Integrated light splitting semiconductor laser

Abstract

The utility model discloses an integrated light-splitting semiconductor laser which comprises a semiconductor laser chip, a lens, an isolator core, a light-splitting assembly and an output unit which are sequentially connected through optical fibers and packaged in a shell to form the light-splitting semiconductor laser. Wherein the semiconductor laser chip is used for emitting laser; the lens is used for shaping and focusing the light beam; the light splitting assembly is used for splitting laser beams; compared with the prior art, the utility model has the advantages of high component integration degree, simple and effective debugging method, convenience in batch production and low cost.

Description

Technical Field

[0001] The utility model relates to the field of optoelectronic integrated devices, in particular to an integrated light-splitting semiconductor laser. Background Art

[0002] With the rapid development of optical communications, laser sensing, and laser cold processing, semiconductor lasers, as the most commonly used light source, are becoming increasingly important. However, as application scenarios continue to expand, different requirements are being placed on specialized semiconductor lasers. The most common method is to split the same beam of light into two different paths: one for monitoring and the other for signal light, enabling optical path monitoring and determining whether the optical path is normal. Alternatively, one path can be used as a signal path branch and the other as a local oscillator path, with mixing performed to measure the corresponding physical quantity.

[0003] The conventional solution is to use discrete devices for welding, such as welding a 14-pin butterfly package semiconductor laser with a fused taper splitter device. The disadvantages of this solution are large size, melting point, low production efficiency, high cost, and are not conducive to product application. Utility Model Content

[0004] The purpose of the utility model is to propose an integrated spectroscopic semiconductor laser to address the shortcomings of existing semiconductor lasers, such as large size, melting point, low production efficiency, high cost, and disadvantages in product application.

[0005] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0006] An integrated splitting semiconductor laser includes a semiconductor laser chip, a lens, an isolator core, a splitting component, and an output unit, which are sequentially connected via optical fibers and packaged in a housing to form a splitting semiconductor laser.

[0007] Among them, the semiconductor laser chip is used to emit laser light;

[0008] Lenses, used for beam shaping and focusing;

[0009] A beam splitter component is used for splitting laser beams.

[0010] As a further preferred embodiment of the present invention, the optical splitting component is configured as a planar optical waveguide optical splitter or a beam splitter module; the planar optical waveguide optical splitter includes a PLC chip; and the beam splitter module includes a beam splitter and a folding unit.

[0011] As a further preferred embodiment of the present invention, when the light splitting component is configured as a planar optical waveguide splitter, the output unit is configured as a dual-core optical fiber array.

[0012] As a further preferred embodiment of the present invention, when the light splitting component is configured as a light splitter module, the output unit is configured as two single-mode single-core collimator components.

[0013] As a further preferred embodiment of the present invention, a monitoring photodiode chip is provided on the front side of the semiconductor laser chip; the monitoring photodiode chip is used for backlight detection of the laser emission and for monitoring the light emitting state of the chip.

[0014] As a further preferred embodiment of the present invention, the input end of the PLC chip is coated with an anti-reflection film.

[0015] As a further preference of the present invention, the dual-core optical fiber array is configured as a polarization-maintaining optical fiber panda eye structure, and the panda eye connection line forms a vertical structure or a horizontal structure with the substrate.

[0016] The integrated light-splitting semiconductor laser proposed in the utility model has the following beneficial effects compared with the prior art: the components of the utility model are highly integrated, the debugging method is simple and effective, it is convenient for batch production, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of an integrated light-splitting semiconductor laser planar optical waveguide solution according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic structural diagram of an integrated light-splitting semiconductor laser beam splitter according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the end face structure of a vertical polarization-maintaining fiber array;

[0020] Figure 4 Schematic diagram of the end face structure of the parallel polarization-maintaining fiber array.

[0021] The meanings of the reference numerals in the figure are: 1. semiconductor laser chip, 2. lens, 3. isolator core, 4. spectrometer component, 41. PLC chip, 42. spectrometer, 43. folding unit, 44. single-mode single-core collimator component, 5. output unit, 51. single-mode optical fiber array, 52. polarization-maintaining optical fiber array, 6. monitoring photodiode chip, 7. anti-reflection film, 8. housing. DETAILED DESCRIPTION

[0022] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Embodiment 1: An integrated spectroscopic semiconductor laser comprises a semiconductor laser chip 1, a lens 2, an isolator core 3, a spectroscopic component 4 and an output unit 5; wherein, the semiconductor laser chip 1 is used for emitting laser light; the lens 2 is used for beam shaping and focusing; the spectroscopic component 4 is used for laser beam splitting; a monitoring photodiode chip 6 is provided on the front side of the semiconductor laser chip 1; the monitoring photodiode chip 6 is used for backlight detection of laser emission and for monitoring the light-emitting state of the chip; they are connected in sequence through optical fibers and packaged in a BOX shell 8 to form a spectroscopic semiconductor laser.

[0024] Example 2: Combination Figure 1 , an integrated splitting semiconductor laser, including a semiconductor laser chip 1, a lens 2, an isolator core 3, a splitting component 4 and an output unit 5, a monitoring photodiode chip 6 is provided on the front side of the semiconductor laser chip 1; the monitoring photodiode chip 6 is used for backlight detection of laser emission and for monitoring the light-emitting state of the chip; they are connected in sequence through optical fibers and encapsulated in a BOX shell 8 to form a splitting semiconductor laser; wherein, the splitting component 4 is configured as a planar optical waveguide optical splitter, and the planar optical waveguide optical splitter includes a PLC chip 41; the input end of the PLC chip 41 is coated with an anti-reflection film 7, and the output unit 5 is configured as a dual-core optical fiber array, and the dual-core optical fiber array and the PLC chip 41 are connected by ultraviolet glue.

[0025] The dual-core optical fiber array is configured as a polarization-maintaining optical fiber panda eye structure, and the panda eye line is in a vertical structure or a horizontal structure with the substrate, such as Figure 3 and 4 shown.

[0026] Example 3: Combination Figure 2 , an integrated splitting semiconductor laser, including a semiconductor laser chip 1, a lens 2, an isolator core 3, a splitting component 4 and an output unit 5; a monitoring photodiode chip 6 is provided on the front side of the semiconductor laser chip 1; the monitoring photodiode chip 6 is used for backlight detection of laser emission and for monitoring the light-emitting state of the chip; they are connected in sequence through optical fibers and encapsulated in a BOX shell 8 to form a splitting semiconductor laser; wherein the splitting component 4 is configured as a splitter 42 module, the splitter 42 module includes a splitter 42 and a folding unit 43, and the output unit 5 is configured as two single-mode single-core collimator components 44.

[0027] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solution obtained by equivalent replacement or equivalent transformation falls within the scope of protection of the present invention.

Claims

1. An integrated spectroscopic semiconductor laser, characterized in that: It includes a semiconductor laser chip, a lens, an isolator core, a light splitting component and an output unit, which are connected in sequence through optical fibers and packaged in a housing to form a light splitting semiconductor laser; Among them, the semiconductor laser chip is used to emit laser light; Lenses, used for beam shaping and focusing; A beam splitter component is used for splitting laser beams.

2. The integrated spectroscopic semiconductor laser according to claim 1, characterized in that: The optical splitting component is configured as a planar optical waveguide optical splitter or an optical splitter module; the planar optical waveguide optical splitter includes a PLC chip; the optical splitter module includes an optical splitter and a folding unit.

3. The integrated spectroscopic semiconductor laser according to claim 2, characterized in that: When the light splitting component is configured as a planar optical waveguide splitter, the output unit is configured as a dual-core optical fiber array.

4. The integrated spectroscopic semiconductor laser according to claim 2, characterized in that: When the light splitting component is configured as a light splitter module, the output unit is configured as two single-mode single-core collimator components.

5. The integrated spectroscopic semiconductor laser according to claim 1, characterized in that: A monitoring photodiode chip is provided on the front side of the semiconductor laser chip; the monitoring photodiode chip is used for backlight detection emitted by the laser and for monitoring the light-emitting state of the chip.

6. The integrated spectroscopic semiconductor laser according to claim 2, characterized in that: The input end of the PLC chip is coated with an anti-reflection film.

7. The integrated spectroscopic semiconductor laser according to claim 3, characterized in that: The dual-core optical fiber array is configured as a polarization-maintaining optical fiber panda eye structure, and the panda eye connection line forms a vertical structure or a horizontal structure with the substrate.

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