Wafer loading and unloading and transfer arm moving device

Abstract

The utility model provides a wafer loading and unloading and transfer arm moving device, which comprises a loading and unloading arm moving mechanism and a transfer arm moving mechanism, the feeding and discharging carrying arm mechanism comprises a feeding and discharging XYZ axis module, a feeding and discharging rotating module, a vacuum suction cup and a vacuum pressure gauge. The feeding and discharging XYZ axis module and the feeding and discharging rotating module are used for achieving the space XYZ axis and rotating motion of the vacuum suction cup. The vacuum pressure gauge is used for monitoring vacuum pressure in real time; the transfer arm moving mechanism comprises a transfer horizontal module, a lifting module and a transfer adsorption platform assembly. The transfer horizontal module and the transfer lifting module are used for achieving horizontal and lifting movement of the transfer adsorption platform assembly. According to the utility model, the XYZ-axis module and the rotating module are adopted to realize the horizontal, lifting and rotating motion of the vacuum chuck, so that the loading and unloading carrying range of wafers is effectively improved; according to the utility model, the transfer moving arm mechanism is arranged, so that the wafer carrying range is further expanded; the vacuum pressure gauge is adopted to monitor the vacuum pressure in real time, and the wafers are effectively prevented from slipping off in the carrying process.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer preparation, in particular to a wafer loading and unloading and transfer arm device. Background Art

[0002] With the rapid development of science and technology, the semiconductor industry has become increasingly important worldwide. In this industry, wafers are the key raw materials for manufacturing integrated circuits. During the wafer preparation process, wafer dicing is indispensable for the wafer packaging process. Before dicing, a film is applied to the back of the wafer to adhere the chip to the film, maintaining the integrity of the die during dicing and reducing problems such as chipping, displacement, and falling during dicing.

[0003] Wafers are stored in a cassette before lamination. How to safely remove the wafers from the cassette, how to safely deliver the wafers to the designated lamination area, and how to safely put the lamination-lamination wafers back into the cassette for storage is therefore crucial. However, in the existing technology, the use of robots to transport wafers has problems such as limited handling range and lack of real-time monitoring. Utility Model Content

[0004] The utility model provides a wafer loading and unloading and transfer arm device to more accurately solve the above-mentioned problems of limited transport range and lack of real-time monitoring in transporting wafers.

[0005] The utility model is achieved through the following technical solutions:

[0006] The utility model provides a wafer loading and unloading and transfer arm device, comprising an loading and unloading arm mechanism and a transfer arm mechanism; the loading and unloading arm mechanism comprises an loading and unloading X-axis module, an loading and unloading Y-axis module, an loading and unloading Z-axis module, an loading and unloading rotation module, a vacuum suction cup and a vacuum pressure gauge; the loading and unloading X-axis module, the loading and unloading Y-axis module, the loading and unloading Z-axis module and the loading and unloading rotation module cooperate to drive the vacuum suction cup to move axially and rotationally; the vacuum pressure gauge is used to monitor the pressure of the vacuum suction cup in real time;

[0007] The transfer arm mechanism includes a frame assembly, a transfer horizontal module, a transfer lifting module and a transfer adsorption platform assembly. The transfer adsorption platform assembly is connected to the transfer lifting module, and the transfer lifting module is connected to the transfer horizontal module through the frame assembly.

[0008] Furthermore, the loading and unloading X-axis module is placed horizontally, the loading and unloading Y-axis module is arranged above the loading and unloading X-axis module, and the loading and unloading Y-axis module is perpendicular to the loading and unloading X-axis module in the horizontal direction, the loading and unloading Y-axis module is fixedly connected to the loading and unloading X-axis module, and the loading and unloading Y-axis module moves along the loading and unloading X-axis module.

[0009] Furthermore, the loading and unloading Z-axis module is arranged above the loading and unloading Y-axis module, and the loading and unloading Z-axis module is perpendicular to the loading and unloading Y-axis module in the vertical direction. The loading and unloading Z-axis module is fixedly connected to the loading and unloading Y-axis module, and the loading and unloading Z-axis module moves along the loading and unloading X-axis module and the loading and unloading Y-axis module.

[0010] Furthermore, the loading and unloading rotating module is arranged on the side of the loading and unloading Z-axis module, the loading and unloading rotating module is fixedly connected to the loading and unloading Z-axis module, and the loading and unloading rotating module moves along the loading and unloading X-axis module, the loading and unloading Y-axis module and the loading and unloading Z-axis module.

[0011] Furthermore, the vacuum suction cup is arranged above the loading and unloading rotating module, and the vacuum suction cup is rotatably connected to the loading and unloading rotating module. The vacuum suction cup moves along the loading and unloading X-axis module, the loading and unloading Y-axis module, the loading and unloading Z-axis module and the loading and unloading rotating module.

[0012] Furthermore, the frame assembly includes a base frame, the base frame is placed horizontally, the transfer horizontal module is arranged above the base frame, and the transfer horizontal module is fixedly connected to the base frame.

[0013] Furthermore, the frame assembly also includes a module reinforcement rib, which is L-shaped, with one end of the module reinforcement rib fixedly connected to the transfer horizontal module and the other end fixedly connected to the transfer lifting module.

[0014] Furthermore, the transfer lifting module is arranged on the side of the transfer horizontal module, and the transfer lifting module is perpendicular to the transfer horizontal module in the vertical direction. The transfer lifting module is fixedly connected to the transfer horizontal module, and the transfer lifting module moves along the transfer horizontal module.

[0015] Furthermore, the frame assembly also includes a platform reinforcement rib, which is L-shaped. One end of the platform reinforcement rib is fixedly connected to the transfer lifting module, and the other end is fixedly connected to the transfer adsorption platform assembly.

[0016] Furthermore, the transfer adsorption platform assembly is arranged on the side of the transfer lifting module, and the transfer adsorption platform assembly is perpendicular to the transfer lifting module. The transfer adsorption platform assembly is fixedly connected to the transfer lifting module, and the transfer adsorption platform assembly moves along the transfer lifting module and the transfer horizontal module.

[0017] Beneficial effects of the utility model:

[0018] 1. The utility model proposes to adopt the coordinated movement of the loading and unloading X-axis module, the loading and unloading Y-axis module, the loading and unloading Z-axis module and the rotation module to realize the horizontal, lifting and rotating movement of the vacuum suction cup, which can effectively improve the wafer loading and unloading range;

[0019] 2. The utility model proposes to set up a transfer arm mechanism, which includes a transfer horizontal module, a transfer lifting module and a transfer adsorption platform assembly. The transfer horizontal module and the transfer lifting module cooperate to realize the horizontal and lifting movement of the transfer adsorption platform assembly, which can further improve the wafer handling range;

[0020] 3. The utility model proposes to use a vacuum pressure gauge to monitor the vacuum pressure in real time, which effectively prevents the wafer from slipping during transportation and realizes safe and stable transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is an overall structural diagram of a wafer loading and unloading and transfer arm device in one embodiment of the present utility model;

[0022] Figure 2 This is an overall structural diagram of the loading and unloading arm mechanism in one embodiment of the present utility model;

[0023] Figure 3 This is another overall structural diagram of the loading and unloading arm mechanism in one embodiment of the utility model;

[0024] Figure 4 This is an overall structural diagram of the transfer arm mechanism in one embodiment of the present utility model.

[0025] Explanation of the reference numbers: 1. Loading and unloading X-axis module; 2. Loading and unloading Y-axis module; 3. Loading and unloading Z-axis module; 4. Loading and unloading rotation module; 5. Vacuum suction cup; 6. Vacuum pressure gauge; 7. Frame assembly; 8. Transfer level module; 9. Transfer lifting module; 10. Transfer adsorption platform assembly; 11. X-axis transmission rod; 12. X-axis mounting seat; 13. X-axis drive motor; 21. Y-axis transmission rod; 22. Y-axis slide rail; 23. Y-axis Slider; 24. Y-axis mounting seat; 25. Y-axis drive motor; 31. Z-axis transmission rod; 32. Z-axis slide rail; 33. Z-axis slider; 34. Z-axis mounting seat; 35. Z-axis drive motor; 41. Rotary motor; 42. Rotary seat; 71. Base frame; 72. Module reinforcement rib; 73. Platform reinforcement rib; 81. Transfer horizontal mounting plate; 91. Transfer lifting mounting plate; 101. Platform mounting plate; 102. Vacuum adsorption platform. DETAILED DESCRIPTION

[0026] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention will be further described below with reference to the accompanying drawings.

[0027] Please refer to Figures 1-4 The utility model proposes a wafer loading and unloading and transfer arm moving device, including a loading and unloading arm moving mechanism and a transfer arm moving mechanism; the loading and unloading arm moving mechanism includes an loading and unloading X-axis module 1, a loading and unloading Y-axis module 2, a loading and unloading Z-axis module 3, a loading and unloading rotation module 4, a vacuum suction cup 5 and a vacuum pressure gauge 6; the loading and unloading X-axis module 1, the loading and unloading Y-axis module 2, the loading and unloading Z-axis module 3 and the loading and unloading rotation module 4 cooperate to enable the vacuum suction cup 5 to realize spatial XYZ axis movement and rotation movement; the vacuum pressure gauge 6 is used to display the pressure of the vacuum suction cup 5;

[0028] The transfer arm moving mechanism includes a frame assembly 7, a transfer horizontal module 8, a transfer lifting module 9, and a transfer adsorption platform assembly 10. The transfer adsorption platform assembly 10 is connected to the transfer lifting module 9, and the transfer lifting module 9 is connected to the transfer horizontal module 8 through the frame assembly 7.

[0029] In this embodiment, the loading and unloading arm mechanism includes an loading and unloading X-axis module 1, an loading and unloading Y-axis module 2, an loading and unloading Z-axis module 3, an loading and unloading rotation module 4, a vacuum suction cup 5 and a vacuum pressure gauge 6; the loading and unloading X-axis module 1 is placed horizontally, the loading and unloading Y-axis module 2 is installed above the X-axis module, and the loading and unloading Y-axis module 2 is perpendicular to the X-axis module in the horizontal direction. At this time, the loading and unloading Y-axis module 2 can move along the X-axis; the loading and unloading Z-axis module 3 is installed above the loading and unloading Y-axis module 2, and the loading and unloading Z-axis module 3 is perpendicular to the Y-axis module in the vertical direction. At this time, the loading and unloading Z-axis module 3 can move along the X-axis and Y-axis; the loading and unloading rotation module 4 is installed on the side of the loading and unloading Z module. At this time, the loading and unloading rotation module 4 can To move along the X-axis, Y-axis and Z-axis; the vacuum suction cup 5 is installed above the rotating module. At this time, the loading and unloading X-axis module 1, the loading and unloading Y-axis module 2, the loading and unloading Z-axis module 3 and the loading and unloading rotating module 4 cooperate to move, so that the vacuum suction cup 5 can realize the XYZ-axis movement and rotation movement of the vacuum suction cup 5; in a specific embodiment, the vacuum suction cup 5 is in the shape of a tooth fork, and the unprocessed wafers are stored in the material box, and the wafers are placed horizontally in the material box. The vacuum suction cup 5 moves to the bottom of the wafer and absorbs the wafer by vacuum, takes the wafer out of the material box and transports it to a further processing and placement place. After all the wafers are processed, the vacuum suction cup 5 transports the wafer back to the material box for storage; during this process, the vacuum pressure gauge 6 monitors the pressure of the vacuum suction cup 5 in real time;

[0030] The transfer arm mechanism includes a frame assembly 7, a transfer horizontal module 8, a transfer lifting module 9, and a transfer adsorption platform assembly 10. The frame assembly 7 includes a base frame 71, and the transfer horizontal module 8 is installed above the base frame 71; the transfer lifting module 9 is arranged on the side of the transfer horizontal module 8, and the transfer lifting module 9 is perpendicular to the transfer horizontal module 8. The frame assembly 7 also includes a module reinforcement rib 72, and the transfer lifting module 9 is fixedly connected to the transfer horizontal module 8 through the reinforcement rib. At this time, the transfer lifting module 9 can achieve horizontal movement; the transfer adsorption platform assembly 10 is arranged on the side of the transfer lifting module 9, and the transfer lifting module 9 is perpendicular to the transfer horizontal module 8. The transfer adsorption platform assembly 10 is perpendicular to the transfer lifting module 9. The frame assembly 7 further includes a platform reinforcement rib 73. The transfer adsorption platform assembly 10 is fixedly connected to the transfer lifting module 9 via the platform reinforcement rib 73. At this time, with the coordinated movement of the transfer horizontal module 8 and the transfer lifting module 9, the transfer adsorption platform assembly 10 can be realized to move horizontally and to move up and down. In a specific embodiment, the position of the wafer needs to be corrected after it is taken out of the material box. After the position correction is completed, the transfer adsorption platform assembly 10 moves to the top of the wafer and transports the wafer to a further processing and placement location by vacuum adsorption.

[0031] The present invention proposes to adopt the coordinated movement of the loading and unloading X-axis module 1, the loading and unloading Y-axis module 2, the loading and unloading Z-axis module 3 and the rotation module to realize the horizontal, lifting and rotational movement of the vacuum suction cup 5, which can effectively improve the wafer loading and unloading handling range; the present invention proposes to set up a transfer arm moving mechanism, the transfer arm moving mechanism includes a transfer horizontal module 8, a transfer lifting module 9 and a transfer adsorption platform assembly 10, the transfer horizontal module 8 and the transfer lifting module 9 cooperate to move to realize the horizontal and lifting movement of the transfer adsorption platform assembly 10, which can further improve the wafer handling range; the present invention proposes to adopt a vacuum pressure gauge 6 to monitor the vacuum pressure in real time, which effectively prevents the wafer from slipping during the handling process and realizes safe and stable handling.

[0032] Please refer to Figure 2 The loading and unloading X-axis module 1 is placed horizontally, the loading and unloading Y-axis module 2 is arranged above the loading and unloading X-axis module 1, and the loading and unloading Y-axis module 2 is perpendicular to the loading and unloading X-axis module 1 in the horizontal direction. The loading and unloading Y-axis module 2 is fixedly connected to the loading and unloading X-axis module 1, and is used for the loading and unloading Y-axis module 2 to move along the X-axis.

[0033] During specific implementation: the loading and unloading X-axis module 1 is placed horizontally, and the loading and unloading X-axis module 1 includes an X-axis mounting seat 12, an X-axis transmission rod 11 and an X-axis drive motor 13. The X-axis transmission rod 11 is connected to the X-axis drive motor 13, and the X-axis mounting plate is connected to the X-axis transmission rod 11; the loading and unloading Y-axis module 2 is arranged above the loading and unloading X-axis module 1, and the loading and unloading Y-axis module 2 is perpendicular to the loading and unloading X-axis module 1 in the horizontal direction, and the loading and unloading Y-axis module 2 is fixedly connected to the X-axis mounting seat 12; when the X-axis transmission rod 11 is driven to move along the X-axis direction, the loading and unloading Y-axis module 2 moves synchronously along the X-axis.

[0034] Please refer to Figure 2 The loading and unloading Z-axis module 3 is arranged above the loading and unloading Y-axis module 2, and the loading and unloading Z-axis module 3 is perpendicular to the loading and unloading Y-axis module 2 in the vertical direction. The loading and unloading Z-axis module 3 is fixedly connected to the loading and unloading Y-axis module 2, and is used for the loading and unloading Z-axis module 3 to move along the X-axis and Y-axis.

[0035] In specific implementation: the loading and unloading Y-axis module 2 includes a Y-axis slide rail 22, a Y-axis slider 23, a Y-axis mounting seat 24, a Y-axis transmission rod 21 and a Y-axis drive motor 25; the Y-axis transmission rod 21 is connected to the Y-axis drive motor 25, the Y-axis slider 23 is connected to the Y-axis transmission rod 21, and the Y-axis slider 23 is embedded in the Y-axis slide rail 22 to form a slidable connection, and the Y-axis mounting seat 24 is fixedly connected to the Y-axis slider 23; the loading and unloading Z-axis module 3 is installed above the Y-axis mounting seat 24, and the upper The unloading Z-axis module 3 is perpendicular to the loading and unloading Y-axis module 2 in the vertical direction. When the Y-axis drive motor 25 drives the Y-axis transmission rod 21 to move along the Y-axis direction, the Y-axis transmission rod 21 drives the Y-axis slider 23 to move along the Y-axis direction, and the Y-axis slider 23 drives the Y-axis mounting seat 24 to move along the Y-axis direction. At this time, the unloading Z-axis module 3 moves synchronously along the Y-axis; the unloading X-axis module 1 and the loading and unloading Y-axis module 2 cooperate to realize the movement of the unloading Z-axis module 3 along the X-axis and Y-axis.

[0036] Please refer to Figure 3 The loading and unloading rotating module 4 is arranged on the side of the loading and unloading Z-axis module 3. The loading and unloading rotating module 4 is fixedly connected to the loading and unloading Z-axis module 3 and is used for the loading and unloading rotating module 4 to move along the X-axis, Y-axis and Z-axis.

[0037] During the specific implementation: the loading and unloading Z-axis module 3 includes a Z-axis slide rail 32, a Z-axis slider 33, a Z-axis mounting seat 34, a Z-axis transmission rod 31 and a Z-axis driving motor 35; the Z-axis transmission rod 31 is connected to the Z-axis driving motor 35, the Z-axis slider 33 is connected to the Z-axis transmission rod 31, and the Z-axis slider 33 is embedded in the Z-axis slide rail 32 to form a slidable connection, and the Z-axis mounting seat 34 is fixedly connected to the Z-axis slider 33; the loading and unloading rotation module 4 is installed on the side of the Z-axis mounting seat 34. When the Z-axis driving motor 35 drives the Z-transmission rod to move along the Z-axis direction, the Z-axis transmission rod 31 drives the Z-axis slider 33 to move along the Z-axis direction, and the Z-axis slider 33 drives the Z-axis mounting seat 34 to move along the Z-axis direction. At this time, the loading and unloading rotation module 4 moves synchronously along the Z-axis; the loading and unloading X-axis module 1, the loading and unloading Y-axis module 2 and the loading and unloading Z-axis module 3 cooperate to move, so that the loading and unloading rotation module 4 can move along the X-axis, Y-axis and Z-axis.

[0038] Please refer to Figure 3 The vacuum suction cup 5 is arranged above the loading and unloading rotating module 4, and the vacuum suction cup 5 is rotatably connected to the loading and unloading rotating module 4, so that the vacuum suction cup 5 can realize X-axis, Y-axis, Z-axis and rotational motion.

[0039] During specific implementation: the loading and unloading rotating module 4 includes a rotating motor 41 and a rotating base 42, the rotating base 42 is connected to the rotating motor 41, and the vacuum suction cup 5 is connected to the rotating base 42. When the rotating motor 41 drives the rotating base 42 to rotate, the vacuum suction cup 5 rotates synchronously; when the loading and unloading X-axis module 1, the loading and unloading Y-axis module 2, the loading and unloading Z-axis module 3 and the loading and unloading rotating module 4 move in coordination, the vacuum suction cup 5 is realized along the X-axis, Y-axis, Z-axis and rotation movement; in a specific embodiment, the vacuum suction cup 5 is in the shape of a tooth fork, the unprocessed wafer is stored in the material box, and the wafer is placed horizontally in the material box, the vacuum suction cup 5 moves to the bottom of the wafer, and absorbs the wafer by vacuum, takes the wafer out of the material box and transports it to a further processing and placement place, after all the wafer processing is completed, the vacuum suction cup 5 transports the wafer back to the material box for storage; during this process, the vacuum pressure gauge 6 monitors the pressure of the vacuum suction cup 5 in real time.

[0040] Please refer to Figure 4 The frame assembly 7 includes a base frame 71, which is placed horizontally. The transfer horizontal module 8 is arranged above the base frame 71, and the transfer horizontal module 8 is fixedly connected to the base frame 71; the frame assembly 7 also includes a module reinforcement rib 72, and the module reinforcement rib 72 is L-shaped. One end of the module reinforcement rib 72 is fixedly connected to the transfer horizontal module 8, and the other end is fixedly connected to the transfer lifting module 9; the transfer lifting module 9 is arranged on the side of the transfer horizontal module 8, and the transfer lifting module 9 is perpendicular to the transfer horizontal module 8 in the vertical direction. The transfer lifting module 9 is fixedly connected to the transfer horizontal module 8 for horizontal movement of the transfer lifting module 9.

[0041] During specific implementation: the frame assembly 7 includes a base frame 71, the base frame 71 is placed horizontally, the transfer horizontal module 8 is arranged above the base frame 71, and the transfer horizontal module 8 is fixedly connected to the base frame 71; the transfer horizontal module 8 is provided with a transfer horizontal mounting plate 81, the transfer horizontal module 8 can drive the transfer horizontal mounting plate 81 to move horizontally, the transfer lifting module 9 is arranged on the side of the transfer horizontal module 8, and the transfer lifting module 9 is perpendicular to the transfer horizontal module 8 in the vertical direction; the frame assembly 7 also includes a module reinforcement rib 72, the module reinforcement rib 72 is L-shaped, one end of the module reinforcement rib 72 is fixedly connected to the transfer horizontal mounting plate 81, and the other end is fixedly connected to the transfer lifting module 9. In a specific embodiment, a threaded connection is adopted, and the transfer horizontal mounting plate 81 is provided with a plurality of mounting holes, and the mounting position is adjustable; at this time, the transfer horizontal module 8 drives the transfer horizontal mounting plate 81 to move horizontally, and the transfer horizontal mounting plate 81 drives the transfer lifting module 9 to move horizontally.

[0042] Please refer to Figure 4The frame assembly 7 also includes a platform reinforcement rib 73, which is L-shaped. One end of the platform reinforcement rib 73 is fixedly connected to the transfer lifting module 9, and the other end is fixedly connected to the transfer adsorption platform assembly 10; the transfer adsorption platform assembly 10 is arranged on the side of the transfer lifting module 9, and the transfer adsorption platform assembly 10 is perpendicular to the transfer lifting module 9. The transfer adsorption platform assembly 10 is fixedly connected to the transfer lifting module 9 and is used for horizontal movement and lifting movement of the transfer adsorption platform assembly 10.

[0043] In specific implementation: the transfer lifting module 9 is provided with a transfer lifting mounting plate 91, and the transfer lifting module 9 can drive the transfer lifting mounting plate 91 to perform lifting movement; the transfer adsorption platform assembly 10 includes a platform mounting plate 101 and a vacuum adsorption platform 102, and the platform mounting plate 101 is fixedly connected to the vacuum adsorption platform 102. In a specific embodiment, a threaded connection is adopted; the frame assembly 7 also includes a platform reinforcement rib 73, and the platform reinforcement rib 73 is L-shaped, and one end of the platform reinforcement rib 73 is fixedly connected to the platform mounting plate 101, and the other end is fixedly connected to the transfer lifting mounting plate 91; the transfer adsorption platform assembly 10 is provided on the transfer lifting The transfer adsorption platform assembly 10 is vertical to the transfer lifting module 9; at this time, the transfer lifting module 9 drives the transfer lifting mounting plate 91 to perform lifting movement, and the lifting mounting plate drives the transfer adsorption platform assembly 10 to perform lifting movement, and the transfer lifting module 9 and the transfer horizontal module 8 cooperate to move, so as to realize the horizontal and lifting movement of the transfer adsorption platform assembly 10; in a specific embodiment, the position of the wafer needs to be corrected after it is taken out of the material box. After the position correction is completed, the vacuum adsorption platform 102 moves to the top of the wafer, and the wafer is transported to a further processing and placement place through vacuum adsorption, thereby further improving the wafer handling range.

[0044] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer loading and unloading and transfer arm device, characterized in that: It includes an loading and unloading arm lifting mechanism and a transfer arm lifting mechanism; the loading and unloading arm lifting mechanism includes an loading and unloading X-axis module, a loading and unloading Y-axis module, a loading and unloading Z-axis module, a loading and unloading rotation module, a vacuum suction cup and a vacuum pressure gauge; the loading and unloading X-axis module, the loading and unloading Y-axis module, the loading and unloading Z-axis module and the loading and unloading rotation module cooperate to drive the axial and rotational movements of the vacuum suction cup; the vacuum pressure gauge is used to monitor the pressure of the vacuum suction cup in real time; The transfer arm mechanism includes a frame assembly, a transfer horizontal module, a transfer lifting module and a transfer adsorption platform assembly. The transfer adsorption platform assembly is connected to the transfer lifting module, and the transfer lifting module is connected to the transfer horizontal module through the frame assembly.

2. The wafer loading and unloading and transfer arm device according to claim 1, characterized in that: The loading and unloading X-axis module is placed horizontally, the loading and unloading Y-axis module is arranged above the loading and unloading X-axis module, and the loading and unloading Y-axis module is perpendicular to the loading and unloading X-axis module in the horizontal direction. The loading and unloading Y-axis module is fixedly connected to the loading and unloading X-axis module, and the loading and unloading Y-axis module moves along the loading and unloading X-axis module.

3. The wafer loading and unloading and transfer arm device according to claim 2, characterized in that: The loading and unloading Z-axis module is arranged above the loading and unloading Y-axis module, and the loading and unloading Z-axis module is perpendicular to the loading and unloading Y-axis module in the vertical direction. The loading and unloading Z-axis module is fixedly connected to the loading and unloading Y-axis module, and the loading and unloading Z-axis module moves along the loading and unloading X-axis module and the loading and unloading Y-axis module.

4. The wafer loading and unloading and transfer arm device according to claim 3, characterized in that: The loading and unloading rotating module is arranged on the side of the loading and unloading Z-axis module, the loading and unloading rotating module is fixedly connected to the loading and unloading Z-axis module, and the loading and unloading rotating module moves along the loading and unloading X-axis module, the loading and unloading Y-axis module and the loading and unloading Z-axis module.

5. The wafer loading and unloading and transfer arm device according to claim 4, characterized in that: The vacuum suction cup is arranged above the loading and unloading rotating module, and the vacuum suction cup is rotatably connected to the loading and unloading rotating module. The vacuum suction cup moves along the loading and unloading X-axis module, the loading and unloading Y-axis module, the loading and unloading Z-axis module and the loading and unloading rotating module.

6. The wafer loading and unloading and transfer arm device according to claim 1, characterized in that: The frame assembly includes a base frame, the base frame is placed horizontally, the transfer horizontal module is arranged above the base frame, and the transfer horizontal module is fixedly connected to the base frame.

7. The wafer loading and unloading and transfer arm device according to claim 1, characterized in that: The frame assembly further includes a module reinforcement rib, which is L-shaped. One end of the module reinforcement rib is fixedly connected to the transfer horizontal module, and the other end is fixedly connected to the transfer lifting module.

8. The wafer loading and unloading and transfer arm device according to claim 7, characterized in that: The transfer lifting module is arranged on the side of the transfer horizontal module, and the transfer lifting module is perpendicular to the transfer horizontal module in the vertical direction. The transfer lifting module is fixedly connected to the transfer horizontal module, and the transfer lifting module moves along the transfer horizontal module.

9. The wafer loading and unloading and transfer arm device according to claim 1, characterized in that: The frame assembly further includes a platform reinforcement rib, which is L-shaped. One end of the platform reinforcement rib is fixedly connected to the transfer lifting module, and the other end is fixedly connected to the transfer adsorption platform assembly.

10. The wafer loading and unloading and transfer arm device according to claim 9, characterized in that: The transfer adsorption platform assembly is arranged on the side of the transfer lifting module, and the transfer adsorption platform assembly is perpendicular to the transfer lifting module. The transfer adsorption platform assembly is fixedly connected to the transfer lifting module, and the transfer adsorption platform assembly moves along the transfer lifting module and the transfer horizontal module.

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