Single-chip microcomputer with heat dissipation mechanism

Abstract

The utility model discloses a singlechip with a heat dissipation mechanism, which comprises a shell, a fan, a first filter screen and a second filter screen, the shell is provided with a sinking groove, two ends of the shell are respectively provided with a first air duct and a second air duct, the first air duct and the second air duct are both communicated with the sinking groove, and the fan is arranged in the sinking groove. The single-chip microcontroller covers an opening of the sinking groove, the fan is installed at the communication position of the first air channel and the sinking groove, the fan is electrically connected with the single-chip microcontroller, the first filter screen covers the first air channel, and the second filter screen covers the second air channel. The utility model provides a single-chip microcomputer with a heat dissipation mechanism, which can effectively prevent dust from being attached to a single-chip microcontroller and can efficiently cool the single-chip microcontroller.

Description

Technical Field

[0001] The utility model relates to the technical field of single chip computer heat dissipation, in particular to a single chip computer with a heat dissipation mechanism. Background Art

[0002] A single-chip microcomputer is a typical embedded single-chip microcontroller, which consists of an arithmetic unit, a controller, a memory, input and output devices, etc. It is equivalent to a microcomputer.

[0003] The microcontroller will generate heat when working. When the temperature of the microcontroller is too high, it will affect the operating speed of the microcontroller. In severe cases, it will be damaged. The common technical solution for cooling the microcontroller on the market is: fix a fan on the microcontroller, and use the cold air blown by the fan to take away the heat, thereby cooling the microcontroller.

[0004] The above solution is only suitable for equipment with a good working environment. When the equipment is placed in a harsh working environment, dust will enter the equipment and adhere to the fan and microcontroller, which will easily affect the efficiency of the fan in blowing out cold air. The dust on the microcontroller will also block the heat exchange between the microcontroller and the cold air. Utility Model Content

[0005] The purpose of the utility model is to provide a single-chip microcomputer with a heat dissipation mechanism, which can effectively isolate dust from adhering to the single-chip microcontroller and can efficiently cool the single-chip microcontroller.

[0006] The technical solution adopted by a single chip microcomputer with a heat dissipation mechanism disclosed in the utility model is:

[0007] The invention comprises a shell, a fan, a first filter and a second filter. A sink is provided on the shell. A first air duct and a second air duct are respectively provided at two ends of the shell. The first air duct and the second air duct are both connected to the sink. The single-chip microcontroller cover is provided at the opening of the sink. The fan is installed at the connection between the first air duct and the sink. The fan is electrically connected to the single-chip microcontroller. The first filter covers the first air duct and the second filter covers the second air duct.

[0008] As a preferred solution, a first through slot is formed at the bottom of the shell, the first through slot is communicated with the first air duct, and the first filter is slidably inserted into the first through slot.

[0009] As a preferred solution, there are four fans, and the four fans are placed side by side in the first air duct.

[0010] As a preferred solution, an annular step is provided on the edge of the sink, and the single-chip microcontroller cover is arranged inside the annular step.

[0011] As a preferred solution, second through grooves are provided on both sides of the inner wall of the second air duct, the ends of the second through grooves are located on the annular steps, the two sides of the second filter are respectively slid into the adjacent second through grooves, and the single-chip microcontroller touches the bottom of the second filter.

[0012] As a preferred solution, the inner wall of the sink is provided with a plurality of spaced installation slots, a heat sink is provided in the sink, and a plurality of spaced fins extend from the heat sink, the heat sink contacts the single-chip microcontroller, and the fins are snapped into adjacent installation slots.

[0013] As a preferred solution, a mounting hole is passed through the housing, a limiting ring extends from the edge of the mounting hole, and a dust cover is provided on the limiting ring.

[0014] The beneficial effects of the single chip microcomputer with a heat dissipation mechanism disclosed in the utility model are:

[0015] After the single-chip microcontroller cover is installed at the opening of the sink, the sink can only communicate with the outside through the first air duct and the second air duct. The housing with the single-chip microcontroller cover is installed on the external device, and the single-chip microcontroller is close to the external device so that the housing cover is installed on the single-chip microcontroller.

[0016] When the single-chip microcontroller is running, it also provides power to the fan. The fan rotates forward to draw cold air from the outside of the housing. The cold air passes through the first filter, the fan, and the first air duct in sequence and enters the sink. The first filter filters impurities in the cold air to prevent external impurities from entering the housing and affecting the air suction efficiency of the fan and the operation of the single-chip microcontroller. The cold air exchanges heat with the single-chip microcontroller and is converted into hot air. The hot air passes through the second air duct and the second filter in sequence and is discharged from the outside of the housing, thereby cooling the single-chip microcontroller while also providing dust protection for the single-chip microcontroller.

[0017] When the hot air passes through the second filter, it will blow away the dust on the second filter, thereby cleaning the second filter. When too much dust accumulates on the first filter, resulting in sluggish air intake, the fan reverses, and the cold air passes through the second filter and the second air duct in turn into the sink, allowing the cold air to enter the sink smoothly. The hot air passes through the first air duct, the fan and the first filter in turn and is discharged to the outside of the shell. The hot air blows away the dust on the first filter, thereby cleaning the first filter. By switching the direction of the fan rotation, the dust on the first filter and the second filter is circulated and cleaned, thereby achieving efficient ventilation efficiency to cool the single-chip microcontroller. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The utility model is a structural schematic diagram of a single chip computer with a heat dissipation mechanism.

[0019] Figure 2The utility model is a schematic diagram of the installation of a dust cover of a single chip microcomputer with a heat dissipation mechanism.

[0020] Figure 3 The utility model is a schematic diagram of the installation of a single-chip microcontroller with a heat dissipation mechanism.

[0021] Figure 4 The utility model is a schematic diagram of the installation structure of the first filter screen and the second filter screen of a single chip computer with a heat dissipation mechanism.

[0022] Figure 5 The utility model is a schematic diagram of a process of cleaning the second filter screen of a single chip microcomputer with a heat dissipation mechanism.

[0023] Figure 6 The utility model is a schematic diagram of a process of cleaning a first filter screen of a single chip microcomputer with a heat dissipation mechanism. DETAILED DESCRIPTION

[0024] The present invention will be further described and explained below in conjunction with specific embodiments and accompanying drawings:

[0025] Please refer to Figure 1-Figure 4 .

[0026] The utility model discloses a single chip computer with a heat dissipation mechanism, which is used to cool down and prevent dust for a single chip microcontroller 1;

[0027] It includes a housing 2, a fan 4, a first filter 5 and a second filter 6;

[0028] The bottom of the housing 2 is provided with a recessed groove 21, and the edge of the recessed groove 21 is provided with an annular step. The width of the annular step is greater than that of the recessed groove 21. The single-chip microcontroller 1 cover is disposed within the annular step, and the single-chip microcontroller 1 covers the opening of the recessed groove 21. The annular step can prevent the single-chip microcontroller 1 cover from sliding into the recessed groove 21. Moreover, when the housing 2 is mounted on an external device, the bottom of the housing 2 contacts the device, the single-chip microcontroller 1 is close to the external device, and the recessed groove 21 covers the single-chip microcontroller 1 in an upside-down state, so that the housing 2 encloses the single-chip microcontroller 1 within the recessed groove 21.

[0029] Furthermore, a first air duct 22 and a second air duct 23 are respectively provided at both ends of the shell 2, the first air duct 22 and the second air duct 23 are parallel to each other, and the first air duct 22 and the second air duct 23 are both connected to the sink 21, and the sink 21 is connected to the outside through the first air duct 22 and the second air duct 23; a first through-groove 221 is provided at the bottom of the shell 2, the first through-groove 221 is connected to the first air duct 22, the width of the first through-groove 221 is greater than the width of the first air duct 22, and the first through-groove 221 and the first air duct 22 are perpendicular to each other; second through-grooves 231 are provided on both sides of the inner wall of the second air duct 23, the second through-groove 231 and the second air duct 23 are perpendicular to each other, and the end of the second through-groove 231 is located on the annular step;

[0030] Furthermore, the inner wall of the sink 21 is provided with a plurality of installation slots 211 arranged at intervals, and two adjacent installation slots 211 are parallel to each other. The installation slots 211 are located between the first air duct 22 and the second air duct 23, and the installation slots 211 and the first air duct 22 are parallel to each other. A heat sink 24 is provided in the sink 21, and a plurality of fins arranged at intervals extend from the top of the heat sink 24. The distance between two adjacent installation slots 211 is the same as the distance between two adjacent fins. The fins of the heat sink 24 are first inserted into the adjacent installation slots 211 to prevent the heat sink 24 from shaking in the sink 21. The bottom of the heat sink 24 contacts the single-chip microcontroller 1, and the heat sink 24 and the running single-chip microcontroller 1 perform heat exchange, so that the heat of the single-chip microcontroller 1 is transferred to the heat sink 24, thereby improving the efficiency of heat dissipation for the single-chip microcontroller 1.

[0031] Furthermore, a mounting hole 25 is provided on the shell 2, and the mounting hole 25 passes through the shell 2. The bottom of the mounting hole 25 is connected to the sink 21. A limiting ring is extended from the edge of the top of the mounting hole 25, and a dust cover 251 is provided on the limiting ring. In this embodiment, the dust cover 251 is preferably hollow cylindrical and made of elastic rubber material. The diameter of the top of the dust cover 251 is smaller than the diameter of the bottom of the dust cover 251; the dust cover 251 is mounted on the outside of the cable 3 of the external device, and the top of the dust cover 251 is mounted on the outside of the cable 3. The cable 3 of the external device passes through the mounting hole 25 and is electrically connected to the single-chip microcontroller 1. The top of the dust cover 251 is mounted on the outside of the limiting ring. The dust cover 251 can prevent dust from entering the shell 2 from the mounting hole 25.

[0032] Please refer to Figure 4-Figure 6 ( Figure 5 and Figure 6 The arrows in the figure indicate the path of cold air flow).

[0033] In this embodiment, four fans 4 are preferably installed at the connection between the first air duct 22 and the sink 21. The four fans 4 are placed side by side in the first air duct 22. The fans 4 are electrically connected to the single-chip microcontroller 1. The single-chip microcontroller 1 also provides power to the fans 4 when it is started.

[0034] The first filter 5 is slidably inserted into the first through-slot 221, so that the first filter 5 covers the first air duct 22. When the cold air passes through the first air duct 22, it needs to pass through the first filter 5. The first filter 5 is used to filter impurities in the cold air. When the housing 2 is mounted on an external device, since the first through-slot 221 is located at the bottom of the housing 2, the external device seals the first through-slot 221, thereby confining the first filter 5 in the first through-slot 221.

[0035] The two sides of the second filter 6 are respectively slid into the adjacent second through grooves 231, so that the second filter 6 covers the second air duct 23. The cold air needs to pass through the second filter 6 when passing through the second air duct 23. The second filter 6 is used to filter impurities in the cold air; when the single-chip microcontroller 1 is covered in the annular step, the single-chip microcontroller 1 touches the bottom of the second filter 6, and the single-chip microcontroller 1 limits the second filter 6 in the second through groove 231.

[0036] When the single-chip microcontroller 1 starts running, it provides power to the fan 4. The fan 4 rotates forward to draw cold air from the outside of the housing 2. The cold air passes through the first filter 5, the fan 4 and the first air duct 22 in sequence and enters the sink 21. The first filter 5 filters impurities in the cold air and intercepts the impurities outside to prevent the impurities in the cold air from affecting the operation of the fan 4 and the single-chip microcontroller 1. The cold air entering the sink 21 exchanges heat with the single-chip microcontroller 1, and the cold air also passes through the fins of the radiator 24. The cold air lowers the temperature of the radiator 24. The cold air is converted into hot air after heat exchange with the single-chip microcontroller 1 and the radiator 24. The hot air is pushed by the fan 4 and passes through the second air duct 23 and the second filter 6 to be discharged from the outside of the housing 2.

[0037] When the hot air passes through the second filter 6, it will blow away the impurities on the second filter 6, thereby automatically cleaning the second filter 6; when the impurities on the first filter 5 accumulate too much and affect the ventilation efficiency of the first filter 5, the fan 4 reverses to draw cold air from the outside of the shell 2, and the cold air passes through the second filter 6 and the second air duct 23 in turn and enters the sink 21, where the second filter 6 filters the impurities in the cold air and intercepts the impurities outside. The cold air is converted into hot air after heat exchange with the single-chip microcontroller 1 and the radiator 24; the hot air is drawn by the fan 4, passes through the first air duct 22, the fan 4 and the first filter 5 and is discharged from the outside of the shell 2. When the hot air passes through the first filter 5, it will blow away the impurities on the first filter 5, thereby automatically cleaning the first filter 5; the impurities on the first filter 5 and the second filter 6 are automatically cleaned by the forward or reverse rotation of the fan 4, so that the first filter 5 and the second filter 6 maintain high ventilation efficiency and effectively cool the single-chip microcontroller 1.

[0038] The utility model provides an electrically adjustable air outlet. After a single-chip microcontroller cover is arranged at the opening of a sink, the sink can only communicate with the outside through a first air duct and a second air duct. A housing covered with the single-chip microcontroller is installed on an external device. The single-chip microcontroller is close to the external device, so that the housing cover is arranged on the single-chip microcontroller.

[0039] When the single-chip microcontroller is running, it also provides power to the fan. The fan rotates forward to draw cold air from the outside of the housing. The cold air passes through the first filter, the fan, and the first air duct in sequence and enters the sink. The first filter filters impurities in the cold air to prevent external impurities from entering the housing and affecting the air suction efficiency of the fan and the operation of the single-chip microcontroller. The cold air exchanges heat with the single-chip microcontroller and is converted into hot air. The hot air passes through the second air duct and the second filter in sequence and is discharged from the outside of the housing, thereby cooling the single-chip microcontroller while also providing dust protection for the single-chip microcontroller.

[0040] When the hot air passes through the second filter, it will blow away the dust on the second filter, thereby cleaning the second filter. When too much dust accumulates on the first filter, resulting in sluggish air intake, the fan reverses, and the cold air passes through the second filter and the second air duct in turn into the sink, allowing the cold air to enter the sink smoothly. The hot air passes through the first air duct, the fan and the first filter in turn and is discharged to the outside of the shell. The hot air blows away the dust on the first filter, thereby cleaning the first filter. By switching the direction of the fan rotation, the dust on the first filter and the second filter is circulated and cleaned, thereby achieving efficient ventilation efficiency to cool the single-chip microcontroller.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the scope of protection of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A single-chip microcontroller with a heat dissipation mechanism for cooling and dustproofing a single-chip microcontroller, characterized in that: The device comprises a housing, a fan, a first filter and a second filter, wherein a sink is formed on the housing, and a first air duct and a second air duct are respectively formed at two ends of the housing, both of which are connected to the sink, and the single-chip microcontroller cover is provided at the opening of the sink; The fan is installed at the connection point between the first air duct and the sink, the fan is electrically connected to the single-chip microcontroller, the first filter covers the first air duct, and the second filter covers the second air duct.

2. A single chip computer with a heat dissipation mechanism as claimed in claim 1, characterized in that: A first through slot is formed at the bottom of the shell. The first through slot is communicated with the first air duct. The first filter is slidably inserted into the first through slot.

3. A single chip computer with a heat dissipation mechanism as claimed in claim 2, characterized in that: There are four fans, which are placed side by side in the first air duct.

4. A single chip computer with a heat dissipation mechanism as claimed in claim 3, characterized in that: An annular step is provided on the edge of the sink, and the single-chip microcontroller cover is arranged in the annular step.

5. A single chip computer with a heat dissipation mechanism as claimed in claim 4, characterized in that: Second through slots are provided on both sides of the inner wall of the second air duct, and the ends of the second through slots are located on the annular steps. The two sides of the second filter are slid into the adjacent second through slots respectively, and the single-chip microcontroller touches the bottom of the second filter.

6. A single chip computer with a heat dissipation mechanism as claimed in claim 5, characterized in that: The inner wall of the sink is provided with a plurality of installation slots arranged at intervals. A heat sink is provided in the sink, and a plurality of fins arranged at intervals extend from the heat sink. The heat sink contacts the single-chip microcontroller, and the fins are snapped into adjacent installation slots.

7. A single chip computer with a heat dissipation mechanism as claimed in claim 6, characterized in that: The housing is provided with a mounting hole, an edge of the mounting hole is provided with a limiting ring, and the limiting ring is provided with a dust cover.

Images