the glassware jar is connected with the base, and the bottom of the glassware jar is connected with the base, and the bottom of the glassware jar is connected with the base.

[0007] Two support frames are vertically connected to the inner bottom wall of the glass box and are respectively close to the left and right ends of the glass box, and two support rods arranged parallel to each other are commonly and horizontally connected between the two support frames, and a slide seat is commonly slidably sleeved on the two support rods, and the bottom ends of the slide seat are vertically connected to two electric telescopic rods and are respectively located on the front and rear sides of the two support rods, and the bottom ends of the two electric telescopic rods are horizontally connected to a right-angle frame, and a motor is provided at the top of the right-angle frame and is close to the vertical end of the right-angle frame, and a fixing clamp is vertically connected to the bottom end of the right-angle frame, and two rollers are fixedly connected to the top of the slide seat and are arranged vertically with the support rod, and a conveying mechanism is commonly provided on the left end of the glass box and the base.

[0008] In the above-mentioned integrated circuit lead frame pressure plate double-sided electroplating device, the transmission mechanism includes eight corresponding groups of support seats, and the left ends of the glass box and the base are each provided with two overlapping grooves. The eight groups of support seats are respectively located at the left and right ends of the two grooves and are symmetrically arranged in pairs between the four groups of support seats around a single groove. Two rotating rods are connected for common rotation between the corresponding groups of support seats. Four linearly arranged rollers 2 are fixedly sleeved on the two rotating rods. A gear 1 is fixedly sleeved in the middle of the rotating rod. A motor 2 is provided on the inner bottom wall of the glass box and is located between the two grooves. A gear 2 is fixedly sleeved on the driving end of the motor 2, and the gear 2 is engaged with the teeth of two adjacent gears 1.

[0009] In the above-mentioned integrated circuit lead frame press plate type double-sided electroplating device, two guide frames are vertically provided on the inner bottom wall of the base and are both located directly below the conveying mechanism.

[0010] In the above-mentioned integrated circuit lead frame press plate type double-sided electroplating device, a wire is connected between the power box and the anode sheet, and the wire passes through the support frame at the right end and is connected to the slide and motor 1.

[0011] In the above-mentioned integrated circuit lead frame press plate type double-sided electroplating device, the vertical ends of the two right-angle frames are located above their horizontal ends and are both located between the two electric telescopic rods.

[0012] In the above-mentioned integrated circuit lead frame press plate type double-sided electroplating device, two soft diaphragms arranged side by side are provided in the groove and are located between the glass box and the base.

[0013] Compared with the existing technology, the advantages of this integrated circuit lead frame press plate double-sided electroplating device are:

[0014] The utility model adopts a partition window and a mechanical arm to keep the electroplating process of the integrated circuit frame in a dust-free state, ensuring the cleanliness of the electroplating process and reducing the loss of electroplating. The mechanical arm is also used to assist and reduce the amount of manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a press plate type double-sided electroplating device for an integrated circuit lead frame proposed by the present invention;

[0016] Figure 2 This is a schematic structural diagram of a press plate type double-sided electroplating device for an integrated circuit lead frame proposed by the present invention;

[0017] Figure 3 This is a schematic structural diagram of a press plate type double-sided electroplating device for an integrated circuit lead frame proposed by the present invention;

[0018] Figure 4 The utility model is a structural schematic diagram of a press plate type double-sided electroplating device for an integrated circuit lead frame.

[0019] In the figure: 1 glass box, 2 base, 3 plating solution tank, 4 slide rail, 5 anode plate, 6 baffle, 7 power box, 8 heating plate, 9 circulation pump, 10 support rod, 11 slide, 12 electric telescopic rod, 13 right-angle frame, 14 motor 1, 15 fixing clamp, 16 roller 1, 17 support frame, 18 support seat, 19 rotating rod, 20 roller 2, 21 gear 1, 22 motor 2, 23 gear 2, 24 guide frame. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Reference Figures 1-4 A double-sided electroplating device for an integrated circuit lead frame with a platen is provided, comprising a glass box 1, a base 2 being arranged horizontally at the bottom end of the glass box 1 and overlapping with the bottom end of the glass box 1, a plating tank 3 being connected to the inner bottom wall of the glass box 1 and close to the right end of the glass box 1, two slide rails 4 being vertically connected to the middle of the plating tank 3 and being arranged symmetrically about the center of the plating tank 3, two baffles 6 being horizontally connected to the inner side wall of the plating tank 3 and close to the right end of the plating tank 3, and a gap between the inner side wall of the plating tank 3 and the two baffles 6 An anode sheet 5 is slidably inserted between the two sides of the plating tank 3. The right end of the plating tank 3 is vertically connected to a power supply box 7. The bottom end of the plating tank 3 is fixedly connected to two horizontally arranged heating plates 8 and are respectively located between the two slide rails 4 and the inner side walls of the plating tank 3. The heating plates 8 heat the liquid in the plating tank 3 to accelerate the electroplating process and better complete the electroplating. The bottom end of the plating tank 3 is vertically connected to a circulation pump 9 and the two ends of the circulation pump 9 are respectively connected to the left and right sides of the two slide rails 4. The plating tank 3 is located inside the base 2;

[0022] Two support frames 17 are vertically connected to the inner bottom wall of the glass box 1 and are respectively close to the left and right ends of the glass box 1. Two support rods 10 arranged parallel to each other are horizontally connected between the two support frames 17. A slide 11 is slidingly sleeved on the two support rods 10. The bottom end of the slide 11 is vertically connected to two electric telescopic rods 12 and is respectively located on the front and rear sides of the two support rods 10. The bottom ends of the two electric telescopic rods 12 are horizontally connected to right-angle frames 13. The vertical ends of the two right-angle frames 13 are located at their horizontal ends. Above the flat end and between the two electric telescopic rods 12, a motor 14 is provided at the top of the right-angle frame 13 and is close to the vertical end of the right-angle frame 13. A fixing clamp 15 is vertically connected to the bottom end of the right-angle frame 13. Two rollers 16 are fixedly connected to the top of the slide 11 and are arranged vertically with the support rod 10. A wire is connected between the power box 7 and the anode plate 5. The wire passes through the support frame 17 at the right end and is connected to the slide 11 and the motor 14. A transmission mechanism is provided together at the left end of the glass box 1 and the base 2.

[0023] The device sends the frame into the glass box 1 through the conveying mechanism, and then the slide 11 moves to the left end of the glass box 1 under the drive of roller 16, and the electric telescopic rod 12 is started to move the right-angle frame 13 downward. The frame is then fixed by the fixing clamp 15, and then the frame is placed between the two slide rails 4 under the drive of the slide 11 and the electric telescopic rod 12. Then, the electroplating is completed in the plating tank 3, and finally the slide 11 and the electric telescopic rod 12 move to the left and are led out into the groove at the far left end. During this process, the circulating pump 9 will mix the liquid in the plating tank 3 to keep it uniform.

[0024] The conveying mechanism includes eight corresponding groups of support seats 18. The left ends of the glass box 1 and the base 2 are each provided with two overlapping grooves. Two soft diaphragms are arranged side by side in the grooves and are located between the glass box 1 and the base 2. The eight groups of support seats 18 are respectively located at the left and right ends of the two grooves and are symmetrically arranged in pairs between the four groups of support seats 18 around a single groove. Two rotating rods 19 are connected to each other for common rotation. Four linearly arranged rollers 20 are fixedly sleeved on the two rotating rods 19. A gear 1 21 is fixedly sleeved in the middle of the rotating rod 19. A motor 22 is provided on the inner bottom wall of the glass box 1 and is located between the two grooves. A gear 23 is fixedly sleeved on the driving end of the motor 22. The gear 23 is meshed with the teeth of the two adjacent gears 1 21. Two guide frames 24 are vertically provided on the inner bottom wall of the base 2 and are both located directly below the conveying mechanism. Driven by gear 1 21 and gear 2 23, the frame located in the guide frame 24 is introduced in and out.

[0025] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A double-sided electroplating device for an integrated circuit lead frame, comprising a glass box (1), characterized in that: The bottom end of the glass box (1) is horizontally provided with a base (2) that overlaps with the bottom end of the glass box (1); the inner bottom wall of the glass box (1) is connected to a plating liquid tank (3) and is close to the right end of the glass box (1); the middle of the plating liquid tank (3) is vertically connected to two slide rails (4) that are symmetrically arranged about the center of the plating liquid tank (3); the inner side wall of the plating liquid tank (3) is horizontally connected to two baffles (6) and is close to the right end of the plating liquid tank (3); the inner side wall of the plating liquid tank (3) and the two baffles are connected to each other. An anode plate (5) is slidably inserted between the plates (6); the right end of the plating tank (3) is vertically connected to a power supply box (7); the bottom end of the plating tank (3) is fixedly connected to two horizontally arranged heating plates (8) and respectively located between the two slide rails (4) and the inner side walls of the plating tank (3); the bottom end of the plating tank (3) is vertically connected to a circulation pump (9) and the two ends of the circulation pump (9) are respectively connected to the left and right sides of the two slide rails (4); the plating tank (3) is located inside the base (2); Two support frames (17) are vertically connected to the inner bottom wall of the glass box (1) and are respectively close to the left and right ends of the glass box (1); two support rods (10) arranged parallel to each other are commonly horizontally connected between the two support frames (17); a slide seat (11) is commonly slidably sleeved on the two support rods (10); the bottom end of the slide seat (11) is vertically connected to two electric telescopic rods (12) and is respectively located on the front and rear sides of the two support rods (10); the bottom ends of the two electric telescopic rods (12) are horizontally connected to a right-angle frame (13); a motor (14) is provided at the top end of the right-angle frame (13) and is close to the vertical end of the right-angle frame (13); a fixing clamp (15) is vertically connected to the bottom end of the right-angle frame (13); two rollers (16) are fixedly connected to the top end of the slide seat (11) and are arranged vertically with the support rods (10); a conveying mechanism is commonly provided on the left end of the glass box (1) and the base (2).

2. The integrated circuit lead frame press plate type double-sided electroplating device according to claim 1, characterized in that: The transmission mechanism includes eight corresponding groups of support seats (18). The left ends of the glass box (1) and the base (2) are each provided with two grooves that overlap with each other. The eight groups of support seats (18) are respectively located at the left and right ends of the two grooves and are symmetrically arranged between the four groups of support seats (18) around the single groove. Two rotating rods (19) are connected to each other for common rotation. Four linearly arranged rollers (20) are fixedly sleeved on the two rotating rods (19). A gear (21) is fixedly sleeved on the middle part of the rotating rod (19). A motor (22) is provided on the inner bottom wall of the glass box (1) and is located between the two grooves. A gear (23) is fixedly sleeved on the driving end of the motor (22). The gear (23) is meshed with the teeth of two adjacent gears (21).

3. The integrated circuit lead frame press plate type double-sided electroplating device according to claim 1, characterized in that: Two guide frames (24) are vertically arranged on the inner bottom wall of the base (2) and are both located directly below the conveying mechanism.

4. The integrated circuit lead frame press plate type double-sided electroplating device according to claim 1, characterized in that: A wire is connected between the power supply box (7) and the anode plate (5), and the wire passes through the support frame (17) at the right end and is connected to the slide seat (11) and the motor (14).

5. The integrated circuit lead frame press plate type double-sided electroplating device according to claim 1, characterized in that: The vertical ends of the two right-angle frames (13) are located above their horizontal ends and are both located between the two electric telescopic rods (12).

6. The integrated circuit lead frame press plate type double-sided electroplating device according to claim 2, characterized in that: Two soft diaphragms arranged side by side are arranged in the groove and are located between the glass box (1) and the base (2).

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