IPM packaging structure and electronic device

Abstract

The utility model discloses an IPM packaging structure and an electronic device. The IPM packaging structure comprises a packaging frame, a first chip, a metal-coated ceramic substrate and a second chip, the packaging frame comprises a frame body, and the frame body is provided with a base island and a reserved installation position. The first chip is arranged on the base island; the metal-coated ceramic substrate is arranged on the reserved mounting position; and the second chip is arranged on the metal-coated ceramic substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of power equipment, in particular to an IPM packaging structure and an electronic device. Background Art

[0002] Slim-DIP (Dual In-Line Package) is a widely used IPM (Intelligent Power Module) product in the home appliance industry for power management. Current IPM products typically utilize a full-frame package structure. However, this structure can lead to severe thermal coupling and insufficient heat dissipation. Utility Model Content

[0003] The Summary of the Utility Model introduces a series of simplified concepts that will be further described in the Detailed Description of the Utility Model. The Summary of the Utility Model of the Utility Model does not intend to limit the key features and essential technical features of the claimed technical solution, nor does it intend to determine the scope of protection of the claimed technical solution.

[0004] In response to the current problems, an embodiment of the present invention provides an IPM packaging structure, which includes: a packaging frame, a first chip, a metal-clad ceramic substrate and a second chip; wherein the packaging frame includes a frame body, and the frame body is provided with a base island and a reserved mounting position; the first chip is arranged on the base island; the metal-clad ceramic substrate is arranged on the reserved mounting position; and the second chip is arranged on the metal-clad ceramic substrate.

[0005] In one embodiment of the present application, the first chip includes a lower bridge chip, and the second chip includes an upper bridge chip.

[0006] In one embodiment of the present application, a second pin is provided on the frame body, and the metal-clad ceramic substrate is connected to the second pin.

[0007] In one embodiment of the present application, the metal-clad ceramic substrate includes: a ceramic substrate having a first surface and a second surface relative to each other; a first metal layer is provided on the first surface, the second chip is provided on the first metal layer, and the first metal layer is connected to the second pin; a second metal layer is provided on the second surface, and the second metal layer is used to contact the heat dissipation structure.

[0008] In one embodiment of the present application, the second pin includes: a pin connection portion provided on the reserved mounting position; wherein the first metal layer is connected to the pin connection portion.

[0009] In one embodiment of the present application, the metal-clad ceramic substrate includes: a main body portion and a connecting portion; the second chip is arranged in the main body portion; the connecting portion connects the main body portion and the second pin; wherein the dimension of the connecting portion close to the main body portion is larger than the dimension close to the second pin.

[0010] In one embodiment of the present application, the metal-clad ceramic substrate is a copper-clad ceramic substrate.

[0011] In one embodiment of the present application, a first pin is provided on the frame body; and the base island is connected to the first pin via a frame connecting rib on the frame body.

[0012] In one embodiment of the present application, the IPM packaging structure further includes: a plastic packaging layer, wherein the plastic packaging layer encapsulates the packaging frame, the metal-clad ceramic substrate, the first chip, and the second chip.

[0013] According to the second aspect of the present application, an electronic device is further provided, comprising any one of the above-mentioned IPM packaging structures.

[0014] According to the IPM packaging structure and electronic device provided by the present invention, a new IPM packaging structure is provided, in which the first chip is arranged on the base island on the frame body, and a reserved mounting position is provided on the frame body, the metal-clad ceramic substrate is arranged on the reserved mounting position, and the second chip is arranged on the metal-clad ceramic substrate, thereby reducing the thermal resistance under the second chip, which is beneficial to heat dissipation, thereby reducing the thermal coupling between the first chip and the second chip, and improving the heat dissipation performance of the IPM packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The following drawings of the present invention are used as a part of the present invention for understanding the present invention. The drawings show embodiments of the present invention and their descriptions, and are used to explain the principle of the present invention.

[0016] In the attached figure:

[0017] Figure 1 A schematic top view of a packaging frame according to a specific embodiment of the present invention is shown;

[0018] Figure 2 A schematic top view of a metal-clad ceramic substrate according to a specific embodiment of the present invention after being arranged on a packaging frame is shown;

[0019] Figure 3 A schematic top view of a metal-clad ceramic substrate according to a specific embodiment of the present invention is shown;

[0020] Figure 4 A schematic diagram of the three-dimensional structure of a metal-clad ceramic substrate and an IPM packaging structure according to a specific embodiment of the present invention is shown;

[0021] Figure 5 A schematic diagram of a junction temperature simulation of an IPM packaging structure according to a specific embodiment of the present invention is shown;

[0022] Figure 6 A schematic diagram of junction temperature simulation using a full-frame packaging structure in the prior art is shown.

[0023] Reference numerals:

[0024] 10-Packaging frame 11-Frame body

[0025] 12-base island 13-reserved installation position

[0026] 14-frame connecting bar 21-first chip

[0027] 22-Second chip 30-Metal-clad ceramic substrate

[0028] 31-ceramic substrate 32-first metal layer

[0029] 33- chip welding area 34- body part

[0030] 35-connection part 351-first connection part

[0031] 352-second connecting portion 41-first pin

[0032] 42-second pin 421-pin connection part DETAILED DESCRIPTION

[0033] In the following description, numerous specific details are provided to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features known in the art are not described to avoid confusion with the present invention.

[0034] It should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the dimensions and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals throughout represent like elements.

[0035] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0036] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then the elements or features described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0037] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present invention. When used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0038] Slim-DIP is a narrow-body DIP. The full name of DIP is Dual In-Line Package, which means dual in-line package in Chinese. Slim-DIP is an IPM product widely used in the home appliance field for power management. It supports current ranges of 5A / 10A / 15A / 20A / 30A. Among them, 15A / 20A IPM products usually adopt two product types: full-frame packaging structure and DBC (metal-ceramic substrate 30). This sacrifices the IGBT (full name Insulate-Gate Bipolar Transistor) chip area or DBC area, and the cost-effectiveness needs to be improved. Some of the disadvantages are: the full-frame packaging structure will have serious thermal coupling and insufficient heat dissipation performance. Specifically, (1) in a full-frame power module, the upper bridge RC-IGBT (reverse-conducting IGBT, a type of upper bridge chip) has severe thermal coupling and insufficient heat dissipation performance, which is reflected in the high junction temperature Tj of the upper bridge chip, limiting the improvement of the maximum output power capability of the power module; (2) due to the obvious difference in heat dissipation between the upper bridge chip and the lower bridge chip, the use of a whole DBC cannot achieve the optimal cost-effectiveness.

[0039] Therefore, in view of the existence of the above technical problems, the embodiment of the present invention proposes an IPM packaging structure, referring to Figures 1 to 4 The IPM packaging structure includes: a packaging frame 10, a first chip 21, a metal-clad ceramic substrate 30 and a second chip 22; wherein the packaging frame 10 includes a frame body 11, on which a base island 12 and a reserved mounting position 13 are provided; the first chip 21 is arranged on the base island 12; the metal-clad ceramic substrate 30 is arranged on the reserved mounting position 13; and the second chip 22 is arranged on the metal-clad ceramic substrate 30.

[0040] By providing a new IPM packaging structure, the first chip 21 is set on the base island 12 on the frame body 11, and a reserved mounting position 13 is set on the frame body 11, the metal-clad ceramic substrate 30 is set on the reserved mounting position 13, and the second chip 22 is set on the metal-clad ceramic substrate 30, thereby reducing the thermal resistance under the second chip 22, which is beneficial to heat dissipation, thereby reducing the thermal coupling between the first chip 21 and the second chip 22, and improving the heat dissipation performance of the IPM packaging structure.

[0041] Specifically, compared with the full-frame packaging structure of the prior art, the second chip 22 of the IPM packaging structure provided in the present application adopts a metal-ceramic substrate 30 structure, which is beneficial to reducing the thermal resistance under the second chip 22, thereby facilitating the heat dissipation of the second chip 22, thereby offsetting the impact of chip thermal coupling.

[0042] The full frame packaging structure and an IPM packaging structure shown in this application can be simulated to compare the heat dissipation effect. Figure 6 In the temperature simulation diagram of a full-frame package structure shown in FIG, the junction temperature of the first chip is 107.27°C and the junction temperature of the second chip is 124.76°C. Figure 5 The temperature simulation diagram of an IPM package structure of the present application is shown. The junction temperature of the first chip 21 is 104.43°C, and the junction temperature of the second chip 22 is 92.170°C. It can be seen that when the IPM package structure shown in the present application is in operation, the junction temperature of the second chip 22 can be greatly reduced, and the junction temperature of the first chip 21 is also reduced.

[0043] Compared to the existing full-DBC IPM packaging structure, the first chip 21 of the IPM packaging structure provided by this application has a lower heat dissipation requirement and uses a packaging frame 10 similar to a full-frame structure, which can reduce costs and have a higher cost-performance ratio. In addition, this application is based on a packaging frame 10 similar to a full-frame structure, so that processes such as DB (Die Bonding) and WB (Wire Bonding) are consistent with the full-frame packaging structure. For example, the second chip 22 and the first chip 21 can be mounted using a tinning method, so that jigs and machines can be shared without increasing other costs, thereby achieving a low-cost IPM packaging structure.

[0044] The above structures are described in detail below with reference to the accompanying drawings.

[0045] refer to Figure 5 When selecting the above-mentioned first chip 21 and second chip 22, the above-mentioned first chip 21 may include a lower bridge chip, and the above-mentioned second chip 22 may include an upper bridge chip. Exemplarily, the upper bridge chip may be, for example, but not limited to, an upper bridge RC-IGBT chip, and the lower bridge chip may be, for example, but not limited to, a lower bridge RC-IGBT chip. The reason for using the lower bridge chip as the first chip 21 is that the junction temperature of the lower bridge chip is low during operation, and its heat dissipation requirement is low. Of course, the first chip 21 directly arranged on the base island 12 of the frame body 11 may include other chip types in addition to the lower bridge chip. For example, it may also include other chips in addition to the upper bridge chip in the power module. The reason for using the upper bridge chip as the second chip 22 is that the junction temperature of the upper bridge chip is high during operation, and its heat dissipation requirement is high. Of course, in addition to the upper bridge chip, other chips may also be used as the second chip 22.

[0046] refer to Figure 1 and Figure 2When setting the base island 12 on the frame body 11, the base island 12 serves as the area for connecting and setting the first chip 21, and its size, pad structure, etc. can be adapted to the first chip 21, so that the first chip 21 can be mounted on the base island 12.

[0047] refer to Figure 1 and Figure 2 Exemplarily, the number of base islands 12 can be the same as the number of first chips 21. For example, the number of base islands 12 can be three, and the number of first chips 21 can also be three, with each first chip 21 being disposed on a corresponding base island 12. Exemplarily, when the first chip 21 is a lower bridge chip, the number of lower bridge chips can be three, with each lower bridge chip being disposed on a corresponding base island 12.

[0048] refer to Figure 1 When setting the packaging frame 10, the packaging frame 10 retains most of the structure of the full frame structure, mainly deleting the frame of some chip mounting parts, for example, the frame of the upper bridge chip mounting part of the full frame structure is deleted and replaced with the reserved mounting position 13.

[0049] When setting the reserved installation position 13, refer to Figure 1 and Figure 2 , which can be slightly larger than the size of the metal-clad ceramic substrate 30, so that the metal-clad ceramic substrate 30 can be placed on the reserved mounting position 13. It can also space the metal-clad ceramic substrate 30 and the adjacent base islands 12, thereby further reducing the thermal coupling between the second chip 22 and the frame body 11.

[0050] When placing the metal-clad ceramic substrate 30 on the reserved mounting position 13, various methods can be used to secure the metal-clad ceramic substrate 30 to the reserved mounting position 13. For example, the metal-clad ceramic substrate 30 can be secured to the reserved mounting position 13 by welding to improve the stability of the mounting position and the reliability of the electrical connection. The welding method can be solder paste and reflow soldering. Specifically, the metal-clad ceramic substrate 30 can be soldered to the reserved mounting position 13 of the frame body 11 using solder paste and reflow soldering to improve the reliability and stability of the soldered connection.

[0051] Exemplary, reference Figure 1 、 Figure 2 and Figure 4, a first pin 41 is also provided on the frame body 11, and the base island 12 is connected to the first pin 41 through the frame connecting rib 14 on the frame body 11, thereby realizing the electrical connection between the first chip 21 and the first pin 41, thereby realizing the first chip 21 can transmit signals with the outside world. Exemplarily, the first pin 41 includes a pin leg, and the pin leg is used to be exposed on the outside of the plastic layer to be electrically connected to the outside world. Exemplarily, the first pin 41 may also include a supporting portion electrically connected to the pin leg, and the supporting portion is fixed on the frame body 11. Exemplarily, the base island 12 is connected to the supporting portion through the frame connecting rib 14 on the frame body 11. Exemplarily, the supporting portion and the pin leg of the first pin 41 can be prepared by integral molding, that is, the supporting portion and the pin leg of the first pin 41 are an integrated structure.

[0052] Exemplary, reference Figure 1 、 Figure 2 and Figure 4 The frame body 11 is also provided with a second pin 42. The metal-clad ceramic substrate 30 is connected to the second pin 42, thereby achieving an electrical connection between the second chip 22 and the second pin 42, so that the second chip 22 can transmit signals to the outside world. The metal-clad ceramic substrate 30 can also be fixed to the reserved mounting position 13.

[0053] When achieving the connection between the metal-clad ceramic substrate 30 and the second pin 42 , various methods may be used, some of which are exemplified below.

[0054] Exemplary, reference Figure 2 、 Figure 3 and Figure 5 The metal-clad ceramic substrate 30 may include: a ceramic substrate 31, the ceramic substrate 31 having a first surface and a second surface relative to each other (not shown in the figure). A first metal layer 32 is provided on the first surface, the second chip 22 is provided on the first metal layer 32, and the first metal layer 32 is connected to the second pin 42. A second metal layer (not shown in the figure) is provided on the second surface, and the second metal layer is used to contact the heat dissipation structure (not shown in the figure). By providing the first metal layer 32 on the first surface of the ceramic substrate 31, it is convenient to solder the second chip 22 on the metal-clad ceramic substrate 30 and electrically connect it to the second pin 42. The second metal on the second surface of the ceramic substrate 31 is used to contact the heat dissipation structure, which is beneficial to the heat dissipation of the second chip 22 and improves the heat dissipation performance of the IPM packaging structure.

[0055] Exemplary, reference Figure 2 、 Figure 3 and Figure 5A chip bonding area 33 is provided on the first metal layer 32 of the metal-clad ceramic substrate 30, and the second chip 22 is provided on the chip bonding area 33. The size and pad structure of the chip bonding area 33 can be adapted to the second chip 22, so that the second chip 22 can be mounted on the chip bonding area 33. When the second chip 22 is provided on the chip bonding area 33 of the first metal layer 32, the second chip 22 can be mounted on the chip bonding area 33 of the first metal layer 32 using a tinning method. When the second chip 22 is used as an upper bridge chip, the thermal resistance of the upper bridge chip can be effectively reduced at the same power, thereby improving the junction temperature of the second chip 22.

[0056] Exemplary, reference Figure 2 and Figure 5 The number of chip bonding areas 33 on the first metal layer 32 can be the same as the number of second chips 22. For example, the number of chip bonding areas 33 can be three, and the number of second chips 22 can also be three, with each second chip 22 being disposed on a corresponding chip bonding area 33. For example, when the second chip 22 is an upper bridge chip, the number of upper bridge chips can be three, with each upper bridge chip being disposed on a corresponding chip bonding area 33.

[0057] The shape of the metal-clad ceramic substrate 30 may be any shape, and some shapes are exemplified below.

[0058] The metal-clad ceramic substrate 30 can be divided into different regions according to its function. Figure 2 、 Figure 3 and Figure 5 The metal-clad ceramic substrate 30 may include a body portion 34 and a connecting portion 35. The second chip 22 is disposed in the body portion 34. The connecting portion 35 connects the body portion 34 and the second lead 42. The connecting portion 35 has a larger dimension near the body portion 34 than near the second lead 42.

[0059] By making the metal-clad ceramic substrate 30 include not only a body portion 34 for arranging the second chip 22, but also a connecting portion 35 connected between the body portion 34 and the second pin 42, and the size of the connecting portion 35 on the side close to the body portion 34 is larger than the size on the side close to the second pin 42, the overall shape of the metal-clad ceramic substrate 30 is an anisotropic DBC structure. Therefore, while ensuring the electrical clearance requirements, the area of ​​the metal-clad ceramic substrate 30 can be increased, thereby improving the heat dissipation performance of the metal-clad ceramic substrate 30 in dissipating heat from the second chip 22.

[0060] Of course, in other embodiments, the metal-clad ceramic substrate 30 may also include only the aforementioned body portion 34 without the connecting portion 35 , so that the body portion 34 is directly electrically connected to the second pin 42 .

[0061] Exemplary, reference Figure 2 and Figure 3 The body portion 34 may be rectangular in shape, so as to facilitate providing rectangular chip bonding areas 33 on the first metal layer 32, and to arrange a plurality of chip bonding areas 33 in a row on the body portion 34. Of course, in other embodiments, the body portion 34 may be shaped other than a rectangle.

[0062] The connection portion 35 may be arranged in various ways.

[0063] For example, reference Figure 2 and Figure 3 The connecting portion 35 may include a first connecting portion 351 and a second connecting portion 352. The second connecting portion 352 is rectangular and connected to the second pin 42. The first connecting portion 351 is trapezoidal in shape, with the first bottom edge of the trapezoid connected to the main body 34 and the second bottom edge of the trapezoid connected to the second connecting portion 352. This approach maximizes the area of ​​the connecting portion 35 while ensuring electrical clearance requirements, thereby improving the heat dissipation performance of the second chip 22 and reducing the junction temperature of the second chip 22 during operation, thereby improving the performance of the second chip 22 and, in turn, the performance of the entire IPM package structure.

[0064] It should be noted that the length of the first base of the trapezoid is greater than the length of the second base of the trapezoid. Figure 3 The first bottom edge is the upper bottom edge of the first connecting portion 351 connected to the main body portion 34, and the second bottom edge is the lower bottom edge of the first connecting portion 351 connected to the second connecting portion 352. Specifically, the length of one side of the rectangular main body portion 34 can be equal to the length of the first bottom edge of the first connecting portion 351, thereby aligning and connecting the first connecting portion 351 and the main body portion 34. The length of one side of the second connecting portion 352 can be equal to the length of the second bottom edge of the first connecting portion 351, thereby aligning and connecting the first connecting portion 351 and the second connecting portion 352.

[0065] Of course, it should be noted that the above only exemplifies one shape of the connecting portion 35 , and other shapes may also be used.

[0066] Exemplary, reference Figure 1 、 Figure 2 and Figure 4The second pin 42 includes a pin leg portion, which is exposed outside the plastic layer to electrically connect to the outside. Exemplarily, the second pin 42 may further include a support portion electrically connected to the pin leg portion, the support portion being fixed to the frame body 11. Exemplarily, the metal-clad ceramic substrate 30 is electrically connected to the support portion of the second pin 42. Exemplarily, the support portion and the pin leg portion of the second pin 42 may be integrally formed, i.e., the support portion and the pin leg portion of the second pin 42 are an integral structure.

[0067] Exemplary, reference Figure 2 The second pin 42 may further include: a pin connection portion 421 provided on the reserved mounting position 13. The first metal layer 32 of the metal-clad ceramic substrate 30 is connected to the pin connection portion 421. For example, the first metal layer 32 may be provided below the pin connection portion 421, and the first metal layer 32 and the pin connection portion 421 may be electrically connected by, for example, but not limited to, welding or bonding. By providing the pin connection portion 421, the electrical contact area between the first metal layer 32 and the second pin 42 can be increased, thereby achieving a stable and reliable electrical connection between the metal-clad ceramic substrate 30 and the second pin 42.

[0068] For example, the pin connection portion 421 of the second pin 42 can be connected to the support portion of the second pin 42. Specifically, the pin connection portion 421 of the second pin 42 and the support portion of the second pin 42 can be an integral structure. For example, the second connecting portion 352 can be directly press-welded to the pin connection portion 421, thereby achieving a reliable and stable electrical connection between the second connecting portion 352 and the pin connection portion 421.

[0069] For example, the metal-clad ceramic substrate 30 may be a copper-clad ceramic substrate, i.e., the first metal layer 32 and the second metal layer are both made of copper. Copper has low resistivity and high thermal conductivity, which can reduce resistivity and facilitate better heat dissipation for the second chip 22. It should be noted that the metal in the metal-clad ceramic substrate 30 is not limited to copper, and may also be other metal materials such as, but not limited to, aluminum and silver.

[0070] Exemplarily, the IPM package structure further includes a plastic encapsulation layer, which encapsulates the package frame 10, the metal-clad ceramic substrate 30, the first chip 21, and the second chip 22. The plastic encapsulation layer encapsulates the package frame 10, the metal-clad ceramic substrate 30, the first chip 21, and the second chip 22 to form a package, thereby achieving a stable and reliable electrical connection and electrical isolation between the chip and the package frame 10, while also protecting the chip and the package frame 10. Exemplarily, the plastic encapsulation layer may be made of, but not limited to, resin, plastic, or rubber packaging materials.

[0071] Furthermore, an embodiment of the present application also provides an electronic device, which includes any one of the above-mentioned IPM packaging structures.

[0072] The electronic device of this embodiment can be a white goods product or device such as an air conditioner, refrigerator, washing machine, electric heater, or any intermediate product including the above-mentioned IPM packaging structure. The electronic device of this embodiment of the utility model has better performance due to the use of the above-mentioned IPM packaging structure.

[0073] The present invention has been described through the above embodiments. However, it should be understood that the above embodiments are for illustrative and illustrative purposes only and are not intended to limit the present invention to the described embodiments. Furthermore, those skilled in the art will appreciate that the present invention is not limited to the above embodiments and that various variations and modifications may be made based on the teachings of the present invention, all of which fall within the scope of the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IPM packaging structure, characterized in that: include: The packaging frame comprises a frame body, wherein the frame body is provided with a base island and a reserved installation position; A first chip is arranged on the base island; a metal-clad ceramic substrate, disposed on the reserved mounting position; and The second chip is arranged on the metal-clad ceramic substrate.

2. The IPM packaging structure according to claim 1, wherein: The first chip comprises a lower bridge chip, and the second chip comprises an upper bridge chip.

3. The IPM packaging structure according to claim 1, wherein: The frame body is provided with a second pin, and the metal-clad ceramic substrate is connected to the second pin.

4. The IPM packaging structure according to claim 3, wherein: The metal-clad ceramic substrate comprises: a ceramic substrate having a first surface and a second surface opposite to each other; A first metal layer is provided on the first surface, the second chip is provided on the first metal layer, and the first metal layer is connected to the second pin; A second metal layer is disposed on the second surface, and the second metal layer is used for contacting the heat dissipation structure.

5. The IPM packaging structure according to claim 4, wherein: The second pin includes: a pin connection portion provided on the reserved mounting position; Wherein, the first metal layer is connected to the pin connection portion.

6. The IPM packaging structure according to claim 3, wherein: The metal-clad ceramic substrate comprises: a main body portion, wherein the second chip is disposed in the main body portion; and A connecting portion connects the main body portion and the second pin; wherein the dimension of the connecting portion close to the main body portion is larger than the dimension of the connecting portion close to the second pin.

7. The IPM packaging structure according to claim 1, wherein: The metal-clad ceramic substrate is a copper-clad ceramic substrate.

8. The IPM packaging structure according to claim 1, wherein: The frame body is provided with a first pin; The base island is connected to the first pin through a frame connecting rib on the frame body.

9. The IPM packaging structure according to claim 1, wherein: Also includes: A plastic packaging layer encapsulates the packaging frame, the metal-clad ceramic substrate, the first chip, and the second chip.

10. An electronic device, characterized in that: The electronic device includes the IPM package structure according to any one of claims 1 to 9.

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