Cooling fan with gravity air valve and equipment cooling structure

Abstract

The utility model provides a heat dissipation fan with a gravity air valve and an equipment heat dissipation structure, the heat dissipation fan comprises a fan box shell, an inner cavity of the fan box shell is coaxially provided with at least one fan assembly, and the axis of the fan assembly is the same as that of the fan box shell. An air valve assembly is rotationally arranged on the upper edge of the air outlet of the fan box shell and can cover the air outlet of the fan box shell. According to the cooling fan, negative pressure is formed in the equipment shell, airflow in the equipment shell is quickly guided out, and the cooling effect is greatly improved. In addition, the air valve on the heat dissipation fan can close the air outlet of the equipment shell when the wind power is small or no wind power exists, and the situation that the heat dissipation efficiency is affected due to airflow backflow is avoided. The heat dissipation fan and the equipment heat dissipation structure are high in heat dissipation efficiency, simple in structure, convenient to install, long in equipment heat dissipation service life and low in overall heat dissipation structure cost.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a heat dissipation fan with a gravity air valve and an equipment heat dissipation structure. Background Art

[0002] With the advent of the intelligent era and the increasing electronicization of devices, chips are increasingly being used in production and daily life. From small household appliances to large industrial equipment, chips are indispensable. Chips control the operation of various modules and process information within a device. Chip performance directly affects operational efficiency, and a major factor affecting chip performance is temperature. When a chip operates, it generates a large amount of heat. This heat is difficult to dissipate, causing the chip temperature to rise sharply, which can lead to chip burnout or reduced operating frequency. Therefore, chip heat dissipation is a very important issue.

[0003] Existing chip heat dissipation methods generally include air flow, conduction, and thermal radiation. The air flow method generally achieves heat dissipation by setting a cooling fan at the chip to blow air to the chip. Currently, the fan is generally set directly above the chip to blow air directly to the chip, or to blow air to the heat sink above the chip. However, this layout will cause the airflow reaching the chip to flow upward, colliding with the airflow blowing towards the chip, resulting in turbulent airflow. The airflow after heat exchange with the chip is difficult to discharge or the discharge effect is poor, which greatly reduces the heat dissipation effect and may generate a lot of wind noise.

[0004] To improve cooling, the fan speed is increased by enlarging the heat sink. However, enlarging the heat sink and adding a vapor chamber increases installation complexity, creates shipping issues, introduces EMI (electromagnetic interference), and increases cooling costs. Increasing fan speed increases fan noise, and prolonged high-speed operation shortens the fan's lifespan.

[0005] In addition, the equipment housing also uses a fan to exhaust the airflow inside the housing. Usually, the fan's air inlet or outlet does not have a damper, or it has a louvered damper. Without a damper, there will be insufficient negative pressure inside the housing, and the air will flow back, affecting heat dissipation. When a louvered damper is installed, each damper blade has a certain thickness. Using multiple dampers in combination will reduce the air duct area, thereby affecting the air inlet and outlet efficiency. At the same time, when multiple dampers are installed, multiple longitudinal and lateral gaps are provided for easy opening and closing. When this type of damper is closed, it cannot completely prevent air backflow, resulting in air loss.

[0006] Therefore, those skilled in the art are in urgent need of a heat dissipation structure with good sealing effect, simple structure, high heat dissipation efficiency, low heat dissipation cost, and low noise. Utility Model Content

[0007] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a cooling fan and a device cooling structure with a gravity air valve, so as to solve the problems in the prior art of poor sealing effect, complex structure, low cooling efficiency and high cooling cost of the cooling fan of the device casing.

[0008] The utility model provides a cooling fan with a gravity air valve, which comprises: a fan box shell, at least one fan assembly is coaxially arranged in the inner cavity of the fan box shell, and the axis of the fan assembly is the same as the axis of the fan box shell; an air valve assembly is rotatably arranged on the upper edge of the air outlet of the fan box shell, and the air valve assembly can cover the air outlet of the fan box shell.

[0009] Furthermore, the air valve assembly includes an air valve bracket, which is fixed to the upper edge of the air outlet of the fan box housing and is rotatably connected to the air valve cover via a rotating shaft; a magnetic part for adsorbing the air valve cover is fixedly provided on the outside of the air valve bracket near the air valve cover.

[0010] Furthermore, the fan assembly includes a fan housing, and the inner wall of the fan housing is fixedly provided with a motor bracket for fixing the motor; one end of the rotating shaft of the motor is fixedly connected to the impeller for supplying air.

[0011] Furthermore, a handle is provided on the outer wall of the air outlet of the fan box housing.

[0012] The utility model provides a heat dissipation fan with a gravity air valve, which includes: a fan box shell, at least one fan assembly is coaxially arranged in the inner cavity of the fan box shell, and the axis of the fan assembly is the same as the axis of the fan box shell; an air valve assembly is rotatably arranged in the inner cavity of the fan box shell near the air inlet, and the air valve assembly can block the air inlet of the fan box shell.

[0013] Furthermore, the air valve assembly includes an air valve bracket, which is fixed to the inner cavity wall of the fan box housing near the air inlet, and the upper part of the air valve bracket is rotatably connected to the air valve cover through a rotating shaft; a magnetic part for adsorbing the air valve cover is fixedly provided on the side of the upper part of the air valve bracket away from the air inlet.

[0014] Furthermore, the fan assembly includes a fan housing, and a motor bracket for fixing the motor is fixedly provided on the inner wall of the fan housing; one end of the rotating shaft of the motor is fixedly connected to an impeller for supplying air.

[0015] The utility model provides a device heat dissipation structure, which includes a heat dissipation fan with a gravity air valve, a device shell and a chip heat dissipation box, wherein an air inlet is provided at one end of the device shell, and at least one heat dissipation fan is provided at the other end corresponding to the air inlet, the circuit board is arranged at the bottom inside the device shell, the chip heat dissipation box is arranged inside the device shell, and is fixed on the upper part of the circuit board, and covers the chip on the circuit board for dissipating heat for the chip; the chip heat dissipation box is arranged at an angle, with its air inlet facing the direction of the air inlet, and the air outlet facing the direction of the heat dissipation fan.

[0016] Furthermore, at least one chip heat dissipation box is provided inside the device housing.

[0017] Furthermore, at least two of the device shells are stacked together, the air inlets are located on one side, and the cooling fans are located on the other side.

[0018] According to the above embodiments, the heat dissipation fan with a gravity damper and the heat dissipation structure of the equipment provided by the present invention have at least the following benefits:

[0019] The cooling fan creates a negative pressure inside the device housing, quickly directing the airflow out of the housing, and assisting the chip heat sink in cooling the chip, greatly improving the cooling effect and lowering the internal temperature to achieve the desired cooling effect. Furthermore, the air valve on the cooling fan can close the air outlet of the device housing when there is little or no wind, preventing airflow from flowing back and affecting cooling efficiency. When the air valve is opened to a certain angle, it is attracted by a magnetic component, allowing it to fully open 90 degrees, eliminating wind resistance in the passage. When the cooling fan slows down or stops, the air valve escapes the magnetic component due to the combined effects of gravity and negative pressure, and then partially or completely drops down to seal the air passage.

[0020] In addition, the chip heat sink in the device's heat dissipation structure is tilted relative to the chip, which can facilitate the flow of heat dissipation airflow, avoid airflow accumulation and disorder, improve heat exchange effect, quickly dissipate heat, and reduce wind noise.

[0021] The heat dissipation fan and the heat dissipation structure of the equipment have high heat dissipation efficiency, simple structure, convenient installation, long heat dissipation life of the equipment, and low cost of the overall heat dissipation structure.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and illustrative and are not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following drawings are part of the specification of the present utility model, which illustrate exemplary embodiments of the present utility model. The accompanying drawings and the description of the specification are used to explain the principles of the present utility model.

[0024] Figure 1 This is a structural diagram of the cooling fan with a gravity air valve provided by the utility model in the first embodiment with the air valve cover in the open state.

[0025] Figure 2 This is a structural diagram of the cooling fan with a gravity air valve provided by the utility model in the closed state of the air valve cover of the first embodiment.

[0026] Figure 3 This is a three-dimensional diagram of a first embodiment of a heat dissipation fan with a gravity air valve provided by the present invention.

[0027] Figure 4 This is a structural diagram of the second embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the open state.

[0028] Figure 5 This is a structural diagram of the second embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the closed state.

[0029] Figure 6 This is a structural diagram of the third embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the open state.

[0030] Figure 7 This is a structural diagram of the cooling fan with a gravity air valve provided by the utility model in the third embodiment with the air valve cover in the closed state.

[0031] Figure 8 This is a structural diagram of the fourth embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the open state.

[0032] Figure 9 This is a structural diagram of the fourth embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the closed state.

[0033] Figure 10 This is a three-dimensional diagram of a fourth embodiment of a heat dissipation fan with a gravity air valve provided by the present invention.

[0034] Figure 11 This is a structural diagram of the fifth embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the open state.

[0035] Figure 12 This is a structural diagram of the cooling fan with a gravity air valve according to the fifth embodiment of the present invention, with the air valve cover in a closed state.

[0036] Figure 13This is a structural diagram of the sixth embodiment of the heat dissipation fan with a gravity air valve provided by the present invention, with the air valve cover in the open state.

[0037] Figure 14 This is the structure of the cooling fan with a gravity air valve in the sixth embodiment of the present invention in the closed state of the air valve cover.

[0038] Figure 15 This is a structural diagram of the air valve cover in the open state of the first embodiment of the equipment heat dissipation structure provided by the utility model.

[0039] Figure 16 This is a structural diagram of the air valve cover in the closed state of the first embodiment of the equipment heat dissipation structure provided by the utility model.

[0040] Figure 17 This is a structural diagram of the air valve cover in the open state of the second embodiment of the equipment heat dissipation structure provided by the utility model.

[0041] Figure 18 This is a structural diagram of the air valve cover in the open state of the third embodiment of the equipment heat dissipation structure provided by the utility model.

[0042] Figure 19 This is a structural diagram of the air valve cover in the closed state of the third embodiment of the equipment heat dissipation structure provided by the utility model.

[0043] Figure 20 This is a structural diagram of the fourth embodiment of the equipment heat dissipation structure provided by the utility model in the open state of the air valve cover.

[0044] Figure 21 This is a structural diagram of the air valve cover in the open state of the fifth embodiment of the equipment heat dissipation structure provided by the utility model.

[0045] Figure 22 This is a structural diagram of the air valve cover in the closed state of the fifth embodiment of the equipment heat dissipation structure provided by the utility model.

[0046] Figure 23 The utility model provides a heat dissipation structure of the device embodiment of the sixth air valve cover open state structure diagram.

[0047] Figure 24 This is a structural diagram of the seventh embodiment of the equipment heat dissipation structure provided by the utility model, with the air valve cover in the open state.

[0048] Figure 25 This is a structural diagram of the air valve cover in the closed state of the seventh embodiment of the equipment heat dissipation structure provided by the utility model.

[0049] Figure 26 This is a structural diagram of the air valve cover in the open state of the eighth embodiment of the equipment heat dissipation structure provided by the utility model.

[0050] Description of reference numerals:

[0051] 1- fan box shell, 2- fan assembly, 3- air valve assembly, 4- handle, 5- equipment housing, 6- chip heat sink, 7- circuit board;

[0052] 21-fan housing, 22-motor, 23-motor bracket, 24-impeller;

[0053] 31-air valve bracket, 32-rotating shaft, 33-air valve cover, 34-magnetic part, 35-sealing ring;

[0054] 51-air inlet;

[0055] 71- chip, 72- heat sink. DETAILED DESCRIPTION

[0056] Various exemplary embodiments of the present invention will now be described in detail. This description should not be considered as limiting the present invention, but should be understood as a more detailed description of certain aspects, features, and embodiments of the present invention.

[0057] It will be apparent to those skilled in the art that various modifications and variations may be made to the specific embodiments described herein without departing from the scope or spirit of the present invention. Other embodiments derived from the present invention will be apparent to those skilled in the art. The present description and examples are intended to be illustrative only.

[0058] The utility model provides a heat dissipation fan with a gravity air valve, such as Figure 1-3 The figure shows a schematic structural diagram of the first embodiment of the heat dissipation fan. In a specific embodiment, the heat dissipation fan includes: a fan box housing 1, a fan assembly 2 is coaxially arranged in the inner cavity of the fan box housing 1, and the axis of the fan assembly 2 is the same as the axis of the fan box housing 1. The fan box housing 1 is in the shape of a straight cylinder, with one end being an air inlet and the other end being an air outlet. An air valve assembly 3 is provided on the upper edge of the air outlet of the fan box housing 1, which is located at the upper edge of the air outlet for easy upward rotation, and the opening direction rotates along the direction of air flow. In addition, the air valve assembly 3 can cover the air outlet of the fan box housing 1, and compared with the louver-type air valve, the air valve assembly 3 has good sealing after covering the air outlet, and backflow will not occur.

[0059] In the technical solution of the present invention, the function of the air valve assembly 3 is to limit the flow direction of the air flow and prevent the air flow from flowing back from the air outlet, resulting in poor or turbulent air flow.

[0060] Furthermore, the air valve assembly 3 includes an air valve bracket 31, which is fixed to the upper edge of the air outlet of the fan box housing 1, and the air valve bracket 31 is rotatably connected to the air valve cover 33 through the rotating shaft 32. The opening direction of the air valve cover 33 rotates along the direction of air flow and opens upward.

[0061] In addition, a magnetic member 34 is fixedly mounted on the outside of the damper bracket 31 near the damper cover 33 to attract the damper cover 33. The magnetic member 34 provides a certain attraction to the damper cover 33 when the damper cover 33 is rotated to a certain angle, assisting in its opening. When the damper cover 33 is completely attracted by the magnetic member 34, the damper cover 33 opens to a 90° angle, eliminating resistance to the airflow path. Preferably, the magnetic member 34 is an electromagnet or a permanent magnet. If the magnetic member 34 is a permanent magnet, when the wind decreases or disappears, the damper cover 33 can rely on gravity to break free from the magnetic force and airflow resistance and rotate downward. If the magnetic member 34 is an electromagnet, when the wind decreases or disappears, the damper cover 33 can rely on gravity to break free from the magnetic force and airflow resistance and rotate downward. The electromagnet can control the magnitude of its magnetic force, thereby controlling the closing of the damper cover 33. After the power is completely cut off, the damper cover is only affected by the resistance of the airflow, and then falls back by overcoming the resistance through gravity.

[0062] Furthermore, the fan assembly 2 includes a fan housing 21 , and a motor bracket 23 for fixing the motor 22 is fixedly provided on the inner wall of the fan housing 21 .

[0063] One end of the rotating shaft of the motor 22 is fixedly connected to an impeller 24 for supplying air.

[0064] Furthermore, a handle 4 is provided on the outer wall of the air outlet of the fan box housing 1 to facilitate installation, disassembly, movement and transportation of the cooling fan.

[0065] like Figure 4 and 5 The figure shows the structure diagram of the second embodiment of the heat dissipation fan with gravity air valve provided by the present invention. Figure 1 The difference between the illustrated embodiment and the embodiment is that, in this embodiment, two fan assemblies 2 are provided in the fan box housing 1. The two fan assemblies 2 are coaxially arranged and have the same airflow direction, so as to improve the airflow delivery efficiency.

[0066] like Figure 6 and 7 The figure shows the structure of the third embodiment of the heat dissipation fan with gravity air valve provided by the present invention. Figure 4 The difference between the illustrated embodiment and the embodiment is that, in this embodiment, two fan assemblies 2 are provided in the fan box housing 1. The two fan assemblies 2 are coaxially arranged, but the axial widths of the two fan assemblies 2 are different to accommodate different installation requirements.

[0067] The utility model provides a heat dissipation fan with a gravity air valve, such as Figure 8-10 The figure shows a schematic diagram of the structure of the fourth embodiment of the heat dissipation fan. In a specific embodiment, the heat dissipation fan includes: a fan box housing 1, a fan assembly 2 is coaxially arranged in the inner cavity of the fan box housing 1, and the axis of the fan assembly 2 is the same as the axis of the fan box housing 1. The fan box housing 1 is a straight cylinder, one end is an air inlet, and the other end is an air outlet. The inner cavity of the fan box housing 1 is rotatably provided with an air valve assembly 3 near the air inlet, and the air valve assembly 3 can block the air inlet of the fan box housing 1. Compared with the louver-type air valve, the air valve assembly 3 can completely cover the air outlet, and has good sealing performance, and there will be no backflow.

[0068] In the technical solution of the present invention, the function of the air valve assembly 3 is to limit the flow direction of the air flow and prevent the air flow from flowing back from the air outlet, resulting in poor or turbulent air flow.

[0069] Furthermore, the air valve assembly 3 includes an air valve bracket 31, which is fixed to the inner cavity wall of the fan box housing 1 near the air inlet, and the upper part of the air valve bracket 31 is rotatably connected to the air valve cover 33 through the rotating shaft 32. The opening direction of the air valve cover 33 rotates along the direction of air flow and opens upward.

[0070] In addition, a magnetic member 34 is fixedly mounted on the upper side of the damper bracket 31, away from the air inlet, to attract the damper cover 33. The magnetic member 34 provides a certain attraction to the damper cover 33 when the damper cover 33 is rotated to a certain angle, assisting in its opening. When the damper cover 33 is completely attracted by the magnetic member 34, the damper cover 33 opens at a 90° angle, eliminating resistance to the airflow path. Preferably, the magnetic member 34 is an electromagnet or a permanent magnet. If the magnetic member 34 is a permanent magnet, when the wind force decreases or disappears, the damper cover 33 can rely on gravity to break free from the magnetic force and airflow resistance and rotate downward. If the magnetic member 34 is an electromagnet, when the wind force decreases or disappears, the damper cover 33 can rely on gravity to break free from the magnetic force and airflow resistance and rotate downward. The electromagnet can control the magnitude of its magnetic force, thereby controlling the closing of the damper cover 33. After the power is completely cut off, the damper cover is only affected by the resistance of the airflow, and then falls back by overcoming the resistance through gravity.

[0071] The air valve assembly 3 further includes a sealing ring 35 , which is disposed on the inner wall of the fan box housing 1 on the air inlet side of the air valve bracket 31 and is used to contact the air valve cover 33 to seal the inner cavity channel of the fan box housing 1 .

[0072] Furthermore, the fan assembly 2 includes a fan housing 21 , and a motor bracket 23 for fixing the motor 22 is fixedly provided on the inner wall of the fan housing 21 .

[0073] One end of the rotating shaft of the motor 22 is fixedly connected to an impeller 24 for supplying air.

[0074] Furthermore, a handle 4 is provided on the outer wall of the air outlet of the fan box housing 1 to facilitate installation, disassembly, movement and transportation of the cooling fan.

[0075] like Figure 11 and 12 The figure shows the structure diagram of the fifth embodiment of the heat dissipation fan with gravity air valve provided by the present invention. Figure 8 The difference between the illustrated embodiment and the embodiment is that, in this embodiment, two fan assemblies 2 are provided in the fan box housing 1. The two fan assemblies 2 are coaxially arranged and have the same airflow direction, so as to improve the airflow delivery efficiency.

[0076] like Figure 13 and 14 The figure shows the structure diagram of the sixth embodiment of the heat dissipation fan with gravity air valve provided by the present invention. Figure 11 The difference between the illustrated embodiment and the embodiment is that, in this embodiment, two fan assemblies 2 are provided in the fan box housing 1. The two fan assemblies 2 are coaxially arranged, but the axial widths of the two fan assemblies 2 are different to accommodate different installation requirements.

[0077] The utility model provides a device heat dissipation structure, such as Figure 15 and 16 The figure shows a schematic diagram of the first embodiment of the device's heat dissipation structure. In a specific embodiment, the heat dissipation structure includes the aforementioned cooling fan, a device housing 5, and a chip heat dissipation box 6. The device housing 5 has an air inlet 51 at one end, and at least one cooling fan is located at the other end of the corresponding air inlet 51. A circuit board 7 is located at the bottom of the device housing 5. The chip heat dissipation box 6 is located inside the device housing 5 and fixed to the top of the circuit board 7. It covers the chip 71 on the circuit board 7 and is used to dissipate heat from the chip 71.

[0078] In this embodiment, the device housing 5 is arranged horizontally.

[0079] In this embodiment, the chip heat sink box 6 is tilted, with its air inlet facing the direction of the air inlet hole 51 and its air outlet facing the direction of the cooling fan. The tilted chip heat sink box 6 can accelerate the speed of the airflow flowing inside the device housing 5, avoid airflow turbulence, and enable the airflow to flow in a single direction. That is, after the airflow enters the device housing 5 from the air inlet hole 51, a portion of the airflow will be sucked into the chip heat sink box 6 from its air inlet and blown out from the air outlet of the chip heat sink box 6, and then flow toward the cooling fan at the other end of the device housing 5, and further be extracted from the inside of the device housing 5 by the cooling fan, thereby achieving heat dissipation for the chip 71. The arrows in the figure indicate the direction of airflow.

[0080] Furthermore, the cooling fan includes a fan box housing 1, and a fan assembly 2 is coaxially arranged in the inner cavity of the fan box housing 1, and the axis of the fan assembly 2 is the same as the axis of the fan box housing 1. The fan box housing 1 is in the shape of a straight cylinder, with one end being an air inlet and the other end being an air outlet. An air valve assembly 3 is rotatably arranged on the upper edge of the air outlet of the fan box housing 1, and is located at the upper edge of the air outlet for easy upward rotation, and the opening direction rotates along the direction of air flow. In addition, the air valve assembly 3 can cover the air outlet of the fan box housing 1, and compared with the louver-type air valve, the air valve assembly 3 has good sealing after covering the air outlet, and backflow will not occur.

[0081] In the technical solution of the present invention, the function of the air valve assembly 3 is to limit the flow direction of the air flow and prevent the air flow from flowing back from the air outlet, resulting in poor or turbulent air flow.

[0082] Furthermore, the air valve assembly 3 includes an air valve bracket 31, which is fixed to the upper edge of the air outlet of the fan box housing 1, and the air valve bracket 31 is rotatably connected to the air valve cover 33 through the rotating shaft 32. The opening direction of the air valve cover 33 rotates along the direction of air flow and opens upward.

[0083] In addition, a magnetic member 34 is fixedly mounted on the outside of the damper bracket 31 near the damper cover 33 to attract the damper cover 33. The magnetic member 34 provides a certain attraction to the damper cover 33 when the damper cover 33 is rotated to a certain angle, assisting in its opening. When the damper cover 33 is completely attracted by the magnetic member 34, the damper cover 33 opens to a 90° angle, eliminating resistance to the airflow path. Preferably, the magnetic member 34 is an electromagnet or a permanent magnet. If the magnetic member 34 is a permanent magnet, when the wind decreases or disappears, the damper cover 33 can rely on gravity to break free from the magnetic force and airflow resistance and rotate downward. If the magnetic member 34 is an electromagnet, when the wind decreases or disappears, the damper cover 33 can rely on gravity to break free from the magnetic force and airflow resistance and rotate downward. The electromagnet can control the magnitude of its magnetic force, thereby controlling the closing of the damper cover 33. After the power is completely cut off, the damper cover is only affected by the resistance of the airflow, and then falls back by overcoming the resistance through gravity.

[0084] Furthermore, a handle 4 is provided on the outer wall of the air outlet of the fan box housing 1 to facilitate installation, disassembly, movement and transportation of the cooling fan.

[0085] like Figure 17 The figure shows the structure diagram of the second embodiment of the heat dissipation structure of the device provided by the utility model. In the specific implementation mode, this embodiment is Figure 15The difference in the illustrated embodiment is that at least two device housings 5 ​​are stacked, with the air inlet 51 located on one side and the cooling fans located on the other. In this embodiment, three device housings 5 ​​are stacked horizontally, and each device housing 5 is equipped with a cooling fan, a chip heat sink 6, and a circuit board 7 to dissipate heat from the chip.

[0086] like Figure 18 and 19 The figure shows the structure diagram of the third embodiment of the heat dissipation structure of the device provided by the present utility model. In the specific implementation mode, this embodiment is Figure 15 The difference of the illustrated embodiment is that, in this embodiment, the device housing 5 is arranged vertically, and the air valve cover 33 at the air outlet of the cooling fan is still opened upward along the air flow direction.

[0087] like Figure 20 The figure shows the structure diagram of the fourth embodiment of the heat dissipation structure of the device provided by the utility model. In the specific implementation mode, this embodiment is Figure 18 The difference in the illustrated embodiment is that at least two device housings 5 ​​are stacked, with the air inlet 51 located on one side and the cooling fans located on the other. In this embodiment, three device housings 5 ​​are stacked vertically, and each device housing 5 is equipped with a cooling fan, a chip heat sink 6, and a circuit board 7 to dissipate heat from the chip.

[0088] like Figure 21 and 22 The figure shows the structure diagram of the fifth embodiment of the heat dissipation structure of the device provided by the utility model. In the specific implementation mode, this embodiment is Figure 15 The difference of the embodiment shown is that at least one chip heat sink 6 is provided inside the device housing 5. In this embodiment, two chip heat sinks 6 are provided on the circuit board 7 inside the device housing 5 corresponding to the chip 71 for dissipating heat for the chip 71.

[0089] like Figure 23 The figure shows the structure diagram of the sixth embodiment of the heat dissipation structure of the device provided by the present utility model. In the specific implementation mode, this embodiment is Figure 21 The difference in the illustrated embodiment is that at least two device housings 5 ​​are stacked, with the air inlet 51 located on one side and the cooling fans located on the other. In this embodiment, three device housings 5 ​​are stacked horizontally, and each device housing 5 is equipped with a cooling fan, a chip heat sink 6, and a circuit board 7 to dissipate heat from the chip.

[0090] like Figure 24 and 25 The figure shows the structure diagram of the seventh embodiment of the heat dissipation structure of the device provided by the utility model. In the specific implementation mode, this embodiment is Figure 21The difference of the embodiment shown is that a heat sink 72 is further provided on the chip 71 to accelerate heat conduction and quickly dissipate heat for the chip 71. Preferably, the heat sink is a water-cooled heat sink or a metal heat sink or a metal heat sink.

[0091] like Figure 24 The figure shows the structure diagram of the eighth embodiment of the heat dissipation structure of the device provided by the utility model. In the specific implementation mode, this embodiment is Figure 24 The difference in the illustrated embodiment is that at least two device housings 5 ​​are stacked, with the air inlet 51 located on one side and the cooling fans located on the other. In this embodiment, three device housings 5 ​​are stacked horizontally, and each device housing 5 is equipped with a cooling fan, a chip heat sink 6, and a circuit board 7 to dissipate heat from the chip.

[0092] The above description is only an illustrative embodiment of the present invention. Without departing from the concept and principle of the present invention, any equivalent changes and modifications made by those skilled in the art should fall within the scope of protection of the present invention.

Claims

1. A cooling fan with a gravity damper, characterized in that: The heat dissipation fan comprises: a fan box housing (1); at least one fan assembly (2) is coaxially arranged in the inner cavity of the fan box housing (1); and the axis of the fan assembly (2) is the same as the axis of the fan box housing (1); An air valve assembly (3) is rotatably provided on the upper edge of the air outlet of the fan box housing (1), and the air valve assembly (3) is capable of covering the air outlet of the fan box housing (1).

2. The heat dissipation fan with a gravity damper according to claim 1, characterized in that: The air valve assembly (3) includes an air valve bracket (31), the air valve bracket (31) is fixed to the upper edge of the air outlet of the fan box housing (1), and the air valve bracket (31) is rotatably connected to the air valve cover (33) via a rotating shaft (32); A magnetic component (34) for adsorbing the air valve cover (33) is fixedly provided on the outside of the air valve bracket (31) near the air valve cover (33).

3. The heat dissipation fan with a gravity damper according to claim 1, characterized in that: The fan assembly (2) comprises a fan housing (21), and a motor bracket (23) for fixing a motor (22) is fixedly provided on the inner wall of the fan housing (21); One end of the rotating shaft of the motor (22) is fixedly connected to an impeller (24) for supplying air.

4. The heat dissipation fan with a gravity damper according to claim 1, characterized in that: A handle (4) is provided on the outer wall of the air outlet of the fan box housing (1).

5. A cooling fan with a gravity damper, characterized in that: The heat dissipation fan comprises: a fan box housing (1); at least one fan assembly (2) is coaxially arranged in the inner cavity of the fan box housing (1); and the axis of the fan assembly (2) is the same as the axis of the fan box housing (1); An air valve assembly (3) is rotatably provided in the inner cavity of the fan box housing (1) near the air inlet, and the air valve assembly (3) is capable of blocking the air inlet of the fan box housing (1).

6. The heat dissipation fan with a gravity damper according to claim 5, characterized in that: The air valve assembly (3) includes an air valve bracket (31), the air valve bracket (31) is fixed to the inner cavity wall of the fan box housing (1) near the air inlet, and the upper part of the air valve bracket (31) is rotatably connected to the air valve cover (33) via a rotating shaft (32); A magnetic component (34) for adsorbing the air valve cover (33) is fixedly provided on a side of the upper portion of the air valve bracket (31) away from the air inlet.

7. The heat dissipation fan with a gravity damper according to claim 5, characterized in that: The fan assembly (2) comprises a fan housing (21), and a motor bracket (23) for fixing a motor (22) is fixedly provided on the inner wall of the fan housing (21); One end of the rotating shaft of the motor (22) is fixedly connected to an impeller (24) for supplying air.

8. A device heat dissipation structure, characterized in that: The heat dissipation structure comprises a heat dissipation fan with a gravity air valve as claimed in any one of claims 1 to 7, a device housing (5) and a chip heat dissipation box (6), wherein: An air inlet (51) is provided at one end of the device housing (5), and at least one cooling fan is provided at the other end corresponding to the air inlet (51). The circuit board (7) is provided at the bottom of the interior of the device housing (5). The chip heat dissipation box (6) is provided inside the device housing (5) and fixed on the upper part of the circuit board (7), and covers the chip (71) on the circuit board (7) for dissipating heat for the chip (71). The chip heat dissipation box (6) is tilted, with its air inlet facing the direction of the air inlet hole (51), and the air outlet facing the direction of the heat dissipation fan.

9. The device heat dissipation structure according to claim 8, characterized in that: At least one chip heat dissipation box (6) is provided inside the device housing (5).

10. The device heat dissipation structure according to claim 8, characterized in that: At least two of the device housings (5) are stacked together, the air inlet holes (51) are located on one side, and the cooling fans are located on the other side.

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