Silicon wafer feeding basket and operation machine

Abstract

The utility model relates to the field of operation machinery, and provides a silicon wafer feeding basket and operation machinery. The silicon wafer feeding basket comprises an upper end plate, a lower end plate and a side face supporting plate, the upper end and the lower end of the side face supporting plate are connected to the upper end plate and the lower end plate respectively, a plurality of spacers are arranged on the side face supporting plate at intervals in the direction from the upper end plate to the lower end plate, and each spacer is perpendicularly arranged relative to the side face supporting plate. A slot for loading a silicon wafer is defined between every two adjacent spacers; wherein a feeding sensing device is arranged in the spacer, and the feeding sensing device is used for sending a signal to the machine table under the condition that the silicon wafer is loaded in the slot. According to the utility model, the sensor assemblies are arranged in the slots of the feeding basket, so that whether the silicon wafers exist in each slot or not can be detected in real time, and the loading condition of the silicon wafers in the feeding basket can be accurately judged. In this way, labor cost can be saved, the number and fragment rate of the battery pieces can be conveniently counted, and the functions of automatic material supplementing, rapid feeding and discharging and the like are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of operating machinery, in particular to a silicon wafer feeding basket and an operating machinery. Background Art

[0002] Currently, wafer loading baskets consist of upper and lower end plates, side (or bottom) support plates, and several slots evenly spaced on these plates. During wafer loading, unloading, and transportation, these existing baskets only serve to support and transport the wafers. They cannot monitor the loading status of the wafers before and after loading and unloading, affecting the loading and unloading rate and wafer counting, hindering further automation of the production line. Utility Model Content

[0003] The utility model provides a silicon wafer loading basket and operating machine to address the shortcomings of the prior art and achieve the following technical effects: by installing sensor assemblies in the slots of the loading basket, it can detect in real time whether a silicon wafer is present in each slot, thereby accurately determining the loading status of the silicon wafers in the loading basket. This not only saves labor costs, but also facilitates counting the number of battery cells and the fragmentation rate, and realizes functions such as automatic restocking and rapid loading and unloading.

[0004] The silicon wafer loading basket according to the first embodiment of the present invention includes:

[0005] An upper end plate, a lower end plate, and a side support plate, wherein the upper and lower ends of the side support plate are respectively connected to the upper end plate and the lower end plate, and a plurality of spacers are arranged on the side support plate in a direction from the upper end plate to the lower end plate, each spacer is arranged perpendicularly relative to the side support plate, and a slot for loading a silicon wafer is defined between every two adjacent spacers;

[0006] Wherein, a loading sensing device is provided in the spacer, and the loading sensing device is used to send a signal to the machine when a silicon wafer is loaded in the slot.

[0007] According to one embodiment of the present utility model, the loading sensing device includes a slot sensor, a silicon wafer sensing site, a communication circuit and a circuit connection site;

[0008] The silicon wafer sensing site is provided on the upper surface of the spacer for contacting and sensing the silicon wafer, the silicon wafer sensing site is connected to the slot sensor, and the slot sensor is connected to the circuit connection site via the communication circuit, and the circuit connection site is used to connect to the machine;

[0009] When a silicon wafer is loaded in the slot, the slot sensor senses the silicon wafer according to the silicon wafer sensing site and transmits a signal to the machine through the connecting circuit and the circuit connection site.

[0010] According to one embodiment of the present utility model, the slot sensor includes a current sensing chip, and the number of sensing sites on the silicon chip is two;

[0011] The two ends of the current sensing chip are respectively connected to the two silicon wafer sensing points through conductive wires. When a silicon wafer is loaded in the slot, the two silicon wafer sensing points are connected through the silicon wafer and together with the conductive wires and the current sensing chip form a connecting loop, so that the current sensing chip generates an electrical signal.

[0012] According to an embodiment of the present invention, the two silicon chip sensing sites are both arranged on the upper surface of the spacer, and the line connecting the two silicon chip sensing sites is parallel to the side support plate.

[0013] According to an embodiment of the present invention, a mounting groove is provided on the lower surface or the upper surface of the spacer, and the current sensing chip and the conductive wire are both installed in the mounting groove.

[0014] According to one embodiment of the present invention, the communication circuit is installed in the side support plate.

[0015] According to an embodiment of the present invention, the connecting circuit extends along the length direction of the side support plate, and the connecting circuit is connected to the current sensing chip in each layer of the spacer.

[0016] According to one embodiment of the present invention, the circuit connection site is located on the upper surface of the upper end plate.

[0017] According to one embodiment of the present invention, the side support plates include three groups of side support plates respectively arranged on the left and right sides and the rear side. Correspondingly, the spacers include three groups of spacers respectively arranged on the left and right sides and the rear side.

[0018] The operating machine according to the embodiment of the second aspect of the present invention includes the silicon wafer loading basket as described in the embodiment of the first aspect of the present invention.

[0019] The utility model provides a silicon wafer loading basket. By arranging a loading sensing device in the spacer, whether the silicon wafer is loaded or not can be accurately detected. Compared with the related art, the utility model has at least the following advantages.

[0020] (1) Accurately detect silicon wafer information: By installing sensor components in the slots of the loading basket, it is possible to detect in real time whether there are silicon wafers in each slot, thereby accurately judging the loading status of the silicon wafers in the loading basket. This not only saves labor costs, but also facilitates the counting of the number of solar cells and the fragmentation rate.

[0021] (2) Automatic operation capability: Through electrical signal detection, the utility model can accurately read the information of silicon wafers and realize functions such as automatic material replenishment and rapid loading and unloading. These are all automated operations that are difficult to achieve with traditional loading baskets. This helps to improve the efficiency of the production line.

[0022] (3) Information traceability: Through means such as flower basket numbering and machine information sharing, the utility model can accurately query the flow information of silicon wafers on the production line, including information on front-end and back-end machines, heat pipes, etc. This is very helpful for troubleshooting inefficient links and improving overall efficiency.

[0023] (4) Reduce false alarm rate: By installing multiple sets of silicon chip contact sites in each slot, multiple silicon chip signals respond simultaneously, which can significantly reduce the false alarm rate and improve the accuracy of flower basket detection.

[0024] (5) Improve the immediacy and accuracy of detection: Compared with the optical detection method used in the closest existing technology, the utility model uses electrical signal detection, which has a lower misjudgment rate and higher immediacy and accuracy of detection.

[0025] (6) Intelligent operation: The utility model can perform detection during the loading and unloading process, and can perform intelligent operations such as automatic feeding, rapid unloading and judgment of transportation fragmentation rate, which are impossible to accomplish with traditional loading flower baskets.

[0026] In summary, the utility model realizes real-time detection of silicon wafer loading status by integrating sensor components in the slots of the loading basket, thereby improving the automation level and efficiency of the production line, and significantly improving the operation effect of the production line by reducing the false alarm rate and improving the immediacy and accuracy of detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 The utility model is a rear structural schematic diagram of a silicon wafer feeding basket provided by the utility model.

[0029] Figure 2The utility model is a schematic side view of the structure of the silicon wafer feeding basket provided by the present invention.

[0030] Figure 3 The utility model is a partial structural diagram of a silicon wafer feeding basket provided by the utility model.

[0031] Figure 4 The utility model is a schematic diagram of the top view of the silicon wafer feeding basket provided by the utility model.

[0032] Reference numerals:

[0033] 1. Upper end plate; 2. Spacer; 3. Side support plate; 5. Circuit connection site; 6. Silicon wafer sensing site; 7. Current sensing chip; 8. Connecting circuit. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the accompanying drawings to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0036] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0037] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] The following provides a silicon wafer loading basket and an operating machine provided by the present invention with reference to the accompanying drawings.

[0039] like Figures 1 to 4 As shown, the silicon wafer loading basket according to the first embodiment of the present utility model includes an upper end plate 1, a lower end plate and a side support plate 3.

[0040] The upper and lower ends of the side support plate 3 are respectively connected to the upper end plate 1 and the lower end plate, and a plurality of spacers 2 are arranged at intervals on the side support plate 3 along the direction from the upper end plate 1 to the lower end plate. Each spacer 2 is arranged vertically relative to the side support plate 3, and a slot for loading silicon wafers is defined between each two adjacent spacers 2.

[0041] Among them, a loading sensing device is provided in the spacer 2, and the loading sensing device is used to send a signal to the machine when a silicon wafer is loaded in the slot.

[0042] It can be understood that the self-detecting loading basket provided by the present invention is an improved silicon wafer loading tool capable of self-detecting the wafer loading status. The upper and lower end plates 1 serve as the top and bottom of the basket, enclosing and supporting the overall structure and providing the basket's overall framework to ensure structural stability. Side support plates 3 connect the side panels of the upper and lower end plates, typically multiple in number, to enhance structural stability and strength. Thus, these side support plates 3 not only enhance the overall structural stability of the basket but also provide a foundation for mounting the spacers 2.

[0043] The spacers 2 are spaced apart on the side support plates 3 to separate different silicon wafer slots and ensure orderly storage of the silicon wafers. The spacers 2 are perpendicular to the side support plates 3, and slots for loading silicon wafers are formed between adjacent spacers 2.

[0044] The loading sensing device is a key innovation of the present invention, which enables the loading basket to automatically detect the loading status of the silicon wafers, thereby improving the automation level and efficiency of the production line.

[0045] Compared to traditional optical detection methods, the present invention utilizes electrical signal detection. This means that when a silicon wafer is inserted into the turnbuckle slot, it contacts the sensor within the slot, generating an electrical signal that is then transmitted to the machine via a communication circuit 8. Furthermore, because it utilizes electrical signal detection, this method can quickly and accurately determine whether a silicon wafer is in a designated slot, reducing the risk of false positives and improving the timeliness of detection.

[0046] In addition, the loading sensing device is connected to the machine to form a loop, allowing the machine to obtain the loading status of the silicon wafers in real time, thereby realizing automatic replenishment, rapid loading and unloading, and other operations, which are difficult to achieve in traditional flower baskets.

[0047] Furthermore, the loading sensing device can not only monitor the loading status of silicon wafers in real time, but also accurately query the flow information of silicon wafers on the production line through means such as flower basket numbering and machine information sharing, making it easier to track and manage.

[0048] Currently, wafer loading baskets consist of upper and lower end plates, side (or bottom) support plates, and several slots evenly spaced on these plates. During wafer loading, unloading, and transportation, these existing baskets only serve to support and transport the wafers. They cannot monitor the loading status of the wafers before and after loading and unloading, affecting the loading and unloading rate and wafer counting, hindering further automation of the production line.

[0049] Therefore, in order to solve the technical problems existing in the above-mentioned related technologies, the present invention provides a silicon wafer loading basket. By setting a loading sensing device in the spacer 2, it can accurately detect whether the silicon wafer is loaded or not, and compared with the related technologies, the present invention has at least the following advantages.

[0050] (1) Accurately detect silicon wafer information: By installing sensor components in the slots of the loading basket, it is possible to detect in real time whether there are silicon wafers in each slot, thereby accurately judging the loading status of the silicon wafers in the loading basket. This not only saves labor costs, but also facilitates the counting of the number of solar cells and the fragmentation rate.

[0051] (2) Automatic operation capability: Through electrical signal detection, the utility model can accurately read the information of silicon wafers and realize functions such as automatic material replenishment and rapid loading and unloading. These are all automated operations that are difficult to achieve with traditional loading baskets. This helps to improve the efficiency of the production line.

[0052] (3) Information traceability: Through means such as flower basket numbering and machine information sharing, the utility model can accurately query the flow information of silicon wafers on the production line, including information on front-end and back-end machines, heat pipes, etc. This is very helpful for troubleshooting inefficient links and improving overall efficiency.

[0053] (4) Reduce false alarm rate: By installing multiple sets of silicon chip contact sites in each slot, multiple silicon chip signals respond simultaneously, which can significantly reduce the false alarm rate and improve the accuracy of flower basket detection.

[0054] (5) Improve the immediacy and accuracy of detection: Compared with the optical detection method used in the closest existing technology, the utility model uses electrical signal detection, which has a lower misjudgment rate and higher immediacy and accuracy of detection.

[0055] (6) Intelligent operation: The utility model can perform detection during the loading and unloading process, and can perform intelligent operations such as automatic feeding, rapid unloading and judgment of transportation fragmentation rate, which are impossible to accomplish with traditional loading flower baskets.

[0056] In summary, the utility model realizes real-time detection of silicon wafer loading status by integrating sensor components in the slots of the loading basket, thereby improving the automation level and efficiency of the production line, and significantly improving the operation effect of the production line by reducing the false alarm rate and improving the immediacy and accuracy of detection.

[0057] like Figure 3 As shown, according to some embodiments of the present invention, the loading sensing device includes a slot sensor, a silicon wafer sensing site 6, a communication circuit 8, and a circuit connection site 5. The silicon wafer sensing site 6 is provided on the upper surface of the spacer 2 for contacting and sensing the silicon wafer. The silicon wafer sensing site 6 is connected to the slot sensor, and the slot sensor is connected to the circuit connection site 5 via the communication circuit 8. The circuit connection site 5 is used to connect to the machine.

[0058] When a silicon wafer is loaded in the slot, the slot sensor senses the silicon wafer according to the silicon wafer sensing site 6 and transmits the signal to the machine through the connecting circuit 8 and the circuit connection site 5.

[0059] like Figure 3 As shown, further, the slot sensor includes a current sensing chip 7, and the number of silicon wafer sensing sites 6 is two. The two ends of the current sensing chip 7 are respectively connected to the two silicon wafer sensing points through conductive wires. When a silicon wafer is loaded in the slot, the two silicon wafer sensing points are connected through the silicon wafer, and together with the conductive wire and the current sensing chip 7, a connecting loop is formed, so that the current sensing chip 7 generates an electrical signal.

[0060] In this embodiment, the socket sensor includes a current sensing chip 7, the two ends of which are connected to two silicon chip sensing sites 6 via conductive wires. When the silicon chip is placed in the socket, the contact between the silicon chip and the two silicon chip sensing sites 6 forms a closed circuit. When the current sensing chip 7 detects the closed circuit, it generates an electrical signal.

[0061] The silicon chip sensing sites 6 are provided on the upper surface of the spacer 2, usually with two sensing sites, which are arranged parallel to the side support plate 3. When the silicon chip is inserted into the slot, the silicon chip will contact the two sensing sites at the same time, closing the circuit.

[0062] Connecting circuit 8 is installed in the side support plate 3 and extends along the length of the support plate. Connecting circuit 8 is connected to the current sensing chip 7 in each layer of spacers 2 to ensure that the signal can be smoothly transmitted from the slot sensor to the circuit connection point 5.

[0063] The circuit connection site is located on the upper surface of the upper end plate 1 and is used to form a loop with the machine platform to transmit the signal detected by the slot sensor to the machine platform.

[0064] Specifically, the workflow is as follows: (1) Preparation phase: Place the loading basket with the slot sensor on the machine. The connection contacts on the machine contact the circuit connection site 5 of the loading basket to form a loop. (2) Insert the silicon wafer: When the silicon wafer is inserted into the slot, the silicon wafer contacts the two silicon wafer sensing sites 6, forming a closed circuit. (3) Signal generation: The closed circuit triggers the current sensing chip 7, causing it to generate an electrical signal. (4) Signal transmission: The electrical signal is transmitted to the circuit connection site 5 through the connecting circuit 8. (5) The machine receives the signal: After receiving the signal, the machine determines that there is a silicon wafer in the slot.

[0065] This structure enables simultaneous wafer inspection during loading and unloading, improving automation. Furthermore, electrical detection reduces the error rate and is more reliable than optical detection. Furthermore, real-time monitoring of wafer status facilitates automated refilling, rapid loading and unloading, and helps monitor and assess fragmentation during transport.

[0066] like Figure 3 As shown, in some specific embodiments, the two silicon wafer sensing sites 6 are both located on the upper surface of the spacer 2 , and the line connecting the two silicon wafer sensing sites 6 is parallel to the side support plate 3 .

[0067] It is understood that the two silicon wafer sensing sites 6 are both located on the upper surface of the septum 2, that is, the surface in direct contact with the silicon wafer. The line connecting the two sensing sites is parallel to the side support plate 3, which means that they are arranged in a straight line on the septum 2.

[0068] The purpose of its design is as follows: (1) Ensure good contact: By setting the sensing site on the upper surface of the spacer 2, it can be ensured that when the silicon wafer is placed in the slot, the silicon wafer and the sensing site are in good contact, thereby forming an effective closed circuit. (2) Improve detection accuracy: The connection line between the two sensing sites is parallel to the side support plate 3. This arrangement helps to improve the accuracy of detection. When the silicon wafer is correctly placed, it will contact the two sensing sites at the same time, forming a closed circuit, which in turn triggers the current sensing chip 7 to generate an electrical signal. (3) Simplify circuit connection: This design allows the conductive wire to be directly connected from the sensing site to the current sensing chip 7, simplifying the circuit connection process and reducing the possibility of false alarms.

[0069] Specifically, the two ends of the current sensing chip 7 are connected to two sensing points on the silicon wafer via conductive wires. When the silicon wafer is placed in the slot, the two sensing points are connected through the silicon wafer, forming a closed circuit, and the current sensing chip 7 receives an electrical signal. The electrical signal generated by the current sensing chip 7 is transmitted to the machine through the communication circuit 8, which determines the presence of the silicon wafer.

[0070] In this way, by arranging two silicon chip sensing sites 6 on the upper surface of the spacer 2 and the connection line between them is parallel to the side support plate 3, this design not only simplifies the circuit layout, but also improves the accuracy and efficiency of detection.

[0071] like Figure 3 As shown, in some specific embodiments of the present invention, a mounting groove is provided on the lower surface or the upper surface of the spacer 2, and the current sensing chip 7 and the conductive wire are both installed in the mounting groove.

[0072] In this embodiment, the mounting slots protect the current sensing chip 7 and the conductive wires from external factors, such as physical damage or contamination. The mounting slot design simplifies the installation of circuit components, making installation easier. The mounting slots facilitate later inspection, maintenance, or replacement of circuit components.

[0073] The mounting groove can be located on the lower or upper surface of the spacer 2, with the specific location depending on the design requirements and the actual application scenario. The mounting groove should be designed to ensure stable installation of the current sensing chip 7 and the conductive wire, while also taking into account protective measures such as waterproofing and dustproofing.

[0074] The current sensing chip 7 and the conductive wire can be installed in the installation groove by gluing, snapping or other fixing methods.

[0075] By installing the current sensing chip 7 and the conductive wires in the mounting slots, the failure rate due to external factors can be reduced, improving the overall reliability of the system. Furthermore, the mounting slot design makes it easier to access the current sensing chip 7 and the conductive wires during maintenance, facilitating inspection and replacement.

[0076] In addition, the design of the mounting groove can provide additional physical protection for the current sensing chip 7 and the conductive wire to avoid damage caused by collision or vibration.

[0077] like Figure 3 As shown, according to some embodiments of the present invention, the communication circuit 8 is installed in the side support plate 3.

[0078] like Figure 3 As shown, further, the connecting circuit 8 extends along the length direction of the side support plate 3, and the connecting circuit 8 is connected to the current sensing chip 7 in each layer of the spacer 2.

[0079] In this embodiment, the interconnect circuit 8 is designed and installed inside the side support plate 3, which means the circuit is not exposed and helps protect it from external factors. The interconnect circuit 8 extends along the length of the side support plate 3, which helps ensure a reasonable and compact circuit layout and facilitates efficient signal transmission. The interconnect circuit 8 is connected to the current sensing chip 7 in each layer of the spacer 2, ensuring that the signal can be transmitted to the machine through the interconnect circuit 8 regardless of which slot the silicon chip is placed in.

[0080] Specifically, the operating principle is as follows: When a silicon wafer is inserted into a slot, it contacts two silicon wafer sensing sites 6, forming a closed circuit. A current sensing chip 7 detects the presence of the silicon wafer by sensing changes in the current in the closed circuit. The signal generated by the current sensing chip 7 is transmitted via a conductive line to a connecting circuit 8. This connecting circuit 8 extends along the length of the side support plate 3, ensuring that the signal generated by the current sensing chip 7 in each layer of the spacer 2 is collected and transmitted to the circuit connection sites 5. Ultimately, the signal is transmitted through the circuit connection sites 5 to the machine, which then determines whether the silicon wafer is present in a specific slot.

[0081] In this way, on the one hand, the internal installation of the connecting circuit 8 and its extension along the length direction of the side support plate 3 ensure the stability and reliability of signal transmission; on the other hand, the structure is compact: this layout of the circuit makes the overall structure of the feeding basket more compact, which is convenient for production and maintenance.

[0082] Furthermore, the internal installation of the communication circuit 8 reduces the impact of external factors on it and reduces the difficulty of maintenance. In addition, the communication circuit 8 is connected to the current sensing chip 7 in each layer of the spacer 2, ensuring that the signals in all slots can be effectively detected and transmitted.

[0083] like Figure 4 As shown, according to some embodiments of the present invention, the circuit connection site 5 is located on the upper surface of the upper end plate 1. It can be understood that this location is mainly selected to facilitate connection with an external machine to form a loop and transmit signals.

[0084] Specifically, the connection operation is as follows: When the self-test basket is connected to the machine, the connection contacts on the machine contact the circuit connection points 5 on the upper end plate 1, forming a closed circuit. When a silicon wafer is inserted into the slot and contacts the wafer, an electrical signal is generated. This signal is transmitted via the connecting circuit 8 to the circuit connection points 5, and then transmitted to the machine through the loop formed with the machine. After receiving the signal, the machine can determine whether the silicon wafer is in the specific slot, thereby realizing the function of automatically detecting the silicon wafer loading status.

[0085] like Figure 1 and 2 As shown, according to some embodiments of the present invention, the side support plates 3 include three groups of side support plates 3 respectively arranged on the left and right sides and the rear side. Correspondingly, the spacers 2 include three groups of spacers 2 respectively arranged on the left and right sides and the rear side.

[0086] In this embodiment, the loading basket includes three sets of side support plates 3 on the left, right, and rear sides. These support plates together form the basket's main structure, providing stable support for the silicon wafers. Multiple sets of spacers 2 are positioned on each set of side support plates 3. These spacers 2 are perpendicular to the side support plates 3 and parallel to each other. Each pair of adjacent spacers 2 defines a slot for loading silicon wafers.

[0087] Each spacer 2 is positioned perpendicular to the side support plate 3 and is equipped with a loading sensor to detect the presence of a silicon wafer within a slot. A slot for loading silicon wafers is defined between every two adjacent spacers 2. These slots are distributed across three groups of spacers 2, one on each side and the other on the rear, increasing the basket's loading capacity and detection range.

[0088] By installing spacers 2 on the left, right, and rear sides, the basket's loading capacity is increased, improving production efficiency. The multiple spacers 2 and slots provide more precise detection and reduce false positives. The three sets of side support plates 3 on the left, right, and rear sides provide a more stable structure, ensuring the basket's durability.

[0089] like Figures 1 to 3 As shown, the operating machine according to the second embodiment of the utility model includes the silicon wafer loading basket described in the first embodiment of the utility model.

[0090] The operating machinery according to the second aspect of the present invention has similar effects to the silicon wafer loading basket described in the first aspect of the present invention, and will not be described in detail here.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A silicon wafer feeding basket, characterized in that: include: An upper end plate, a lower end plate, and a side support plate, wherein the upper and lower ends of the side support plate are respectively connected to the upper end plate and the lower end plate, and a plurality of spacers are arranged on the side support plate in a direction from the upper end plate to the lower end plate, each spacer is arranged perpendicularly relative to the side support plate, and a slot for loading a silicon wafer is defined between every two adjacent spacers; Wherein, a loading sensing device is provided in the spacer, and the loading sensing device is used to send a signal to the machine when a silicon wafer is loaded in the slot.

2. The silicon wafer feeding basket according to claim 1, characterized in that: The feeding sensing device includes a slot sensor, a silicon wafer sensing site, a connecting circuit and a circuit connection site; The silicon wafer sensing site is provided on the upper surface of the spacer for contacting and sensing the silicon wafer, the silicon wafer sensing site is connected to the slot sensor, and the slot sensor is connected to the circuit connection site via the communication circuit, and the circuit connection site is used to connect to the machine; When a silicon wafer is loaded in the slot, the slot sensor senses the silicon wafer according to the silicon wafer sensing site and transmits a signal to the machine through the connecting circuit and the circuit connection site.

3. The silicon wafer feeding basket according to claim 2, characterized in that: The slot sensor includes a current sensing chip, and the number of sensing sites on the silicon chip is two; The two ends of the current sensing chip are respectively connected to the two silicon chip sensing sites through conductive wires. When a silicon chip is loaded in the slot, the two silicon chip sensing sites are connected through the silicon chip and form a connecting loop together with the conductive wires and the current sensing chip, so that the current sensing chip generates an electrical signal.

4. The silicon wafer feeding basket according to claim 3, characterized in that: The two silicon chip sensing sites are both arranged on the upper surface of the spacer, and the line connecting the two silicon chip sensing sites is parallel to the side support plate.

5. The silicon wafer feeding basket according to claim 3, characterized in that: The lower surface or the upper surface of the spacer is provided with a mounting groove, and the current sensing chip and the conductive wire are both mounted in the mounting groove.

6. The silicon wafer feeding basket according to any one of claims 2 to 5, characterized in that: The communication circuit is installed in the side support plate.

7. The silicon wafer feeding basket according to claim 6, characterized in that: The connecting circuit extends along the length direction of the side support plate, and the connecting circuit is connected to the current sensing chip in each layer of the spacer.

8. The silicon wafer feeding basket according to claim 6, characterized in that: The circuit connection site is located on the upper surface of the upper end plate.

9. The silicon wafer feeding basket according to any one of claims 1 to 5, characterized in that: The side support plates include three groups of side support plates respectively arranged on the left and right sides and the rear side. Correspondingly, the spacers include three groups of spacers respectively arranged on the left and right sides and the rear side.

10. A working machine, characterized in that: It comprises the silicon wafer loading basket as described in any one of claims 1 to 9.

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