Camera sealing device for semiconductor equipment

Abstract

The camera sealing device used on the semiconductor equipment comprises the first partition plate and the second partition plate, the first partition plate is provided with the first positioning piece, the second partition plate is provided with the second positioning piece, and the first positioning piece and the second positioning piece are matched to connect the first partition plate and the second partition plate into a whole so as to seal a camera. Compared with the prior art, the sealing device adopts a split structure, the camera can be sealed by splicing the first partition plate and the second partition plate, and when the sealing device needs to be disassembled, the whole camera does not need to be disassembled, and only the first partition plate and the second partition plate need to be disassembled, so that the sealing device is convenient to disassemble, assemble and maintain, and the sealing effect is good. Time is saved, working efficiency is improved, the camera can be protected from being damaged, and the service life of the camera is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of sealing, and in particular relates to a camera sealing device used on semiconductor equipment. Background Art

[0002] In the semiconductor equipment field, cameras are often used to take photos of chips or wafers, and subsequent high-precision operations are achieved by analyzing the captured images. This shows that cameras are extremely important for semiconductor equipment. Currently, when sealing cameras, silicone seals are usually used as a whole. If the silicone seal is damaged and needs to be replaced, the entire camera must be disassembled, which not only wastes time and reduces work efficiency, but also easily damages the camera.

[0003] Therefore, how to overcome the above technical defects is a problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide a camera sealing device for semiconductor equipment, which is not only convenient for disassembly and maintenance, saving time and improving work efficiency, but also can protect the camera from damage and extend the service life of the camera.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A camera sealing device for semiconductor equipment includes a first partition and a second partition. The first partition is provided with a first positioning member, and the second partition is provided with a second positioning member. The first positioning member and the second positioning member cooperate to connect the first partition and the second partition into one body to achieve sealing of the camera.

[0007] Optionally, a first groove is provided on the first partition plate, and a second groove is provided on the second partition plate, and the first groove and the second groove are matched to form a mounting hole that can be mounted on the camera.

[0008] Optionally, there are multiple first positioning members and multiple second positioning members, and the first positioning members are matched and connected with the second positioning members in a one-to-one correspondence.

[0009] Optionally, there are two first positioning members, and they are respectively arranged at notch positions close to the first groove;

[0010] There are two second positioning members, and they are respectively arranged at notch positions close to the second groove.

[0011] Optionally, a positioning groove is provided on the first partition, and the first positioning member is provided on the positioning groove;

[0012] A positioning block is provided on the second partition plate, and the second positioning member is provided on the positioning block;

[0013] The depth of the positioning groove is not less than the thickness of the positioning block.

[0014] Optionally, the first positioning member is a positioning column, and the second positioning member is a positioning hole, or the first positioning member is a positioning hole, and the second positioning member is a positioning column.

[0015] Optionally, the first partition and the second partition are both made of formaldehyde resin material.

[0016] Optionally, a first sealing cover plate is further included, and the first sealing cover plate is pressed tightly against the first partition plate and the second partition plate.

[0017] Optionally, a second sealing cover plate is further included, the first sealing cover plate is provided with an opening, and the second sealing cover plate is sealed at the opening.

[0018] Optionally, the first sealing cover plate and the second sealing cover plate are both correspondingly provided with fastening holes, and the first sealing cover plate and the second sealing cover plate are fastened and connected.

[0019] It can be seen from the above technical solution that, compared with the prior art, the camera sealing device for semiconductor equipment disclosed in the embodiment of the present invention adopts a split structure, and the sealing of the camera can be completed by splicing the first partition and the second partition. When the sealing device needs to be removed, there is no need to remove the entire camera, only the first partition and the second partition need to be disassembled. Therefore, the sealing device is not only convenient for disassembly and maintenance, saves time, and improves work efficiency, but also can protect the camera from damage and extend the service life of the camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0021] Figure 1 This is a schematic diagram of the overall structure of a camera sealing device for semiconductor equipment disclosed in an embodiment of the present utility model;

[0022] Figure 2 This is a schematic diagram of the exploded structure of the camera sealing device for semiconductor equipment disclosed in an embodiment of the present utility model;

[0023] Figure 3An exploded schematic diagram of a mounting structure of a camera sealing device for semiconductor equipment disclosed in an embodiment of the present utility model;

[0024] Figure 4 This is an overall schematic diagram of the installation structure of the camera sealing device for semiconductor equipment disclosed in an embodiment of the present utility model.

[0025] Description of reference numerals:

[0026] 100, first partition; 101, first groove; 102, positioning groove; 103, first positioning member; 200, second partition; 201, second groove; 201, positioning block; 203, second positioning member; 300, first sealing cover plate; 400, second sealing cover plate; 500, camera; 600, mounting rod. DETAILED DESCRIPTION

[0027] In view of this, the core of the present invention is to provide a camera sealing device for semiconductor equipment, which not only facilitates disassembly and maintenance, saves time and improves work efficiency, but also protects the camera from damage and extends the service life of the camera.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Please refer to Figures 1 to 4 .

[0029] Please refer to Figure 1 and Figure 2 The camera sealing device for semiconductor equipment disclosed in an embodiment of the present invention includes a first partition 100 and a second partition 200. A first positioning member 103 is provided on the first partition 100, and a second positioning member 203 is provided on the second partition 200. The first positioning member 103 and the second positioning member 203 cooperate to connect the first partition 100 and the second partition 200 into one body to achieve sealing of the camera 500.

[0030] Compared with the prior art, the camera sealing device for semiconductor equipment disclosed in the embodiment of the present invention adopts a split structure. The sealing of the camera 500 can be completed by splicing the first partition 100 and the second partition 200. When the sealing device needs to be removed, there is no need to remove the entire camera 500. It is only necessary to disassemble the first partition 100 and the second partition 200. Therefore, the sealing device is not only convenient for disassembly and maintenance, saves time, and improves work efficiency, but also can protect the camera from damage and extend the service life of the camera.

[0031] In order to facilitate the fixation of the sealing device, in the camera sealing device for semiconductor equipment disclosed in the embodiment of the present invention, a first groove 101 is opened on the first partition 100, and a second groove 201 is opened on the second partition 200, wherein the first groove 101 and the second groove 201 are matched to form a mounting hole that can be installed on the camera 500.

[0032] It should be noted that a mounting rod is provided on the camera 500. When the sealing device is installed, the mounting hole formed by splicing the first partition 100 and the second partition 200 can be placed on the mounting rod 600 to seal the camera 500, thereby preventing water and the like from leaking into the interior of the camera 500.

[0033] The embodiment of the present invention does not limit the specific number of the first positioning members 103 and the second positioning members 203 . As long as the number meets the use requirements of the present invention, it is within the protection scope of the present invention.

[0034] As one embodiment, the first positioning member 103 and the second positioning member 203 disclosed in the embodiment of the present utility model are both multiple, and the first positioning member 103 and the second positioning member 203 are matched and connected in a one-to-one correspondence.

[0035] As a further embodiment, the embodiment of the present invention discloses two first positioning members 103, each disposed near the notch of the first groove 101, and two second positioning members 203, each disposed near the notch of the second groove 201. This arrangement facilitates the connection between the first partition 100 and the second partition 200.

[0036] As a further embodiment, the first partition 100 disclosed in the embodiment of the present invention is provided with a positioning groove 102, a first positioning member 103 is disposed on the positioning groove 102, and a second partition 200 is provided with a positioning block 201, and the second positioning member 203 is disposed on the positioning block 201. The depth of the positioning groove 102 is not less than the thickness of the positioning block 201. This arrangement ensures that no additional protrusions exist after the first partition 100 and the second partition 200 are connected, thereby preventing interference with other components during installation.

[0037] The embodiment of the present invention does not limit the specific structure of the first positioning member 103 and the second positioning member 203. As long as the structure meets the use requirements of the present invention, it is within the protection scope of the present invention.

[0038] As one embodiment, the first positioning member 103 disclosed in the embodiment of the present utility model can be a positioning column, and the second positioning member 203 can be a positioning hole. Of course, the first positioning member 103 can also be a positioning hole, and the second positioning member 203 can also be a positioning column. Those skilled in the art can make a choice according to actual conditions.

[0039] The embodiment of the present invention does not limit the specific materials of the first partition plate 100 and the second partition plate 200. As long as the structure meets the use requirements of the present invention, it is within the protection scope of the present invention.

[0040] As a preferred embodiment, the first partition plate 100 and the second partition plate 200 disclosed in the embodiment of the present invention are both made of formaldehyde resin material. Such a configuration is not only more durable, but also easy to process and has higher processing precision.

[0041] Please refer to Figure 3 and Figure 4 As a further embodiment, the camera sealing device for semiconductor equipment disclosed in the embodiment of the present invention further includes a first sealing cover plate 300, wherein the first sealing cover plate 300 is pressed against the first partition plate 100 and the second partition plate 200.

[0042] As a further embodiment, the camera sealing device for semiconductor equipment disclosed in the embodiment of the present invention further includes a second sealing cover plate 400 , wherein the first sealing cover plate 300 is provided with an opening, and the second sealing cover plate 400 blocks the opening.

[0043] Specifically, fastening holes are correspondingly provided on the first sealing cover plate 300 and the second sealing cover plate 400 , and the first sealing cover plate 300 and the second sealing cover plate 400 are fastened and connected by fasteners.

[0044] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0045] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0046] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A camera sealing device for semiconductor equipment, characterized in that: It includes a first partition and a second partition, wherein a first positioning member is provided on the first partition, and a second positioning member is provided on the second partition. The first positioning member and the second positioning member cooperate to connect the first partition and the second partition into one body to achieve sealing of the camera.

2. The camera sealing device for semiconductor equipment according to claim 1, wherein: A first groove is formed on the first partition plate, and a second groove is formed on the second partition plate. The first groove and the second groove are matched to form a mounting hole that can be mounted on the camera.

3. The camera sealing device for semiconductor equipment according to claim 2, wherein: There are multiple first positioning members and multiple second positioning members, and the first positioning members are matched and connected with the second positioning members in a one-to-one correspondence.

4. The camera sealing device for semiconductor equipment according to claim 3, wherein: There are two first positioning members, and they are respectively arranged at notch positions close to the first groove; There are two second positioning members, and they are respectively arranged at notch positions close to the second groove.

5. The camera sealing device for semiconductor equipment according to claim 4, wherein: The first partition is provided with a positioning groove, and the first positioning member is provided on the positioning groove; A positioning block is provided on the second partition plate, and the second positioning member is provided on the positioning block; The depth of the positioning groove is not less than the thickness of the positioning block.

6. The camera sealing device for semiconductor equipment according to claim 1, wherein: The first positioning member is a positioning column, and the second positioning member is a positioning hole, or the first positioning member is a positioning hole, and the second positioning member is a positioning column.

7. The camera sealing device for semiconductor equipment according to claim 1, wherein: The first partition plate and the second partition plate are both made of formaldehyde resin material.

8. The camera sealing device for semiconductor equipment according to claim 1, wherein: The system further includes a first sealing cover plate, wherein the first sealing cover plate is pressed tightly against the first partition plate and the second partition plate.

9. The camera sealing device for semiconductor equipment according to claim 8, wherein: The first sealing cover plate is provided with an opening, and the second sealing cover plate is sealed to the opening.

10. The camera sealing device for semiconductor equipment according to claim 9, wherein: The first sealing cover plate and the second sealing cover plate are both correspondingly provided with fastening holes, and the first sealing cover plate and the second sealing cover plate are fastened and connected.

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