Heat dissipation structure of display module with PCB (printed circuit board)

Abstract

The utility model relates to a heat dissipation structure of a display module with a PCB. The heat dissipation structure of the display module with the PCB comprises a backlight iron stand, an extension assembly and the PCB, wherein the extension assembly is arranged on the backlight iron stand; the PCB is arranged on the extension assembly. According to the scheme provided by the invention, the PCB can be far away from the back surface of the display screen, so that local temperature rise of the display screen is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display, in particular to a heat dissipation structure of a display module with a PCB board. Background Art

[0002] Currently, large-size displays require a large number of integrated circuits, so many functional modules are integrated on the PCB, such as backlight boost IC modules, DCDC circuit modules, and even signal conversion circuit modules.

[0003] However, these circuit modules generate high temperatures during operation due to their high power consumption. Conventional display designs attach the PCB to the back of the display, which can easily lead to high temperatures in certain areas of the display, thus affecting display performance. Utility Model Content

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a heat dissipation structure of a display module with a PCB board, which can keep the PCB board away from the back of the display screen, thereby avoiding a local temperature increase of the display screen.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] In a first aspect, the present application provides a heat dissipation structure of a display module with a PCB board, comprising: a backlight iron frame; an extension component, the extension component being arranged on the backlight iron frame; and a PCB board, the PCB board being arranged on the extension component.

[0007] The extension assembly includes a first supporting plate and a second supporting plate, and the first supporting plate and the second supporting plate are respectively arranged on the backlight iron frame at intervals.

[0008] A first locking hole is formed on the first supporting plate, and the PCB is disposed on the first supporting plate.

[0009] A second locking hole is formed on the second supporting plate, and the PCB is disposed on the second supporting plate.

[0010] The extension component further includes a bending plate, which is arranged on the backlight iron frame, and the PCB board is arranged on the bending plate.

[0011] An air flow channel is provided between the bending plate and the backlight iron frame.

[0012] The width of the air flow channel ranges from 3.0 mm to 4.0 mm.

[0013] The bending plate is provided with a first threaded hole.

[0014] The bending plate is further provided with a second threaded hole.

[0015] The first threaded hole and the second threaded hole both have a circular cross-sectional structure.

[0016] Compared with the prior art, the present invention has at least the following advantages:

[0017] By setting up an extension component, the PCB board can be set on the extension component, so that there is a certain distance from the back of the display screen, avoiding direct contact with the back of the display screen, thereby preventing heat from accumulating on the back of the display screen and ensuring normal display performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for use in the embodiments.

[0019] Figure 1 This is a schematic structural diagram of a heat dissipation structure of a display module with a PCB board in one embodiment of the present invention;

[0020] Figure 2 This is a structural schematic diagram of another embodiment of the heat dissipation structure of a display module with a PCB board in one embodiment of the present utility model;

[0021] Figure 3 This is a structural schematic diagram of another embodiment of the heat dissipation structure of a display module with a PCB board in one embodiment of the present utility model;

[0022] Figure 4 This is a structural schematic diagram of another implementation of the heat dissipation structure of a display module with a PCB board in one embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following describes embodiments of the present application in more detail with reference to the accompanying drawings. Although the accompanying drawings illustrate embodiments of the present application, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0024] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0025] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," and the like should be interpreted broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0026] Currently, large-scale displays require numerous integrated circuits, necessitating the integration of numerous functional modules onto PCBs. These include backlight boost ICs, DC-DC circuits, and even signal conversion circuits. However, these circuits, due to their high power consumption, generate high operating temperatures. Conventional display designs typically attach the PCB to the back of the display, which can lead to locally high temperatures, impacting display performance.

[0027] To address the above-mentioned problem, an embodiment of the present application provides a heat dissipation structure of a display module with a PCB board, which can keep the PCB board away from the back of the display screen, thereby avoiding a local temperature increase of the display screen.

[0028] The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0029] See also Figure 1 A heat dissipation structure of a display module with a PCB board includes: a backlight iron frame 100, an extension component 200 and a PCB board 300, wherein the extension component 200 is arranged on the backlight iron frame 100; the PCB board 300 is arranged on the extension component 200.

[0030] It should be noted that by setting up the extension component 200, the PCB board 300 can be set on the extension component 200, so that it has a certain distance from the back of the display screen, avoiding direct contact with the back of the display screen, thereby preventing heat from accumulating on the back of the display screen and ensuring normal display performance.

[0031] See also Figure 1 and Figure 2 In one embodiment, the extension assembly 200 includes a first support plate 210 and a second support plate 220, which are spaced apart and disposed on the backlight frame 100. Specifically, the first support plate 210 defines a first locking hole 211, and the PCB 300 is disposed on the first support plate 210. Specifically, the second support plate 220 defines a second locking hole 221, and the PCB 300 is disposed on the second support plate 220.

[0032] It should be noted that the first support plate 210 and the second support plate 220 are plates extending from the backlight frame 100, and the PCB board 300 is mounted on the first support plate 210 and the second support plate 220 by screws. The arrangement of the first support plate 210 and the second support plate 220 can prevent the PCB board 300 from directly contacting the back of the display screen.

[0033] See also Figure 3 and Figure 4 In another embodiment, the extension component 200 further includes a bending plate 230, which is disposed on the backlight iron frame 100, and the PCB board 300 is disposed on the bending plate 230. Specifically, an air flow channel 400 is provided between the bending plate 230 and the backlight iron frame 100. Specifically, the width of the air flow channel 400 ranges from 3.0 mm to 4.0 mm. Specifically, a first threaded hole 231 is provided on the bending plate 230. Specifically, a second threaded hole 232 is also provided on the bending plate 230. Specifically, the first threaded hole 231 and the second threaded hole 232 both have a circular cross-sectional structure.

[0034] It should be noted that the bending plate 230 is formed by bending the backlight iron frame 100. After the PCB board 300 is installed on the bending plate 230 by screwing, there is a distance of 3.0mm to 4.0mm from the back of the display screen. The air flow channel 400 formed by this distance helps to dissipate heat from the PCB board 300.

[0035] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the description are not necessarily required for this application. In addition, it is understood that the steps in the method of the embodiment of the present application can be adjusted in sequence, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0036] The embodiments of the present application have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or improvements to the technology in the market, or to enable other persons skilled in the art to understand the embodiments disclosed herein.

Claims

1. A heat dissipation structure of a display module with a PCB board, characterized in that: include: Backlit iron frame; An extension component, the extension component is arranged on the backlight iron frame; A PCB board is arranged on the extension component.

2. The heat dissipation structure of a display module with a PCB board according to claim 1, characterized in that: The extension assembly includes a first supporting plate and a second supporting plate, and the first supporting plate and the second supporting plate are respectively arranged on the backlight iron frame at intervals.

3. The heat dissipation structure of a display module with a PCB board according to claim 2, characterized in that: A first locking hole is formed on the first supporting plate, and the PCB is disposed on the first supporting plate.

4. The heat dissipation structure of a display module with a PCB board according to claim 2, characterized in that: A second locking hole is formed on the second supporting plate, and the PCB is disposed on the second supporting plate.

5. The heat dissipation structure of a display module with a PCB board according to claim 1, characterized in that: The extension component further includes a bending plate, which is arranged on the backlight iron frame, and the PCB board is arranged on the bending plate.

6. The heat dissipation structure of a display module with a PCB board according to claim 5, characterized in that: An air flow channel is provided between the bending plate and the backlight iron frame.

7. The heat dissipation structure of a display module with a PCB board according to claim 6, characterized in that: The width of the air flow channel ranges from 3.0 mm to 4.0 mm.

8. The heat dissipation structure of a display module with a PCB board according to claim 6, characterized in that: The bending plate is provided with a first threaded hole.

9. The heat dissipation structure of a display module with a PCB board according to claim 8, characterized in that: The bending plate is further provided with a second threaded hole.

10. The heat dissipation structure of a display module with a PCB board according to claim 9, characterized in that: The first threaded hole and the second threaded hole both have a circular cross-sectional structure.

Images