Soldering tin liquid level height detection device

Abstract

The utility model relates to the technical field of detection equipment, in particular to a soldering tin liquid level height detection device. Comprising a machine table, a support arranged on the machine table, a translation driving mechanism arranged on the support, a lifting driving mechanism arranged at the moving end of the translation driving mechanism, a seat body arranged at the lifting end of the lifting driving mechanism, a lifting driver arranged on the seat body and a mounting seat arranged at the lifting end of the lifting driver. The detection probe is installed on the installation base, the polishing mechanism is installed on the machine table, the detection probe is movably arranged above the polishing mechanism, and the polishing mechanism is used for polishing the detection probe. According to the utility model, the soldering tin liquid level height can be detected, the detection probe can be automatically polished, the detection precision of the detection probe on the soldering tin liquid level height is ensured, and the service life of the detection probe is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of detection equipment, in particular to a solder liquid level detection device. Background Art

[0002] Among the existing patents, the applicant applied for Chinese patent document No. 202022460963.3 on October 29, 2020, which discloses a fully automatic soldering machine. The patent document specifically discloses that the liquid level detection mechanism includes a driving cylinder 1 installed on a multi-axis linkage drive device and a detection probe of a piston rod installed on the driving cylinder 1. The detection probe detects the height of the liquid in the flux furnace. After long-term use, the detection probe is easily oxidized or adhered to tin, resulting in a deterioration in the detection accuracy of the detection probe. In order to ensure the detection accuracy of the detection probe, in the existing technology, either the detection probe is directly replaced or the detection probe needs to be manually polished. Utility Model Content

[0003] In order to solve the above technical problems, the purpose of the present utility model is to provide a solder liquid level detection device.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A solder liquid level detection device includes a machine platform, a bracket mounted on the machine platform, a translation drive mechanism mounted on the bracket, a lifting drive mechanism mounted on the moving end of the translation drive mechanism, a base body mounted on the lifting end of the lifting drive mechanism, a lifting drive mounted on the base body, a mounting base mounted on the lifting end of the lifting drive, a detection probe mounted on the mounting base, and a polishing mechanism mounted on the machine platform, wherein the detection probe is movably arranged above the polishing mechanism, and the polishing mechanism is used to polish the detection probe.

[0006] Furthermore, the polishing mechanism includes a polishing box installed on the machine, a rotating drive arranged in the polishing box and a polishing brush installed on the rotating end of the rotating drive. A polishing hole is opened on the top surface of the polishing box, and the polishing brush is located in the polishing hole. The polishing brush is used to polish the detection probe.

[0007] Furthermore, the detection probe is a titanium alloy probe.

[0008] Furthermore, a detection tip is provided at the bottom end of the detection probe.

[0009] Furthermore, there are multiple detection probes, and the multiple detection probes are arranged in parallel.

[0010] The beneficial effects of the present utility model are as follows: in actual application, the translation drive mechanism and the lifting drive mechanism cooperate to drive the detection probe to move to the soldering furnace, and the detection probe detects the solder liquid level in the soldering furnace; in order to ensure the detection probe's detection accuracy of the solder liquid level and improve the service life of the detection probe, the detection probe can be automatically polished at any time or at regular intervals; when the detection probe needs to be polished, the translation drive mechanism and the lifting drive mechanism cooperate to drive the detection probe to move above the polishing mechanism, and then the lifting drive drives the mounting base and the detection probe downward into the polishing mechanism, and the polishing mechanism polishes the detection probe. The utility model can not only detect the solder liquid level, but also automatically polish the detection probe, ensuring the detection probe's detection accuracy of the solder liquid level and improving the service life of the detection probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0012] Figure 2 It is a cross-sectional view of the polishing mechanism of the present utility model.

[0013] Description of reference numerals:

[0014] 1. Machine; 2. Bracket; 3. Translation drive mechanism; 4. Lifting drive mechanism; 5. Base; 6. Lifting drive; 7. Mounting seat; 8. Detection probe; 9. Polishing mechanism; 10. Polishing box; 11. Rotation drive; 12. Polishing brush; 13. Polishing hole; 14. Detection tip. DETAILED DESCRIPTION

[0015] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to embodiments and drawings. The contents mentioned in the embodiments are not intended to limit the present invention.

[0016] like Figure 1 and Figure 2 As shown, the utility model provides a solder liquid level detection device, which includes a machine 1, a bracket 2 installed on the machine 1, a translation drive mechanism 3 installed on the bracket 2, a lifting drive mechanism 4 installed on the moving end of the translation drive mechanism 3, a base body 5 installed on the lifting end of the lifting drive mechanism 4, a lifting drive 6 installed on the base body 5, a mounting base 7 installed on the lifting end of the lifting drive 6, a detection probe 8 installed on the mounting base 7 and a polishing mechanism 9 installed on the machine 1, the detection probe 8 is movably arranged above the polishing mechanism 9, and the polishing mechanism 9 is used to polish the detection probe 8; specifically, the lifting drive 6 can adopt a cylinder.

[0017] In actual application, the translation drive mechanism 3 and the lifting drive mechanism 4 cooperate to drive the detection probe 8 to move to the soldering furnace, and the detection probe 8 detects the solder liquid level in the soldering furnace; in order to ensure the detection accuracy of the detection probe 8 on the solder liquid level and improve the service life of the detection probe 8, the detection probe 8 can be automatically polished at any time or at a fixed time; when the detection probe 8 needs to be polished, the translation drive mechanism 3 and the lifting drive mechanism 4 cooperate to drive the detection probe 8 to move above the polishing mechanism 9, and then the lifting drive 6 drives the mounting seat 7 and the detection probe 8 to move downward into the polishing mechanism 9, and the polishing mechanism 9 polishes the detection probe 8. The utility model can not only detect the solder liquid level, but also automatically polish the detection probe 8, ensuring the detection accuracy of the detection probe 8 on the solder liquid level and improving the service life of the detection probe 8.

[0018] In this embodiment, the polishing mechanism 9 includes a polishing box 10 mounted on the machine 1, a rotary driver 11 disposed within the polishing box 10, and a polishing brush 12 mounted at the rotating end of the rotary driver 11. A polishing hole 13 is formed on the top surface of the polishing box 10, and the polishing brush 12 is located within the polishing hole 13. The polishing brush 12 is used to polish the detection probe 8. Specifically, the rotary driver 11 can be a motor.

[0019] In actual application, when the detection probe 8 is inserted into the polishing brush 12 from the polishing hole 13, the rotary driver 11 drives the polishing brush 12 to rotate, and the rotating polishing brush 12 polishes the detection probe 8 to ensure the quality of the detection probe 8, thereby ensuring the accuracy of the detection probe 8 in detecting the solder liquid level height.

[0020] In this embodiment, the detection probe 8 is a titanium alloy probe, which has the characteristics of high strength, good corrosion resistance and high heat resistance, and a long service life.

[0021] In this embodiment, a detection tip 14 is provided at the bottom end of the detection probe 8; this structural design facilitates the polishing brush 12 to polish the detection probe 8, and the polishing efficiency is high.

[0022] In this embodiment, there are multiple detection probes 8 , and the multiple detection probes 8 are arranged in parallel.

[0023] All technical features in this embodiment can be freely combined according to actual needs.

[0024] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A solder liquid level detection device, characterized in that: The invention comprises a machine (1), a bracket (2) mounted on the machine (1), a translation drive mechanism (3) mounted on the bracket (2), a lifting drive mechanism (4) mounted on the moving end of the translation drive mechanism (3), a seat (5) mounted on the lifting end of the lifting drive mechanism (4), a lifting driver (6) mounted on the seat (5), a mounting seat (7) mounted on the lifting end of the lifting driver (6), a detection probe (8) mounted on the mounting seat (7), and a polishing mechanism (9) mounted on the machine (1). The detection probe (8) is movably arranged above the polishing mechanism (9), and the polishing mechanism (9) is used to polish the detection probe (8).

2. The solder liquid level detection device according to claim 1, characterized in that: The polishing mechanism (9) comprises a polishing box (10) mounted on a machine (1), a rotary driver (11) disposed in the polishing box (10), and a polishing brush (12) mounted on a rotating end of the rotary driver (11). A polishing hole (13) is provided on the top surface of the polishing box (10), and the polishing brush (12) is located in the polishing hole (13). The polishing brush (12) is used to polish the detection probe (8).

3. The solder liquid level detection device according to claim 1, characterized in that: The detection probe (8) is a titanium alloy probe.

4. The solder liquid level detection device according to claim 1, characterized in that: The bottom end of the detection probe (8) is provided with a detection tip (14).

5. The solder liquid level detection device according to claim 1, characterized in that: There are multiple detection probes (8), and the multiple detection probes (8) are arranged in parallel.

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