Rivet assembly and multilayer circuit board device

Abstract

The utility model provides a rivet assembly and a multilayer circuit board device. The rivet assembly penetrates through a first penetrating hole in the first circuit board and a second penetrating hole in the second circuit board, the rivet assembly comprises a rivet sleeve piece and a rivet piece, one end of the rivet piece abuts against one end of the first circuit board, and the other end of the rivet piece penetrates through the first penetrating hole and is detachably connected with the rivet sleeve piece. The rivet sleeve piece comprises a separating piece and a penetrating piece, one end of the separating piece is fixedly connected with one end of the penetrating piece, the other end of the penetrating piece is arranged in the second penetrating hole in a penetrating mode, and when the rivet piece is connected with the rivet sleeve piece, the two ends of the separating piece abut against the first circuit board and the second circuit board respectively. According to the rivet assembly, the first circuit board and the second circuit board are arranged, so that an isolation space exists between the first circuit board and the second circuit board, signal blocking of any circuit board caused by direct contact between the circuit boards can be effectively avoided, the usability of the circuit boards is effectively ensured, and the practicability of the rivet assembly is effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the field of wireless communication equipment, and in particular to a press-fit fixation method for a multi-layer circuit board. Background Art

[0002] With the rapid development of the electronics industry, multilayer PCBs are gaining widespread adoption due to their improved performance, lower power consumption, and higher integration. Multilayer PCBs integrate numerous electronic components and complex circuit layouts, requiring extremely precise connections between these components and circuits. If the PCBs are not properly secured, vibration, impact, and other factors can cause them to deform or loosen during operation, compromising circuit stability and reliability.

[0003] To this end, Chinese patent number CN217603105U proposes a rivet for press-fitting multi-layer circuit boards. The rivet is installed in a rivet hole on the multi-layer circuit board. The rivet comprises a flat head larger than the rivet hole diameter, and a sleeve extending perpendicularly from the flat head. The sleeve is a hollow cylindrical structure. The sleeve has multiple elongated grooves disposed perpendicular to the flat head. The elongated grooves are spaced apart along the circumference of the sleeve, and the depth of the elongated grooves is less than the height of the sleeve.

[0004] Although the long grooves used in the rivets will not tear and produce rivet chips when pressed together, in the field of wireless communication equipment, because the circuit boards contain communication electronic components such as antennas, and the penetrating part of the rivet in the above patent is a single cylinder, when the multi-layer circuit boards are locked in series, direct contact between the circuit boards will occur, resulting in unnecessary electromagnetic coupling between the multi-layer circuit boards, which will cause signal interference between the circuit boards, thereby adversely affecting other circuits on the circuit boards. Utility Model Content

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide a rivet assembly capable of providing an isolation space between multi-layer circuit boards.

[0006] The purpose of this disclosure is achieved through the following technical solutions:

[0007] A rivet assembly is provided, which is respectively provided through a first penetration hole on a first circuit board and a second penetration hole on a second circuit board, the rivet assembly comprising:

[0008] A nail kit, the nail kit comprising a separator and a penetration member, one end of the separator being fixedly connected to one end of the penetration member, and the other end of the penetration member being penetrated through the second penetration hole;

[0009] a rivet, one end of which abuts against one end of the first circuit board, and the other end of which penetrates the first penetration hole and is detachably connected to the nail kit;

[0010] One end of the separator abuts against the second circuit board, and the other end of the separator abuts against the other end of the first circuit board, so that there is a distance between the first circuit board and the second circuit board.

[0011] In one embodiment, the partition is provided with a first mounting hole, and the penetration member is provided with a second mounting hole communicating with the first mounting hole;

[0012] The other end of the rivet is sequentially penetrated through the first penetration hole, the first mounting hole and the second mounting hole.

[0013] In one embodiment, the outer diameter of the separator is larger than the inner diameter of the first through hole and the inner diameter of the second through hole.

[0014] In one embodiment, the height of the separator is 0.5 mm to 4 mm.

[0015] In one embodiment, the rivet component includes a nail head component and a nail post component;

[0016] One end of the nail head piece is fixedly connected to one end of the nail column piece, the nail head piece abuts against the first circuit board, the overlapping area of ​​the nail head piece and the first circuit board covers the first penetration hole, and the other end of the nail column piece is sequentially penetrated through the first penetration hole, the first mounting hole and the second mounting hole.

[0017] In one embodiment, the nail kit and the rivet component are both integrally formed structures.

[0018] In one embodiment, the nail kit is a plastic nail sleeve, and the rivet piece is a plastic rivet.

[0019] In one embodiment, the first through hole, the first mounting hole, and the second mounting hole have the same diameter.

[0020] In one embodiment, the penetration member is provided with a plurality of penetration portions arranged at intervals, and the plurality of penetration portions collectively form the second mounting hole;

[0021] A plurality of spacing grooves are formed on the peripheral wall of the penetration member, and each of the spacing grooves extends to the end of the penetration member away from the partition member.

[0022] A multi-layer circuit board device includes a first circuit board, a second circuit board, and a plurality of rivet assemblies described in any one of the above embodiments.

[0023] The first circuit board begins to have the first through-hole, and the second circuit board begins to have the second through-hole. The other end of the rivet is penetrated through the first through-hole and is detachably connected to the nail kit. The other end of the through-hole is penetrated through the second through-hole. One end of the separator abuts against the second circuit board, and the other end of the separator abuts against the other end of the first circuit board, so that there is a distance between the first circuit board and the second circuit board.

[0024] Compared with the prior art, the present disclosure has at least the following advantages:

[0025] 1. A rivet assembly is provided to penetrate the first penetration hole of the first circuit board and the second penetration hole of the second circuit board respectively. The rivet assembly includes a nail kit and a rivet member. The nail kit includes a fixedly connected separator and a penetration member. The penetration member is penetrated by the second circuit board. Because the rivet member is penetrated by the first circuit board and is detachably connected to the nail kit, the first circuit board and the second circuit board can be effectively locked in series by providing the rivet assembly, thereby effectively improving the structural stability between the first circuit board and the second circuit board.

[0026] 2. After the rivet assembly locks the first circuit board and the second circuit board in series, the two ends of the separator in the nail assembly respectively abut against the first circuit board and the second circuit board. Due to the certain height of the separator, an isolation space is created between the first circuit board and the second circuit board. This can effectively prevent direct contact between the first circuit board and the second circuit board, which may cause signal obstruction of either circuit board, thereby effectively ensuring the availability of the first circuit board and the second circuit board, and effectively improving the practicality of the rivet assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 A schematic structural diagram of a multilayer circuit board device in one embodiment;

[0029] Figure 2 for Figure 1 A schematic structural diagram of the multi-layer circuit board device from another perspective;

[0030] Figure 3 for Figure 2 An enlarged schematic diagram of point A is shown;

[0031] Figure 4 for Figure 1 Schematic diagram of the exploded structure of the multi-layer circuit board device shown;

[0032] Figure 5 for Figure 1 A partially enlarged schematic diagram of a rivet assembly in the multi-layer circuit board device shown;

[0033] Figure 6 for Figure 5 Schematic diagram of the exploded structure of the rivet assembly shown. DETAILED DESCRIPTION

[0034] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. The terms used herein in the specification of this disclosure are intended only to describe specific embodiments and are not intended to limit this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] See also Figures 1 to 6 In order to better understand the rivet assembly 10 of the present disclosure, the rivet assembly 10 is further explained below:

[0038] A rivet assembly 10 of one embodiment is respectively penetrated through a first penetration hole 301 on a first circuit board 300 and a second penetration hole 401 on a second circuit board 400. The rivet assembly 10 includes a nail kit 100 and a rivet member 200. The nail kit 100 includes a separator 110 and a penetration member 120. One end of the separator 110 is fixedly connected to one end of the penetration member 120, and the other end of the penetration member 120 is penetrated through the second penetration hole 401. One end of the rivet member 200 abuts against one end of the first circuit board 300, and the other end of the rivet member 200 is penetrated through the first penetration hole 301 and is detachably connected to the nail kit 100. When the rivet member 200 is connected to the nail kit 100, one end of the separator 110 abuts against the second circuit board 400, and the other end of the separator 110 abuts against the other end of the first circuit board 300.

[0039] In this embodiment, a rivet assembly 10 is provided to penetrate the first penetration hole 301 on the first circuit board 300 and the second penetration hole 401 on the second circuit board 400, respectively. The rivet assembly 10 includes a nail kit 100 and a rivet member 200. The nail kit 100 includes a fixedly connected partition 110 and a penetration member 120, wherein the penetration member 120 is penetrated by the second circuit board 400. Because the rivet member 200 is penetrated by the first circuit board 300 and is detachably connected to the nail kit 100, the first circuit board 300 and the second circuit board 400 can be effectively locked in series by providing the rivet assembly 10.

[0040] Furthermore, after the rivet assembly 10 locks the first circuit board 300 and the second circuit board 400 in series, the two ends of the separator 110 in the nail kit 100 respectively abut against the first circuit board 300 and the second circuit board 400. Since the separator 110 has a certain height, an isolation space exists between the first circuit board 300 and the second circuit board 400. This can effectively avoid direct contact between the first circuit board 300 and the second circuit board 400, which may cause the signal of either circuit board to be blocked, thereby effectively ensuring the availability of the first circuit board 300 and the second circuit board 400, thereby effectively improving the practicality of the rivet assembly 10.

[0041] It should be noted that since the nail kit 100 and the rivet member 200 in the rivet assembly 10 are detachably connected, it is only necessary to penetrate the nail kit 200 into the second penetration hole 401 on the second circuit board 400, then place the first circuit board 300 on the nail kit 200, and finally insert the rivet member 100 to complete the separation and fixation of the first circuit board 300 and the second circuit board 400. This can effectively improve the production efficiency of the rivet assembly 10 and the multi-layer circuit board device 20.

[0042] like Figure 6As shown, in one embodiment, the separator 110 is provided with a first mounting hole 1101, the penetration member 120 is provided with a second mounting hole 1201 communicating with the first mounting hole 1101, and the other end of the rivet member 200 is sequentially penetrated through the first penetration hole 301, the first mounting hole 1101, and the second mounting hole 1201. It can be understood that by providing the first mounting hole 1101 in the separator 110, the penetration member 120 is provided with a second mounting hole 1201 communicating with the first mounting hole 1101, and the other end of the rivet member 200 is sequentially penetrated through the first penetration hole 301, the first mounting hole 1101, and the second mounting hole 1201, the rivet member 200 can be detachably connected to the nail kit 100, and the penetration member 120 is penetrated through the second circuit board 400. Therefore, by providing the rivet assembly 10, the first circuit board 300 and the second circuit board 400 can be effectively locked in series, thereby effectively improving the structural stability of the multi-layer circuit board device 20.

[0043] like Figure 2 and Figure 3 As shown, in one embodiment, the outer diameter of the separator 110 is larger than the inner diameter of the first through hole 301 and the inner diameter of the second through hole 401. It is understood that by setting the outer diameter of the separator 110 larger than the inner diameter of the first through hole 301 and the inner diameter of the second through hole 401, the two ends of the separator 110 can effectively abut against the first circuit board 300 and the second circuit board 400, respectively, thereby creating an isolation space between the first circuit board 300 and the second circuit board 400. This effectively prevents direct contact between the first circuit board 300 and the second circuit board 400, which could block the signal on either circuit board, thereby effectively ensuring the availability of the first circuit board 300 and the second circuit board 400.

[0044] like Figure 4 、 Figure 5 and Figure 6 As shown, in one embodiment, the height of the separator 110 is 0.5 mm to 4 mm. It is understood that the height of the separator 110 is 0.5 mm to 4 mm, which can effectively isolate the first circuit board 300 and the second circuit board 400, avoiding unnecessary electromagnetic coupling between the circuit boards and adversely affecting other circuits on the circuit boards, thereby effectively ensuring the normal operation of the circuit boards and effectively improving the operating stability of the multi-layer circuit board device 20.

[0045] like Figure 5 and Figure 6As shown, in one embodiment, the rivet component 200 includes a nail head component 210 and a nail column component 220, one end of the nail head component 210 is fixedly connected to one end of the nail column component 220, the nail head component 210 abuts against the first circuit board 300, and the overlapping area between the nail head component 210 and the first circuit board 300 covers the first penetration hole 301, and the other end of the nail column component 220 is sequentially penetrated through the first penetration hole 301, the first mounting hole 1101 and the second mounting hole 1201. It can be understood that the overlapping area of ​​the nail head member 210 and the first circuit board 300 covers the first penetration hole 301, and the nail head member 210 is fixedly connected to the nail column member 220. When the nail column member 220 is sequentially penetrated through the first penetration hole 301, the first mounting hole 1101 and the second mounting hole 1201, the nail head member 210 can effectively abut against the first circuit board 300, so that the first circuit board 300 and the second circuit board 400 can be effectively locked in series through the interference fit of the rivet member 200 and the nail kit 100, thereby effectively improving the structural stability between the first circuit board 300 and the second circuit board 400.

[0046] like Figure 3 and Figure 6 As shown, in one embodiment, the nail kit 100 and the rivet member 200 are both integrally formed. It is understood that the integrally formed structure provides both the nail kit 100 and the rivet member 200 with good structural stability, thereby better locking and securing the multi-layer circuit board and preventing the structure of the multi-layer circuit board from shaking, thereby effectively improving the structural stability of the multi-layer circuit board.

[0047] like Figure 3 and Figure 6 As shown, in one embodiment, the nail kit 100 is a plastic nail sleeve, and the rivet member 200 is a plastic rivet. It will be appreciated that the nail kit 100 being a plastic nail sleeve and the rivet member 200 being a plastic rivet can prevent the first circuit board 300 and the second circuit board 400 from being electrically connected via the nail kit 100 and the rivet member 200, thereby ensuring that the first circuit board 300 and the second circuit board 400 do not interfere with each other. Furthermore, the plastic rivet and the plastic nail sleeve have high flexibility and elasticity, enabling the nail kit 100 and the rivet member 200 to effectively form an interference fit, thereby effectively improving the overall structural stability of the rivet assembly 10.

[0048] like Figure 1 and Figure 3As shown, in one embodiment, the first through-hole 301, the first mounting hole 1101, and the second mounting hole 1201 have equal diameters. It is understood that the equal diameters of the first through-hole 301, the first mounting hole 1101, and the second mounting hole 1201 can save on the drilling process for the nail kit 100, thereby effectively improving the manufacturing efficiency of the nail kit 100. Furthermore, the equal diameters ensure a precise fit between the rivet component 200 and the first through-hole 301, the first mounting hole 1101, and the second mounting hole 1201, thereby effectively avoiding gaps or looseness caused by mismatched diameters, thereby effectively improving the connection stability between the rivet assembly 10 and the first circuit board 300 and the second circuit board 400.

[0049] like Figure 6 As shown, in one embodiment, the penetration member 120 includes a plurality of penetration portions 1210, each of which is equidistantly spaced apart, and each of the penetration portions 1210 together forms a second mounting hole 1201. It should be noted that the penetration member 120 is penetrated in the second penetration hole 401 and the penetration member 120 and the second penetration hole 401 are interference fit. It is understandable that by providing the penetration member 120 with a plurality of penetration portions 1210, and each of which is equidistantly spaced apart, the penetration member 120 can be more easily penetrated in the second penetration hole 401 and interference fit therewith, thereby effectively improving the assembly efficiency of the rivet assembly 10 and the multi-layer circuit board device 20.

[0050] Furthermore, the peripheral wall of the penetration member 120 is formed with a plurality of spacing grooves 1202, each of which extends to the end of the penetration member 120 away from the separator 110. After secure assembly, the end of the penetration member 120 away from the separator 110 is squeezed and bent outward by the rivet member 200, forming an umbrella-shaped anti-slip structure on the penetration member 120, ensuring a secure installation and fixation between the rivet assembly 100 and the second circuit board 400. This effectively improves the connection stability between the rivet assembly 10 and the first circuit board 300 and the second circuit board 400.

[0051] See also Figures 1 to 6 The present disclosure further provides a multi-layer circuit board device 20, comprising a first circuit board 300, a second circuit board 400, and several rivet assemblies 10 in any of the above embodiments. The first circuit board 300 begins with a first penetration hole 301, and the second circuit board 400 begins with a second penetration hole 401. The other end of the rivet member 200 is penetrated through the first penetration hole 301 and is detachably connected to the rivet kit 100. The other end of the penetration member 120 is penetrated through the second penetration hole 401. One end of the separator 110 abuts against the second circuit board 400, and the other end of the separator 110 abuts against the other end of the first circuit board 300, so that there is a distance between the first circuit board 300 and the second circuit board 400.

[0052] In this example, a rivet assembly 10 is provided to penetrate the first penetration hole 301 on the first circuit board 300 and the second penetration hole 401 on the second circuit board 400, respectively. The rivet assembly 10 includes a nail kit 100 and a rivet member 200. The nail kit 100 includes a fixedly connected partition 110 and a penetration member 120, wherein the penetration member 120 is penetrated by the second circuit board 400. Because the rivet member 200 is penetrated by the first circuit board 300 and is detachably connected to the nail kit 100, the first circuit board 300 and the second circuit board 400 can be effectively locked in series by providing the rivet assembly 10, thereby effectively improving the structural stability of the multi-layer circuit board device 20.

[0053] Furthermore, after the rivet assembly 10 locks the first circuit board 300 and the second circuit board 400 in series, the two ends of the separator 110 in the nail kit 100 respectively abut against the first circuit board 300 and the second circuit board 400. Since the separator 110 has a certain height, an isolation space exists between the first circuit board 300 and the second circuit board 400. This can effectively avoid direct contact between the first circuit board 300 and the second circuit board 400, which may cause the signal of any circuit board to be blocked, thereby effectively ensuring the availability of the first circuit board 300 and the second circuit board 400, and thus effectively improving the practicality of the multi-layer circuit board device 20.

[0054] Compared with the prior art, the present invention has at least the following advantages:

[0055] 1. A rivet assembly is provided to penetrate the first penetration hole of the first circuit board and the second penetration hole of the second circuit board respectively. The rivet assembly includes a nail kit and a rivet member. The nail kit includes a fixedly connected separator and a penetration member. The penetration member is penetrated by the second circuit board. Because the rivet member is penetrated by the first circuit board and is detachably connected to the nail kit, the first circuit board and the second circuit board can be effectively locked in series by providing the rivet assembly, thereby effectively improving the structural stability between the first circuit board and the second circuit board.

[0056] 2. After the rivet assembly locks the first circuit board and the second circuit board in series, the two ends of the separator in the nail assembly respectively abut against the first circuit board and the second circuit board. Due to the certain height of the separator, an isolation space is created between the first circuit board and the second circuit board. This can effectively prevent direct contact between the first circuit board and the second circuit board, which may cause signal obstruction of either circuit board, thereby effectively ensuring the availability of the first circuit board and the second circuit board, and effectively improving the practicality of the rivet assembly.

[0057] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosed patent shall be determined by the appended claims.

Claims

1. A rivet assembly, respectively penetrated through a first penetration hole in a first circuit board and a second penetration hole in a second circuit board, characterized in that: The rivet assembly comprises: A nail kit, the nail kit comprising a separator and a penetration member, one end of the separator being fixedly connected to one end of the penetration member, and the other end of the penetration member being penetrated through the second penetration hole; a rivet, one end of which abuts against one end of the first circuit board, and the other end of which penetrates the first penetration hole and is detachably connected to the nail kit; One end of the separator abuts against the second circuit board, and the other end of the separator abuts against the other end of the first circuit board, so that there is a distance between the first circuit board and the second circuit board.

2. The rivet assembly according to claim 1, wherein: The partition is provided with a first mounting hole, and the penetration member is provided with a second mounting hole connected to the first mounting hole; The other end of the rivet is sequentially penetrated through the first penetration hole, the first mounting hole and the second mounting hole.

3. The rivet assembly according to claim 1, wherein: The outer diameter of the separator is larger than the inner diameter of the first through hole and the inner diameter of the second through hole.

4. The rivet assembly according to claim 1, wherein: The height of the separator is 0.5 mm to 4 mm.

5. The rivet assembly according to claim 2, wherein: The rivet part includes a nail head part and a nail column part; One end of the nail head is fixedly connected to one end of the nail column. The nail head abuts against the first circuit board. The other end of the nail column is sequentially penetrated through the first penetration hole, the first mounting hole and the second mounting hole.

6. The rivet assembly according to claim 1, wherein: The nail kit and the rivet piece are both integrally formed structures.

7. The rivet assembly according to claim 1, wherein: The nail kit is a plastic nail sleeve, and the rivet piece is a plastic rivet.

8. The rivet assembly according to claim 2, wherein: The first through hole, the first mounting hole and the second mounting hole have the same diameter.

9. The rivet assembly according to claim 2, wherein: The penetration member is provided with a plurality of penetration portions arranged at intervals, and the plurality of penetration portions collectively form the second mounting hole; and / or, A plurality of spacing grooves are formed on the peripheral wall of the penetration member, and each of the spacing grooves extends to the end of the penetration member away from the partition member.

10. A multilayer circuit board device, characterized in that: comprising a first circuit board, a second circuit board, and several rivet assemblies according to any one of claims 1 to 9; The first circuit board begins to have the first through-hole, and the second circuit board begins to have the second through-hole. The other end of the rivet is penetrated through the first through-hole and is detachably connected to the nail kit. The other end of the through-hole is penetrated through the second through-hole. One end of the separator abuts against the second circuit board, and the other end of the separator abuts against the other end of the first circuit board, so that there is a distance between the first circuit board and the second circuit board.

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