S-shaped water channel heat dissipation structure

Abstract

An S-shaped water channel heat dissipation structure comprises a heat dissipation body bottom plate which provides support for all parts. The peripheral baffle is fixed on the bottom plate of the heat dissipation main body and forms a liquid storage space; the heat dissipation unit matrix comprises at least one heat dissipation unit group arranged in the peripheral baffle, at least one column of heat dissipation units are arranged in the heat dissipation unit group, and the interior of each heat dissipation unit is divided into S-shaped flow channels through partition baffles which are arranged in a staggered mode; the number of the buffer areas is two, the buffer areas are distributed on the two opposite side edges of the peripheral baffle, and at least one flow channel opening leading to the buffer areas is formed in the heat dissipation unit set close to the buffer areas. The rotary water channel heat dissipation structure is compact and reasonable in structure and convenient to operate, and provides an effective solution for the heat dissipation problem of a silicon carbide power device through the beneficial effects of remarkably improving the heat dissipation efficiency, optimizing the water flow path, improving the flexibility and adaptability, enhancing the stability and durability and the like.

Description

Technical Field

[0001] The utility model relates to the technical field, in particular to an S-shaped water channel heat dissipation structure. Background Art

[0002] Silicon carbide power devices are increasingly being used in electric vehicles, and their market is growing rapidly. With continuous technological advancements, the power density of silicon carbide power devices continues to increase while their size continues to decrease. While this trend has brought performance improvements, it has also led to serious heat dissipation issues. Inefficient heat dissipation has become a key factor hindering the further development of silicon carbide power devices.

[0003] Traditional water channel heat dissipation structures are struggling to cope with the high power density and compact size of silicon carbide power devices. While increasing the length of the water channel has been shown to effectively improve heat dissipation, simply extending the water channel cannot meet the growing heat dissipation needs. Furthermore, traditional water channel structures often lack flexibility and cannot be customized and optimized for actual application scenarios, resulting in unsatisfactory heat dissipation.

[0004] More critically, traditional water channel designs often neglect optimizing the water flow path and fully utilizing the heat dissipation area. The water flow within the channel is less than ideal, with backflow and eddy currents occurring, reducing heat dissipation efficiency. Furthermore, the limited heat dissipation area prevents sufficient heat exchange with the coolant, further limiting improvements in heat dissipation performance.

[0005] Therefore, to address the heat dissipation issues faced by silicon carbide power devices, a new water channel structure is urgently needed. This structure needs to fully utilize the water channel length and heat dissipation area, optimize the water flow path, and improve heat dissipation efficiency. At the same time, it also needs to be flexible enough to adapt to the needs of different application scenarios. This utility model is proposed in this context, aiming to address the technical shortcomings of traditional water channel structures in terms of heat dissipation efficiency, flexibility, and water flow path optimization. Utility Model Content

[0006] In response to the shortcomings of the above-mentioned existing production technology, the applicant provides an S-shaped water channel heat dissipation structure. The rotating water channel heat dissipation structure of the utility model provides an effective solution to the heat dissipation problem of silicon carbide power devices by significantly improving heat dissipation efficiency, optimizing water flow path, improving flexibility and adaptability, and enhancing stability and durability.

[0007] The technical solutions adopted in this utility model are as follows:

[0008] An S-shaped water channel heat dissipation structure, comprising:

[0009] The heat dissipation main body bottom plate provides support for various components;

[0010] A peripheral baffle, which is fixed to the bottom plate of the heat dissipation body and forms a liquid storage space;

[0011] A heat dissipation unit matrix includes at least two heat dissipation unit groups arranged in a peripheral baffle, and at least two rows of heat dissipation units are arranged in the heat dissipation unit group. The heat dissipation units are divided into "S"-shaped flow channels by staggered partition baffles, and the thickness of the movable end of the partition baffle is greater than the thickness of the fixed end of the partition baffle.

[0012] Furthermore, it also includes two buffer zones, which are distributed on two opposite sides of the peripheral baffle, and at least one flow channel opening leading to the buffer zone is provided in the heat dissipation unit group close to the buffer zone.

[0013] Furthermore, a water inlet is provided in one of the buffer zones, and a water outlet is provided in the other buffer zone.

[0014] A flow channel that penetrates each other is opened between two adjacent heat dissipation unit groups.

[0015] Furthermore, the number of the heat dissipation unit groups is one, two, three or four.

[0016] Furthermore, the heat dissipation body bottom plate, peripheral baffles and separation baffles are all made of copper.

[0017] Furthermore, the heat dissipation main body bottom plate, peripheral baffles and separation baffles are integrally cast.

[0018] The beneficial effects of the utility model are as follows:

[0019] This utility model boasts a compact, rational structure and easy operation. Its rotating water channel heat dissipation structure significantly improves heat dissipation efficiency, optimizes water flow paths, enhances flexibility and adaptability, and strengthens stability and durability, providing an effective solution to the heat dissipation issues faced by silicon carbide power devices. This novel water channel structure not only meets the heat dissipation requirements of high power density and compact size, but also improves the overall performance and service life of electric vehicles, offering broad application prospects and market value.

[0020] At the same time, the utility model also has the following advantages:

[0021] 1. This utility model utilizes a rotating water channel heat dissipation structure to effectively increase the water flow path and heat dissipation area. The rotating water channel design allows the coolant to fully exchange heat with the heat dissipation body base and partition baffles during flow, thereby removing more heat. Compared to traditional water channel structures, this utility model significantly improves heat dissipation efficiency, better meeting the heat dissipation requirements of silicon carbide power devices under high power density and small size conditions. This improvement not only helps extend the service life of power devices but also improves the overall performance of electric vehicles.

[0022] 2. This utility model incorporates partitions and buffer zones within the rotating water channel heat dissipation structure. By staggering the partitions, the heat dissipation unit is divided into serpentine channels, increasing the complexity of the water flow path. Simultaneously, the buffer zone design ensures unidirectional water flow, preventing backflow. This optimized water flow path ensures thorough mixing of the coolant within the channel, improving heat dissipation while also reducing the impact of water flow on the structure, thereby enhancing its stability and service life.

[0023] 3. The rotary water channel heat dissipation structure of this utility model offers a high degree of design flexibility, allowing customization and optimization based on the needs of specific application scenarios. By adjusting the number of heat dissipation unit groups and columns in the heat dissipation unit matrix, as well as employing varying numbers of S-shaped heat dissipation units, different combinations of heat dissipation effects can be achieved. This flexibility enables this utility model to better adapt to silicon carbide power devices of varying power densities and volumes, meeting diverse heat dissipation requirements.

[0024] 4. The rotary water channel heat dissipation structure of this utility model utilizes an integrally cast design. The heat dissipation base, peripheral baffles, and partition baffles are all made of copper or other high-quality metal materials, ensuring structural stability and durability. Furthermore, by optimizing the thickness of the partition baffles, their stability is enhanced, slowing the flow of water and further improving the heat dissipation effect. This increased stability and durability helps extend the service life of the heat dissipation structure and reduce maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural diagram of the present utility model.

[0026] in:

[0027] 1. Heat dissipation main body bottom plate; 2. Peripheral baffle; 3. Partition baffle; 4. Heat dissipation unit; 5. Buffer zone; 6. Connection node. DETAILED DESCRIPTION

[0028] The specific implementation of the present utility model will be described below with reference to the accompanying drawings.

[0029] Example 1

[0030] The utility model relates to an S-shaped water channel heat dissipation structure, which is particularly suitable for silicon carbide power devices in electric vehicles, and is intended to improve the heat dissipation capacity and reduce the heating temperature of the chip. The rotating water channel heat dissipation structure of this embodiment mainly includes the following components:

[0031] Specifically, such as Figure 1 As shown, the heat dissipation main body bottom plate 1 in this embodiment serves as a supporting component of the entire heat dissipation structure. The material selected is copper, which has good thermal conductivity.

[0032] like Figure 1 As shown, the peripheral baffle 2 in this embodiment is fixed on the bottom plate 1 of the heat dissipation body to form a closed liquid storage space to prevent liquid leakage.

[0033] The partition baffles 3 are staggeredly arranged in the heat dissipation unit to divide the heat dissipation unit into serpentine flow channels, increase the water flow path, and improve the heat dissipation effect. The design of the partition baffles 3.

[0034] Two buffer zones 5 are located on opposite sides of the peripheral baffle 2 to buffer and distribute water flow. One buffer zone 5 has a water inlet, while the other has a water outlet. This design ensures unidirectional water flow, avoids backflow, and improves heat dissipation efficiency.

[0035] The heat dissipation unit matrix includes at least two heat dissipation unit groups arranged in the peripheral baffle 2. In this embodiment, the heat dissipation unit group refers to a combination of multiple heat dissipation units arranged in a horizontal row as shown in the figure, and at least two columns of heat dissipation units are arranged in the heat dissipation unit group.

[0036] The rotating water channel heat dissipation structure of this utility model offers a high degree of design flexibility, allowing customization and optimization based on the needs of specific application scenarios. By adjusting the number of heat dissipation unit groups and columns in the heat dissipation unit matrix, as well as employing varying numbers of S-shaped heat dissipation units, different combinations of heat dissipation effects can be achieved. This flexibility enables the utility model to better adapt to silicon carbide power devices of varying power densities and volumes, meeting diverse heat dissipation requirements.

[0037] At the same time, in order to improve the overall stability, the heat dissipation main body base plate 1, the peripheral baffle 2 and the partition baffle 3 are cast as one piece, and are all made of copper material. In actual use, they can also be replaced with other metal materials with better heat dissipation effects.

[0038] This effectively increases the water flow path and heat dissipation area. The rotating water channel design allows the coolant to fully exchange heat with the heat dissipation base and partition baffles during flow, thereby removing more heat. Compared to traditional water channel structures, this new design significantly improves heat dissipation efficiency, better meeting the heat dissipation requirements of silicon carbide power devices in high power density and compact size. This improvement not only helps extend the service life of power devices but also improves the overall performance of electric vehicles.

[0039] During operation, coolant enters the buffer zone 5 through the water inlet and then flows through the serpentine flow path of the heat dissipation unit 1 4. During this flow, the liquid fully exchanges heat with the heat dissipation body base plate 1 and the partition baffle 3, removing heat. Finally, the coolant flows out of the water outlet, completing the heat dissipation process.

[0040] Example 2

[0041] like Figure 1 As shown, the heat dissipation unit matrix in this embodiment includes 4 heat dissipation unit groups, and 5 columns of heat dissipation units are arranged in the heat dissipation unit groups. The heat dissipation unit matrix in this embodiment is composed of a structural combination of heat dissipation units 4. At the same time, in this embodiment, the thickness of the movable end of the partition baffle 3 (that is, the end where the partition baffle 3 is not connected) is greater than the thickness of the fixed end of the partition baffle 3 (that is, the end where the partition baffle 3 is connected to other structures). This design enhances the stability of the partition baffle 3, while delaying the passing efficiency of water flow and improving the heat dissipation effect.

[0042] At the same time, the different designs of the number of rotations and the number of water inlets in each row of the rotating water channel in this embodiment make the heat dissipation more flexible and efficient.

[0043] During operation, coolant enters the buffer zone 5 through the water inlet and flows sequentially through the S-shaped channels of each rotating waterway, following the heat dissipation matrix formed by multiple heat dissipation units 4. During this flow, the coolant undergoes extensive heat exchange with the heat dissipation base plate 1 and the partition baffles 3. The coolant continuously changes direction during its flow, increasing its contact time with the heat dissipation surface and the heat dissipation area. Finally, the coolant flows out of the water outlet, completing the heat dissipation process.

[0044] In summary, the S-shaped rotating water channel heat dissipation structure of this utility model provides an effective solution to the heat dissipation problems of silicon carbide power devices by significantly improving heat dissipation efficiency, optimizing water flow paths, enhancing flexibility and adaptability, and enhancing stability and durability. This new water channel structure not only meets the heat dissipation requirements of high power density and small size, but also improves the overall performance and service life of electric vehicles, possessing broad application prospects and market value.

[0045] The above description is an explanation of the utility model, not a limitation of the utility model. The scope of the utility model is defined by the claims. Any form of modification can be made within the scope of protection of the utility model.

Claims

1. An S-shaped water channel heat dissipation structure, characterized in that: include: The heat dissipation main body bottom plate (1) provides support for various components; A peripheral baffle (2) is fixed on the heat dissipation main body bottom plate (1) and forms a liquid storage space; A heat dissipation unit matrix comprises at least two heat dissipation unit groups arranged in a peripheral baffle (2), wherein at least two rows of heat dissipation units are arranged in the heat dissipation unit group, wherein the heat dissipation units are divided into "S"-shaped flow channels by staggered separation baffles (3), and the thickness of the movable end of the separation baffle (3) is greater than the thickness of the fixed end of the separation baffle (3).

2. The S-shaped water channel heat dissipation structure according to claim 1, characterized in that: It also includes two buffer zones (5) distributed on two opposite sides of the peripheral baffle (2), and at least one flow channel opening leading to the buffer zone (5) is provided in the heat dissipation unit group close to the buffer zone (5).

3. The S-shaped water channel heat dissipation structure according to claim 2, characterized in that: A water inlet is provided in one of the buffer zones (5), and a water outlet is provided in the other buffer zone (5).

4. The S-shaped water channel heat dissipation structure according to claim 1, characterized in that: A flow channel that penetrates each other is opened between two adjacent heat dissipation unit groups.

5. The S-shaped water channel heat dissipation structure according to claim 1, characterized in that: The number of the heat dissipation unit groups is one, two, three or four.

6. The S-shaped water channel heat dissipation structure according to claim 1, characterized in that: The heat dissipation main body bottom plate (1), the peripheral baffle (2) and the separation baffle (3) are all made of copper.

7. The S-shaped water channel heat dissipation structure according to claim 1, characterized in that: The heat dissipation main body bottom plate (1), the peripheral baffle (2) and the separation baffle (3) are integrally cast.

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